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75900-1361

75900-1361

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    75900-1361 - 3.50mm (.138") Pitch, MX150 Dual Row Header, Breakaway, Right Angle, 12 Circuits - Mole...

  • 详情介绍
  • 数据手册
  • 价格&库存
75900-1361 数据手册
This document was generated on 05/31/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0759001361 Active mx150_unshrouded_breakaway_header 3.50mm (.138") Pitch, MX150™ Dual Row Header, Breakaway, Right Angle, 12 Circuits, 1.25µm (50µ") Nickel (Ni) Overall, 2.50µm (100µ") Minimum Select Matte Tin (Sn) Plating on Tail, 0.75µm Minimum Select Gold (Au) Contact Area, 3.05mm (.120") PC Tail Length Documents: Application Specification (PDF) Drawing (PDF) 3D Model Packaging Specification (PDF) Product Specification PS-75757-000 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name PCB Headers 75900 Wire-to-Board mx150_unshrouded_breakaway_header MX150™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Yes 12 12 12 Black 25 No No No None None Brass Gold Tin High Temperature Thermoplastic 2 Right Angle 0.120 In 3.05 mm No None 0.062 In 1.57 mm Tube 0.138 In 3.50 mm 0.138 In 3.50 mm 100 2.50 50 1.25 No No No Search Parts in this Series 75900Series Use With MX150 ™ Receptacles Dual Row Housings 33472 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -40°C to +125°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 16A 500V DC Material Info Reference - Drawing Numbers Application Specification Product Specification Sales Drawing AS-75900-206 PS-75757-000 SD-75900-001 This document was generated on 05/31/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
75900-1361
1. 物料型号: - 型号:0759001361 - 状态:Active(活跃)

2. 器件简介: - 产品系列:PCB Headers - 系列:75900 - 应用:Wire-to-Board - 产品名称:MX150™ - 概述:mx150_unshrouded_breakaway_header,3.50mm (.138") 间距,MX150™ 双排头部,可分离,直角,12路,1.25米(50")镍(Ni)整体,2.50米(100")最小选择磨砂锡(Sn)镀层尾部,0.75微米最小选择金(Au)接触面积,3.05mm (.120") PC尾部长度。

3. 引脚分配: - 引脚数量(已加载):12 - 最大引脚数量:12 - 引脚细节:12

4. 参数特性: - 可分离:是 - 颜色 - 树脂:黑色 - 耐用性(最大插配次数):25 - 首次配对/最后断裂:否 - 符合 Glow-Wire:否 - 导向配对部件:否 - 金属材质:黄铜 - 配对镀层:金 - 终止镀层:锡 - 树脂材质:热固性 - 行数:2 - 方向:直角 - PCB尾部长度(英寸):0.120英寸 - PCB尾部长度(毫米):3.05毫米 - PCB厚度推荐(英寸):0.062英寸 - PCB厚度推荐(毫米):1.57毫米 - 包装类型:管装 - 配对接口间距(英寸):0.138英寸 - 配对接口间距(毫米):3.50毫米 - 终端接口间距(英寸):0.138英寸 - 终端接口间距(毫米):3.50毫米 - 配对镀层最小:2.50微米 - 终止镀层最小:1.25微米 - 极化到配对部件:否 - 极化到PCB:否

5. 功能详解应用信息: - 温度范围:-40°C至+125°C - 安装方式:通孔 - 最大每接触电流:16A - 电气电压最大:请参考图纸 - 材料信息参考:请参考图纸

6. 封装信息: - 封装类型:MX150™ 双排外壳 - 堆叠表面安装兼容(SMC)
75900-1361 价格&库存

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