760470001

760470001

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    760470001 - Small Form-factor Pluggable Plus (SFP) Stacked 2-by-5 Multi-Port Connector with 4 Lightp...

  • 详情介绍
  • 数据手册
  • 价格&库存
760470001 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0760470001 Active sfp_stacked_multiport_connectors Small Form-factor Pluggable Plus (SFP+) Stacked 2-by-5 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 200 Circuits, Tin (Sn)/Lead(Pb) Tails Documents: 3D Model Drawing (PDF) Application Specification (PDF) Product Specification PS-75310-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Component Type Overview Product Name Type I/O Connectors 76047 Module-to-Board Receptacle sfp_stacked_multiport_connectors SFP Plus N/A Physical Boot Color Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) Flammability Gender Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Panel Mount Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) N/A 200 200 200 Black, Clear (Blue Tint) 100 94V-0 Female None Yes High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic, Polycarbonate 2 Right Angle 0.081 In 2.07 mm Yes Yes 0.062 In 1.57 mm Tray No 0.031 In 0.80 mm 0.031 In 0.80 mm 30.4 0.76 30.4 Search Parts in this Series 76047Series Use With 0759510999 SFP Dust Plug, Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # SFP Stacked Multi- 0622029980 Port Insertion Tool, 2 by 5 SFP Stacked Multi- 0622029990 Port Extraction Tool, 2 by 5 Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Ports Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Waterproof / Dustproof 0.76 Yes Yes 10 No -40°C to +85°C Through Hole - Compliant Pin No Electrical Current - Maximum per Contact Grounding to Panel Shield Type Shielded Voltage - Maximum 0.5A None EMI Gasket Yes 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Application Specification Packaging Specification Product Specification Sales Drawing Test Summary AS-75310-001, AS-76090-001 PK-75733-001 PS-75310-001 SD-76047-001 TS-75310-001 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
760470001
1. 物料型号: - 型号:0760470001 - 描述:Small Form-factor Pluggable Plus (SFP+) Stacked 2-by-5 Multi-Port Connector with 4 Lightpipe Ports, EMI Metal Gasket, 200 Circuits, Tin (Sn)/Lead(Pb) Tails

2. 器件简介: - 产品家族:1/O Connectors - 系列:76047 - 应用:Module-to-Board - 组件类型:Receptacle - 概述:SFP+ Stacked Multi-Port Connectors - 产品名称:SFP Plus

3. 引脚分配: - 电路(已加载):200 - 电路(最大):200 - 行数:2 - 接口方向:直角 - PCB厚度推荐:0.062英寸(1.57毫米)

4. 参数特性: - 耐用性(最大插拔次数):100次 - 阻燃性:UL94V-0 - 性别:Female - 锁扣:是 - 金属材质:高性能合金(HPA)金 - 镀层:锡铅 - 树脂材质:耐高温热塑性塑料,聚碳酸酯 - 间距 - 接口:0.031英寸(0.80毫米)

5. 功能详解: - 该连接器支持SFP+协议,适用于模块到板的连接,具有200个电路,最大支持200个电路。具有EMI金属垫圈和4个光管端口,用于信号传输和EMI防护。

6. 应用信息: - 应用规范:AS-75310-001, AS-76090-001 - 包装规范:PK-75733-001 - 产品规范:PS-75310-001 - 销售图纸:SD-76047-001 - 测试总结:TS-75310-001

7. 封装信息: - 包装类型:Tray - 面板安装:否 - 镀层最小厚度:Mating 30.4微英寸(0.76微米),Termination 30.4微英寸(0.76微米)
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