MP201
Dying Gasp Storage and Release
Control IC
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The MP201 is a dying gasp storage and release
controller. It charges storage capacitor from the
input during normal operation. Once the storage
capacitor is charged to the selected voltage, the
charge is stopped, and the storage capacitor is
separated from the input. The charging circuit
maintains the storage voltage after the charge
is completed.
•
•
•
•
•
•
The MP201 keeps monitoring the input voltage,
and releases the charge from storage capacitor
to input capacitor when the input voltage is
lower than the selected release voltage. It
regulates the input voltage to keep it close to
release voltage for as long as possible.
Wide 4.5V to 18V Input Operating Range
2.5A dumping current from Storage to VIN
Built-in 260mA Current Limit for Charging
Storage Capacitor
User Programmable Storage and Release
Voltage
Dying Gasp FLAG Indicator
Available in SOIC-8 package
APPLICATIONS
•
•
•
Cable/DSL/PON Modems
Home Gateway
Access Point Networks
All MPS parts are lead-free and adhere to the RoHS directive. For MPS green
status, please visit MPS website under Products, Quality Assurance page.
The MP201 has built-in current limit circuit
during the charging up of the storage capacitors.
The storage and release voltage can be
programmed to user’s desired value by external
resistors.
“MPS” and “The Future of Analog IC Technology” are registered trademarks of
Monolithic Power Systems, Inc.
The MP201 comes in an SOIC-8 package and
requires a minimum number of readily available
standard external components.
TYPICAL APPLICATION
C3
2.2nF
VIN
4.5V to 18V
C1
47
C2
15pF
R3
464k
8
2
VIN
3
BST
FB2
R4
MP201
STRG
Open Drain
Output
6
4
MP201 Rev. 1.01
11/27/2012
C4
22nF
VMAX
1
GND
Connect
to SW
VSTRG
23V
7
R1
845k
GASP
FB1
R5
10
5
R2
37.4k
C5
1000
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
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© 2012 MPS. All Rights Reserved.
1
MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
ORDERING INFORMATION
Part Number*
MP201DS
Package
SOIC-8
Top Marking
MP201
* For Tape & Reel, add suffix –Z (eg.MP201DS–Z);
For RoHS compliant packaging, add suffix –LF (e.g. MP201DS–LF–Z)
PACKAGE REFERENCE
TOP VIEW
BST
1
8
VMAX
VIN
2
7
STRG
FB2
3
6
GASP
GND
4
5
FB1
SOIC-8
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
VIN ..................................................-0.3V to 22V
VBST. ................................................-0.3V to 40V
VBST-VIN………………………………-0.3V to 25V
VMAX.................................................-0.3V to 42V
VMAX-VIN………………………….......-0.3V to 25V
VSTRG ...............................................-0.3V to 32V
VSTRG-VIN……………………………..-0.3V to 25V
VGASP ...............................................-0.3V to 22V
All Other Pins .................................-0.3V to 6.5V
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
(2)
Continuous Power Dissipation (TA = +25°C)
........................................................... 1.39W
Junction Temperature ...............................150°C
SOIC-8.................................... 90 ...... 45... °C/W
Recommended Operating Conditions
(4)
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
(3)
Supply Voltage VIN ...........................4.5V to 18V
Storage Voltage VSTRG ........................................
................................Vin to 2×VIN-0.8V(32V max)
Operating Junction Temp. (TJ). -40°C to +125°C
MP201 Rev. 1.01
11/27/2012
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© 2012 MPS. All Rights Reserved.
2
MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
ELECTRICAL CHARACTERISTICS (5)
VIN = 12V, TA = 25°C, unless otherwise noted.
Parameter
Symbol
Input Supply Voltage Range
Supply Current (Quiescent)
VIN Under Voltage Lockout
Threshold Rising
VIN Under Voltage Lockout
Threshold Hysteresis
VIN
IIN
Condition
Min
Typ
Max
Units
250
18
300
V
μA
3.0
3.5
V
4.5
VFB = 1.1V
INUVVth
2.5
250
INUVHYS
mV
Storage Feedback Voltage
VFB1
0.97
1
1.03
V
Release Feedback Voltage
Vstorage Refresh
Threshold-High
Vstorage Refresh
Threshold-Low
Vstorage Refresh
Threshold-Hysteresis
Feedback Current
GASP High Threshold(6)
GASP Low Threshold(6)
VFB2
0.97
1
1.03
V
1.025
1.05
V
GASP Rising Delay Time
GASP Falling Delay Time
VFB1_H
0.95
VFB1_L
VFB1_Hys
IFB
VTHGASP
VTLGASP
VFB1= VFB2=1V
V
50
mV
10
1.05
1
GASPTdR
GASPTdF
GASP Sink Current
VGASP
Capability
GASP Leakage Current
IGASP_LEAK
Input Inrush Current Limit
IPRECHARGE_LIMIT
for Charging Storage
Capacitor
Current limit for Dumping
IDUMP_LIMIT
Charge from CSTORAGE to
VIN
Thermal Shutdown(7)
TSD
Thermal Shutdown
THYS
Hysteresis(7)
0.975
50
nA
V
V
73
μs
0.7
μs
Sink 4mA
0.2
0.3
V
VGASP=3.3V
0.01
0.1
uA
0.2
0.26
0.33
A
2
2.5
3
A
VIN=12V, Charging CSTORAGE
from 0 to VIN
150
ºC
30
ºC
Notes:
5) Production test at +25°C. Specifications over the temperature range are guaranteed by design and characterization.
6) This voltage is FB2 voltage.
7) Guaranted by design
MP201 Rev. 1.01
11/27/2012
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© 2012 MPS. All Rights Reserved.
3
MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
PIN FUNCTIONS
Pin #
Name
1
BST
2
VIN
3
FB2
4
GND
5
6
7
8
FB1
GASP
STRG
VMAX
MP201 Rev. 1.01
11/27/2012
Description
Bootstrap. A capacitor and a resistor in series connected between this pin and DC/DC
converter’s SW node is required to charge storage capacitor.
Supply Voltage. The MP201 operates from a +4.5V to +18V input rail. Input decoupling
capacitor is needed to decouple the input rail.
Feedback to set release voltage.
System Ground. This pin is the reference ground of the regulated output voltage.
For this reason care must be taken in PCB layout. Suggested to be connected to
GND with copper and vias.
Feedback to set storage voltage.
Open drain output to indicate dying gasp operation is active.
Connect to storage capacitor for dying gasp storage and release operation.
Internal Supply. A 2.2nF ceramic capacitor is required for decoupling.
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© 2012 MPS. All Rights Reserved.
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MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
TYPICAL CHARACTERISTICS
VIN = 12V, VSTORAGE = 23V, VRELEASE=10.2V, For DCDC Converter: POUT=5W, VOUT=3.3V, TA = +25ºC,
unless otherwise noted.
Thermal Performance
300
12
250
10
200
8
150
6
100
4
50
2
0
0
500
MP201 Rev. 1.01
11/27/2012
1000
1500 2000 2500
0
0.0001 0.001
IRELEASE (A)
Release Time vs.
Storage Capacitance
0.01
0.1
1
10
3
2.8
2.6
2.4
2.2
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
5
Safe Operation Area
10
15
20
25
VOLTAGE BETWEEN
STRG PIN AND VIN PIN (V)
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© 2012 MPS. All Rights Reserved.
30
5
MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 12V, VSTORAGE = 23V, VRELEASE=10.2V, For DCDC Converter: POUT=5W, VOUT=3.3V, TA = +25ºC,
unless otherwise noted.
VSTORAGE Charge Up
VSTORAGE Release
VSTORAGE Refresh
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
500mA/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
500mA/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
500mA/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
VSTORAGE
5V/div.
VIN
5V/div.
GASP
10V/div.
IRELEASE
1A/div.
MP201 Rev. 1.01
11/27/2012
www.MonolithicPower.com
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© 2012 MPS. All Rights Reserved.
6
MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
BLOCK DIAGRAM
VMAX
VSTORAGE
BST
Boost/Charge/
Release
Circuitry
VIN
FB2
Logic Control
FB1
GASP
GND
Figure 1 – Functional Block Diagram
MP201 Rev. 1.01
11/27/2012
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© 2012 MPS. All Rights Reserved.
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MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
OPERATION
MP201 is a dying gasp storage and release
control IC. It charges the storage capacitors
from input supply during power start up and
keeps refreshing the storage voltage at a
regulated value during normal operation.
MP201 continuously monitors the input voltage.
Once the input voltage is lower than the
programmed release voltage in the case of
losing input power, it releases the charge from
the storage capacitors to input, and keeps the
input voltage regulated to the release voltage
for as long as possible. It allows the system to
respond to input power failure.
Start-Up
During the power start-up, there are two periods
to charge the storage capacitors. In the first
period, the MP201 pre-charges the large
storage capacitors from 0 to nearly VIN with
built-in inrush current limit. Once the storage
voltage is close to the input voltage, the storage
voltage is boosted and regulated at target
voltage.
The BST pin of MP201 should connect to the
DCDC switch node. Only after the DCDC is
enabled, the MP201 will start boosting. Figure 2
shows the charging build-up process of MP201.
VIN
Release
MP201 keeps monitoring the input voltage.
Once the input voltage is lower than selected
release voltage in the case of losing input
power, MP201 moves the charge from high
voltage storage capacitor to low input voltage
capacitor. The release voltage can be
determined by choosing appropriate input
resistance divider. The maximum LDO release
current can be as high as 2.5A. Until the
storage capacitor voltage is near the input
voltage, the input voltage loses its regulation
and reduces further. A conceptual release
process of MP201 is shown in Figure 3.
Vstorage
VIN
Vrelease
Input UVLO of DC/DC converter
GASP
t
Figure 3 – Timing of Releasing
Gasp Indicator
EN of DC/DC
Output of DCDC
Storage Voltage
VIN
Target storage voltage
When the FB2 voltage, feedback voltage for the
input power, is higher than 1.05XVFB2, the
GASP pin will be pulled high. Connect a resistor
across VIN and GASP can drive GASP high.
When the FB2 voltage is lower than 1.00XVFB2,
the GASP voltage will be internally pulled low.
GASP voltage can be used as a communication
indicator signal which states input power
availability.
Pre-Charge w/ current limit
Figure 2 – Timing of Charging
MP201 Rev. 1.01
11/27/2012
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© 2012 MPS. All Rights Reserved.
8
MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
APPLICATION INFORMATION
SET STORAGE VOLTAGE
VIN
The storage voltage can be set by choosing
appropriate external feedback resistors R1 and
R2 which is shown in Figure 4.
R3
Cf
FB2
Cin
R4
STRG
R1
FB1
Cstorage
Figure 5 – Release Feedback Circuit
Similarly, the release voltage is set by:
R2
VRELEASE = (1 +
Figure 4 – Feedback Circuit for Storage
Voltage
The storage voltage is determined by:
VSTORAGE = (1 +
R1
) × VFB1
R2
Here is the example, if the storage voltage is
set to be 20V, choose R2 to be 40kΩ, R1 will be
then given by:
R1 =
40kΩ × (20 − VFB2 )
= 760kΩ
VFB2
Table 1 lists the recommended resistors for
different storage voltages.
Table 1 – Resistor Selection for Different
Storage Voltages
VSTORAGE(V)
15
19
23
R1 (kΩ)
750
750
845
R2 (kΩ)
53.2
41.6
37.4
Select Release Voltage and Input Capacitors
The release voltage can be set by choosing
external feedback resistors R3 and R4 which is
shown in Figure 5.
R3
) × VFB2
R4
However, the selection of R3 and R4 not only
determines the release voltage, but impacts the
stability. Generally, choosing R3 to be
300~500kΩ is recommended for a stable
performance with 47μF Cin. Table 2 lists the
recommended resistors setup for different
release voltages.
Table 2 – Resistor Selection for Different
Release Voltages
VRELEASE
(V)
11
10.2
9.0
R3
(kΩ)
475
464
324
R4
(kΩ)
47.5
49.9
40.2
Cf
(pF)
15
15
15
CIN
(μF)
47
47
47
Select Storage Capacitor
The Storage Capacitor is for energy storage
during normal operation and the energy will be
released to VIN in case of losing input power.
Typically, a general purpose electrolytic
capacitor is recommended.
The voltage rating of storage capacitor needs to
be higher than the targeted storage voltage.
The voltage rating of storage capacitor can be
fully utilized since the voltage on storage
capacitor is very stable during normal operation.
There will be less ripple current/voltage for most
of the time during normal operation. The ripple
current rating of storage cap can be less
consideration.
The needed capacitance is dependent on how
long the dying gasp time based on typically
MP201 Rev. 1.01
11/27/2012
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© 2012 MPS. All Rights Reserved.
9
MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
application. Assume the input release current is
IRELEASE when input voltage is regulated at
VRELEASE for the DCDC converter. The storage
voltage of MP201 is VSTORAGE, and the required
dying gasp time is TDASP. The necessary storage
capacitance can be calculated as following
equation:
Cs =
IRELEASE × TDASP
VSTORAGE − VRELEASE
If
IRELEASE=1A,
TD=20ms,
VSTORAGE=20V,
VRELEASE=10V, the needed storage capacitance is
2000μF. Generally, the storage capacitance
should be chosen a little bit large to avoid
capacitance reduction at high voltage offset.
In typical xDSL applications using a 12V input
supply, it is recommended to set the storage
voltage higher than 20V to fully utilize the high
voltage
energy
and
minimize
storage
capacitance requirements. Generally, a 25V
rated electrolytic capacitor can be used. The
lifetime of electrolytic capacitors can be severely
impacted by both environmental and electrical
factors. One of the most critical electrical factors
is the AC RMS ripple current through the
capacitor which leads to increased capacitor core
temperatures. Normally, for typical industrial uses,
it is recommended to derate the capacitor voltage
rating to 70%-80%. For example, a 25V rated
electrolytic capacitor would be used for a 16V to
20V application.
However, since the MP201 tightly regulates the
storage voltage, the storage capacitor almost has
no AC ripple current going through it. The
resulting refresh rate of the MP201 is very low
which allows customers to safely use a 90%
capacitor derating (8). For example, a 25V
electrolytic capacitor, can safely handle a storage
voltage of up to 22V. Table 3 is some
recommended storage electrolytic capacitors
which can be used in typical xDSL application
PCB Layout Guide
PCB layout is very important to achieve stable
operation. Please follow these guidelines and
take the EVB board layout for references.
1) Connect the BST pin as close as possible to
the SW node of DCDC converter through a
resistor and a small ceramic capacitor. Try to
avoid interconnect the feedback path.
2) Ensure all feedback connections are short
and direct. Place the feedback resistors and
compensation components as close to the
chip as possible.
3) Keep the connection of the storage
capacitors and STRG pin as short and wide
as possible.
Table 3 – Recommended Storage Capacitors
Part #
25ME1500WX
PEH526HAB4270M3
EEUFR1E152B
Vender
Sanyo
Kemet
Panasonic
Capacitance
1500μF
2700μF
1500μF
Voltage
25V
25V
25V
Operating Temp
-40 to +105°C
-40 to +105°C
-40 to +105°C
Notes:
8) “Applying voltage does not affect the life time because the self heating by applying voltage can be ignored”, from Sanyo.
Design Example
Below is a design example following the
application guidelines for the specifications:
Table 4: Design Example
VIN
VS
VRELEASE
MP201 Rev. 1.01
11/27/2012
12V to 18V
23V
10.2V
The detailed application schematic is shown in
Figure 6. The typical performance and circuit
waveforms have been shown in the Typical
Performance Characteristics section. For more
device applications, please refer to the related
Evaluation Board Datasheets.
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© 2012 MPS. All Rights Reserved.
10
MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
TYPICAL APPLICATION CIRCUITS
VIN
12V to 18V
C3
2.2nF
C2
15pF
C1
22
R3
464 k
VMAX
STRG
VIN
FB2
R5
10k
MP201
R4
49.9k
R1
845k
C5
1000
FB1
R2
37.4k
GASP
GND
VSTRG
23V
C4
22nF
BST
R5
10
SW
VIN
MPS DC/DC
converter
VOUT
Figure 6 – MP201 Application Circuit
MP201 Rev. 1.01
11/27/2012
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© 2012 MPS. All Rights Reserved.
11
MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC
PACKAGE INFORMATION
SOIC8
0.189(4.80)
0.197(5.00)
8
0.050(1.27)
0.024(0.61)
5
0.063(1.60)
0.150(3.80)
0.157(4.00)
PIN 1 ID
1
0.228(5.80)
0.244(6.20)
0.213(5.40)
4
TOP VIEW
RECOMMENDED LAND PATTERN
0.053(1.35)
0.069(1.75)
SEATING PLANE
0.004(0.10)
0.010(0.25)
0.013(0.33)
0.020(0.51)
0.0075(0.19)
0.0098(0.25)
SEE DETAIL "A"
0.050(1.27)
BSC
SIDE VIEW
FRONT VIEW
0.010(0.25)
x 45o
0.020(0.50)
GAUGE PLANE
0.010(0.25) BSC
0o-8o
0.016(0.41)
0.050(1.27)
DETAIL "A"
NOTE:
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN
BRACKET IS IN MILLIMETERS.
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS.
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH
OR PROTRUSIONS.
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.004" INCHES MAX.
5) DRAWING CONFORMS TO JEDEC MS-012, VARIATION AA.
6) DRAWING IS NOT TO SCALE.
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP201 Rev. 1.01
11/27/2012
www.MonolithicPower.com
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2012 MPS. All Rights Reserved.
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