76134-1002

76134-1002

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    76134-1002 - VHDM® H-Series Board-to-Board Backplane Header, 2.00mm (.079) Pitch, Vertical, 8-Row, O...

  • 详情介绍
  • 数据手册
  • 价格&库存
76134-1002 数据手册
This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0761341002 Active vhdm VHDM® H-Series Board-to-Board Backplane Header, 2.00mm (.079") Pitch, Vertical, 8-Row, Open Signal Module, 80 Circuits, Advance Mate Shield, Pin Length 6.25mm (.246") Documents: Drawing (PDF) Product Specification PS-74031-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 76134 Backplane Open Header PCB Header vhdm VHDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 80 80 Black 200 No No None Beryllium Copper, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic N/A Open Pin Field 8 Vertical 0.067 In 1.70 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.039 In 1.00 mm 30 0.75 30 0.75 Yes Yes Yes -55°C to +105°C Search Parts in this Series 76134Series Mates With 76021 VHDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® 8 Row Pin 0622015900 and Shield Repair Tool VHDM® 8 Row 0622016100 Shield Extraction Tool Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Shield Type Shielded Voltage - Maximum 3A 2.5 Gbps Ground Plane Shield Yes 30V AC (RMS)/DC VHDM® Insertion 0622020209 Module for Standard Shield Signal Header, 8 Row by 10 Wide, 20.00mm (.787") Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 10 SMC & Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification PK-74060-003 Product Specification PS-74031-999 Sales Drawing SD-76134-001 VHDM and Very High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
76134-1002
1. 物料型号: - 零件编号:0761341002 - 状态:Active - 描述:vhdm VHDM® H-Series Board-to-Board Backplane Header, 2.00mm (.079") Pitch, Vertical, 8-Row, Open Signal Module, 80 Circuits, Advance Mate Shield, Pin Length 6.25mm (.246")

2. 器件简介: - 产品系列:Backplane Connectors - 产品名称:VHDM® N/A - 应用:EU RoHS China RoHS - 组件类型:Open Pin Field 8 Vertical - 电路数(已加载/最大):80/80 - 材料:Beryllium Copper, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic

3. 引脚分配: - 引脚数:80 - 引脚配置:8行

4. 参数特性: - 耐环境性:-55°C to +105°C - 耐用性(最大配对周期):First Mate / Last Break - 无卤素:是 - 符合RoHS:是 - 含有SVHC:否

5. 功能详解: - 电流-每接触最大:3A - 数据速率:2.5 Gbps - 屏蔽类型:Shielded - 电压-最大:30V AC (RMS)/DC - 焊接过程数据:260秒,适用于无铅焊接

6. 应用信息: - 与76021 VHDM® Board-to-Board Daughtercard Receptacle配合使用 - PCB厚度推荐:1.70 mm / 1.80 mm - 引脚间距:2.00 mm

7. 封装信息: - 封装类型:VHDM® 8 Row - 堆叠:可堆叠 - 表面安装兼容(SMC):是 - 操作温度范围:-55°C to +105°C
76134-1002 价格&库存

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