78079-0002

78079-0002

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    78079-0002 - 1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins,...

  • 详情介绍
  • 数据手册
  • 价格&库存
78079-0002 数据手册
This document was generated on 04/20/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0780790002 Active 1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.38µm (15µ") Gold (Au) Plating, 3.18mm(.125") Soldertail, 240 Circuits, Lead free Documents: 3D Model Drawing (PDF) Product Specification PS-78079-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Component Type JEDEC Outline Product Name Memory Module Sockets 78079 Socket MO-269 DDR3 DIMM Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Entry Angle Flammability Function Key Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 240 240 Black 25 Vertical 94V-0 None Yes Copper Alloy Gold Tin High Temperature Thermoplastic 0.125 In 3.18 mm Yes Yes 0.093 In 2.36 mm Tray 0.039 In 1.00 mm 0.039 In 1.00 mm 15 0.38 100 2.54 -55°C to +85°C Through Hole Search Parts in this Series 78079Series Mates With JEDEC standard 1.27mm modules Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 1A 30V AC (RMS)/DC Center Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 2 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-78079-001 SD-78079-001 This document was generated on 04/20/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
78079-0002
1. 物料型号: - 型号:0780790002 - 状态:Active(活跃) - 描述:1.00mm (.039") 间距 DDR3 DIMM 插座,垂直式,通孔,带斜面金属针脚,黑色外壳和锁扣,0.38µm (15µ") 金 (Au) 镀层,3.18mm (.125") 焊尾,240 路,无铅。

2. 器件简介: - 产品家族:Memory Module Sockets(内存模块插座) - 系列:78079 - 组件类型:插座 - JEDEC外形:MO-269 - 产品名称:DDR3 DIMM

3. 引脚分配: - 已载入电路数:240 - 最大电路数:240

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):25 - 进入角度:垂直 - 阻燃等级:94V-0 - 金属材质:铜合金 - 镀层 - 配合:金 - 镀层 - 终止:锡 - 树脂材质:高温热塑性塑料 - PCB尾长:3.18 mm - PCB厚度推荐:2.36 mm - 包装类型:托盘 - 配合接口间距:1.00 mm - 终止接口间距:1.00 mm - 镀层最小 - 配合:0.38 µm - 镀层最小 - 终止:2.54 µm - 操作温度范围:-55°C 至 +85°C - 终止接口样式:通孔

5. 功能详解: - 最大每接触点电流:1A - 最大电压:30V AC (RMS)/DC - 电压键:中心

6. 应用信息: - 与JEDEC标准1.27mm模块配合使用

7. 封装信息: - 封装类型:通孔 - 焊尾长度:3.18 mm
78079-0002 价格&库存

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