78321-0151

78321-0151

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    78321-0151 - 1.00mm (.039") Pitch DDR3 DIMM Socket, LLCR, Vertical, Through Hole, with Beveled Metal...

  • 详情介绍
  • 数据手册
  • 价格&库存
78321-0151 数据手册
This document was generated on 06/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0783210151 Active 1.00mm (.039") Pitch DDR3 DIMM Socket, LLCR, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Natural (Off-White) Latches, 0.76µm (30µ") Gold (Au) Plating, 2.67mm (.105") Solder Tail Length, 1.57mm (.062") PCB Thickness, 240 Circuits, Lead free Documents: Drawing (PDF) Product Specification PS-78321-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Component Type JEDEC Outline Product Name Memory Module Sockets 78321 Socket MO-269 DDR3 DIMM Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Entry Angle Flammability Function Key Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 240 240 Black, Natural 25 Vertical 94V-0 None Yes Copper Alloy Gold Tin High Temperature Thermoplastic 0.105 In 2.67 mm Yes Yes 0.062 In 1.57 mm Tray 0.039 In 1.00 mm 0.039 In 1.00 mm 30 0.76 100 2.54 -55°C to +85°C Through Hole Search Parts in this Series 78321Series Mates With JEDEC standard 1.27mm modules Electrical Current - Maximum per Contact Voltage - Maximum 1A 30V AC (RMS)/DC Voltage Key Center Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 10 SMC & Wave Capable (TH only) 2 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-78321-001 PS-78321-001 SD-78321-001 This document was generated on 06/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
78321-0151
1. 物料型号: - 型号:0783210151 - 状态:Active(激活) - 描述:1.00mm (.039") 间距 DDR3 DIMM 插座,LLCR,垂直,通孔,带斜面金属针脚,黑色外壳,自然色(离白色)锁扣,0.76µm (30µ") 金(Au)镀层,2.67mm (.105") 焊接尾长,1.57mm (.062") PCB厚度,240电路,无铅。

2. 器件简介: - 产品家族:Memory Module Sockets(内存模块插座) - 系列:78321 - 组件类型:Socket(插座) - JEDEC轮廓:MO-269 - 产品名称:DDR3 DIMM

3. 引脚分配: - 电路(已加载):240 - 电路(最大):240

4. 参数特性: - 颜色 - 树脂:黑色,自然色 - 耐用性(最大插拔次数):25 - 进入角度:垂直 - 阻燃性:94V-0 - 功能键:无 - 与配对部件的键控:是 - 金属材料:铜合金 - 镀层配对:金 - 镀层终止:锡 - 树脂材料:高温热塑性塑料 - PCB尾长(英寸):0.105 In - PCB尾长(毫米):2.67 mm - PCB定位器:是 - PCB保持:是 - 推荐PCB厚度(英寸):0.062 In - 推荐PCB厚度(毫米):1.57 mm - 包装类型:Tray(托盘) - 配对接口间距(英寸):0.039 In - 配对接口间距(毫米):1.00 mm - 终止接口间距(英寸):0.039 In - 终止接口间距(毫米):1.00 mm - 镀层最小:配对(uin):30 - 镀层最小:配对(um):0.76 - 镀层最小:终止(uin):100 - 镀层最小:终止(um):2.54 - 工作温度范围:-55°C至+85°C - 终止接口样式:通孔

5. 功能详解: - 每接触点最大电流:1A - 最大电压:30V AC(RMS)/DC

6. 应用信息: - 与JEDEC标准1.27mm模块配合使用。

7. 封装信息: - 封装类型:Tray(托盘)
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