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78061-0002

78061-0002

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    78061-0002 - 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Go...

  • 详情介绍
  • 数据手册
  • 价格&库存
78061-0002 数据手册
This document was generated on 04/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0780610002 Active 1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38µm (15µ") Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins, with Off-White Latches, 3.18mm (.125") Solder Tail Length, Lead-free Documents: 3D Model Drawing (PDF) Product Specification PS-78061-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR 19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Comments Component Type JEDEC Outline Product Name Memory Module Sockets 78061 Latches in Off-White Color Solder Tail Length at 3.18mm (.125") Memory Module MO-256 FB DIMM Physical Circuits (Loaded) Color - Resin Durability (mating cycles max) Entry Angle Flammability Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Temperature Range - Operating Termination Interface: Style 240 Black, Natural 25 Vertical (Top Entry) 94V-0 Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 0.125 In 3.18 mm Yes Yes 0.093 In 2.40 mm Tray 0.039 In 1.00 mm -55°C to +85°C Through Hole Search Parts in this Series 78061Series Mates With JEDEC MO-256 modules Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 1A 30V 1.8V, Center Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 265 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-78061-001, RPS-78061-001 SD-78061-001 This document was generated on 04/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
78061-0002
1. 物料型号: - 型号:0780610002 - 状态:Active(活跃) - 描述:1.00mm (.039") 间距全缓冲DIMM插座,垂直,通孔,0.38µm (15µ") 金(Au)选择性镀金,240路,带斜面金属针脚,带米白色锁扣,3.18mm (.125") 焊尾长度,无铅。

2. 器件简介: - 产品家族:Memory Module Sockets(内存模块插座) - 系列:78061 - 组件类型:Memory Module(内存模块) - JEDEC Outline:MO-256 - 产品名称:FB DIMM(全缓冲DIMM)

3. 引脚分配: - 电路(已加载):240 - 引脚间距(接口):1.00mm(0.039英寸)

4. 参数特性: - 颜色 - 树脂:黑色,自然色 - 耐久性(最大插拔次数):25次 - 进入角度:垂直(顶部进入) - 阻燃性:94V-0 - 与配对部件的键控:是 - 金属材质:黄铜,磷青铜 - 金属镀层:金 - 金属镀层终止:锡 - 树脂材质:高温热塑性塑料 - PCB尾长(英寸):0.125英寸 - PCB尾长(毫米):3.18毫米 - PCB定位器:是 - PCB保持:是 - 推荐PCB厚度(英寸):0.093英寸 - 推荐PCB厚度(毫米):2.40毫米 - 包装类型:托盘 - 工作温度范围:-55°C至+85°C - 终止接口样式:通孔

5. 功能详解: - 最大电流每接触点:1A - 最大电压:30V - 电压键:1.8V,中心

6. 应用信息: - 与JEDEC MO-256模块兼容

7. 封装信息: - 封装类型:通孔 - 焊尾长度:3.18mm(0.125英寸)
78061-0002 价格&库存

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