87705-1021

厂商：
MOLEX9
封装：
描述：
87705-1021 - 1.00mm (.039") Pitch DDR-II DIMM Socket, Vertical, Center Keys, 3.18mm (.125") Tail Len...

数据手册：

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87705-1021 数据手册

This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0877051021 Active 1.00mm (.039") Pitch DDR-II DIMM Socket, Vertical, Center Keys, 3.18mm (.125") Tail Length, Beige Latches, 0.38µm (15µ") Gold (Au) Plating, with Beveled Metal Pins, 240 Circuits, Lead-Free Documents: 3D Model Drawing (PDF) Product Specification PS-87705-002 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only 1409726 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Comments Component Type JEDEC Outline Product Name Memory Module Sockets 87705 Latches in Beige Color Socket MO-237 DDR2 DIMM Physical Circuits (Loaded) Color - Resin Durability (mating cycles max) Entry Angle Flammability Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 240 Black, Natural 25 Vertical (Top Entry) 94V-0 Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 0.125 In 3.18 mm Yes 0.093 In 2.40 mm Tray 0.039 In 1.00 mm 15.2 0.38 101.6 2.54 -10°C to +85°C Through Hole Search Parts in this Series 87705Series Mates With JEDEC standard 1.27mm modules Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 0.5A 30V 1.8V, Center Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature 5 SMC & Wave Capable (TH only) 1 Process Temperature max. C 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87705-002 SD-87705-001 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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87705-1021

1. 物料型号： - 型号：0877051021 - 描述：1.00mm (.039") 间距 DDR-II DIMM 插座，垂直，中心键，3.18mm (.125") 尾部

2. 器件简介： - 产品家族：内存模块插座 - 系列：87705 - 组件类型：插座 - JEDEC Outline Product Name：MO-237 DDR2 DIMM

3. 引脚分配： - 电路（已加载）：240 - 引脚间距：1.00mm (0.039") 4. 参数特性： - 颜色 - 树脂：黑色，自然色 - 耐用性（最大配对周期）：25 - 进入角度：垂直（顶部进入） - 阻燃性：94V-0 - 与配对部件的键控：是 - 材料 - 金属：黄铜，磷青铜 - 材料 - 镀层配对：金 - 材料 - 镀层终止：锡 - 材料 - 树脂：高温热塑性塑料 - PCB尾长：3.18mm (0.125") 5. 功能详解： - 电气特性： - 每个接触点最大电流：0.5A - 最大电压：30V - 电压键：1.8V, 中心 - 焊接过程数据： - 最大过程温度下持续时间（秒）：5秒，适用于表面贴装和波峰焊（仅限通孔）

6. 应用信息： - 与JEDEC标准1.27mm模块兼容 - 推荐模块布局按照JEDEC MO-237 - 产品应包装在托盘中 - 产品外壳侧面应有日期代码

7. 封装信息： - 封装类型：通孔 - 操作温度范围：-10°C至+85°C - 镀层最小：配对0.38um，终止2.54um

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