SCF5250CAG120

Freescale Semiconductor Data Sheet Document Number: SCF5250EC Rev. 1.1, 04/2005 SCF5250 Integrated ColdFire® Microprocessor Data Sheet 1 Introduction Table of Contents 1 2 3 4 5 6 Introduction..........................................................1 SCF5250 Block Diagram .....................................8 Documentation ....................................................8 Signal Descriptions..............................................9 Electrical Characteristics ...................................21 Pin-Out and Package Information .....................38 This document provides an overview of the SCF5250 ColdFire® processor and general descriptions of SCF5250 features and its various modules. The SCF5250 was designed as a system controller/decoder for compressed audio music players, especially portable and automotive CD and hard disk drive players. The 32-bit ColdFire core with Enhanced Multiply Accumulate (EMAC) unit provides optimum performance and code density for the combination of control code and signal processing required for audio decoding and post processing, file management, and system control. Low power features include a hardwired CD ROM decoder, advanced 0.13um CMOS process technology, 1.2V core power supply, and on-chip 128KByte SRAM that enables Windows Media Audio (WMA) decoding without the need for external DRAM in CD applications. The SCF5250 is also an excellent general purpose system controller with over 110 Dhrystone 2.1 MIPS @ 120MHz performance at a very competitive price. The integrated peripherals and enhanced MAC unit allow the © Freescale Semiconductor, Inc., 2004. All rights reserved. Introduction SCF5250 to replace both the microcontroller and the DSP in certain applications. Most peripheral pins can also be remapped as General Purpose I/O pins. 1.1 1.1.1 Orderable Part Numbers Orderable Part Table Table 1. Orderable Part Numbers Orderable Part Number Maximum Clock Frequency 120 MHz 120 MHz 120 MHz 120 MHz 120 MHz Package Type 144 pin QFP 144 pin QFP 144 pin QFP 144 pin QFP 196 ball MAPBGA Operating Temperature Range -20°C to 70°C -20°C to 70°C -40°C to 85°C -40°C to 85°C -20°C to 70°C Part Status Leaded Lead Free Leaded Lead Free Lead Free SCF5250PV120 SCF5250AG120 SCF5250CPV120 SCF5250CAG120 SCF5250VM120 1.2 1.2.1 SCF5250 Features ColdFire V2 Core The ColdFire processor Version 2 core consists of two independent, decoupled pipeline structures to maximize performance while minimizing core size.The instruction fetch pipeline (IFP) is a two-stage pipeline for prefetching instructions. The prefetched instruction stream is then gated into the two-stage operand execution pipeline (OEP), which decodes the instruction, fetches the required operands, and then executes the required function. Because the IFP and OEP pipelines are decoupled by an instruction buffer that serves as a FIFO queue, the IFP can prefetch instructions in advance of their actual use by the OEP, which minimizes time stalled waiting for instructions. The OEP is implemented in a two-stage pipeline featuring a traditional RISC data path with a dual-read-ported register file feeding an arithmetic/logic unit (ALU). 1.2.2 DMA Controller The SCF5250 provides four fully programmable DMA channels for quick data transfer. Single and dual address mode is supported with the ability to program bursting and cycle stealing. Data transfer is selectable as 8, 16, 32, or 128-bits. Packing and unpacking is supported. Two internal audio channels and the dual UART can be used with the DMA channels. All channels can perform memory to memory transfers. The DMA controller has a user-selectable, 24- or 16-bit counter and a programmable DMA exception handler. External requests are not supported. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 2 Freescale Semiconductor Introduction 1.2.3 Enhanced Multiply and Accumulate Module (EMAC) The integrated EMAC unit provides a common set of DSP operations and enhances the integer multiply instructions in the ColdFire architecture. The EMAC provides functionality in three related areas: 1. Faster signed and unsigned integer multiplies 2. New multiply-accumulate operations supporting signed and unsigned operands 3. New miscellaneous register operations Multiplies of 16x16 and 32x32 with 48-bit accumulates are supported in addition to a full set of extensions for signed and unsigned integers plus signed, fixed-point fractional input operands. The EMAC has a single-clock issue for 32x32-bit multiplication instructions and implements a four-stage execution pipeline. 1.2.4 Instruction Cache The instruction cache improves system performance by providing cached instructions to the execution unit in a single clock. The SCF5250 processor uses a 8K-byte, direct-mapped instruction cache to achieve 107 MIPS at 120 MHz. The cache is accessed by physical addresses, where each 16-byte line consists of an address tag and a valid bit. The instruction cache also includes a bursting interface for 16-bit and 8-bit port sizes to quickly fill cache lines. 1.2.5 Internal 128-KByte SRAM The 128-KByte on-chip SRAM is available in two banks, SRAM0 (64K) and SRAM1 (64K). It provides one clock-cycle access for the ColdFire core. This SRAM can store processor stack and critical code or data segments to maximize performance. Memory in SRAM1 can be accessed under DMA. 1.2.6 SDRAM Controller The SCF5250 SDRAM controller provides a glueless interface for one bank of SDRAM up to 32 MB (256 Mbits). The controller supports a 16-bit data bus. A unique addressing scheme allows for increases in system memory size without rerouting address lines and rewiring boards. The controller operates in page mode, non-page mode, and burst-page mode and supports SDRAMS. 1.2.7 System Interface The SCF5250 provides a glueless interface to 16-bit port size SRAM, ROM, and peripheral devices with independent programmable control of the assertion and negation of chip-select and write-enable signals. The SCF5250 also supports bursting ROMs. 1.2.8 External Bus Interface The bus interface controller transfers information between the ColdFire core or DMA and memory, peripherals, or other devices on the external bus. The external bus interface provides 23 bits of address bus SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 3 Introduction space, a 16-bit data bus, Output Enable, and Read/Write signals. This interface implements an extended synchronous protocol that supports bursting operations. 1.2.9 Serial Audio Interfaces The SC5250 digital audio interface provides three serial Philips IIS/Sony EIAJ interfaces. One interface is a 4-pin (1 bit clock, 1 word clock, 1 data in, 1 data out), the other two interfaces are 3-pin (1 bit clock, 1 word clock, 1 data in or out). The serial interfaces have no limit on minimum sampling frequency. Maximum sampling frequency is determined by maximum frequency on bit clock input. This is 1/3 the frequency of the internal system clock. 1.2.10 IEC958 Digital Audio Interfaces The SCF5250 has one digital audio input interface, and one digital audio output interface. The single output carries the consumer “c” channel. 1.2.11 Audio Bus The audio interfaces connect to an internal bus that carries all audio data. Each receiver places its received data on the audio bus and each transmitter takes data from the audio bus for transmission. Each transmitter has a source select register. In addition to the audio interfaces, there are six CPU accessible registers connected to the audio bus. Three of these registers allow data reads from the audio bus and allow selection of the audio source. The other three register provide a write path to the audio bus and can be selected by transmitters as the audio source. Through these registers, the CPU has access to the audio samples for processing. Audio can be routed from a receiver to a transmitter without the data being processed by the core so the audio bus can be used as a digital audio data switch. The audio bus can also be used for audio format conversion. 1.2.12 CD-ROM Encoder/Decoder The SCF5250 is capable of processing CD-ROM sectors in hardware. Processing is compliant with CD-ROM and CD-ROM XA standards. The CD-ROM decoder performs following functions in hardware: • Sector sync recognition • Descrambling of sectors • Verification of the CRC checksum for Mode 1, Mode 2 Form 1, and Mode 2 Form 2 sectors • Third-layer error correction is not performed The CD-ROM encoder performs following functions in hardware: • Sector sync recognition • Scrambling of sectors SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 4 Freescale Semiconductor Introduction • • Insertion of the CRC checksum for Mode 1, Mode 2 Form 1, and Mode 2 Form 2 sectors. Third-layer error encoding needs to be done in software. This can use approximately 5-10 Mhz of performance for single-speed. 1.2.13 Dual UART Module Two full-duplex UARTs with independent receive and transmit buffers are in this module. Data formats can be 5, 6, 7, or 8 bits with even, odd, or no parity, and up to 2 stop bits in 1/16 increments. Four-byte receive buffers and two-byte transmit buffers minimize CPU service calls. The Dual UART module also provides several error-detection and maskable-interrupt capabilities. Modem support includes request-to-send (RTS) and clear-to-send (CTS) lines. The system clock provides the clocking function from a programmable prescaler. You can select full duplex, auto-echo loopback, local loopback, and remote loopback modes. The programmable Dual UARTs can interrupt the CPU on various normal or error-condition events. 1.2.14 Queued Serial Peripheral Interface QSPI The QSPI module provides a serial peripheral interface with queued transfer capability. It supports up to 16 stacked transfers at a time, making CPU intervention between transfers unnecessary. Transfers of up to 15 Mbits/second are possible at a CPU clock of 120 MHz. The QSPI supports master mode operation only. 1.2.15 Timer Module The timer module includes two general-purpose timers, each of which contains a free-running 16-bit timer. Timer0 has an external pin TOUT0, which can be used in Output Compare mode. This mode triggers an external signal or interrupts the CPU when the timer reaches a set value, and can also generate waveforms on TOUT0. The timer unit has an 8-bit prescaler that allows programming of the clock input frequency, which is derived from the system clock. In addition to the ÷1 and ÷16 clock derived from the bus clock (CPU clock / 2), the programmable timer-output pins either generate an active-low pulse or toggle the outputs. 1.2.16 IDE and SmartMedia Interfaces The SCF5250 system bus allows connection of an IDE hard disk drive or SmartMedia flash card with a minimum of external hardware. The external hardware consists of bus buffers for address and data and are intended to reduce the load on the bus and prevent SDRAM and Flash accesses to propagate to the IDE bus. The control signals for the buffers are generated in the SCF5250. 1.2.17 Analog/Digital Converter (ADC) The six channel ADC is a based on the Sigma-Delta concept with 12-bit resolution. Both the analogue comparator and digital sections of the ADC are provided internally. An external integrator circuit (resistor/capacitor) is required, which is driven by the ADC output. A software interrupt is provided when the ADC measurement cycle is complete. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 5 Introduction 1.2.18 I2C Module The two-wire I2C bus interface, which is compliant with the Philips I2C bus standard, is a bidirectional serial bus that exchanges data between devices. The I2C bus minimizes the interconnection between devices in the end system and is best suited for applications that need occasional bursts of rapid communication over short distances among several devices. Bus capacitance and the number of unique addresses limit the maximum communication length and the number of devices that can be connected. 1.2.19 Chip-Selects Up to four programmable chip-select outputs provide signals that enable glueless connection to external memory and peripheral circuits. The base address, access permissions and automatic wait-state insertion are programmable with configuration registers. These signals also interface to 16-bit ports. CS0 is active after reset to provide boot-up from external FLASH/ROM. 1.2.20 GPIO Interface A total of 60 General Purpose inputs and 57 General Purpose outputs are available. These are multiplexed with various other signals. Seven of the GPIO inputs have edge sensitive interrupt capability. 1.2.21 Interrupt Controller The interrupt controller provides user-programmable control of a total of 57 interrupts. There are 49 internal interrupt sources. In addition, there are 7 GPIOs where interrupts can be generated on the rising or falling edge of the pin. All interrupts are autovectored and interrupt levels are programmable. 1.2.22 JTAG To help with system diagnostics and manufacturing testing, the SCF5250 includes dedicated user-accessible test logic that complies with the IEEE 1149.1A standard for boundary scan testability, often referred to as Joint Test Action Group, or JTAG. For more information, refer to the IEEE 1149.1A standard. Freescale provides BSDL files for JTAG testing. 1.2.23 System Debug Interface The ColdFire processor core debug interface supports real-time instruction trace and debug, plus background-debug mode. A background-debug mode (BDM) interface provides system debug. In real-time instruction trace, four status lines provide information on processor activity in real time (PST pins). A four-bit wide debug data bus (DDATA) displays operand data and change-of-flow addresses, which helps track the machine’s dynamic execution path. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 6 Freescale Semiconductor Introduction 1.2.24 Crystal and On-chip PLL Typically, an external 16.92 Mhz or 33.86 Mhz clock input is used for CD R/W applications, while an 11.2896 MHz clock is more practical for Portable CD player applications. However, the on-chip programmable PLL, which generates the processor clock, allows the use of almost any low frequency external clock (5-35 Mhz). Two clock outputs (MCLK1 and MCLK2) are provided for use as Audio Master Clock. The output frequencies of both outputs are programmable to Fxtal, Fxtal/2, Fxtal/3, and Fxtal/4. The Fxtal/3 option is only available when the 33.86 Mhz crystal is connected. The SCF5250 supports VCO operation of the oscillator by means of a 16-bit pulse density modulation output. Using this mode, it is possible to lock the oscillator to the frequency of an incoming IEC958 or IIS signal. The maximum trim depends on the type and design of the oscillator. Typically a trim of +/- 100 ppm can be achieved with a crystal oscillator and over +/- 1000 ppm with an LC oscillator. 1.2.25 Boot ROM The boot ROM on the SCF5250 serves to boot the CPU in designs which do not have external Flash memory or ROM. Typically this occurs in systems which have a separate MCU to control the system, and/or the SCF5250 is used as a stand-alone decoder. The SCF5250 can be booted in one of three modes: • External ROM • Internal ROM Master mode – boots from I2C, SPI, or IDE • Internal ROM Slave mode – boots from I2C or UART 1.2.26 Voltage Regulator The SCF5250 contains an on-chip linear regulator that generates 1.2V from a 3.3V input. The regulator is self-contained and drives the 1.2V core voltage out on one pin that can be used to power the core supply pins at the board level. In battery powered portable applications, it is recommended that an external dc-dc converter be used to generate the 1.2V core voltage to minimize power consumption. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 7 SCF5250 Block Diagram 2 SCF5250 Block Diagram Flash Media Int IDE Interface QSPI BDM JTAG CD ROM block encode & decode I2S Rx x3 UART x2 DMAs / Timers GPI/O I2S Tx x2 SPDIF Tx SPDIF Rx 1.2V Regulator Boot ROM Oscillator 12-bit ADC I2C x2 PLL 128K SRAM V2 ColdFire® Core 8K I-Cache EMAC System Bus Controller SDRAM Ctr & Chip Selects Figure 1. SCF5250 Block Diagram 3 Documentation Table 2 lists the documents that provide a complete description of the SCF5250 and are required to design properly with the part. Documentation is available from a local Freescale distributor, a Freescale semiconductor sales office, a Freescale Literature Distribution Center, or through the Freescale DSP home page on the Internet; http://e-www.Freescale.com/ (the source for the latest information). SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 8 Freescale Semiconductor Signal Descriptions . Table 2. SCF5250 Documentation Document Name CFPRM/D ColdFire2UM Description ColdFire Family Programmer’s Reference Manual Version 2/2M ColdFire Core Processor User’s Manual Version 2/2M ColdFire Core Processor User’s Manual Addendum SCF5250 User’s Manual Order Number CFPRM/D ColdFire2UM/D ColdFire2UMAD ColdFire2UMAD/D SCF5250UM SCF5250UM/D 4 4.1 Signal Descriptions Introduction This section describes the SCF5250 input and output signals. The signal descriptions as shown in Table 2-A are grouped according to relevant functionality. Table 3. SCF5250 Signal Index Signal Name Address A[24:1] A[23]/GPO54 Mnemonic Function 24 address lines, address line 23 multiplexed with GPO54 and address 24 is multiplexed with A20 (SDRAM access only). Bus write enable - indicates if read or write cycle in progress Output enable for asynchronous memories connected to chip selects Data bus used to transfer word data Row address strobe for external SDRAM. Column address strobe for external SDRAM Write enable for external SDRAM Indicates during write cycle if high byte is written Indicates during write cycle if low byte is written SDRAM chip select SDRAM clock enable SDRAM clock output Input/ Output Out Reset State X Read-write control Output enable Data R/W OE D[31:16] Out Out In/Out Out Out Out Out Out In/Out Out In/Out H negated Hi-Z negated negated negated Synchronous row address SDRAS/GPIO59 strobe Synchronous column address strobe SDRAM write enable SDCAS/GPIO39 SDWE/GPIO38 SDRAM upper byte enable SDUDQM/GPO53 SDRAM lower byte enable SDLDQM/GPO52 SDRAM chip selects SDRAM clock enable System clock SD_CS0/GPIO60 BCLKE/GPIO63 BCLK/GPIO40 negated SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 9 Signal Descriptions Table 3. SCF5250 Signal Index (continued) Signal Name ISA bus read strobe ISA bus write strobe Mnemonic IDE-DIOR/GPIO31 (CS2) IDE-DIOW/GPIO32 (CS2) IDE-IORDY/GPIO33 CS0/CS4 CS1/QSPI_CS3/GPIO28 BUFENB1/GPIO29 BUFENB2/GPIO30 Function There is 1 ISA bus read strobe and 1 ISA bus write strobe. They allow connection of one independent ISA bus peripherals, e.g. an IDE slave device. ISA bus wait line - available for both busses Enables peripherals at programmed addresses. CS[0] provides boot ROM selection Two programmable buffer enables allow seamless steering of external buffers to split data and address bus in sections. Transfer Acknowledge signal Wake-up signal input Clock signal for Dual I operation 2C Input/ Output In/Out In/Out Reset State ISA bus wait signal Chip Selects[2:0] In/Out Out In/Out In/Out In/Out negated Buffer enable 1 Buffer enable 2 Transfer acknowledge Wake Up Serial Clock Line Serial Data Line Receive Data Transmit Data Request-To-Send Clear-To-Send Timer Output IEC958 inputs TA/GPIO12 WAKE_UP/GPIO21 SCL0/SDATA1_BS1/GPIO41 SCL1/TXD1/GPIO10 SDA0/SDATA3/GPIO42 SDA1/RXD1/GPIO44 SDA1/RXD1/GPIO44 RXD0/GPIO46 SCL1/TXD1/GPIO10 TXD0/GPIO45 DDATA3/RTS0/GPIO4 DDATA1/RTS1/SDATA2_BS2/GPIO2 In/Out In In/Out In/Out In Out Out In Out In module Serial data port for second I2C module operation Signal is receive serial data input for DUART Signal is transmit serial data output for DUART DUART signals a ready to receive data query DDATA2/CTSO/GPIO3 Signals to DUART that data can be DDATA0/CTS1/SDATA0_SDIO1/GPIO1 transmitted to peripheral SDATAO1/TOUT0/GPIO18 EBUIN1/GPIO36 EBUIN2/SCLK_OUT/GPIO13 EBUIN3/CMD_SDIO2/GPIO14 QSPI_CS0/EBUIN4/GPIO15 EBUOUT1/GPIO37 QSPI_CS1/EBUOUT2/GPIO16 SDATAI1/GPIO17 SDATAI3/GPIO8 SDATAO1/TOUT0/GPIO18 SDATAO2/GPIO34 LRCK1/GPIO19 LRCK2/GPIO23 LRCK3/GPIO43/AUDIO_CLOCK SCLK1/GPIO20 SCLK2/GPIO22 SCLK3/GPIO35 Capable of output waveform or pulse generation audio interfaces IEC958 inputs IEC958 outputs Serial data in Serial data out Word clock audio interfaces IEC958 outputs audio interfaces serial data inputs audio interfaces serial data outputs audio interfaces serial word clocks Out In In/Out Out In/Out Bit clock audio interfaces serial bit clocks In/Out SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 10 Freescale Semiconductor Signal Descriptions Table 3. SCF5250 Signal Index (continued) Signal Name Serial input Serial input Subcode clock Subcode sync Subcode data Clock frequency trim Audio clocks out Audio clock in EF/GPIO6 CFLG/GPIO5 RCK/QSPI_DIN/QSPI_DOUT/ GPIO26 QSPI_DOUT/SFSY/GPIO27 QSPI_CLK/SUBR/GPIO25 XTRIM/GPIO0 MCLK1/GPIO11 QSPI_CS2/MCLK2/GPIO24 LRCK3/GPIO43/AUDIO_CLOCK Mnemonic Function error flag serial in C-flag serial in audio interfaces subcode clock audio interfaces subcode sync audio interfaces subcode data clock trim control DAC output clocks Optional Audio clock Input Secure Digital command lane MemoryStick interface 2 data i/o Clock out for both MemoryStick interfaces and for Secure Digital In/Out In/Out In/Out In/Out In/Out Input/ Output In/Out In/Out In/Out In/Out In/Out Out Out Reset State MemoryStick/SecureDigita EBUIN3/CMD_SDIO2/GPIO14 l interface EBUIN2/SCLK_OUT/GPIO13 DDATA0/CTS1/SDATA0_SDIO1/GPIO1 SecureDigital serial data bit 0 MemoryStick interface 1 data i/o SCL0/SDATA1_BS1/GPIO41 DDATA1/RTS1/SDATA2_BS2/GPIO2 SecureDigital serial data bit 1 MemoryStick interface 1 strobe SecureDigital serial data bit 2 MemoryStick interface 2 strobe Reset output signal SecureDigital serial data bit 3 Analog to Digital converter input signals SDA0/SDATA3/GPIO42 ADC IN ADIN0/GPI52 ADIN1/GPI53 ADIN2/GPI54 ADIN3/GPI55 ADIN4/GPI56 ADIN5/GPI57 ADREF ADOUT/SCLK4/GPIO58 QSPI_CLK/SUBR/GPIO25 In/Out In ADC OUT Analog to digital convertor output signal. Connect to ADREF via integrator network. QSPI clock signal In/Out QSPI clock QSPI data in QSPI data out QSPI chip selects In/Out In/Out In/Out In/Out RCK/QSPI_DIN/QSPI_DOUT/GPIO26 QSPI data input RCK/QSPI_DIN/QSPI_DOUT/GPIO26 QSPI data out QSPI_DOUT/SFSY/GPIO27 QSPI_CS0/EBUIN4/GPIO15 QSPI_CS1/EBUOUT2/GPIO16 QSPI_CS2/MCLK2/GPIO24 CS1/QSPI_CS3/GPIO28 CRIN CROUT RSTI TEST[2:0] LINOUT QSPI chip selects Crystal in Crystal out Reset In Freescale Test Mode Linear regulator output Crystal input Crystal Out Processor Reset Input TEST pins. outputs 1.2 V to supply core In Out In In Out SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 11 Signal Descriptions Table 3. SCF5250 Signal Index (continued) Signal Name Linear regulator input Linear regulator ground High Impedance Debug Data LININ LINGND HI-Z Assertion Tri-states all output signal pins. In In/Out Hi-Z Mnemonic Function Input, typically I/O supply (3.3V) Input/ Output In Reset State DDATA0/CTS1/SDATA0_SDIO1/GPIO1 Displays captured processor data and DDATA1/RTS1/SDATA2_BS2/GPIO2 break-point status. DDATA2/CTS0/GPIO3 DDATA3/RTS0/GPIO4 PST0/GPIO50 PST1/GPIO49 PST2/INTMON2/GPIO48 PST3/INTMON1/GPIO47 PSTCLK/GPIO51 TCK TRST/DSCLK Indicates internal processor status. Processor Status In/Out Hi-Z Processor clock Test Clock Test Reset/Development Serial Clock processor clock output Clock signal for IEEE 1149.1A JTAG. Multiplexed signal that is asynchronous reset for JTAG controller. Clock input for debug module. Multiplexed signal that is test mode select in JTAG mode and a hardware break-point in debug mode. Multiplexed serial input for the JTAG or background debug module. Multiplexed serial output for the JTAG or background debug module. Out In In Test Mode Select/ Break Point TMS/BKPT In Test Data Input / TDI/DSI Development Serial Input Test Data TDO/DSO Output/Development Serial Output In Out 4.2 GPIO Many pins have an optional GPIO function. • General purpose input is always active, regardless of state of pin. • General purpose output or primary output is determined by the appropriate setting of the Pin Multiplex Control Registers, GPIO-FUNCTION, GPIO1-FUNCTION and PIN-CONFIG. • At Power-on reset, all pins are set to their primary function. 4.3 SCF5250 Bus Signals These signals provide the external bus interface to the SCF5250. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 12 Freescale Semiconductor Signal Descriptions 4.3.1 • Address Bus The address bus provides the address of the byte or most significant byte of the word or longword being transferred.The address lines also serve as the DRAM address pins, providing multiplexed row and column address signals. Bits 23 down to 1 and 24 of the address are available. A24 is intended to be used with 256 Mbit DRAM’s. Signals are named: — A[23:1] — A20/24 • 4.3.2 Read-Write Control This signal indicates during any bus cycle whether a read or write is in progress. A low is write cycle and a high is a read cycle. 4.3.3 Output Enable The OE signal is intended to be connected to the output enable of asynchronous memories connected to chip selects. During bus read cycles, the ColdFire processor will drive OE low. 4.3.4 Data Bus The data bus (D[31:16]) is bi-directional and non-multiplexed. Data is registered by the SCF5250 on the rising clock edge. The data bus uses a default configuration if none of the chip-selects or DRAM bank match the address decode. All 16 bits of the data bus are driven during writes, regardless of port width or operand size. 4.3.5 Transfer Acknowledge The TA/GPIO12 pin is the transfer acknowledge signal. 4.4 SDRAM Controller Signals The following SDRAM signals provide a glueless interface to external SDRAM. An SDRAM width of 16 bits is supported and can access as much as 32MB of memory. ADRAMs are not supported. Table 4. SDRAM Controller Signals SDRAM Signal Synchronous DRAM row address strobe Description The SDRAS/GPIO59 active low pin provides a seamless interface to the RAS input on synchronous DRAM Synchronous DRAM Column Address Strobe The SDCAS/GPIO39 active low pin provides a seamless interface to CAS input on synchronous DRAM. Synchronous DRAM Write The SDWE/GPIO38 active-low pin is asserted to signify that a SDRAM write cycle is underway. This pin outputs logic ‘1’ during read bus cycles. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 13 Signal Descriptions Table 4. SDRAM Controller Signals (continued) SDRAM Signal Synchronous DRAM Chip Enable Description The SD_CS0/GPIO60 active-low output signal is used during synchronous mode to route directly to the chip select of a SDRAM device. The DRAM byte enables UDMQ and LDQM are driven by the SDUDQM/GPO53 and SDLDQM/GPO52 byte enable outputs. The DRAM clock is driven by the BCLK/GPIO40 signal The BCLKE active high output signal is used during synchronous mode to route directly to the SCKE signal of external SDRAMs. This signal provides the clock enable to the SDRAM. Synchronous DRAM UDQM and LQDM signals Synchronous DRAM clock Synchronous DRAM Clock Enable 4.5 Chip Selects There are three chip select outputs on the SCF5250 device. CS0/CS4 and CS1/QSPI_CS3/GPIO28 and CS2 which is associated with the IDE interface read and write strobes - IDE-DIOR and IDE-DIOW. CS0 and CS4 are multiplexed. The SCF5250 has the option to boot from an internal Boot Rom. The function of the CS0/CS4 pin is determined by the boot mode. When the device is booted from internal ROM, the internal ROM is accessed with CS0 (required for boot) and the CS0/CS4 pin is driven by CS4. When the device is booted from external ROM / Flash, the CS0/CS4 pin is driven by CS0 and the internal ROM is disabled. The active low chip selects can be used to access asynchronous memories. The interface is glueless. 4.6 ISA bus The SCF5250 supports an ISA bus. Using the ISA bus protocol, reads and writes for one ISA bus peripheral is possible. IDE-DIOR/GPIO31 and IDE-DIOW/GPIO32 are the read and write strobe. The peripheral can insert wait states by pulling IDE-IORDY/GPIO33. CS2 is associated with the IDE-DIOR and IDE-DIOW. 4.7 Bus Buffer Signals As the SCF5250 has a complicated slave bus, which allows SDRAM, asynchronous memories, and ISA peripherals on the bus, it may become necessary to introduce a buffer on the bus in certain applications. The SCF5250 has a glueless interface to steer these bus buffers with two bus buffer output signals BUFENB1/GPIO29 and BUFENB2/GPIO30. 4.8 I2C Module Signals There are two I2C interfaces on this device. The I2C module acts as a two-wire, bidirectional serial interface between the SCF5250 processor and peripherals with an I2C interface (e.g., LED controller, A-to-D converter, D-to-A converter). When SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 14 Freescale Semiconductor Signal Descriptions devices connected to the I2C bus drive the bus, they will either drive logic-0 or high-impedance. This can be accomplished with an open-drain output. Table 5. I2C Module Signals I2c Module Signal I2C Serial Clock Description The SCL0/SDATA1_BS1/GPIO41 and SCL1/TXD1/GPIO10 bidirectional signals are the clock signal for first and second I2C module operation. The I2C module controls this signal when the bus is in master mode; all I2C devices drive this signal to synchronize I2C timing. Signals are multiplexed The SDA0/SDATA3/GPIO42 and SDA1/RXD1/GPIO44 bidirectional signals are the data input/output for the first and second serial I2C interface. Signals are multiplexed I2C Serial Data 4.9 Serial Module Signals Table 6. Serial Module Signals Serial Module Signal Receive Data Description The RXD0/GPIO46 and SDA1/RXD1/GPIO44 are the inputs on which serial data is received by the DUART. Data is sampled on RxD[1:0] on the rising edge of the serial clock source, with the least significant bit received first. The DUART transmits serial data on the TXD0/GPIO45 and SCL1/TXD1/GPIO10 output signals. Data is transmitted on the falling edge of the serial clock source, with the least significant bit transmitted (LSB) first. When no data is being transmitted or the transmitter is disabled, these two signals are held high. TxD[1:0] are also held high in local loopback mode. The DDATA3/RTS0/GP104 and DDATA1/RTS1/SDATA2_BS2/GPIO2 request-to-send outputs indicate to the peripheral device that the DUART is ready to send data and requires a clear-to-send signal to initiate transfer. Peripherals drive the DDATA2/CTS0/GPIO3 and DDATA0/CTS1/SDATA0_SDIO1/GPIO1 inputs to indicate to the SCF5250 serial module that it can begin data transmission. The following signals transfer serial data between the two UART modules and external peripherals. Transmit Data Request To Send Clear To Send 4.10 Timer Module Signals The following signal provides an external interface to Timer0. Table 7. Timer Module Signals Serial Module Signal Timer Output Description The SDATAO1/TOUT0/GPIO18 programmable output pulse or toggle on various timer events. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 15 Signal Descriptions 4.11 Serial Audio Interface Signals The following signals provide the external audio interface. Table 8. Serial Audio Interface Signals Serial Module Signal Serial Audio Bit Clock Description The SCLK1/GPIO20, SCLK2/GPIO22 and SCLK3/GPIO35, multiplexed pins can serve as general purpose I/Os or serial audio bit clocks. As bit clocks, these bidirectional pins can be programmed as outputs to drive their associated serial audio (IIS) bit clocks. Alternately, these pins can be programmed as inputs when the serial audio bit clocks are driven internally. The functionality is programmed within the Audio module. During reset, these pins are configured as input serial audio bit clocks. The LRCK1/GPIO19, LRCK2/GPIO23 and LRCK3/GPIO43/AUDIO_CLOCK multiplexed pins can serve as general purpose I/Os or serial audio word clocks. As word clocks, the bidirectional pins can be programmed as inputs to drive their associated serial audio word clock. Alternately, these pins can be programmed as outputs when the serial audio word clocks are derived internally. The functionality is programmed within the Audio module. During reset, these pins are configured as input serial audio word clocks. LRCK3/GPIO43/AUDIO_CLOCK can be used as the external audio clock input. If the core clock chosen to be non-audio specific. The SDATAI1/GPIO17 and SDATAI3/GPIO8 multiplexed pins can serve as general purpose I/Os or serial audio inputs. As serial audio inputs the data is sent to interfaces 1and 3 respectively. During reset, the pins are configured as serial data inputs. SDATO1/TOUT0/GPIO18 AND SDATAO2/GPIO34 multiplexed pins can serve as general purpose I/Os or serial audio outputs. During reset, the pins are configured as serial data outputs. The EF/GPIO6 multiplexed pin can serve as general purpose I/Os or error flag input. As error flag input, this pin will input the error flag delivered by the CD-DSP. EF/GPIO6 is only relevant for serial interface SDATAI1. The CFLG/GPIO5 multiplexed pin can serve as general purpose I/O or CFLG input. As CFLG input, the pin will input the CFLG flag delivered by the CD-DSP. CFLG/GPIO5 is only relevant for serial interface SDATAI1. Serial Audio Word Clock Serial Audio Data In Serial Audio Data Out Serial audio error flag Serial audio CFLG SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 16 Freescale Semiconductor Signal Descriptions 4.12 Digital Audio Interface Signals Table 9. Digital Audio Interface Signals Serial Module Signal Digital Audio In Description The EBUIN1/GPIO36, EBUIN2/SCLK_OUT/GPIO13, EBUIN3/CMD_SDIO2/GPIO14, and QSPI_CS0/EBUIN4/GPIO15 multiplexed signals can serve as general purpose input or can be driven by various digital audio (IEC958) input sources. Both functionalities are always active. Input chosen for IEC958 receiver is programmed within the audio module. Input value on the 4 pins can always be read from the appropriate GPIO register. The EBUOUT1/GPIO37 and QSPI_CS1/EBUOUT2/GPIO16 multiplexed pins can serve as general purpose I/O or as digital audio (IEC958) output. EBUOUT1 is digital audio out for consumer mode, EBUOUT2 is digital audio out for professional mode. During reset, the pin is configured as a digital audio output. Digital Audio Out 4.13 Subcode Interface There is a 3-line subcode interface on the SCF5250. This 3-line subcode interface allows the device to format and transmit subcode in EIAJ format to a CD channel encoder device. The three signals are described in Table 10. Table 10. Subcode Interface Signal Signal name RCK/QSPI_DIN/QSPI_DOUT/GPIO26 QSPI_DOUT/SFSY/GPIO27 Description Subcode clock input. When pin is used as subcode clock, this pin is driven by the CD channel encoder. Subcode sync output This signal is driven high if a subcode sync needs to be inserted in the EFM stream. Subcode data output This signal is a subcode data out pin. QSPI_CLK/SUBR/GPIO25 4.14 Analog to Digital Converter (ADC) The ADOUT signal on the ADOUT/SCLK4/GPIO58 pin provides the reference voltage in PWM format. This output requires an external integrator circuit (resistor/capacitor) to convert it to a DC level to be input to the ADREF pin. The six AD inputs are each fed to their own comparator. The reference input to each (ADREF) is then multiplexed as only one AD comparison can be made at any one time. NOTE To use the ADINx as General Purpose inputs (rather than there analogue function) it is necessary to generate a fixed comparator voltage level of VDD/2. This can be accomplished by a potential divider network connected to the ADREF pin. However in portable applications where stand-by power SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 17 Signal Descriptions consumption is important the current taken by the divider network (in stand-by mode) could be excessive. Therefore it is possible to generate a VDD/2 voltage by selecting SCLK4 output mode and feeding this clock signal (which is 50% duty cycle) through an external integration circuit. This would generate a voltage level equal to VDD/2 but would be disabled when stand-by mode was selected. 4.15 Secure Digital/ MemoryStick Card Interface The device has a versatile flash card interface that supports both SecureDigital and MemoryStick cards. The interface can either support one SecureDigital or two MemoryStick cards. No mixing of card types is possible. Table 11 gives the pin descriptions. Table 11. Flash Memory Card Signals Flash Memory Signal EBUIN2/SCLKOUT/GPIO13 EBUIN3/CMD_SDIO2/GPIO14 DDATAO/CTS1/SDATA0_SDIO1/GPIO1 SCL0/SDATA1_BS1/GPIO41 DDATA1/RTS1/SDATA2_BS2/GPIO2 Description Clock out for both MemoryStick interfaces and for SecureDigital Secure Digital command line MemoryStick interface 2 data i/o SecureDigital serial data bit 0 MemoryStick interface 1 data i/o SecureDigital serial data bit 1 MemoryStick interface 1 strobe SecureDigital serial data bit 2 MemoryStick interface 2 strobe Reset output signal Selection between Reset function and SDATA2_BS2 is done by programming PLLCR register. SecureDigital serial data bit 3 SDA0/SDATA3/GPIO42 4.16 Queued Serial Peripheral Interface (QSPI) The QSPI interface is a high-speed serial interface allowing transmit and receive of serial data. Pin descriptions are given in Table 12. Table 12. Queued Serial Peripheral Interface (QSPI) Signals Serial Module Signal QSPICLK/SUBR/GPIO25 RCK/QSPIDIN/QSPI_DOUT/GPIO26 RCK/QSPI_DIN/QSPI_DOUT/GPIO26 QSPI_DOUT/SFSY/GPIO27 Description Multiplexed signal IIC interface clock or QSPI clock output Function select is done via PLLCR register. Multiplexed signal IIC interface data or QSPI data input. Function select is done via PLLCR register. QSPI data output SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 18 Freescale Semiconductor Signal Descriptions Table 12. Queued Serial Peripheral Interface (QSPI) Signals (continued) Serial Module Signal QSPICS0/EBUIN4GPIO15 QSPICS1/EBUOUT2/GPIO16 QSPICS2/MCLK2/GPIO24 CS1/QSPICS3/GPIO28 4 different QSPI chip selects Description 4.17 Crystal Trim The XTRIM/GPIO0 output produces a pulse-density modulated phase/frequency difference signal to be used after low-pass filtering to control varicap-voltage to control crystal oscillation frequency. This will lock the crystal to the incoming digital audio signal. 4.18 Clock Out The MCLK1/GPIO11 and QSPI_CS2/MCLK2/GPIO24 can serve as DAC clock outputs. When programmed as DAC clock outputs, these signals are directly derived from the crystal oscillator or clock Input (CRIN). 4.19 Debug and Test Signals These signals interface with external I/O to provide processor debug and status signals. 4.19.1 Test Mode The TEST[2:0] inputs are used for various manufacturing and debug tests. For normal mode TEST [2:1] should be ways be tied low. TEST0 should be set high for BDM debug mode and set low for JTAG mode. 4.19.2 High Impedance The assertion of HI_Z will force all output drivers to a high-impedance state. The timing on HI_Z is independent of the clock. NOTE JTAG operation will override the HI_Z pin. 4.19.3 Processor Clock Output The internal PLL generates this PSTCLK/GPIO51 and output signal, and is the processor clock output that is used as the timing reference for the Debug bus timing (DDATA[3:0] and PST[3:0]). The PSTCLK/GPIO51 is at the same frequency as the core processor. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 19 Signal Descriptions 4.19.4 Debug Data The debug data pins, DDATA0/CTS1/SDATA0_SDIO1/GPIO1, DDATA1/RTS1/SDATA2_BS2/GPIO2, DDATA2/CTS0/GPIO3, and DDATA3/RTS0/GPIO4, are four bits wide. This nibble-wide bus displays captured processor data and break-point status. 4.19.5 Processor Status The processor status pins, PST0/GPIO50, PST1/GPIO49, PST2/INTMON/GPIO48, and PST3/INTMON/GPIO47, indicate the SCF5250 processor status. During debug mode, the timing is synchronous with the processor clock (PSTCLK) and the status is not related to the current bus transfer. Table 13 shows the encodings of these signals. . Table 13. Processor Status Signal Encodings PST[3:0] Definition (HEX) $0 $1 $2 $3 $4 $5 $6 $7 $8 $9 $A $B $C $D $E $F (BINARY) 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Continue execution Begin execution of an instruction Reserved Entry into user-mode Begin execution of PULSE and WDDATA instructions Begin execution of taken branch or Synch_PC1 Reserved Begin execution of RTE instruction Begin 1-byte data transfer on DDATA Begin 2-byte data transfer on DDATA Begin 3-byte data transfer on DDATA Begin 4-byte data transfer on DDATA Exception processing2 Emulator mode entry exception processing2 Processor is stopped, waiting for interrupt2 Processor is halted2 Rev. B enhancement. These encodings are asserted for multiple cycles. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 20 Freescale Semiconductor Electrical Characteristics 4.20 BDM/JTAG Signals The SCF5250 complies with the IEEE 1149.1A JTAG testing standard. The JTAG test pins are multiplexed with background debug pins. 4.21 Clock and Reset signals These signals configure the SCF5250 and provide interface signals to the external system. 4.21.1 Reset In Asserting RSTI causes the SCF5250SCF5250 to enter reset exception processing. When RSTI is recognized, the data bus is tri-stated. 4.21.2 Clock Input SCF5250 includes on -chip crystal oscillator. The crystal should be connected between CRIN and CROUT. An externally generated clock signal can also be used and should be connected directly to the CRIN pin. 4.22 Wake-Up Signal To exit power down mode, apply a LOW level to the WAKE_UP/GPIO21 input pin. 4.23 On-chip Linear Regulator The SCF5250 includes an on-chip linear regulator. This regulator provides an 1.2 V output which is intended to be used to power the SCF5250 core. Three pins are associated with this function. LININ, LINOUT and LINGND. Typically LININ would be fed by the I/O (PAD) supply (3.3 V) with separate filtering recommended to provide some isolation between the I/O and the core. In portable solutions this linear regulator may not be efficient enough and in this case we would expect the 1.2 V supply to be generated externally, possibly by a highly efficient DC-DC convertor. If not used leave pins not connected. 5 Electrical Characteristics Table 14. Maximum Ratings Rating Supply Core Voltage Maximum Core Operating Voltage Minimum Core Operating Voltage Symbol Vcc Vcc Vcc Value -0.5 to +2.5 +1.32 +1.08 Units V V V SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 21 Electrical Characteristics Table 14. Maximum Ratings (continued) Rating Supply I/O Voltage Maximum I/O Operating Voltage Minimum I/O Operating Voltage Input Voltage Storage Temperature Range Symbol Vcc Vcc Vcc Vin Tstg Value -0.5 to +4.6 +3.6 +3.0 -0.5 to +6.0 -65 to150 Units V V V V o C Table 15. Operating Temperature Characteristic Maximum Operating Ambient Temperature Minimum Operating Ambient Temperature Note: Symbol TAmax TAmin Value 851 -40 Units οC oC This published maximum operating ambient temperature should be used only as a system design guideline. All device operating parameters are guaranteed only when the junction temperature does not exceed 105°C. Table 16. Recommended Operating Supply Voltages Pin Name CORE-VDD CORE-VSS PAD-VDD PAD-VSS ADVDD ADGND OSCPAD-VDD OSCPAD-GND PLLCORE1VDD PLLCORE1GND PLLCORE2VDD PLLCORE2GND LIN 3.0v 1.08V 1.08V 3.0V 3.0V 3.0V Min 1.08V Typ 1.2V gnd 3.3v gnd 3.3v gnd 3.3v gnd 1.2V gnd 1.2v gnd 3.3V 3.6V 1.32V 1.32V 3.6V 3.6V Max 1.32V --3.6V SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 22 Freescale Semiconductor Electrical Characteristics Table 17. Linear Regulator Operating Specification Characteristic Input Voltage Output Voltage (LINOUT) Output Current Power Dissipation Load Regulation 10% Iout -> 90% Iout Power Supply Rejection Note: Symbol Vin Vout Iout Pd Min 3.0V 1.14V Typ 3.3V 1.2V 100mA Max 3.6 1.26V 150mA 436uW 40mV 50mV 60mV PSRR 40dB A pmos regulator is employed as a current source in this Linear regulator, so a 10µF capacitor (ESR 0 ... 5 Ohm) is needed on the output pin (LINOUT) to integrate the current. Typically this will require the use of a Tantalum type capacitor. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 23 Electrical Characteristics Table 18. DC Electrical Specifications (I/O Vcc = 3.3 Vdc + 0.3 Vdc) Characteristic Operation Voltage Range for I/O Input High Voltage Input Low Voltage Input Leakage Current @ 0.0 V /3.3 V During Normal Operation Hi-Impedance (Three-State) Leakage Current @ 0.0 V/3.3 V During Normal Operation Output High Voltage IOH = 8mA1, 4mA2, 2mA3 Output Low Voltage IOL = 8mA1, 4mA2, 2mA3 Schmitt Trigger Low to High Threshold Point6 Schmitt Trigger High to Low Threshold Point 6 Symbol Vcc VIH VIL Iin ITSI VOH VOL VT+ VTCL Min 3.0 2 -0.3 2.4 1.47 - Max 3.6 5.5 0.8 ±1 ±1 0.4 .95 50 Units V V V µµA µµA V V V V pF Load Capacitance (DATA[31:16], SCLK[4:1], SCLKOUT, EBUOUT[2:1], LRCK[3:1], SDATAO[2:1], CFLG, EF, DDATA[3:0], PST[3:0], PSTCLK, IDE-DIOR, IDE-DIOW, IORDY) Load Capacitance (ADDR[24:9], BCLK) Load Capacitance (BCLKE, SDCAS, SDRAS, SDLDQM, SD_CS0, SDUDQM, SDWE, BUFENB[2:1]) Load Capacitance (SDA0, SDA1, SCL0, SCL1, CMD_SDIO2, SDATA2_BS2, SDATA1_BS1, SDATA0_SDIO1, CS0/CS4, CS1, OE, R/W, TA, TXD[1:0], XTRIM, TDO/DSO, RCK, SFSY, SUBR, SDATA3, TOUT0, QSPID_OUT, QSPICS[3:0], GP[6:5]) Capacitance5, Vin = 0 V, f = 1 MHz CL CL CL - 40 30 20 pF pF pF CIN - 6 pF DATA[31:16], ADDR[24:9], PSTCLK, BCLK SCL, SDA, PST[3:0], DDATA[3:0], TDSO, SDRAS, SDCAS, SDWE, SD_CS0, SDLDQM, SDUDQM, R/W TOUT0, RTS[1:0], TXD[1:0], SCLK[4:1] BKPT/TMS, DSI/TDI, DSCLK/TRST Capacitance CIN is periodically sampled rather than 100% tested. SCLK[4:1], SCL0, SCL1, SDA0, SDA1, CRIN, RSTI SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 24 Freescale Semiconductor Electrical Characteristics Table 19. Clock Timing Specification NUM Characteristic Min CRIN Frequency1 C5 C6 C7 C8 Note: Units Max 33.86 — 60 — 55 MHz nSec % nSec % 5.00 7.1 40 14.2 45 PSTCLK cycle time PSTCLK duty cycle BCLK cycle time BCLK duty cycle There are only three choices for the valid Audio frequencies 11.29 MHz, 16.93 MHz, or 33.86 MHz; no other values are allowed. The System Clock is derived from one of these crystals via an internal PLL. CRIN PSTCLK C6 C6 C7 BCLK C8 C8 Figure 2. Clock Timing Definition NOTE Signals above are shown in relation to the clock. No relationship between signals is implied or intended. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 25 Electrical Characteristics Table 20. Input AC Timing Specification Num B11,2 B21 B31 1. 2. Characteristic Min Signal Valid to BCLK Rising (setup) BCLK Rising to signal Invalid (hold) BCLK to Input High Impedance 3 2 — Max — — 5 Units nSec nSec BCLK cycle Inputs (rising): DATA[31:16] AC timing specs assume 40pF load capacitance on BCLK and 50pF load capacitance on output pins. If this value is different, the input and output timing specifications would need to be adjusted to match the clock load. Table 21. Output AC Timing Specification Num • B101 • B111 • B102 • B112 • B123 • H1 • H2 1. 2. 3. 4. Characteristic5 Min BCLK (8mA) Rising to signal Valid BCLK (8mA) Rising to signal Invalid (hold) BCLK (4mA) Rising to signal Valid BCLK (4mA) Rising to signal Invalid (hold) BCLK to High Impedance (Three-State) HIZ to High Impedance HIZ to Low Impedance --3.5 --4 --— — Max 10 — 11 — 14 tbd tbd Units nSec nSec nSec nSec nSec nSec nSec Outputs (8mA): DATA[31:16], ADDR[25,23:9] Outputs (4mA): SDRAS, SDCAS, SDWE, SD_CS0, SDUDQM, SDLDQM, BCLKE High Impedance (Three-State): DATA[31:16] AC timing specs assume 40pF load capacitance on BCLK and a 50pF load capacitance on output pins. If this value is different, the input and output timing specifications would need to be adjusted to match the clock load. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 26 Freescale Semiconductor Electrical Characteristics B11 S2 S3 S4 S5 B12 B10 S4 S5 S0 S1 S1 S2 S3 S0 B10 ADDR[24:0] B2 Figure 3. Input/Output Timing Definition-I SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 27 DATA[31:16] BCLK R/W B5 Electrical Characteristics BCLK B3 B4 INPUTS BCLK B13 B14 OUTPUTS HIZ H1 H2 OUTPUTS Figure 4. Input/Output Timing Definition-III SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 28 Freescale Semiconductor Electrical Characteristics Table 22. Debug AC Timing Specification Num Characteristic Min D1 D2 D31 D4 1. 2. Units Max 6 — — — nSec nSec nSec nSec PSTCLK to signal Valid (Output valid) PSTCLK to signal Invalid (Output hold) Signal Valid to PSTCLK (Input setup) PSTCLK to signal Invalid (Input hold) --1.8 3 5 DSCLK and DSI are internally synchronized. This setup time must be met only if recognition on a particular clock is required. AC timing specs assume 50pF load capacitance on PSTCLK and output pins. If this value is different, the input and output timing specifications would need to be adjusted to match the clock load. PSTCLK D3 D4 DSCLK D3 D1 D4 DSI PST[3:0] DDATA[3:0] DSO D2 Figure 5. Debug Timing Definition SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 29 Electrical Characteristics Table 23. Timer Module AC Timing Specification Num Characteristic Min T1 T2 T3 T4 T5 T6 T7 TIN Cycle time TIN Valid to BCLK (input setup) BCLK to TIN Invalid (input hold) BCLK to TOUT Valid (output valid) BCLK to TOUT Invalid (output hold) TIN Pulse Width TOUT Pulse Width 3T 6 0 — tbd 1T 1T Max — — — 10 — — — bus clocks nSec nSec nSec nSec bus clocks bus clocks Units BCLK T6 TIN T2 T3 TIN T1 T7 TOUT T4 T5 Figure 6. Timer Module Timing Definition SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 30 Freescale Semiconductor Electrical Characteristics Table 24. UART Module AC Timing Specifications Num Characteristic Min U1 U2 U3 U4 U5 U6 U7 U8 RXD Valid to BCLK (input setup) BCLK to RXD Invalid (input hold) CTS Valid to BCLK (input setup) BCLK to CTS Invalid (input hold) BCLK to TXD Valid (output valid) BCLK to TXD Invalid (output hold) BCLK to RTS Valid (output valid) BCLK to RTS Invalid (output hold) 6 0 6 0 --3 --3 Max — — — — tbd — tbd — nSec nSec nSec nSec nSec nSec nSec nSec Units BCLK U1 RXD U2 U3 CTS U4 U5 TXD U6 U7 RTS U8 Figure 7. UART Timing Definition SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 31 Electrical Characteristics Table 25. I2C-Bus Input Timing Specifications Between SCL and SDA Num M1 M2 M3 M4 M5 M6 M7 M8 M9 Characteristic Min Start Condition Hold Time Clock Low Period SCL/SDA Rise Time (VIL= 0.5 V to VIH = 2.4 V) Data Hold Time SCL/SDA Fall Time (VIH= 2.4 V to VIL = 0.5 V) Clock High time Data Setup Time Start Condition Setup Time (for repeated start condition only) Stop Condition Setup Time 2 8 — 0 — 4 0 2 2 Max — — 1 — 1 — — — — bus clocks bus clocks mSec nSec mSec bus clocks nSec bus clocks bus clocks Units Table 26. I2C-Bus Output Timing Specifications Between SCL and SDA Num M11 M21 M32 M41 M53 M61 M71 M8 1 Characteristic Min Start Condition Hold Time Clock Low Period SCL/SDA Rise Time (VIL= 0.5 V to VIH = 2.4 V) Data Hold Time SCL/SDA Fall Time (VIH= 2.4 V to VIL = 0.5 V) Clock High time Data Setup Time Start Condition Setup Time (for repeated start condition only) Stop Condition Setup Time 6 10 note 2 7 — 10 2 20 10 Max — — note 2 — 3 — — — — Units bus clocks bus clocks mSec bus clocks nSec bus clocks bus clocks bus clocks bus clocks M91 1. Note: Output numbers are dependent on the value programmed into the MFDR; an MFDR programmed with the maximum frequency (MFDR = 0x20) will result in minimum output timings as shown in the above table. The MBUS interface is designed to scale the actual data transition time to move it to the middle of the SCL low period. The actual position is affected by the prescale and division values programmed into the MFDR; however, numbers given in the above table are the minimum values. Since SCL and SDA are open-collector-type outputs, which the processor can only actively drive low, the time required for SCL or SDA to reach a high level depends on external signal capacitance and pull-up resistor values. Specified at a nominal 20 pF load. 2. 3. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 32 Freescale Semiconductor Electrical Characteristics M2 SCL M1 M4 M6 M7 M8 M5 M3 M9 SDA Figure 8. I2C Timing Definition Table 27. I2C Output Bus Timings 96 MHz Num M103 M11 M121 M132 1. Characteristic Min SCL, SDA Valid to BCLK (input setup) BCLK to SCL, SDA Invalid (input hold) BCLK to SCL, SDA Low (output valid) BCLK to SCL, SDA Invalid (output hold) 2 4.5 — 3 Max — — 10 — Units nSec nSec nSec nSec Since SCL and SDA are open-collector-type outputs, which the processor can only actively drive low, this specification applies only when SCL or SDA are driven low by the processor. The time required for SCL or SDA to reach a high level depends on external signal capacitance and pull-up resistor values. Since SCL and SDA are open-collector-type outputs, which the processor can only actively drive low, this specification applies only when SCL or SDA are actively being driven or held low by the processor. SCL and SDA are internally synchronized.This setup time must be met only if recognition on a particular clock is required. 2. 3. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 33 Electrical Characteristics BCLK M10 SCL, SDA IN M11 SCL, SDA OUT M12 SCL, SDA OUT M13 Figure 9. I2C and System Clock Timing Relationship Table 28. General-Purpose I/O Port AC Timing Specifications Num Characteristic Min P1 P2 P3 P4 GPIO Valid to BCLK (input setup) BCLK to GPIO Invalid (input hold) BCLK to GPIO Valid (output valid) BCLK to GPIO Invalid (output hold) 6 0 — 1 Max — — tbd — nSec nSec nSec nSec Units SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 34 Freescale Semiconductor Electrical Characteristics BCLK P1 GPIO IN P2 P3 GPIO OUT P4 Figure 10. General-Purpose Parallel Port Timing Definition Table 29. IEEE 1149.1 (JTAG) AC Timing Specifications Num Characteristic Min J1 J2a J2b J3a J3b J4 J5 J6 J7 J8 J9 J10 J11 TCK Frequency of Operation TCK Cycle Time TCK Clock Pulse High Width TCK Clock Pulse Low Width TCK Fall Time (VIH=2.4 V to VIL=0.5 V) TCK Rise Time (VIL=0.5 v to VIH=2.4 V) TDI, TMS to TCK rising (Input Setup) TCK rising to TDI, TMS Invalid (Hold) Boundary Scan Data Valid to TCK (Setup) TCK to Boundary Scan Data Invalid to rising edge (Hold) TRST Pulse Width (asynchronous to clock edges) TCK falling to TDO Valid (signal from driven or three-state) TCK falling to TDO High Impedance TCK falling to Boundary Scan Data Valid (signal from driven or three-state) 0 100 25 25 — — 8 10 tbd tbd 12 — — — Max 10 5 5 — — — — — 15 15 tbd MHz nSec nSec nSec nSec nSec nSec nSec nSec nSec nSec nSec nSec nSec Units SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 35 Electrical Characteristics Table 29. IEEE 1149.1 (JTAG) AC Timing Specifications (continued) Num Characteristic Min J12 TCK falling to Boundary Scan Data High Impedance — Max tbd nSec Units J1 J2A J4 J2B J3A J3B TCK TDI, TMS J5 BOUNDARY SCAN DATA INPUT J6 J7 TRST J8 J9 TDO J10 BOUNDARY SCAN DATA OUTPUT J11 J12 Figure 11. JTAG Timing SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 36 Freescale Semiconductor Electrical Characteristics 5.1 IIS Module AC Timing Specifications Table 30. SCLK INPUT, SDATAO OUTPUT Timing Specifications Name TU TD Characteristic Min SCLK fall to SDATAO rise SCLK fall to SDATAO fall ----Max 25 25 ns ns Unit SCLK (INPUT) SDATAO1, 2 (OUTPUT) TU TD Figure 12. SCLK Input, SDATA Output Timing Table 31. SCLK OUTPUT, SDATA0 OUTPUT Timing Specifications Name TU TD Characteristic Min SCLK fall to SDATAO rise SCLK fall to SDATAO fall ----Max 3 3 ns ns Unit SCLK (OUTPUT) SDATAO1, 2 (OUTPUT) TU TD Figure 13. SCLK Output, SDATAO Output Timing Diagram SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 37 Pin-Out and Package Information Table 32. SCLK INPUT, SDATAI INPUT Timing Specifications Name TSU TH Characteristic Min SDATAI IN to SCLKn SCLK rise to SDATAI -5 3 Max — — ns ns Unit SCLK (INPUT OR OUTPUT) SDATA1, 3, 4 (INPUT) TSU TH Figure 14. SCLK Input/Output, SDATAI Input Timing Diagram 6 6.1 Pin-Out and Package Information Pinning Chart Table 33. 144 QFP Pin Assignments 144 QFP Pin Number 01 02 Pin State After Reset X Out (requires pull up /down for boot-up selection) Name Type Description DATA16 A23/GPO54 I/O I/O Data SDRAM address / static adr 03 04 05 06 07 08 PAD-VDD A22 A21 A20/A24 A19 A18 O O O O O SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr Out Out Out Out Out SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 38 Freescale Semiconductor Pin-Out and Package Information Table 33. 144 QFP Pin Assignments (continued) 144 QFP Pin Number 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Pin State After Reset Name Type Description PAD-GND A17 A16 A15 A14 A13 PAD-VDD A12 A11 CORE-VDD CORE-GND A10 A9 A8 A7 A6 A5 PAD-GND A4 A3 A2 A1 CS0/CS4 O o o o o O O O O O O SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr PAD-GND SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr Static chip select 0 / static chip select 4 Bus write enable Out Out Out Out Out Out Out Out Out Out Out O O SDRAM address / static adr SDRAM address / static adr Out Out O O O O O SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr SDRAM address / static adr Out Out Out Out Out 32 33 34 RW OSC PAD VDD CRIN o Out I Crystal / external clock input X SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 39 Pin-Out and Package Information Table 33. 144 QFP Pin Assignments (continued) 144 QFP Pin Number 35 36 37 38 39 40 41 42 43 44 45 46 47 Pin State After Reset X Name Type Description CROUT OSC PAD GND PLL CORE1 VDD PLL CORE2 VDD PLL CORE2 GND PLL CORE1 GND OE IDE-DIOW/GPIO32 IDE-IORDY/GPIO33 IDE-DIOR/GPIO31 BUFENB2/GPIO30 BUFENB1/GPIO29 TA/GPIO12 O Crystal clock output OSC_PAD_GND O I/O I/O I/O I/O I/O I/O Output Enable IDE DIOW IDE interface IORDY IDE interface DIOR External buffer 2 enable External buffer 1 enable Transfer acknowledge Out Out / HIGH In / LOW Out / HIGH Out / HIGH Out / HIGH In (requires pull-up for normal operation) In (requires pull-up for normal operation) In / LOW 48 WAKE_UP/ GPIO21 I/O Wake-up input 49 EBUIN2/SCLK_OUT/ GPIO13 EBUIN3/CMD_SDIO2/ GPIO14 PAD VDD EBUIN1/GPIO36 EBUOUT1/GPIO37 XTRIM/GPIO0 CS1/QSPI_CS3/GPIO28 RCK/ QSPI_DIN/QSPI_DOUT/ GPIO26 I/O Audio interfaces EBU in 2 / FlashMedia Clock Audio interfaces EBU in 3 / FlashMedia Command interface 50 I/O In / LOW 51 52 53 54 55 56 I/O I/O I/O I/O I/O Audio interfaces EBU in 1 Audio interfaces EBU out 1 Audio interfaces X-tal trim Chip select 1/ QSPI Chip Select 3 Subcode RCK interface / QSPI Data In / Data Out In / LOW Out / LOW Out / clock out Out / HIGH Out / LOW SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 40 Freescale Semiconductor Pin-Out and Package Information Table 33. 144 QFP Pin Assignments (continued) 144 QFP Pin Number 57 Pin State After Reset Out / LOW Name Type Description QSPI_CLK/SUBR/ GPIO25 QSPI_DOUT/SFSY/ GPIO27 QSPI_CS1/EBUOUT2/ GPIO16 QSPI_CS0/EBUIN4/ GPIO15 PAD GND SCLK1/GPIO20 LRCK1/GPIO19 SDATAO1/TOUT0/ GPIO18 SDATAI1/GPIO17 CFLG/GPIO5 EF/GPIO6 QSPI_CS2/MCLK2/ GPIO24 SDATAI3/GPIO8 ADIN0/GPI52 ADIN1/GPI53 ADIN2/GPI54 ADVDD ADGND ADIN3/GPI55 ADIN4/GPI56 ADIN5/GPI57 ADREF ADOUT/SCLK4/ GPIO58 I/O QSPI clock pin / subcode interface 58 I/O QSPI Data Output / subcode interface SFSY QSPI Chip select 1 output / audio interface EBU output 2 QSPI chip select 0 / audio interface EBUIN 4 Out / LOW 59 I/O Out / LOW 60 I/O Out / LOW 61 62 63 64 I/O I/O I/O Audio interfaces serial clock 1 Audio interfaces word clock 1 Audio interfaces serial data output 1 / Timer output 0 Audio interfaces serial data in 1 CFLG input Error flag input QSPI Chip Select output 2 / audio master clock output 2 Audio interfaces serial data input 3 AD input 0 AD input 1 AD input 2 In / LOW In / LOW Out / LOW 65 66 67 68 I I/O I/O I/O In / LOW In / LOW In / LOW Out / LOW 69 70 71 72 73 74 75 76 77 78 79 I/O A A A In / LOW In only In only In only A A A A I/O AD input 3 AD input 4 AD input 5 ADC reference input AD output / SCLK4 (for GPI function in low power applications) In only In only In only In Out / clock output SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 41 Pin-Out and Package Information Table 33. 144 QFP Pin Assignments (continued) 144 QFP Pin Number 80 Pin State After Reset In / LOW Name Type Description LRCK3/GPIO43/ AUDIO_CLOCK SCLK3/GPIO35 SCL0/SDATA1_BS1/ GPIO41 SDA0/SDATA3/ GPIO42 DDATA0/CTS1/ SDATA0_SDIO1/ GPIO1 DDATA1/RTS1/ SDATA2_BS2/GPIO2 DDATA2/CTS0/GPIO3 DDATA3/RTS0/GPIO4 SCL1/TXD1/GPIO10 I/O Audio interface LRCK3 / Audio master clock input Audio interface SCLK3 I2C0 clock line / FlashMedia Data interface I2C0 data / FlashMedia data interface Debug / UART1 CTS / FlashMedia data interface 81 82 I/O I/O In / LOW Out / LOW 83 I/O Hi-Z 84 I/O Out / HIGH 85 I/O Debug / UART1 RTS / FlashMedia data interface Debug / UART0 CTS Debug / UART0 RTS I2C1 clock line / second UART transmit data output Out / HIGH 86 87 88 I/O I/O I/O Out / HIGH Out / HIGH Out / LOW 89 90 91 CORE VDD CORE GND SDA1/RXD1/GPIO44 I/O I2C1 data line / second UART receive data input Hi-Z 92 93 94 95 PAD VDD TXD0/GPIO45 RXD0/GPIO46 PST3/INTMON1/ GPIO47 PST2/INTMON2/ GPIO48 PAD GND PST1/GPIO49 PST0/GPIO50 PSTCLK/GPIO51 TDO/DSO I/O I/O I/O O Debug Debug Debug JTAG/debug Out / HIGH Out / HIGH Out / clock output BDM I/O I/O I/O First UART transmit data output First UART receive data input Debug / interrupt monitor output 1 Out / HIGH In / LOW Out / HIGH 96 I/O Debug / interrupt monitor output 2 Out / HIGH 97 98 99 100 101 SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 42 Freescale Semiconductor Pin-Out and Package Information Table 33. 144 QFP Pin Assignments (continued) 144 QFP Pin Number 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 Pin State After Reset BDM BDM BDM BDM X In / LOW In /LOW X X X Name Type Description TDI/DSI TCK TMS/BKPT TRST/DSCLK RSTI SCLK2/GPIO22 LRCK2/GPIO23 LINOUT LININ LINGND SDATAO2/GPIO34 MCLK1/GPIO11 HI-Z TEST2 TEST1 TEST0 SDWE/GPIO38 SDCAS/GPIO39 PAD VDD SDRAS/GPIO59 SD_CS0/GPIO60 SDLDQM/GPO52 SDUDQM/GPO53 BCLKE/GPIO63 BCLK/GPIO40 DATA31 DATA30 I I I I I I/O I/O A A JTAG/debug JTAG JTAG/debug JTAG/Debug Reset Audio interfaces serial clock 2 Audio interfaces EBU out 1 Linear regulator output Linear regulator input Linear regulator ground I/O I/O I I I I I/O I/O Audio interfaces serial data output 2 Out / LOW Audio master clock output 1 JTAG Test Test Test SDRAM write enable SDRAM CAS Out / clock output X X X X Out / HIGH Out / HIGH I/O I/O O O I/O I/O I/O I/O SDRAM RAS SDRAM chip select out 0 SDRAM LDQM SDRAM UDQM SDRAM clock enable output SDRAM clock output Data Data Out / HIGH Out / HIGH Out / HIGH Out / HIGH Out / HIGH Out / HIGH X X SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 43 Pin-Out and Package Information Table 33. 144 QFP Pin Assignments (continued) 144 QFP Pin Number 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 Pin State After Reset Name Type Description PAD GND DATA29 DATA28 DATA27 DATA26 DATA25 PAD-VDD DATA24 DATA23 DATA22 DATA21 DATA20 PAD GND DATA19 DATA18 DATA17 I/O I/O I/O Data Data Data X X X I/O I/O I/O I/O I/O Data Data Data Data Data X X X X X I/O I/O I/O I/O I/O Data Data Data Data Data X X X X X 6.2 Package The SCF5250 is assembled in 144-pin QFP package. Thermal characteristics are not available at this time. SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 44 Freescale Semiconductor THIS PAGE INTENTIONALLY LEFT BLANK SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 45 THIS PAGE INTENTIONALLY LEFT BLANK SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 46 Freescale Semiconductor THIS PAGE INTENTIONALLY LEFT BLANK SCF5250 Integrated ColdFire® Microprocessor Data Sheet, Rev. 1.1 Freescale Semiconductor 47 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners.© Freescale Semiconductor, Inc. 2005. All rights reserved. Document Number: SCF5250EC Rev. 1.1 04/2005