87758-3016

厂商：
MOLEX9
封装：
描述：
87758-3016 - 2.00mm (.079") Pitch Milli-Grid™ Header, Through Hole, Vertical, 30 Circuits, 0.38μm (1...

数据手册：

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87758-3016 数据手册

This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0877583016 Active milligrid 2.00mm (.079") Pitch Milli-Grid™ Header, Through Hole, Vertical, 30 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free Documents: Drawing (PDF) Product Specification PS-87761-100 (PDF) RoHS Certificate of Compliance (PDF) Series Agency Certification UL E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name PCB Headers 87758 Board-to-Board milligrid Milli-Grid™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Yes 30 30 Black No 94V-0 No No None None 0.157 In 4.00 mm Phosphor Bronze Gold Tin Nylon 2 Vertical 0.102 In 2.60 mm No None 0.063 In 1.60 mm Tray 0.079 In 2.00 mm 0.079 In 2.00 mm 15 0.38 No No No No Search Parts in this Series 87758Series Mates With 79107 Milli-Grid™ Receptacle, Vertical, Through Hole. 79108 Milli-Grid™ Flex-toBoard, Vertical Receptacle. Milli-Grid™ Receptacle, Surface Mount. 79109. 87381 Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2A 125V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 3 Wave Capable (TH only) 1 250 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87761-100 SD-87758-107 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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87758-3016

1. 物料型号： - 型号：0877583016 - 描述：Activemilligrid 2.00mm (.079") Pitch Milli-Grid™ Header, Through Hole, Vertical, 30 Circuits, 0.38µm - 状态：无铅选择性金（Au）电镀，口袋托盘包装，符合RoHS标准

2. 器件简介： - 产品名称：PCB Headers - 系列：87758系列 - 特点：垂直、通孔、30路电路、0.38微米金电镀

3. 引脚分配： - 引脚数量：30 - 引脚间距：2.00mm (.079") pitch

4. 参数特性： - 电气特性：最大电流每接触点2A，最大电压125V - 温度范围：-55°C至+105°C - 材料信息：HDUSING:30%G.F.NYLON 46,94V-0,COLOR:BLACK PIN: 0.50mm S0.PHOSPHOR BRONZE 510 - 电镀：16- 0.38um MIN GOLD N CONTACT AREA TIN IN SOLDER AREA, BOTH OVER NICKEL OVERALL

5. 功能详解： - 该连接器为垂直型，适用于板对板连接，具有30个电路连接点，电镀为无铅金，适用于多种环境条件。

6. 应用信息： - 应用领域：电子发烧友网站推荐，华强PCB和华强芯城网站提供相关服务 - 兼容性：与79107 Milli-Grid™ Receptacle, Vertical, Through Hole等型号兼容

7. 封装信息： - 封装类型：口袋托盘包装 - 封装材料：金属电镀材料为磷青铜和金锡，塑料部分为尼龙 - 封装尺寸：PC尾长2.60mm，PCB定位和保持，推荐PCB厚度为1.60mm

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