MTDF1N03HD

MTDF1N03HD

  • 厂商:

    MOTOROLA(摩托罗拉)

  • 封装:

  • 描述:

    MTDF1N03HD - DUAL TMOS POWER MOSFET 2.0 AMPERES 30 VOLTS RDS(on) = 0.120 OHM - Motorola, Inc

  • 详情介绍
  • 数据手册
  • 价格&库存
MTDF1N03HD 数据手册
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MTDF1N03HD/D Designer's ™ Data Sheet Medium Power Surface Mount Products MTDF1N03HD Motorola Preferred Device Micro8™ devices are an advanced series of power MOSFETs which utilize Motorola’s High Cell Density HDTMOS process to achieve lowest possible on–resistance per silicon area. They are capable of withstanding high energy in the avalanche and commutation modes and the drain–to–source diode has a very low reverse recovery time. Micro8™ devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc–dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients. • Miniature Micro8 Surface Mount Package — Saves Board Space • Extremely Low Profile (
MTDF1N03HD
物料型号:MTDF1N03HD/D

器件简介:MTDF1N03HD/D 是一款中等功率的表面贴装产品,TMOS双N沟道场效应晶体管。

采用摩托罗拉的高单元密度HDTMOS工艺制造,能够在低电压、高速开关应用中实现高效率,适用于dc-dc转换器和便携式及电池供电产品的电源管理。


引脚分配: - 引脚1:源极1(Source 1) - 引脚2:栅极1(Gate 1) - 引脚3:源极2(Source 2) - 引脚4:栅极2(Gate 2) - 引脚5:漏极2(Drain 2) - 引脚6:漏极1(Drain 1) - 引脚7:漏极1(Drain 1) - 引脚8:漏极2(Drain 2)

参数特性: - 漏极-源极电压(VDS):30V - 漏极-栅极电压(RGs = 1.0 M):30V - 栅极-源极电压(连续):±20V - 导通电阻(RDS(on)):0.120欧姆 - 连续漏极电流(@ TA = 25°C):2.8A - 脉冲漏极电流(IDM):23A - 热阻(Junction to Ambient):100°C/W(1平方英寸FR-4或G-10 PCB)

功能详解:MTDF1N03HD/D 场效应晶体管具备低导通电阻和高耐压特性,适用于需要高效率和快速开关的应用。

其内部二极管具有低反向恢复时间,适合用于桥式电路。

此外,器件还具有逻辑电平门驱动能力,可以由逻辑IC驱动。


应用信息:典型应用包括dc-dc转换器、便携式和电池供电产品的电源管理,以及磁盘驱动器和磁带驱动器等大容量存储产品的低电压电机控制。


封装信息:Micro8表面贴装封装,具有极低的高度(<1.1mm),适用于PCMCIA卡等薄型应用。

封装的热阻为200°C/W,能够在25°C的环境温度下实现0.63瓦的总功率耗散。

建议在玻璃环氧印刷电路板上使用推荐的足迹以实现此功率耗散。

使用如Thermal Clad™等板材料,可以在同一足迹下将功率耗散翻倍。
MTDF1N03HD 价格&库存

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