MPX2050DP

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX2050/D 50 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2050 series device is a silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output — directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin–film resistor network integrated on–chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Features • Temperature Compensated Over 0°C to +85°C • Unique Silicon Shear Stress Strain Gauge • Easy to Use Chip Carrier Package Options • Ratiometric to Supply Voltage • Differential and Gauge Options • ±0.25% Linearity (MPX2050) Application Examples • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Non–Invasive Blood Pressure Measurement Figure 1 shows a block diagram of the internal circuitry on the stand–alone pressure sensor chip. VS 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY 1 GND MPX2050 SERIES 0 to 50 kPa (0 to 7.25 psi) 40 mV FULL SCALE SPAN (TYPICAL) MPX2050D CASE 344 MPX2050GP CASE 344B 2 4 SENSING ELEMENT Vout+ Vout- MPX2050DP CASE 344C Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). 1 2 MPX2050GSX CASE 344F PIN NUMBER Gnd +Vout 3 4 VS –Vout NOTE: Pin 1 is noted by the notch in the lead. REV 8 Motorola Sensor © Motorola, Inc. 2002 Device Data 1 MPX2050 SERIES MAXIMUM RATINGS(NOTE) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 –40 to +125 –40 to +125 Unit kPa °C °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Supply Range(1) Symbol POP VS Io MPX2050 MPX2050 VFSS Voff ∆V/∆P MPX2050 (0 to 50 kPa) (–40°C to +125°C) — — — TCVFSS TCVoff Zin Zout (10% to 90%) tR — — Min 0 — — 38.5 –1.0 — –0.25 — — –1.0 –1.0 1000 1400 — — — Typ — 10 6.0 40 — 0.8 — ±0.1 ±0.5 — — — — 1.0 20 ±0.5 Max 50 16 — 41.5 1.0 — 0.25 — — 1.0 1.0 2500 3000 — — — Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV Ω Ω ms ms %VFSS Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) Temperature Hysteresis(5) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Warm–Up Offset Stability(7) Time(6) NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 2 Motorola Sensor Device Data MPX2050 SERIES LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. LEAST SQUARES FIT RELATIVE VOLTAGE OUTPUT EXAGGERATED PERFORMANCE CURVE LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION END POINT STRAIGHT LINE FIT OFFSET 0 50 PRESSURE (% FULLSCALE) 100 Figure 2. Linearity Specification Comparison ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the minimum, maximum and typical output characteristics of the MPX2050 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on Full–Scale Span and Offset are very small and are shown under Operating Characteristics. 40 35 OUTPUT (mVdc) 30 25 20 15 10 5 kPa PSI 0 -5 0 VS = 10 Vdc TA = 25°C MPX2050 P1 > P2 MAX TYP SPAN RANGE (TYP) MIN WIRE BOND SILICONE DIE COAT STAINLESS STEEL METAL COVER DIE P1 EPOXY CASE 12.5 1.8 25 3.6 37.5 5.4 50 7.25 OFFSET (TYP) LEAD FRAME Figure 3. Output versus Pressure Differential Figure 4. Cross–Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2050 series pressure sensor operating charac- teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ P2 RTV DIE BOND 3 MPX2050 SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The Motorola MPX pressure sensor is Part Number MPX2050D MPX2050DP MPX2050GP MPX2050GSX designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type 344 344C 344B 344F Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached ORDERING INFORMATION MPX2050 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Basic Element Ported Elements Differential Differential, Dual Port Gauge Gauge Axial PC Mount Options Case Type 344 344C 344B 344F Order Number MPX2050D MPX2050DP MPX2050GP MPX2050GSX Device Marking MPX2050D MPX2050DP MPX2050GP MPX2050D 4 Motorola Sensor Device Data MPX2050 SERIES PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _ NOM 0.475 0.495 0.430 0.450 0.048 0.052 0.106 0.118 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _ NOM 12.07 12.57 10.92 11.43 1.22 1.32 2.68 3.00 C R M 1 B –A– N PIN 1 1 2 3 4 2 3 4 Z L –T– J SEATING PLANE G F 4 PL F Y D 0.136 (0.005) M TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. “F” 8 PL DIM A B C D F G J L M N R Y Z STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344–15 ISSUE Z SEATING PLANE –T– R H N PORT #1 POSITIVE PRESSURE (P1) –A– U L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC –Q– B PIN 1 12 34 K S F G D 4 PL 0.13 (0.005) –P– 0.25 (0.010) J C M TQ S M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344B–01 ISSUE B Motorola Sensor Device Data 5 MPX2050 SERIES PACKAGE DIMENSIONS — CONTINUED V R PORT #2 PORT #1 –A– U W H PORT #2 VACUUM (P2) L PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 N –Q– SEATING PLANE B SEATING PLANE PIN 1 1234 –P– –T– J C 0.13 (0.005) M K S –T– 0.25 (0.010) M TQ S G D 4 PL F TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C–01 ISSUE B –T– C E A U –Q– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B –P– 0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) G TP Q STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT M S S CASE 344F–01 ISSUE B 6 Motorola Sensor Device Data MPX2050 SERIES NOTES Motorola Sensor Device Data 7 MPX2050 SERIES Motorola reserves the right to make changes without further notice to any products herein. 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Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334 Technical Information Center: 1–800–521–6274 HOME PAGE: http://www.motorola.com/semiconductors/ 8 ◊ Motorola Sensor Device Data MPX2050/D