MPX2700DP

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX2700/D 700 kPa High Pressure, Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2700 series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output — directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin–film resistor network integrated on–chip. The sensor is laser trimmed for precise span and offset calibration and temperature compensation. Features • Unique Silicon Shear Stress Strain Gauge • ± 0.5% Linearity • Easy to Use Chip Carrier Package • Basic Element, Single and Dual Ported Devices Available • Available in Absolute, Differential and Gauge configurations Application Examples • Pump/Motor Controllers • Pneumatic Control • Tire Pressure Gauges • Robotics • Medical Diagnostics • Pressure Switching • Hydraulics Figure 1 shows a block diagram of the internal circuitry on the stand–alone pressure sensor chip. VS 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY MPX2700 SERIES 0 to 700 kPa (0 to 100 psi) 40 mV FULL SCALE SPAN (TYPICAL) BASIC CHIP CARRIER ELEMENT CASE 344–15, STYLE 1 DIFFERENTIAL PORT OPTION CASE 344C–01, STYLE 1 NOTE: Pin 1 is the notched pin. X–ducer SENSING ELEMENT 2 4 Vout+ Vout– PIN NUMBER 1 2 Gnd +Vout 3 4 VS –Vout 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X–ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). This sensor is designed for applications where P1 is always greater than, or equal to P2. Senseon and X–ducer are trademarks of Motorola, Inc. REV 2 Motorola Sensor Device Data © Motorola, Inc. 1997 1 MPX2700 SERIES MAXIMUM RATINGS Overpressure(8) (P2 Burst Pressure(8) (P2 Storage Temperature v 1 Atmosphere) v 1 Atmosphere) Rating Symbol P1max P1burst Tstg TA Value 2800 5000 – 40 to +125 – 40 to +125 Unit kPa kPa °C °C Operating Temperature OPERATING CHARACTERISTICS (VCC = 10 Vdc, TA = 25°C unless otherwise noted. P1 Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) (0 to 700 kPa) Temperature Hysteresis(5) (– 40°C to +125°C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm–Up(7) Symbol POP VS Io VFSS Voff ∆V/∆P — — — TCVFSS TCVoff Zin Zout tR — 0 — — w P2; P2 v 1 Atmosphere.) Typ — 10 6.0 40 — 0.057 — ± 0.1 ± 0.5 — — — — 1.0 20 Max 700 16 — 41.5 1.0 — 0.5 — — 1.0 1.0 4000 3000 — — Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV Ω Ω ms ms Min 38.5 –1.0 — – 0.5 — — –1.0 –1.0 1300 1400 — — MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element Case 344–15) Symbol — Min — Typ 2.0 Max — Unit Grams NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. 8. Basic Element only, Case 344–15. 9. P2 max : 500 kPa. 2 Motorola Sensor Device Data MPX2700 SERIES LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit (see Figure 3). While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. LEAST SQUARES FIT RELATIVE VOLTAGE OUTPUT EXAGGERATED PERFORMANCE CURVE LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION END POINT STRAIGHT LINE FIT OFFSET 0 50 PRESSURE (% FULLSCALE) 100 Figure 2. Linearity Specification Comparison ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX2700 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on Full–Scale Span and Offset are very small and are shown under Operating Characteristics. 50 40 OUTPUT (mV) 30 20 MIN 10 0 –5 LEAD FRAME OFFSET VS = 10 V TA = 25°C P1 > P2 MAX TYP SILICONE DIE COAT SPAN RANGE (TYP) WIRE BOND DIE P1 STAINLESS STEEL METAL COVER PSI kPa 20 140 40 280 60 420 80 560 100 700 Figure 3. Output versus Pressure Differential Figure 4. Cross–Section of Differential Pressure Sensor Die in Its Basic Package (Not to Scale) Figure 4 shows the cross section of the Motorola MPX pressure sensor die in the chip carrier package. A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. MPX2700 series pressure sensor operating characteristics and internal reli- ability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ P2 EPOXY CASE RTV DIE BOND 3 MPX2700 SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola MPX Part Number MPX2700D MPX2700DP MPX2700GP MPX2700GVP MPX2700GS MPX2700GVS MPX2700GSX MPX2700GVSX MPX2700ASX MPX2700AS MPX2700AP MPX2700A pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type 344–15C 344C–01 344B–01 344D–01 344E–01 344A–01 344F–01 344G–01 Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Stainless Steel Cap Side with Port Attached Stainless Steel Cap Side with Port Attached Stainless Steel Cap ORDERING INFORMATION MPX2700 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type DiT Basic Element Ported Elements Options Oi Differential Differential Gauge Gauge Vacuum Gauge Stove Pipe Gauge Vacuum Stove Pipe Gauge Axial Gauge Vacuum Axial Case Type C T Case 344–15 Case 344C–01 Case 344B–01 Case 344D–01 Case 344E–01 Case 344A–01 Case 344F–01 Case 344G–01 Order Number MPX2700D MPX2700DP MPX2700GP MPX2700GVP MPX2700GS MPX2700GVS MPX2700GSX MPX2700GVSX Device Marking MPX2700D MPX2700DP MPX2700GP MPX2700GVP MPX2700D MPX2700D MPX2700D MPX2700D 4 Motorola Sensor Device Data MPX2700 SERIES PACKAGE DIMENSIONS NOTES: C R M B –A– N PIN 1 1 2 3 4 POSITIVE PRESSURE (P1) 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30_ NOM 0.475 0.495 0.430 0.450 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30_ NOM 12.07 12.57 10.92 11.43 L –T– J SEATING PLANE POSITIVE PRESSURE (P1) G F 4 PL D 0.136 (0.005) M TA M DIM A B C D F G J L M N R STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344–15 ISSUE W PORT #2 VACUUM PRESSURE (P2) C POSITIVE PRESSURE (P1) PIN 1 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K N R S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 GROUND + OUTPUT + SUPPLY – OUTPUT MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 –B– V 12 34 K J R SEATING PLANE S G F D 4 PL 0.13 (0.005) M N –T– TB M STYLE 1: PIN 1. 2. 3. 4. CASE 344A–01 ISSUE B Motorola Sensor Device Data 5 MPX2700 SERIES PACKAGE DIMENSIONS — CONTINUED SEATING PLANE –T– R H N PORT #1 POSITIVE PRESSURE (P1) –A– U L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC –Q– B 12 34 PIN 1 K S F G D 4 PL 0.13 (0.005) –P– 0.25 (0.010) J C M TQ S DIM A B C D F G H J K L N P Q R S U M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344B–01 ISSUE B V R PORT #2 PORT #1 –A– U W H PORT #2 VACUUM (P2) L PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 N –Q– SEATING PLANE B SEATING PLANE PIN 1 1234 –P– –T– J C 0.13 (0.005) M K S –T– 0.25 (0.010) M TQ S G D 4 PL F TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344C–01 ISSUE B 6 Motorola Sensor Device Data MPX2700 SERIES PACKAGE DIMENSIONS — CONTINUED –A– –T– R N –Q– SEATING PLANE PORT #2 VACUUM (P2) U L H POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.158 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC B 12 34 K S PIN 1 DIM A B C D F G H J K L N P Q R S U C J –P– 0.25 (0.010) M F TQ S G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344D–01 ISSUE B PORT #1 POSITIVE PRESSURE (P1) C BACK SIDE VACUUM (P2) A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K N R S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 –B– V 43 21 PIN 1 K J R SEATING PLANE S G F D 4 PL 0.13 (0.005) M N –T– TB M GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344E–01 ISSUE B Motorola Sensor Device Data 7 MPX2700 SERIES PACKAGE DIMENSIONS — CONTINUED –T– C E A U –Q– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B –P– 0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K DIM A B C D E F G J K N P Q R S U V J F D 4 PL 0.13 (0.005) G STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (–) OUT M TP S Q S CASE 344F–01 ISSUE B –T– C E POSITIVE PRESSURE (P1) A U –Q– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 V N R B PORT #2 VACUUM (P2) PIN 1 –P– 0.25 (0.010) M TQ M 1 2 3 4 S K DIM A B C D E F G J K N P Q R S U V J F D 4 PL 0.13 (0.005) G M TP S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (–) OUT CASE 344G–01 ISSUE B 8 Motorola Sensor Device Data MPX2700 SERIES Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. 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Motorola Sensor Device Data 9 MPX2700 SERIES Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax™: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET: http://motorola.com/sps 10 ◊ MPX2700/D Motorola Sensor Device Data