MPX100AS

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX100/D 100 kPa Uncompensated Silicon Pressure Sensors The MPX100 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output — directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola’s single element strain gauge design. Features • Low Cost • Patented, Silicon Shear Stress Strain Gauge Design • Easy to Use Chip Carrier Package Options • Ratiometric to Supply Voltage • 60 mV Span (Typ) • Absolute, Differential and Gauge Options • ± 0.25% Linearity (Max) Application Examples • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Barometers • Altimeters Figure 1 illustrates a schematic of the internal circuitry on the stand–alone pressure sensor chip. PIN 3 + VS PIN 2 + Vout X–ducer PIN 4 – Vout PIN 1 MPX100 SERIES 0 to 100 kPa (0 – 14.5 psi) 60 mV FULL SCALE SPAN (TYPICAL) BASIC CHIP CARRIER ELEMENT CASE 344–15, STYLE 1 DIFFERENTIAL PORT OPTION CASE 344C–01, STYLE 1 NOTE: Pin 1 is the notched pin. PIN NUMBER 1 2 Gnd +Vout 3 4 VS –Vout Figure 1. Uncompensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X–ducer is directly proportional to the differential pressure applied. The absolute sensor has a built–in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. X–ducer is a trademark of Motorola, Inc. REV 6 Motorola Sensor Device Data © Motorola, Inc. 1998 1 MPX100 SERIES MAXIMUM RATINGS Rating Overpressure(8) (P1 > P2) Burst Pressure(8) (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Pburst Tstg TA Value 200 1000 – 40 to +125 – 40 to +125 Unit kPa kPa °C °C OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) (0 to 100 kPa) Temperature Hysteresis(5) (– 40°C to +125°C) Temperature Coefficient of Full Scale Span(6) Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm–Up Offset Stability(9) Symbol POP VS Io VFSS Voff ∆V/∆P — — — TCVFSS TCVoff TCR Zin Zout tR — — Min 0 — — 45 0 — – 0.25 — — – 0.22 — 0.21 400 750 — — — Typ — 3.0 6.0 60 20 0.6 — ± 0.1 ± 0.5 — ±15 — — — 1.0 20 ± 0.5 Max 100 6.0 — 90 35 — 0.25 — — – 0.16 — 0.27 550 1875 — — — Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS/°C µV/°C %Zin/°C Ω Ω ms ms %VFSS MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element Case 344–15) Common Mode Line Pressure(7) Symbol — — Min — — Typ 2.0 — Max — 690 Unit Grams kPa NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • TCR: Zin deviation with minimum rated pressure applied, over the temperature range of – 40°C to +125°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 2 Motorola Sensor Device Data MPX100 SERIES LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (see Figure 2). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worse case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. TEMPERATURE COMPENSATION Figure 3 shows the typical output characteristics of the MPX100 series over temperature. The X–ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components or by designing your system using the MPX2100 series sensors. Several approaches to external temperature compensation over both – 40 to +125°C and 0 to + 80°C ranges are presented in Motorola Applications Note AN840. 70 60 50 OUTPUT (mVdc) ACTUAL 40 30 20 10 0 0 PRESSURE (kPA) THEORETICAL OFFSET (VOFF) MAX POP SPAN (VFSS) OUTPUT (mVdc) 50 40 30 20 10 0 PSI kPa 0 2.0 4.0 6.0 8.0 10 10 20 30 40 50 60 70 OFFSET (TYP) 12 14 16 80 90 100 LINEARITY 70 60 VS = 3.0 Vdc P1 > P2 – 40°C +25°C +125°C SPAN RANGE (TYP) PRESSURE DIFFERENTIAL Figure 2. Linearity Specification Comparison Figure 3. Output versus Pressure Differential SILICONE GEL DIE COAT WIRE BOND WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND LEAD FRAME Figure 4. Cross–Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344–15). A silicone gel helps protect the die surface and wire bond from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX100 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ABSOLUTE ELEMENT P2 DIFFERENTIAL/GAUGE STAINLESS STEEL DIE METAL COVER P1 EPOXY CASE SILICONE GEL ABSOLUTE DIE COAT DIE P1 STAINLESS STEEL METAL COVER EPOXY CASE ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ DIE BOND 3 MPX100 SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The differential or gauge sensor is designed to operate with positive differential Part Number MPX100A, MPX100D MPX100DP MPX100AP, MPX100GP MPX100AS MPX100ASX Case Type 344–15C 344C–01 344B–01 344E–01 344F–01 pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached ORDERING INFORMATION MPX100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. Device Type Basic Element Ported Elements Options Absolute, Differential Differential Absolute, Gauge Absolute, Gauge Stove Pipe Absolute, Gauge Axial Case Type Case 344–15 Case 344C–01 Case 344B–01 Case 344E–01 Case 344F–01 MPX Series MPX100A MPX100D MPX100DP MPX100AP MPX100GP MPX100AS MPX100GS MPX100ASX MPX100GSX Device Marking MPX100A MPX100D MPX100DP MPX100AP MPX100GP MPX100A MPX100D MPX100A MPX100D 4 Motorola Sensor Device Data MPX100 SERIES PACKAGE DIMENSIONS C R M 1 B –A– N PIN 1 1 2 3 4 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _ NOM 0.475 0.495 0.430 0.450 0.048 0.052 0.106 0.118 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _ NOM 12.07 12.57 10.92 11.43 1.22 1.32 2.68 3.00 L –T– J SEATING PLANE G F 4 PL F Y D 0.136 (0.005) M TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. “F” 8 PL DIM A B C D F G J L M N R Y Z GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344–15 ISSUE Z SEATING PLANE –T– R H N PORT #1 POSITIVE PRESSURE (P1) –A– U L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC –Q– B 12 34 PIN 1 K S F G D 4 PL 0.13 (0.005) –P– 0.25 (0.010) J C M TQ S DIM A B C D F G H J K L N P Q R S U M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344B–01 ISSUE B Motorola Sensor Device Data 5 MPX100 SERIES PACKAGE DIMENSIONS — CONTINUED V R PORT #2 PORT #1 –A– U W H PORT #2 VACUUM (P2) L PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 N –Q– SEATING PLANE B SEATING PLANE PIN 1 1234 –P– –T– J C 0.13 (0.005) M K S –T– 0.25 (0.010) M TQ S G D 4 PL F TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344C–01 ISSUE B PORT #1 POSITIVE PRESSURE (P1) C BACK SIDE VACUUM (P2) A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K N R S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 –B– V 43 21 PIN 1 K J R SEATING PLANE S G F D 4 PL 0.13 (0.005) M N –T– TB M GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344E–01 ISSUE B 6 Motorola Sensor Device Data MPX100 SERIES PACKAGE DIMENSIONS — CONTINUED –T– C E A U –Q– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B –P– 0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K DIM A B C D E F G J K N P Q R S U V J F D 4 PL 0.13 (0.005) G STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (–) OUT M TP S Q S CASE 344F–01 ISSUE B Motorola Sensor Device Data 7 MPX100 SERIES Motorola reserves the right to make changes without further notice to any products herein. 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