87381-1874

87381-1874

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    87381-1874 - 2.00mm (.079) Pitch Milli-Grid™ Receptacle, Surface Mount, Top Entry, 0.38μm (15μ) Gold...

  • 详情介绍
  • 数据手册
  • 价格&库存
87381-1874 数据手册
This document was generated on 03/18/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0873811874 Active 2.00mm (.079") Pitch Milli-Grid™ Receptacle, Surface Mount, Top Entry, 0.38µm (15µ") Gold (Au) Plating, without Cap, without Locating Pegs, 18 Circuits, Lead-free Documents: 3D Model Drawing (PDF) Product Specification PS-87380-002 (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Product Literature Order No Product Name PCB Receptacles 87381 Board-to-Board 987650-1991 Milli-Grid™ Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 18 18 Black 25 94V-0 No None Phosphor Bronze Gold Tin-Lead High Temperature Thermoplastic 2 Vertical No None 0.031 In 0.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 15 0.38 50 1.27 No N/A -55°C to +105°C Surface Mount Search Parts in this Series 87381Series Mates With 87758 Vertical, Through Hole, Stackable PCB Header, 87759 Vertical, Surface Mount, Stackable PCB Header, 87760 Right Angle, Through Hole, Stackable PCB Header, 87831 Vertical, Through Hole PCB Header, 87832 Vertical, Surface Mount PCB Electrical Current - Maximum per Contact Voltage - Maximum 1.9A 125V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 12 Reflow Capable (SMT only) 1 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87380-002 SD-87381-**6* This document was generated on 03/18/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
87381-1874
1. 物料型号: - 型号:0873811874

2. 器件简介: - 描述:2.00mm (.079") 间距 Mili-Grid™ 插座,表面贴装,顶入式,0. Gold (Au) 镀层,无盖帽,无定位销,18路,无铅。

3. 引脚分配: - 电路(已加载):18 - 电路(最大):18

4. 参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):25 - 阻燃性:94V-0 - 锁到配对部件:无 - 金属材质:磷青铜 - 镀层材质 - 配合:金 - 镀层材质 - 终止:锡铅 - 树脂材质:高温热塑性塑料 - 行数:2 - 方向:垂直 - PCB定位器:无 - PCB固定:无 - PCB厚度推荐(英寸):0.031In - PCB厚度推荐(毫米):0.80 mm - 包装类型:管装 - 配合接口间距(英寸):0.079 In - 配合接口间距(毫米):2.00 mm - 终止接口间距(英寸):0.079 In - 终止接口间距(毫米):2.00 mm - 镀层最小:配合(uin):15 - 镀层最小:配合(um):0.38 - 镀层最小:终止(uin):50 - 镀层最小:终止(um):1.27 - 极化到PCB:无 - 表面贴装兼容(SMC):N/A - 工作温度范围:-55°C至+105°C - 终止接口:风格 - 表面贴装

5. 功能详解: - 电流 - 每个接触点最大:1.9A - 电压 - 最大:125V

6. 应用信息: - 产品家族:PCB插座 - 系列:87381 - 应用:板对板

7. 封装信息: - 配合接口间距:2.00 mm - 终止接口间距:2.00 mm
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