TD041SCANFD

TD041SCANFD DFN package isolated CANFD Transceiver Features               Package Ultra-small, ultra-thin, chip scale DFN package Compatible with the "ISO 11898-2" standard I/O power supply range supports 3.3V and 5V microprocessors High isolation to 3750Vrms Bus-Pin ESD protection up to 15kV(HBM) Baud rate up to 5Mbps -58V to +58V Bus fault protection >25kV/μs CMTI TXD dominant time-out function Low communication delay The bus supports maximum 110 nodes Industrial operating ambient temperature range:-40℃ to +125℃ Meet AEC-Q100 standards EN62368 approval Applications        Industrial automation, control, sensors and drive systems Building and greenhouse environmental control(HVAC) automation Security system Transport Medical treatment Telecommunication Can Bus standard such as CAN open, Device Net, NMEA2000, ARNIC825, ISO11783, CAN Kingdom, CAN aerospace Functional Description TD041SCANFD is a isolated CAN bus transceiver, which is compliant with ISO11898-2 standard. The TD041SCANFD provide differential transmitting and receiving capability between the CANFD protocol controller and the physical layer bus. It is capable of running at data rates of up to 5 Mbps. The device has the function of series line, over-voltage, ground loss protection(-58V to +58V) and thermal shutdown so that it is especially suitable for working in harsh environment. The rated operating temperature range of TD041SCANFD is –40°C to 125°C. 2020.11.17-A/2 Page 1 of 9 MORNSUN Guangzhou Science & Technology Co., Ltd. reserves the copyright and right of final interpretation Contents 1 2 3 Home..................................................................................1 1.1 Feature and Package........................................................1 1.2 Applications......................................................................1 1.3 Functional Description....................................................1 Pin Connection and Description........................................2 IC Related parameters........................................................3 3.1 Absolute Maximum Rating............................................3 3.2 Recommended Operating Conditions..........................3 3.3 Electrical Characteristics................................................4 3.4 Transmission Characteristics.........................................5 3.5 Physical Information.........................................................5 4 Characteristic Curve..................................................................5 4.1 Typical Performance Curve.........................................................5 4.2 Parameter Measurement Information..........................................6 5 Product Working Description....................................................7 6 Application Circuit....................................................................7 7 Suggestions for Power Supply...................................................8 8 Order Information......................................................................8 9 Package Information..................................................................8 10 Tape & Reel Information............................................................9 Pin Connection Internal Block Diagram Note：All GND1 pins are internally connected; All GND2 pins are internally connected. Function Table Letter Description H High-Level L Low-Level I Indeterminate X Unrelated Z High Impedance NC No Connection Table 1. Driver Function table Power Input VDD1 VDD2 On On On Output TXD Bus State CANH CANL VDD2SENSE On L Dominant H L L On H Recessive Z Z L On left floating Recessive Z Z L Off On X Recessive Z Z I On Off L I I I H Table 2. Receiver Function table Power Input Output VDD1 VDD2 VID = CANH − CANL Bus State RXD VDD2SENSE On On ≥0.9 V Dominant L L 2020.11.17-A/2 Page 2 of 9 MORNSUN Guangzhou Science & Technology Co., Ltd. reserves the copyright and right of final interpretation On On ≤0.5 V Recessive H L On On 0.5 V < VID < 0.9 V I I L On On OPEN Recessive H L Off On X X I I On Off X X H H Pin Descriptions Pin Number Pin Name Pin Functions 1 NC 2 GND1 No Connect. Ground(Logic side). 3 GND1 Ground(Logic side). 4 VDD2SENSE 5 RXD Receiver Output Data(L:Dominant Bus State; H:Recessive Bus State). 6 TXD Driver Input Data(L:Dominant Bus State; H:Recessive Bus State). VDD2 Voltage Sense. 7 VDD1 Power Supply (Logic Side). 8 GND1 Ground(Logic side). 9 GND2 Ground (Bus Side). 10 NC 11 CANL No Connect. Low Level CAN Voltage Input/Output. 12 CANH High Level CAN Voltage Input/Output. 13 VDD2 Power Supply (Bus Side). 14 NC No Connect. 15 NC No Connect. 16 GND2 Ground (Bus Side). Absolute Maximum Ratings General test conditions: Free-air, normal operating temperature range (unless otherwise specified). Min. Max. UNIT VDD1,VDD2 PARAMETERS Power Supply -0.5 6 V VI Input Voltage(TXD) -0.5 VDD1 + 0.5 V VO(RXD) Output Voltage (RXD) -0.5 VDD1 + 0.5 V VO(SENSE) Output Voltage (VDD2SENSE) -0.5 VDD1 + 0.5 V VCANH,VCANL Bus terminal voltage(CANH, CANL) -58 58 V TA Operating Temperature Range -40 125 °C Tstg Storage Temperature Range -50 150 °C Peak temp. ≤260℃, maximum duration ≤60s at 217℃. Please also refer toIPC/JEDEC J-STD-020D.3. Reflow Soldering Temperature Important: Exposure to absolute maximum rated conditions for an extended period may severely affect the device reliability, and stress levels exceeding the “Absolute Maximum Ratings” may result in permanent damage. Recommended Operating Conditions Recommended Operating Conditions VDD1 Power Supply(Logic Side) Min. Nom. Max. 2.375 3.3 5.5 5 VDD2 Power Supply(Bus Side) 4.5 VI or VIC Voltage at any bus terminal (common mode) -12 VIH High-level input voltage(TXD) 2 VIL Low-level input voltage(TXD) ID1 Input Static Current(Logic Side) ID2 Input Static Current(Bus Side) VDD1= 5.5V, VDD2= 5.25V， No Signal Unit 5.5 +12 V 0.8 3.5 13.5 2020.11.17-A/2 mA Page 3 of 9 MORNSUN Guangzhou Science & Technology Co., Ltd. reserves the copyright and right of final interpretation Recommended Operating Conditions PD Power Dissipation PD1 Power Dissipation(Logic Side) PD2 Power Dissipation(Bus Side) Min. Max. Unit 200 VDD1= 5.5V,VDD2= 5.25V, TA=105°C, RL= 60Ω; TXD Input Signal:f=500kHz; Duty=50% Signaling rate Electrical Characteristics Nom. 25 mW 175 40 5000 kbps General test conditions and VDD1=VDD2= 5V, Ta = 25℃ (unless otherwise specified). PARAMETERS CONDITIONS Min. Input High Voltage TXD pin, see Figure 13 2 Nom. Max. Unit DRIVER VIH V VIL Input Low Voltage TXD pin, see Figure 13 0.8 V IIH, IIL CMOS Input Current TXD pin, see Figure 13 500 uA VCANL,VCANH Recessive Bus Voltage VTXD = high, RL = ∞, see Figure 13 2.0 3.0 V VCANH CANH Output Voltage VTXD = low, see Figure 13 2.75 4.5 V VCANL CANL Output Voltage VTXD = low, see Figure 13 0.5 2 V VOD Differential Output Voltage VTXD = low, RL = 45 Ω, see Figure 13 1.5 3 V VTXD = high, RL = ∞, see Figure 13 -500 +50 mV 900 mV RECEIVER VIT+ VIT- Positive-going input threshold voltage Negative-going input threshold voltage VHYS Hysteresis Voltage (VIT+ – VIT–) RIN Differential Input Resistance 500 See Figure 12 mV 150 mV 19 30 52 kΩ 0.2 0.4 V VDD1-0.4 VDD1-0.2 V VOL RXD Output Low Voltage IOUT = 1.5 mA VOH RXD Output High Voltage IOUT = −1.5 mA CI Input capacitance to ground (CANH or CANL) TXD at 3 V, VI = 0.4 sin (4E6πt) + 2.5 V 26 pF CID Differential input capacitance TXD at 3 V, VI = 0.4 sin (4E6πt) 5 pF Other VOL VDD2SENSE Output Low Voltage IOSENSE = 1.5 mA VOH VDD2SENSE Output High Voltage IOSENSE = −1.5 mA VTH(SENSE) Bus Voltage Sense Threshold Voltage HBM ESD IEC/EN 61000-4-2（Contact） Perf. Criteria B 0.2 VDD1-0.4 0.4 V VDD1-0.2 V 2.0 2.5 V CANH, CANL and GND ±15 KV Other pins ±2 KV CANH, CANL and GND ±4 KV EFT IEC61000-4-4：Perf. Criteria B CANH, CANL and GND ±2 KV Surge IEC61000-4-5：Perf. Criteria B CANH, CANL and GND(Common Mode) ±2 KV VI-O Isolation Test Leakage current