87381-0864

厂商：
MOLEX9
封装：
描述：
87381-0864 - 2.00mm (.079) Pitch Milli-Grid™ Receptacle, Surface Mount, Top Entry, 0.38μm (15μ) Gold...

数据手册：

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87381-0864 数据手册

This document was generated on 04/09/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0873810864 Active 2.00mm (.079") Pitch Milli-Grid™ Receptacle, Surface Mount, Top Entry, 0.38µm (15µ") Gold (Au) Plating, with Cap, without Locating Pegs, 8 Circuits, Lead-free Documents: 3D Model Drawing (PDF) Product Specification PS-87380-002 (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Product Literature Order No Product Name PCB Receptacles 87381 Board-to-Board With Cap 987650-1991 Milli-Grid™ Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 8 8 Black 25 94V-0 No None Phosphor Bronze Gold Tin-Lead High Temperature Thermoplastic 2 Vertical No None Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 15 0.38 50 1.27 No N/A -55°C to +105°C Surface Mount Search Parts in this Series 87381Series Mates With 87758 Vertical, Through Hole, Stackable PCB Header, 87759 Vertical, Surface Mount, Stackable PCB Header, 87760 Right Angle, Through Hole, Stackable PCB Header, 87831 Vertical, Through Hole PCB Header, 87832 Vertical, Surface Mount PCB Electrical Current - Maximum per Contact Voltage - Maximum 1.9A 125V Solder Process Data Duration at Max. Process Temperature (seconds) 12 Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C Reflow Capable (SMT only) 1 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87380-002 SD-87381-**6* This document was generated on 04/09/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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87381-0864

1. 物料型号： - 型号：0873810864 - 描述：2.00mm (.079") 间距 Mii-Grid™ 插座，表面贴装，顶入式，0.3金（Au）镀层，带帽，无定位销，8电路，无铅。

2. 器件简介： - 产品系列：87381 - 产品名称：Milli-Grid™ - 应用：板对板连接 - 评论：带帽

3. 引脚分配： - 电路（已加载）：8 - 电路（最大）：8

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大插拔次数）：25次 - 阻燃性：94V-0 - 锁紧到配对部件：无 - 金属材质：磷青铜 - 镀层材质 - 配合：金 - 镀层材质 - 终止：锡铅 - 树脂材质：未提供 - 排数：2 - 方向：未提供明确方向 - PCB定位：无 - PCB保持：无 - 包装类型：管装 - 配合接口间距（英寸）：0.079 In - 配合接口间距（毫米）：2.00 mm - 终止接口间距（英寸）：0.079 In - 终止接口间距（毫米）：2.00 mm - 镀层最小：配合（微英寸）：15 - 镀层最小：配合（微米）：0.38 - 镀层最小：终止（微英寸）：50 - 镀层最小：终止（微米）：1.27 - 极化到PCB：无 - 表面贴装兼容（SMC）：不适用 - 工作温度范围：-55°C至+105°C - 终止接口：风格 - 表面贴装

5. 功能详解： - 每个接触点最大电流：1.9A - 最大电压：125V - 焊接过程数据：在最高过程温度下持续时间（秒）：12

6. 应用信息： - 与以下型号的垂直、通孔、可堆叠PCB插座兼容：87758、87759、87760、87831、87832。

7. 封装信息： - 封装类型：表面贴装 - 引脚间距：2.00mm

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