MBC13901

Freescale Semiconductor, Inc. this document by MBC13901PP/D Order ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Product Preview MBC13901 RF NPN SILICON TRANSISTOR fτ = 15 GHz NFmin = 1.2 dB ICMAX = 20 mA VCEO = 5.0 V SEMICONDUCTOR TECHNICAL DATA The RF Building Block Series NPN Silicon Low Noise Transistor The MBC13901 is a high performance transistor fabricated using Motorola’s 15 GHz fτ bipolar IC process. It is housed in the 4–lead SC–70 (SOT–343) surface mount plastic package resulting in a parasitic effect reduction and RF performance enhancements. The high performance at low power makes the MBC13901 suitable for front–end applications in portable wireless systems such as pagers, cellular and cordless phones. Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 • • • • • Low Noise Figure, NFmin = 1.0 dB (Typ) @1.0 GHz, 3.0 V and 3.0 mA Maximum Stable Gain, 22 dB @ 1.0 GHz, 3.0 V and 3.0 mA Output Third Order Intercept, OIP3 = 23 dBm @ 1.0 GHz, 3.0 V and 22 mA Ultra small SOT–343 Surface Mount Package Available Only in Tape and Reel Packaging 1 4 (Scale 4:1) PLASTIC PACKAGE CASE 318M (SOT–343, Tape & Reel Only) ORDERING INFORMATION Device MBC13901 Package SOT–343 This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice. © Motorola, Inc. 2000 Rev 0 MOTOROLA WIRELESS SEMICONDUCTOR Information On This Product, For More SOLUTIONS – RF AND IF DEVICE DATA Go to: www.freescale.com 1 Freescale Semiconductor, Inc. MBC13901 NOTES ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 2 MOTOROLA For More Information On This Product, WIRELESS SEMICONDUCTOR SOLUTIONS – RF AND IF DEVICE DATA Go to: www.freescale.com Freescale Semiconductor, Inc. MBC13901 NOTES ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 MOTOROLA WIRELESS SEMICONDUCTOR Information On This Product, For More SOLUTIONS – RF AND IF DEVICE DATA Go to: www.freescale.com 3 Freescale Semiconductor, Inc. MBC13901 OUTLINE DIMENSIONS PLASTIC INC. 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, PACKAGE CASE 318M–01 (SOT–343) ISSUE O 2X 0.20 C 0.15 C E/2 E1/2 E D B (B1) e4 PIN 1 IDENTIFIER IN THIS ZONE A A2 A1 B 3 Freescale Semiconductor, Inc... A e2 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 0.10 M C A–B D SEATING PLANE B B SECTION B–B (SEE NOTE 7) WITH PLATING Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. 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How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 Technical Information Center: 1–800–521–6274 HOME PAGE: http://www.motorola.com/semiconductors/ 4 ÉÇÇ Ç ÉÉÉÉ ÇÉÉÉ ÇÇ c1 c b1 BASE METAL ÉÉ ÉÉ E1 b 4 1 2 4X 0.10 C 3X 2X b 0.15 C NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15mm PER END. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15mm PER SIDE. 4. DIMENSIONS D AND E1 ARE DETERMINED AT THE OUTMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF PLASTIC BODY. 5. DATUMS A, B AND D TO BE DETERMINED 0.10mm FROM THE LEAD TIP. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08mm AND 0.15mm FROM THE LEAD TIP. MILLIMETERS MIN MAX ––– 1.10 0.00 0.10 0.80 1.00 0.25 0.40 0.25 0.35 0.55 0.70 0.55 0.65 0.10 0.25 0.08 0.20 2.00 BSC 2.10 BSC 1.25 BSC 1.30 BSC 0.65 BSC 1.15 BSC 0.50 BSC 0.26 0.46 0.425 REF 0.15 BSC 0_ 8_ 4_ 10 _ 2X e1 D e3 4X VIEW C q1 GAUGE PLANE SEATING PLANE 4X q1 C q L (L1) VIEW C L2 DIM A A1 A2 b b1 B B1 c c1 D E E1 e1 e2 e3 e4 L L1 L2 q q1 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569 ASIA / PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2, Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334 MBC13901PP/D ◊For More Information On This Product, WIRELESS SEMICONDUCTOR MOTOROLA SOLUTIONS – RF AND IF DEVICE DATA Go to: www.freescale.com