78061-0062

78061-0062

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    78061-0062 - 1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76u (30u") G...

  • 详情介绍
  • 数据手册
  • 价格&库存
78061-0062 数据手册
This document was generated on 03/17/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0780610062 Active 1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76µ (30µ") Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins, with Black Latches, 3.18mm (.125") Solder Tail Length, Lead-free Documents: 3D Model Drawing (PDF) Product Specification PS-78061-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR 19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Comments Component Type JEDEC Outline Product Name Memory Module Sockets 78061 Latches in Black Color Solder Tail Length at 3.18mm (.125") Memory Module MO-256 FB DIMM Physical Circuits (Loaded) Color - Resin Durability (mating cycles max) Entry Angle Flammability Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 240 Black 25 Vertical (Top Entry) 94V-0 Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 0.125 In 3.18 mm Yes Yes 0.093 In 2.40 mm Tray 0.039 In 1.00 mm 30 0.76 100 2.54 -55°C to +85°C Through Hole Search Parts in this Series 78061Series Mates With JEDEC MO-256 modules Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 1A 30V 1.8V, Center Solder Process Data Duration at Max. Process Temperature (seconds) 5 Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C SMC & Wave Capable (TH only) 1 265 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-78061-001, RPS-78061-001 SD-78061-001 This document was generated on 03/17/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
78061-0062
1. 物料型号: - 型号:0780610062 - 状态:Active(活跃)

2. 器件简介: - 描述:1.00mm (.039") 间距全缓冲DIMM插座,垂直式,通孔,0.76 (30, 金(Au)选择性镀层,240路,带斜面金属引脚,带黑色锁扣,3.18mm (.125") 焊尾长度,无铅。 - 文档:3D模型图纸(PDF)、产品规格书PS-78061-001(PDF)、RoHS合规证书(PDF)。 - 认证:CSA(LR19980)、UL(E29179)。

3. 引脚分配: - 组件类型:内存模块。 - JEDEC轮廓:MO-256。 - 产品名称:FB DIMM。 - 电路(已加载):240。 - 树脂颜色:黑色。 - 耐用性(最大插拔次数):25。 - 进入角度:垂直(顶部进入)。 - 阻燃性:94V-0。 - 与配对部件的键控:是。 - 金属材质:铍铜,磷青铜。 - 镀层材质:金。 - 镀层终止材质:锡。 - 树脂材质:高温热塑性塑料。 - PCB尾长(英寸):0.125 In。 - PCB尾长(毫米):3.18 mm。 - PCB定位器:是。 - PCB保持:是。 - 推荐PCB厚度(英寸):0.093 In。 - 推荐PCB厚度(毫米):2.40 mm。 - 包装类型:托盘。 - 配合接口间距(英寸):0.039 In。 - 配合接口间距(毫米):1.00 mm。 - 镀层最小:配合(uin):30。 - 镀层最小:配合(um):0.76。 - 镀层最小:终止(uin):100。 - 镀层最小:终止(um):2.54。

4. 参数特性: - 工作温度范围:-55°C至+85°C。 - 终止接口样式:通孔。 - 最大每接触点电流:1A。 - 最大电压:30V。 - 电压键:1.8V,中心。

5. 功能详解: - 该DIMM插座支持JEDEC MO-256模块,适用于内存模块的连接和数据传输。

6. 应用信息: - 适用于需要内存模块连接的电子设备,如服务器、计算机等。

7. 封装信息: - 封装类型:托盘。 - 引脚间距:1.00mm。 - 焊尾长度:3.18mm。
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