MP111
Dying Gasp Storage and Release
Control IC
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The MP111 is a dying gasp storage and release
controller. It charges storage capacitor from the
input during normal operation. Once the storage
capacitor is charged to the selected voltage, the
charge is stopped, and the storage capacitor is
separated from the input. The charging circuit
maintains the storage voltage after the charge
is completed.
The MP111 keeps monitoring the input voltage,
and releases the charge from storage capacitor
to input capacitor when the input voltage is
lower than the selected release voltage. It
regulates the input voltage to keep it close to
release voltage for as long as possible.
APPLICATIONS
Wide 4.5V to 18V Input Operating Range
2.5A dumping current from Storage to VIN
Built-in 250mA Current Limit for Charging
Storage Capacitor
User Programmable Storage and Release
Voltage
Dying Gasp FLAG Indicator
Available in SOIC-8 package
Cable/DSL/PON Modems
Home Gateway
Access Point Networks
All MPS parts are lead-free, halogen free, and adhere to the RoHS
directive. For MPS green status, please visit MPS website under Quality
Assurance.
“MPS” and “The Future of Analog IC Technology” are Registered
Trademarks of Monolithic Power Systems, Inc.
The MP111 has built-in current limit circuit
during the charging up of the storage capacitors.
The storage and release voltage can be
programmed to user’s desired value by external
resistors.
The MP111 comes in an SOIC-8 package and
requires a minimum number of readily available
standard external components.
TYPICAL APPLICATION
C3
2.2nF
VIN
4.5V to 18V
C1
22
C2
15pF
R3
464k
3
BST
MP111
STRG
6
4
C4
22nF
VMAX
FB2
R4
49.9k
Open Drain
Output
8
2
VIN
1
VSTRG
23V
R1
845k
FB1
Connect
to SW
7
GASP
GND
R5
10
5
R2
37.4k
C5
2000
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
MP111 Rev. 1.0 1
3/4/2020
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1
MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
ORDERING INFORMATION
Part Number*
MP111DS
Package
SOIC-8
Top Marking
See Below
* For Tape & Reel, add suffix –Z (eg.MP111DS–Z);
For RoHS, compliant packaging, add suffix –LF (eg. MP111DS–LF–Z).
TOP MARKING
MP111: part number
LLLLLLLL: lot number
MPS; MPS prefix
Y: year code
WW: week code
PACKAGE REFERENCE
TOP VIEW
BST
1
8
VMAX
VIN
2
7
STRG
FB2
3
6
GASP
GND
4
5
FB1
SOIC-8
MP111 Rev. 1.0 1
3/4/2020
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance (4)
VIN ................................................... -0.3V to 22V
VBST.................................................. -0.3V to 40V
VBST-VIN………………………………-0.3V to 25V
VMAX ................................................. -0.3V to 42V
VMAX-VIN………………………….......-0.3V to 25V
VSTRG................................................ -0.3V to 32V
VSTRG-VIN……………………………..-0.3V to 25V
VPG, VGASP ........................................ -0.3V to 22V
All Other Pins ................................. -0.3V to 6.5V
Junction Temperature ............................... 150C
Lead Temperature .................................... 260C
Continuous Power Dissipation (TA = +25°C) (2)
............................................................... 1.2W
Junction Temperature ............................... 150C
SOIC-8 .................................... 90 ....... 45 ... C/W
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
Recommended Operating Conditions (3)
Supply Voltage VIN ........................... 4.5V to 18V
Storage Voltage VSTRG .........................................
................................Vin to 2×VIN-0.8V(32V max)
Operating Junction Temp. (TJ). -40°C to +125°C
MP111 Rev. 1.0 1
3/4/2020
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
ELECTRICAL CHARACTERISTICS
VIN = 12V, TA = 25C, unless otherwise noted.
Parameter
Symbol
Input Supply Voltage Range
VIN
Supply Current (Shutdown)
IIN
Supply Current (Quiescent)
IIN
VIN Under Voltage Lockout
Threshold Rising
VIN Under Voltage Lockout
Threshold Hysteresis
Feedback Voltage
Vstorage
Refresh
Threshold-High
Vstorage
Refresh
Threshold-Low
Vstorage
Refresh
Threshold-Hysteresis
Feedback Current
GASP High Threshold
GASP Low Threshold
IFB
VTHGASP
VTLGASP
GASP Delay
GASPTd
Condition
Min
Max
4.5
VEN = 0V
VEN = 2V, VFB = 1.1V
INUVVth
3.0
INUVHYS
18
0.95
VFB1_H
300
μA
3.5
4.0
1
V
mV
1.05
VFB-0.05 VFB-0.025
VFB1_Hys
V
μA
VFB+0.025 VFB+0.05
VFB1_L
Units
1
350
VFB
GASP Sink Current
VGASP
Capability
GASP Leakage Current
IGASP_LEAK
Input Inrush Current Limit
for
Charging
Storage IPRECHARGE_LIMIT
Capacitor
Current limit for Dumping
Charge from CSTORAGE to
IDUMP_LIMIT
VIN
Thermal Shutdown (5)
TSD
Thermal
Shutdown
THYS
Hysteresis (5)
Typ
V
V
V
50
mV
10
1.05
1
nA
VFB2
VFB2
2
μs
Sink 4mA
0.4
V
VGASP=3.3V
10
nA
0.25
A
2.5
A
150
ºC
30
ºC
VFB1= VFB2=1V
VIN=12V,
Charging
CSTORAGE from 0 to VIN
Notes:
5) Guaranteed by design.
MP111 Rev. 1.0 1
3/4/2020
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 12V, VSTORAGE = 23V, VRELEASE=10.2V, For DCDC Converter: POUT=5W, VOUT=3.3V, TA = +25ºC,
unless otherwise noted.
Release Time vs.
Storage Capacitance
Thermal Performance
12
P=1W
250
10
200
150
P=3W
100
50
P=5W
0
0
500
1000
1500 2000 2500
POWER LOSS (W)
RELEASE TIME (ms)
300
8
6
4
2
0
0.0001 0.001
0.01
0.1
1
10
MAXIMUM HOLD UP TIME (s)
MP111 Rev. 1.0 1
3/4/2020
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 12V, VSTORAGE = 23V, VRELEASE=10.2V, CSTOREGE=1000μF, For DCDC Converter: POUT=5W,
VOUT=3.3V, TA = +25ºC, unless otherwise noted.
VSTORAGE Charge Up
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
500mA/div.
VSTORAGE Refresh
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
VSTORAGE Release
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
Release Time vs. Power
Release Time vs. Power
Release Time vs. Power
POUT = 5W
POUT = 3W
POUT = 1W
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
IRELEASE
1A/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
IRELEASE
1A/div.
MP111 Rev. 1.0 1
3/4/2020
www.MonolithicPower.com
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
PIN FUNCTIONS
SOIC-8
Pin #
Name
1
BST
2
VIN
3
FB2
4
GND
5
6
7
8
FB1
GASP
STRG
VMAX
MP111 Rev. 1.0 1
3/4/2020
Description
Bootstrap. A capacitor and a resistor in series connected between this pin and DC/DC
converter’s SW node is required to charge storage capacitor.
Supply Voltage. The MP111 operates from a +4.5V to +18V input rail. Input decoupling
capacitor is needed to decouple the input rail.
Feedback to set release voltage.
System Ground. This pin is the reference ground of the regulated output voltage.
For this reason care must be taken in PCB layout. Suggested to be connected to
GND with copper and vias.
Feedback to set storage voltage.
Open drain output to indicate dying gasp operation is active.
Connect to storage capacitor for dying gasp storage and release operation.
Internal Supply. A 2.2nF ceramic capacitor is required for decoupling.
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
BLOCK DIAGRAM
VMAX
VSTORAGE
BST
Boost/Charge/
Release
Circuitry
VIN
FB2
Logic Control
FB1
GASP
GND
Figure 1 – Functional Block Diagram
MP111 Rev. 1.0 1
3/4/2020
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
OPERATION
MP111 is a dying gasp storage and release
control IC. It charges the storage capacitors
from input supply during power start up and
keeps refreshing the storage voltage at a
regulated value during normal operation.
MP111 continuously monitors the input voltage.
Once the input voltage is lower than the
programmed release voltage in case of losing
input power, it releases the charge from the
storage capacitors to input, and keeps the input
voltage regulated to the release voltage for as
long as possible. It allows the system to
respond to input power failure.
Start-Up
Release
MP111 keeps monitoring the input voltage.
Once the input voltage is lower than selected
release voltage in case of losing input power,
MP111 moves the charge from high voltage
storage capacitor to low input voltage capacitor.
The release voltage can be determined by
choosing appropriate input resistance divider.
The maximum LDO release current can be as
high as 2.5A. Until the storage capacitor voltage
is near the input voltage, the input voltage loses
its regulation and reduces further. A conceptual
release process of MP111 is shown in Figure 3.
Vstorage
During the power start-up, there are two periods
to charge the storage capacitors. In the first
period, the MP111 pre-charges the large
storage capacitors from 0 to nearly VIN with
built-in inrush current limit. Once the storage
voltage is close to the input voltage, the storage
voltage is boosted and regulated at target
voltage.
The BST pin of MP111 should connect to the
DCDC switch node. Only after the DCDC is
enabled, the MP111 will start boosting. Figure 2
shows the charging build-up process of MP111.
VIN
Vrelease
Input UVLO of DC/DC converter
GASP
t
Figure 3 – Timing of Releasing
Gasp Indicator
When the FB2 voltage, feedback voltage for the
input power, is higher than 1.05XVFB2, the
GASP pin will be pulled high. Connect a resistor
across VIN and GASP can drive GASP high.
When the FB voltage is lower than 1.00XVFB2,
the GASP voltage will be internally pulled low.
GASP voltage can be used as communication
indicator signal which states input power
availability.
Figure 2 – Timing of Charging
MP111 Rev. 1.0 1
3/4/2020
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
APPLICATION INFORMATION
SET STORAGE VOLTAGE
The storage voltage can be set by choosing
appropriate external feedback resistors R1 and
R2 which is shown in Figure 4.
Figure 5 – Release Feedback Circuit
Similarly, the release voltage is set by:
VRELEASE (1
Figure 4 – Feedback Circuit for Storage
Voltage
The storage voltage is determined by:
VSTORAGE (1
R1
) VFB1
R2
Here is the example, if the storage voltage is
set to be 20V, choose R2 to be 40kΩ, R1 will be
then given by:
R1
40k (20 VFB2 )
760k
VFB2
Table 1 lists the recommended resistors for
different storage voltages.
Table 1 – Resistor Selection for Different
Storage Voltages
VSTORAGE (V)
15
19
23
R1 (kΩ)
750
750
850
R2 (kΩ)
53.2
41.6
37.4
Select Release Voltage and Input Capacitors
The release voltage can be set by choosing
external feedback resistors R3 and R4 which is
shown in Figure 5.
R3
) VFB2
R4
However, the selection of R3 and R4 not only
determines the release voltage, but impacts the
stability. Generally, choosing R3 to be
300~500kΩ is recommended for a stable
performance with 47μF Cin. Table 2 lists the
recommended resistors setup for different
release voltages.
Table 2 – Resistor Selection for Different
Release Voltages
VRELEASE
(V)
11
10.2
9.0
R1
(kΩ)
475
464
324
R2
(kΩ)
47.5
49.9
40.2
Cf
(pF)
15
15
15
Cin
(μF)
47
47
47
Select Storage Capacitor
The Storage Capacitor is for energy storage
during normal operation and the energy will be
released to VIN in case of losing input power.
Typically, a general purpose electrolytic
capacitor is recommended.
The voltage rating of storage capacitor needs to
be higher than the targeted storage voltage.
The voltage rating of storage capacitor can be
fully utilized since the voltage on storage
capacitor is very stable during normal operation.
There will be less ripple current/voltage for most
of the time during normal operation. The ripple
current rating of storage cap can be less
consideration.
The needed capacitance is dependent on how
long the dying gasp time based on typically
MP111 Rev. 1.0 1
3/4/2020
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
application. Assume the input release current is
IRELEASE when input voltage is regulated at
VRELEASE for the DCDC converter. The storage
voltage of MP111 is VSTORAGE, and the required
dying gasp time is TDASP. The necessary storage
capacitance can be calculated as following
equation:
Cs
IRELEASE TDASP
VSTORAGE VRELEASE
TD=20ms,
VSTORAGE=20V,
If
IRELEASE=1A,
VRELEASE=10V, the needed storage capacitance is
2000μF. Generally, the storage capacitance
should be chosen a little bit large to avoid
capacitance reduction at high voltage offset.
In typical xDSL applications using a 12V input
supply, it is recommended to set the storage
voltage higher than 20V to fully utilize the high
voltage
energy
and
minimize
storage
capacitance requirements. Generally, a 25V
rated electrolytic capacitor can be used. The
lifetime of electrolytic capacitors can be severely
impacted by both environmental and electrical
factors. One of the most critical electrical factors
is the AC RMS ripple current through the
capacitor which leads to increased capacitor core
temperatures. Normally, for typical industrial uses,
it is recommended to derate the capacitor voltage
rating by as much as 70%-80%. For example, a
25V rated electrolytic capacitor would be used for
a 16V to 20V application.
However, since the MP111 tightly regulates the
storage voltage, the storage capacitor almost has
no AC ripple current going through it. The
resulting refresh rate of the MP111 is very low
which allows customers to safely use a 90%
capacitor derating (6). For example, a 25V
electrolytic capacitor, can safely handle a storage
voltage of up to 22V. Table 3 is some
recommended storage electrolytic capacitors
which can be used in typical xDSL application
PCB Layout Guide
PCB layout is very important to achieve stable
operation. Please follow these guidelines and
take the EVB board layout for references.
1) Connect the BST pin as close as possible to
the SW node of DCDC converter through a
resistor and a small ceramic capacitor. Try to
avoid interconnect the feedback path.
2) Ensure all feedback connections are short
and direct. Place the feedback resistors and
compensation components as close to the
chip as possible.
3) Keep the connection of the storage
capacitors and STRG pin as short and wide
as possible.
Table 3 – Recommended Storage Capacitors
Part #
25ME1500WX
PEH526HAB4270M3
EEUFR1E152B
Vender
Sanyo
Kemet
Panasonic
Capacitance
1500μF
2700μF
1500μF
Voltage
25V
25V
25V
Operating Temp
-40 to +105C
-40 to +105C
-40 to +105C
Notes:
6) “Applying voltage does not affect the life time because the self heating by applying voltage can be ignored”, from Sanyo.
MP111 Rev. 1.0 1
3/4/2020
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MP111 – DYING GASP STORAGE AND RELEASE CONTROL IC
TYPICAL APPLICATION CIRCUITS
VIN
4.5V to 18V
C3
2.2nF
C2
15pF
C1
22
R3
464 k
VMAX
STRG
VIN
FB2
R5
10k
MP111
R4
49.9k
R1
845k
C5
2000
FB1
R2
37.4k
GASP
GND
VSTRG
23V
C4
22nF
R5
10
BST
SW
VIN
MPS DC/DC
converter
VOUT
Figure 6 – MP111 Application Circuit
MP111 Rev. 1.0 1
3/4/2020
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MP200 – DYING GASP STORAGE AND RELEASE CONTROL IC
PACKAGE INFORMATION
SOIC-8
0.189(4.80)
0.197(5.00)
8
0.050(1.27)
0.024(0.61)
5
0.063(1.60)
0.150(3.80)
0.157(4.00)
PIN 1 ID
1
0.228(5.80)
0.244(6.20)
0.213(5.40)
4
TOP VIEW
RECOMMENDED LAND PATTERN
0.053(1.35)
0.069(1.75)
SEATING PLANE
0.004(0.10)
0.010(0.25)
0.013(0.33)
0.020(0.51)
0.0075(0.19)
0.0098(0.25)
SEE DETAIL "A"
0.050(1.27)
BSC
SIDE VIEW
FRONT VIEW
0.010(0.25)
x 45o
0.020(0.50)
GAUGE PLANE
0.010(0.25) BSC
0o-8o
0.016(0.41)
0.050(1.27)
DETAIL "A"
NOTE:
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN
BRACKET IS IN MILLIMETERS.
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS.
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH
OR PROTRUSIONS.
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.004" INCHES MAX.
5) DRAWING CONFORMS TO JEDEC MS-012, VARIATION AA.
6) DRAWING IS NOT TO SCALE.
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP111 Rev. 1.01
3/4/2020
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