MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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The RF MOSFET Line
RF Power Field Effect Transistors MRF5S19100HR3
Designed for PCN and PCS base station applications with frequencies up to 1.9 to 2.0 GHz. Suitable for TDMA, C DMA and multicarrier amplifier applications. • Typical 2 - Carrier N - CDMA Performance: VDD = 28 Volts, IDQ = 1000 mA, Pout = 22 Watts Avg., Full Frequency Band. IS - 95 (Pilot, Sync, Paging, Traffic Codes 8 Through 13) Channel Bandwidth = 1.2288 MHz. Peak/Avg. = 9.8 dB @ 0.01% Probability on CCDF. Power Gain — 13.9 dB Drain Efficiency — 25.5% IM3 @ 2.5 MHz Offset — - 36.5 dBc @ 1.2288 MHz Channel Bandwidth ACPR @ 885 kHz Offset — - 50.7 dBc @ 30 kHz Channel Bandwidth • Capable of Handling 10:1 VSWR, @ 28 Vdc, 1960 MHz, 100 Watts CW Output Power • Characterized with Series Equivalent Large - Signal Impedance Parameters • Internally Matched, Controlled Q, for Ease of Use • Qualified Up to a Maximum of 32 VDD Operation • Integrated ESD Protection • Lower Thermal Resistance Package • Low Gold Plating Thickness on Leads, 40µ″ Nominal. • In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 Inch Reel.
N - Channel Enhancement - Mode Lateral MOSFETs MRF5S19100HSR3
1990 MHz, 22 W AVG, 28 V 2 x N - CDMA LATERAL N - CHANNEL RF POWER MOSFETs
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CASE 465- 06, STYLE 1 NI - 780 MRF5S19100HR3
CASE 465A - 06, STYLE 1 NI - 780S MRF5S19100HSR3
MAXIMUM RATINGS
Rating Drain - Source Voltage Gate - Source Voltage Total Device Dissipation @ TC = 25°C Derate above 25°C Storage Temperature Range Operating Junction Temperature Symbol VDSS VGS PD Tstg TJ Value 65 - 0.5, +15 269 1.54 - 65 to +150 200 Unit Vdc Vdc W W/°C °C °C
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Case Case Temperature 75°C, 100 W CW Case Temperature 70°C, 22 W CW Symbol RθJC Value (1) 0.64 0.65 Unit °C/W
(1) Refer to AN1955/D, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.motorola.com/semiconductors/rf . Select Documentation/Application Notes - AN1955. NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed.
REV 2
MOTOROLA RF Motorola, Inc. 2004 DEVICE DATA
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MRF5S19100HR3 MRF5S19100HSR3 1
Freescale Semiconductor, Inc.
ESD PROTECTION CHARACTERISTICS
Test Conditions Human Body Model Machine Model Charge Device Model Class 2 (Minimum) M3 (Minimum) C7 (Minimum)
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Zero Gate Voltage Drain Leakage Current (VDS = 65 Vdc, VGS = 0 Vdc) Zero Gate Voltage Drain Leakage Current (VDS = 28 Vdc, VGS = 0 Vdc) Gate - Source Leakage Current (VGS = 5 Vdc, VDS = 0 Vdc) ON CHARACTERISTICS (DC) Gate Threshold Voltage (VDS = 10 Vdc, ID = 240 µAdc) Gate Quiescent Voltage (VDS = 28 Vdc, ID = 1000 mAdc) Drain - Source On - Voltage (VGS = 10 Vdc, ID = 2.4 Adc) Forward Transconductance (VDS = 10 Vdc, ID = 2.4 Adc) DYNAMIC CHARACTERISTICS Reverse Transfer Capacitance (1) (VDS = 28 Vdc, VGS = 0, f = 1.0 MHz) Crss — 2.2 — pF VGS(th) VGS(Q) VDS(on) gfs — — — — 2.7 3.7 0.26 6.3 — — — — Vdc Vdc Vdc S IDSS IDSS IGSS — — — — — — 10 1 1 µAdc µAdc µAdc Symbol Min Typ Max Unit
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FUNCTIONAL TESTS (In Motorola Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 1000 mA, Pout = 22 W Avg., f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 =1990 MHz, 2 - Carrier N - CDMA, 1.2288 MHz Channel Bandwidth Carriers. ACPR measured in 30 kHz Bandwidth @ ±885 kHz Offset. IM3 measured in 1.2288 MHz Channel Bandwidth @ ±2.5 MHz Offset. Peak/Avg. = 9.8 dB @ 0.01% Probability on CCDF. Power Gain Drain Efficiency Intermodulation Distortion Adjacent Channel Power Ratio Input Return Loss (1) Part is internally matched both on input and output. Gps ηD IM3 ACPR IRL 12.5 24 — — — 13.9 25.5 - 36.5 - 50.7 - 13 — — - 35 - 48 -9 dB % dBc dBc dB
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B1 VBIAS R1 R2 + C3 C4 C5 R3 C7 W1 VSUPPLY + C8 + C9 + C10 R4 C11 C12 + C13 + C14
C6 Z9 Z6 RF INPUT Z1 Z2 C15 Z3 C16 C1 Z4 Z5 Z7 DUT Z8 Z10 Z11 Z12 C2 Z13 Z14 C17 RF OUTPUT
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Z1, Z3 Z2 Z4 Z5 Z6 Z7 Z8
0.140″ 0.450″ 0.525″ 0.636″ 0.650″ 0.320″ 0.091″
x 0.080″ Microstrip x 0.080″ Microstrip x 0.080″ Microstrip x 0.141″ Microstrip x 0.050″ Microstrip x 1.299″ Microstrip x 1.133″ Microstrip
Z9 Z10 Z11 Z12 Z13 Z14 PCB
0.590″ x 0.071″ Microstrip 0.450″ x 1.133″ Microstrip 0.450″ x 0.141″ Microstrip 0.490″ x 0.080″ Microstrip 0.085″ x 0.080″ Microstrip 1.124″ x 0.080″ Microstrip Arlon GX - 0300 - 55 - 22, 0.030″, εr = 2.55
Figure 1. MRF5S19100HR3(HSR3) Test Circuit Schematic
Table 1. MRF5S19100HR3(HSR3) Test Circuit Component Designations and Values
Part B1 C1 C2 C3 C4, C12 C5, C11 C6 C7 C8 C9, C10, C13, C14 C15 C16 C17* R1 R2 R3, R4 W1 Short RF Bead 22 pF Chip Capacitor, B Case 10 pF Chip Capacitor, B Case 1 µF, 50 V Tantalum Capacitor 0.1 µF Chip Capacitors, B Case 1K pF Chip Capacitors, B Case 2.7 pF Chip Capacitor, B Case 4.3 pF Chip Capacitor, B Case 10 µF, 35 V Tantalum Capacitor 22 µF, 35 V Tantalum Capacitors 0.6 – 4.5 Gigatrim Variable Capacitor 2.2 pF Chip Capacitor, B Case 0.3 pF Chip Capacitor, B Case 1 kW Chip Resistor 560 kW Chip Resistor 12 W Chip Resistors 1 turn 14 gauge wire Description Part Number 95F786 100B220CP 500X 100B100CP 500X T494C105(1)050AS CDR33BX104AKWS 100B102JP 500X 100B2R7BP 500X 100B4R3JP 500X T494D106(1)035AS T494X226(1)035AS 44F3358 100B2R2BP 500X 100B0R3BP 500X D5534M07B1K00R CR1206 564JT RM73B2B120JT Manufacturer Newark ATC ATC Kemet Kemet ATC ATC ATC Kemet Kemet Newark ATC ATC Newark Newark Garrett Electronics
* Need for part will vary from fixture to fixture.
MOTOROLA RF DEVICE DATA
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MRF5S19100HR3 MRF5S19100HSR3 3
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MRF5S19100 Rev 1 C6 VGG R1 B1 R2 C3 C4 C5 CUT OUT AREA R3 W1 C7
C8
C9 C10
C11 C12
R4 C13 C2 C14
VDD
C1
C16 C15
C17
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Figure 2. MRF5S19100HR3(HSR3) Test Circuit Component Layout
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TYPICAL CHARACTERISTICS
Gps ηD ηD, DRAIN EFFICIENCY (%) 15 14 13 G ps , POWER GAIN (dB) 12 11 10 9 IM3 8 7 6 ACPR 1.2288 MHz Channel Bandwidth Peak/Avg. = 9.8 dB @ 0.01% Probability (CCDF) IRL VDD = 28 Vdc, Pout = 22 W (Avg.), IDQ = 1000 mA 2−Carrier N−CDMA, 2.5 MHz Carrier Spacing 40 35 30 25 20 IM3 (dBc), ACPR (dBc) −30 −35 −40 −45 −50 −10 −15 −20 −25 −30 −35
5 −55 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 f, FREQUENCY (MHz)
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Figure 3. 2 - Carrier N - CDMA Broadband Performance
16 15 G ps , POWER GAIN (dB) 14 13 530 mA 12 11 10 1 VDD = 28 Vdc f1 = 1958.75 MHz, f2 = 1961.25 MHz Two−Tone Measurement, 2.5 MHz Tone Spacing 10 Pout, OUTPUT POWER (WATTS) PEP 100 IDQ = 1500 mA 1300 mA 1000 mA 760 mA IMD, THIRD ORDER INTERMODULATION DISTORTION (dBc)
−15 −20 −25 −30 −35 −40 −45 1000 mA −50 −55 1 760 mA 10 Pout, OUTPUT POWER (WATTS) PEP 100 530 mA IDQ = 1500 mA 1300 mA VDD = 28 Vdc f1 = 1958.75 MHz, f2 = 1961.25 MHz Two−Tone Measurement, 2.5 MHz Tone Spacing
Figure 4. Two - Tone Power Gain versus Output Power
Figure 5. Third Order Intermodulation Distortion versus Output Power
IMD, INTERMODULATION DISTORTION (dBc)
−25 Pout , OUTPUT POWER (dBm) −30 −35 −40 −45 −50 7th Order −55 0.1 1 TWO−TONE SPACING (MHz) 10 40 VDD = 28 Vdc, Pout = 100 W (PEP), IDQ = 1000 mA Two−Tone Measurements, Center Frequency = 1960 MHz
58 57 56 55 54 53 52 51 50 49 48 47 46 32 33 34 35 36 37 P3dB = 51.98 dBm (157.81 W) P1dB = 51.3 dBm (135.01 W) Actual Ideal
3rd Order
5th Order
VDD = 28 Vdc, IDQ = 1000 mA Pulsed CW, 8 µsec(on), 1 msec(off) Center Frequency = 1960 MHz 38 39 40 41 42 43 44
Pin, INPUT POWER (dBm)
Figure 6. Intermodulation Distortion Products versus Tone Spacing
Figure 7. Pulse CW Output Power versus Input Power
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MRF5S19100HR3 MRF5S19100HSR3 5
IRL, INPUT RETURN LOSS (dB)
Freescale Semiconductor, Inc.
TYPICAL CHARACTERISTICS
ηD, DRAIN EFFICIENCY (%), Gps, POWER GAIN (dB) 35 30 25 20 15 Gps 10 5 0 1 10 Pout, OUTPUT POWER (WATTS) AVG. −56 −63 −70 75 VDD = 28 Vdc, IDQ = 1000 mA f1 = 1958.75 MHz, f2 = 1961.25 MHz 2 x N−CDMA, 2.5 MHz @ 1.2288 MHz Channel Bandwidth Peak/Avg. = 9.8 dB @ 0.01% Probability (CCDF) ηD IM3 −35 −42 −49 IM3 (dBc), ACPR (dBc) −21 MTTF FACTOR (HOURS x AMPS2) −28 109
108
ACPR
107
106 100
120
140
160
180
200
220
TJ, JUNCTION TEMPERATURE (°C) This above graph displays calculated MTTF in hours x ampere2 drain current. Life tests at elevated temperatures have correlated to better than ±10% of the theoretical prediction for metal failure. Divide MTTF factor by ID2 for MTTF in a particular application.
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Figure 8. 2 - Carrier N - CDMA ACPR, IM3, Power Gain and Drain Efficiency versus Output Power
Figure 10. MTTF Factor versus Junction Temperature
TYPICAL CHARACTERISTICS N - CDMA TEST SIGNAL
0 −10 −20 −30 −40 (dB) −50 −60 −70 −80 −90 −100 −7.5 −6 −4.5 −3 −1.5 0 1.5 3 4.5 6 7.5 −ACPR @ 30 kHz Integrated BW +ACPR @ 30 kHz Integrated BW −IM3 @ 1.2288 MHz Integrated BW +IM3 @ 1.2288 MHz Integrated BW 1.2288 MHz Channel BW
f, FREQUENCY (MHz)
Figure 9. 2 - Carrier N - CDMA Spectrum
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Z o = 10 Ω
f = 1990 MHz Zload* f = 1930 MHz f = 1930 MHz Zsource f = 1990 MHz
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VDD = 28 Vdc, IDQ = 1000 mA, Pout = 22 W Avg. f MHz 1930 1960 1990 Zsource Ω 4.45 - j5.32 4.53 - j5.40 5.12 - j5.45 Zload Ω 1.98 - j2.58 1.83 - j2.55 1.60 - j2.15
Zsource = Test circuit impedance as measured from gate to ground. Zload = Test circuit impedance as measured from drain to ground.
Input Matching Network
Device Under Test
Output Matching Network
Z
source
Z
load
Figure 11. Series Equivalent Input and Output Impedance
MOTOROLA RF DEVICE DATA
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MRF5S19100HR3 MRF5S19100HSR3 7
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NOTES
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NOTES
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MOTOROLA RF DEVICE DATA
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MRF5S19100HR3 MRF5S19100HSR3 9
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NOTES
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PACKAGE DIMENSIONS
B G
1
2X
Q bbb
M
TA
M
B
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3 (FLANGE)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M−1994. 2. CONTROLLING DIMENSION: INCH. 3. DELETED 4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY FROM PACKAGE BODY. DIM A B C D E F G H K M N Q R S aaa bbb ccc INCHES MIN MAX 1.335 1.345 0.380 0.390 0.125 0.170 0.495 0.505 0.035 0.045 0.003 0.006 1.100 BSC 0.057 0.067 0.170 0.210 0.774 0.786 0.772 0.788 .118 .138 0.365 0.375 0.365 0.375 0.005 REF 0.010 REF 0.015 REF MILLIMETERS MIN MAX 33.91 34.16 9.65 9.91 3.18 4.32 12.57 12.83 0.89 1.14 0.08 0.15 27.94 BSC 1.45 1.70 4.32 5.33 19.66 19.96 19.60 20.00 3.00 3.51 9.27 9.53 9.27 9.52 0.127 REF 0.254 REF 0.381 REF
B
2
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(INSULATOR)
R
M
(LID)
bbb N
(LID)
M
TA
B
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ccc
M
TA
M
B
M
S
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(INSULATOR)
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H
ccc C
TA
M
B
M
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M
TA
M
B
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F E A
(FLANGE)
A
T
SEATING PLANE
CASE 465 - 06 ISSUE F NI - 780 MRF5S19100HR3
STYLE 1: PIN 1. DRAIN 2. GATE 3. SOURCE
4X U (FLANGE)
B
1
4X Z (LID)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M−1994. 2. CONTROLLING DIMENSION: INCH. 3. DELETED 4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY FROM PACKAGE BODY. DIM A B C D E F H K M N R S U Z aaa bbb ccc INCHES MIN MAX 0.805 0.815 0.380 0.390 0.125 0.170 0.495 0.505 0.035 0.045 0.003 0.006 0.057 0.067 0.170 0.210 0.774 0.786 0.772 0.788 0.365 0.375 0.365 0.375 −−− 0.040 −−− 0.030 0.005 REF 0.010 REF 0.015 REF MILLIMETERS MIN MAX 20.45 20.70 9.65 9.91 3.18 4.32 12.57 12.83 0.89 1.14 0.08 0.15 1.45 1.70 4.32 5.33 19.61 20.02 19.61 20.02 9.27 9.53 9.27 9.52 −−− 1.02 −−− 0.76 0.127 REF 0.254 REF 0.381 REF
(FLANGE)
B
2
2X
K
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M
TA
M
B
M
N
(LID)
R
M
(LID)
ccc M H
3
TA
M
B
M
ccc aaa
M
TA TA
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B B
M
(INSULATOR)
S
M
(INSULATOR) M
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M
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B
M
M
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STYLE 1: PIN 1. DRAIN 2. GATE 5. SOURCE
F T
SEATING PLANE
E A
(FLANGE)
A
CASE 465A - 06 ISSUE F NI - 780S MRF5S19100HSR3
MOTOROLA RF DEVICE DATA
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MRF5S19100HR3 MRF5S19100HSR3 11
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Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. E Motorola Inc. 2004 HOW TO REACH US: USA /EUROPE /LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1-800-521-6274 or 480-768-2130 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu, Minato-ku, Tokyo 106-8573, Japan 81-3- 3440-3569 ASIA /PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong 852-26668334 HOME PAGE: http://motorola.com/semiconductors
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