MP28167
2.8V-22V VIN, 3A IOUT, 4-Switch
Integrated Buck-Boost Converter
with Fixed 5V Output
DESCRIPTION
FEATURES
The MP28167 is a synchronous, 4-switch,
integrated buck-boost converter, capable of
regulating the output voltage across a 2.8V to
22V wide input voltage range with high
efficiency.
The MP28167 uses constant-on-time control in
buck mode and constant-off-time control in boost
mode, providing fast load transient response as
well as smooth buck-boost mode transient. The
MP28167 provides forced PWM switching mode
and programmable output CC (constant current)
limit, which supports flexible design for different
applications.
Full protection features include over-current
protection (OCP), over-voltage protection
(OVP), under-voltage protection (UVP), and
thermal shutdown.
Wide 2.8V to 22V Operating Input Voltage
Range
Fixed 5V Output Voltage
3A Output Current or 4A Input Current
130mV Line Drop Compensation
500kHz Fixed Switching Frequency
Forced PWM Switching Mode
Four Low RDS(ON) Internal Buck Power
MOSFETs
Adjustable Accurate CC Output Current
Limit with Internal Sensing FET
Output Over-Voltage Hiccup Protection
Output Short-Circuitry Hiccup Protection
Over-Temperature Shutdown
EN Shutdown Discharge Function
Available in a QFN-16 (3mmx3mm) Package
APPLICATIONS
The MP28167 is available in a 16-pin QFN
(3mmx3mm) package.
Buck-Boost Bus Supply
All MPS parts are lead-free, halogen free, and adhere to the RoHS directive. For
MPS green status, please visit the MPS website under Quality Assurance. “MPS,”
the MPS logo, and “Simple, Easy Solutions” are registered trademarks of
Monolithic Power Systems, Inc. or its subsidiaries.
TYPICAL APPLICATION
Efficiency vs. Output Current
C4
100nF
BST1
SW1
IN
C1
100µF
BST2
C1A
22µF
C5
95
100nF
SW2
R3
499k
VOUT
OUT
EN
C2A
10µFx2
MP28167
C7
22nF
NC
NC
RSV1
RSV2
VCC
C3
1µF
AGND
GND
R1
21.5k
MP28167 Rev 1.0
4/29/2019
100
4.7µH
OC
+
C2
100µF
EFFICIENCY (%)
VIN
12V
+
VIN = 12V, VOUT = 5V, L = 4.7µH, RDC = 19.7mΩ
L1
90
85
80
75
70
65
C6
22nF
60
0.01
0.1
1
OUTPUT CURRENT (A)
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10
1
MP28167 – 22V VIN, 3A IOUT INTEGRATED BUCK-BOOST CONVERTER
ORDERING INFORMATION
Part Number*
Package
Top Marking
MP28167GQ
QFN-16 (3mmx3mm)
See Below
* For Tape & Reel, add suffix –Z (e.g. MP28167GQ–Z).
TOP MARKING
BJH: Product code of MP28167GQ
Y: Year code
LLL: Lot number
PACKAGE REFERENCE
TOP VIEW
BST1 SW1
16
IN
SW2
BST2
OUT
1
GND
GND
EN
AGND
NC
VCC
RSV1 RSV2
OC
NC
QFN-16 (3mmx3mm)
MP28167 Rev 1.0
4/29/2019
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© 2019 MPS. All Rights Reserved.
2
MP28167 – 22V VIN, 3A IOUT INTEGRATED BUCK-BOOST CONVERTER
PIN FUNCTIONS
Pin #
Name
1
IN
2, 11
GND
3
EN
4, 8
5
6
7
9
10
12
NC
RSV1
RSV2
OC
VCC
AGND
OUT
13
BST2
14
SW2
15
SW1
16
BST1
MP28167 Rev 1.0
4/29/2019
Description
Supply voltage. IN is the drain of the internal power device and provides power
to the entire chip. The MP28167 operates from a 2.8V to 22V input voltage. A
capacitor (CIN) is required to prevent large voltage spikes from appearing at the
input. Place CIN as close to the IC as possible.
Power ground. GND is the reference ground of the regulated output voltage.
GND requires extra care during PCB layout. Connect GND with copper traces
and vias.
On/off control for entire chip. Drive EN high to turn on the chip. Drive EN low
or float EN to turn off the device. EN has an internal 2MΩ pull-down resistor to
ground.
No connection. These pins should be connected to GND.
Reserved pin. This pin cannot be floated. It can be tied to GND or VCC.
Reserved pin. This pin cannot be floated. It can be tied to GND or VCC.
Output constant current limit set pin.
Internal 3.65V LDO regulator output. Decouple VCC with a 1µF capacitor.
Analog ground. Connect AGND to GND.
Output power pin. Place the output capacitor close to OUT and GND.
Bootstrap. Connect a 0.1µF capacitor between SW2 and BST2 to form a
floating supply across the high-side switch driver.
Switching node of the second half-bridge. Connect one end of the inductor
to SW2 for the current to run through the bridge.
Switching node of the first half-bridge. Connect one end of the inductor to
SW1 for the current to run through the bridge.
Bootstrap. Connect a 0.1µF capacitor between SW1 and BST1 to form a
floating supply across the high-side switch driver.
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3
MP28167 – 22V VIN, 3A IOUT INTEGRATED BUCK-BOOST CONVERTER
θJA
θJC
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
Supply voltage (VIN, VOUT) ............................ 24V
VSW1, SW2 ..............................................................
-0.3V (-7V for VOUT)
When the input voltage is significantly higher
than the output voltage, the MP28167 works in
buck mode. In buck mode, SWA and SWB
switch for the buck regulation, while SWC is off
MP28167 Rev 1.0
4/29/2019
Figure 5: Boost Waveform
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13
MP28167 – 22V VIN, 3A IOUT INTEGRATED BUCK-BOOST CONVERTER
Buck-Boost Mode (VIN ≈ VOUT)
When VIN is close to VOUT, the converter may not
be able to provide enough energy to work in buck
mode due to SWA’s minimum off time, or the
converter may supply too much power to VOUT in
boost mode due to SWC’s minimum on time. The
MP28167 uses buck-boost control to regulate
the output in these conditions.
In buck mode, if VIN drops and the SWA off
period is close to the buck minimum off time,
buck-boost mode is engaged. When the next
cycle starts after the SWA and SWD on period
(buck HS-FET on period), boost starts with SWA
and SWC on (boost LS-FET on). Then, SWA and
SWD turn on again for the rest of the boost
period (boost HS-FET on).
After the boost period elapses, the buck period
starts and SWB and SWD remain on until the
inductor current drops to the COMP voltage.
Then SWA and SWD turn on until next the boost
period starts. This repeated process in which the
buck and boost switching work with one interval
period is called buck-boost mode.
In boost mode, if VIN rises and the SWC on
period is close to the boost minimum on time,
buck-boost mode is engaged. After the boost
constant-off-time period (SWA and SWD on),
SWB and SWD remain on until the inductor
current signal drops to the COMP voltage, just
like a buck off period control.
After the inductor current signal triggers the
COMP voltage, SWA and SWD turn on for the
buck on time, which is followed by one boost
switching (SWA and SWC on), and buck and
boost repeat switching work with one interval.
Figure 6 shows the buck-boost waveform for
both VIN > VOUT and VIN < VOUT conditions.
SW1
tBoo st-Min
SW2
Buck min off time
IL
COMP
Buck
Buck-Boo st
tBuck-Boo st
SW1
tBuck-Min
SW2
Boo st min on time
COMP
IL
Boo st Buck-Boo st
tBuck-Boo st
(b) Boost to Buck-Boost Transient
Figure 6: Buck-Boost Waveform
In buck-boost mode, if VIN exceeds 130% of
VOUT, the MP28167 shifts from buck-boost mode
to buck mode. If VIN is below 20% of VOUT, it shifts
from buck-boost mode to boost mode.
Working Mode – FCCM (or Forced PWM)
Mode
The MP28167 works in forced PWM mode with
fixed frequency. In FCCM conditions, the buck
on time and boost off time are determined by an
internal circuit to get a fixed frequency based on
the VIN/VOUT ratio. When the load decreases, the
average input current drops and the inductor
current may go to negative from VOUT to VIN
during the off time (SWD on). This forces the
inductor current to work in continuous mode with
fixed frequency, and can produce a lower VOUT
ripple.
Internal VCC Regulator
The 3.65V internal regulator powers most of the
internal circuitries. This regulator takes VIN and
operates in the full VIN range. When VIN exceeds
3.65V, the output of the regulator is in full
regulation. If VIN is less than 3.65V, the output
decreases with VIN. The VCC requires an
external 1µF ceramic decoupling capacitor.
Enable Control (EN)
The MP28167 has an enable control (EN). Pull
EN high to enable the IC. Pull EN low or float to
disable the IC.
Under-Voltage Lockout (UVLO)
Under-voltage lockout (UVLO) protects the chip
from operating at an insufficient supply voltage.
The UVLO comparator monitors the input
voltage, and enables or disables the whole IC.
(a) Buck to Buck-Boost Transient
MP28167 Rev 1.0
4/29/2019
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14
MP28167 – 22V VIN, 3A IOUT INTEGRATED BUCK-BOOST CONVERTER
Internal Soft Start (SS)
The soft start (SS) prevents the converter output
voltage from overshooting during start-up. When
the chip starts up, the internal circuitry generates
a SS voltage that ramps up from 0V to 3.65V.
When SS is lower than VREF, the error amplifier
uses SS as the reference. When SS is higher
than VREF, the error amplifier uses VREF as the
reference.
If the output of the MP28167 is pre-biased to a
certain voltage during start-up, the IC disables
the switching of both the high-side and low-side
switches until the voltage on the internal SS
capacitor exceeds the internal feedback voltage
(see Figure 7).
EN
90%
VOUT
tDELA Y
Figure 7: EN On to VOUT > 90% Delay
Output Constant Current Limit (OCP)
The MP28167 has a constant current limit
control loop to limit the output average current.
The current information is sensed from switches
A, B, C, and D. Then an average algorithm is
used to calculate the output current.
When the output current exceeds the currentlimit threshold, the output voltage starts to drop.
If VOUT drops below the under-voltage (UV)
threshold (typically 50% below the reference),
the MP28167 enters hiccup mode. The part
stops switching and recovers automatically with
12.5% duty cycles.
Over-Voltage Protection (OVP)
The MP28167 monitors a resistor-divided
feedback voltage to detect output over-voltage.
When the feedback voltage exceeds 160% of the
MP28167 Rev 1.0
4/29/2019
target voltage, the OVP comparator output goes
high and the output to ground discharge resistor
turns on.
The OUT pin has an absolute OVP function.
Once the OUT voltage exceeds the absolute
OVP threshold (23V), the MP28167 stops
switching and turns on the output to ground
discharge resistor.
Start-Up and Shutdown
If both VIN and EN exceed their respective
thresholds, the chip is enabled. The reference
block starts first, generating a stable reference
voltage and current, and then the internal
regulator is enabled. The regulator provides a
stable supply for the remaining circuitries.
Several events can shut down the chip: EN low,
VIN low, and thermal shutdown. In shutdown, the
signaling path is blocked to avoid any fault
triggering. Then the COMP voltage and the
internal supply rails are pulled down. The floating
driver is not subject to this shutdown command.
Output Discharge
The MP28167 has an output discharge function
that provides a resistive discharge path for the
external output capacitor. The function is active
when the part is disabled (input voltage is under
UVLO or EN is off), and the discharge path turns
off when VOUT < 50mV or the 50ms maximum
timer is reached.
Thermal Shutdown (TSD)
Thermal shutdown prevents the part from
operating at exceedingly high temperatures.
When the silicon die temperature exceeds
150°C, the entire chip shuts down. When the
temperature falls below its lower threshold
(typically 130°C), the chip is enabled. This is a
non-latch protection.
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15
MP28167 – 22V VIN, 3A IOUT INTEGRATED BUCK-BOOST CONVERTER
APPLICATION INFORMATION
Component Selection
The Over-Current Limit Set (RSET)
The MP28167 current-limit value should be
greater than the normal maximum load current,
allowing the tolerances in the current-sense
value. The current limit can be determined with
Equation (1):
RSET (k)=
75.24
I _ limit(A)
(1)
This also provides the theory result.
Table 1 lists the recommended ILIM setting
resistor and capacitor values, based on the EVB.
Table 1: R_OC vs. I_LIMIT
R_OC (kΩ)
75
64.9
54.9
44.2
37.4
30
21.5
15
C_OC (nF)
6.8
6.8
8.2
10
12
15
22
33
I_LIMIT (A)
0.98
1.15
1.37
1.72
2.04
2.54
3.56
5.11
Selecting the Inductor
As one buck-boost topology circuit, the inductor
must support buck applications with the
maximum input voltage, and boost applications
with the minimum input voltage. Two critical
inductance values can be determined, according
to the buck mode and boost mode current ripples,
using Equation (2) and Equation (3):
LMINBUCK
LMINBOOST
VOUT (VIN(MAX) VOUT )
VIN(MAX) fREQ IL
VIN(MIN) (VOUT VIN(MIN) )
VOUT fREQ IL
In addition to the inductance value, to avoid
saturation, the inductor must support the peak
current, based on Equation (4) and Equation (5):
IPEAK BUCK IOUT
IPEAK BOOST
VOUT (VIN(MAX) VOUT )
2 VIN(MAX) fREQ L
(4)
VOUT IOUT VIN(MIN) (VOUT VIN(MIN) )
(5)
VIN(MIN)
2 VOUT fREQ L
Where η is the estimated efficiency of the
MP28167.
Input and Output Capacitor Selection
It is recommended to use ceramic capacitors
plus electrolytic capacitors for the input and
output capacitors, in order to filter input and
output ripple current and obtain stable operation.
The
input
capacitor
requires
enough
capacitance to absorb the input switching current.
For most applications, a 100µF electrolytic
capacitor plus a 22µF ceramic capacitor is
sufficient.
The output capacitor stabilizes the DC output
voltage. Low-ESR capacitors with enough
capacitance to limit the output voltage ripple are
preferred. Refer to application schematic for
more detail.
(2)
(3)
Where fREQ is the switching frequency and ∆IL is
the peak-to-peak inductor current ripple. As a
rule of thumb, the peak-to-peak ripple can be set
at 10% to 40% of the inductor current. The
minimum inductor value for the application must
be higher than both the Equation (2) and
Equation (3) results.
MP28167 Rev 1.0
4/29/2019
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16
MP28167 – 22V VIN, 3A IOUT INTEGRATED BUCK-BOOST CONVERTER
PCB Layout Guidelines (9)
Efficient PCB layout is critical for successful
operation and thermal dissipation. For best
results, refer to Figure 8 and the guidelines
below:
1. Place the ceramic CIN and COUT capacitors
close to the IC’s VIN-to-GND and OUT-toGND pins, respectively.
2. Use a large copper plane for PGND. Add
multiple vias to improve thermal dissipation.
Connect AGND to PGND.
3. Use short, direct, and wide traces to connect
OUT. Adding vias under the IC and then
routing the OUT trace on both PCB layers is
highly recommended.
4. Place a large copper plane for SW1, SW2.
5. Place the VCC decoupling capacitor as close
to VCC as possible.
Top Layer
Note:
9) The recommended layout is based on the Typical Application
Circuit on page 18.
Zoom View of IC
Figure 8: Recommended Layout
MP28167 Rev 1.0
4/29/2019
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17
MP28167 – 22V VIN, 3A IOUT INTEGRATED BUCK-BOOST CONVERTER
TYPICAL APPLICATION CIRCUITS
C4
16
VIN
2.8V–22V
C1
100µF
+
100nF
1
C1B
22µF
C1A
0.1µF
SW1
BST1
IN
BST2
R3
499k
3
SW2
OUT
13
C5
100nF
14
VOUT
5V
C2A
0.1µF
MP28167
C2B
10µF
C2C
10µF
C2
100µF
E MZJ350A RA 101MHA
NC
NC
RSV1
RSV2
OC
VCC
C3
1µF
AGND
10
4.7µH
12
EN
C7
22nF
9
L1
15
GND
2, 11
4
8
5
6
7
C6
22nF
R2
21.5k
Figure 9: Typical Application Circuit for 2.8V-22VIN, 5VOUT, 3A Output Current or 4A Input Current
C4
16
VIN
2.8V–22V
C1
100µF
+
100nF
1
C1B
22µF
C1A
0.1µF
BST1
SW1
IN
BST2
R3
499k
3
SW2
OUT
13
C5
VCC
AGND
10
GND
2, 11
R2
21.5k
100nF
14
VOUT
5V
C2A
0.1µF
MP28167
C3
1µF
4.7µH
12
EN
C7
22nF
9
L1
15
NC
NC
RSV1
RSV2
OC
C2B
22µF
C2C
22µF
C2
22µF
C2C
22µF
C2
22µF
4
8
5
6
7
C6
22nF
Figure 10: Typical Application Circuit for 2.8V-22VIN, 5VOUT, 3A Output Current or 4A Input Current
MP28167 Rev 1.0
4/29/2019
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18
MP28167 – 22V VIN, 3A IOUT INTEGRATED BUCK-BOOST CONVERTER
PACKAGE INFORMATION
QFN-16 (3mmx3mm)
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that thirdparty Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not assume
any legal responsibility for any said applications.
MP28167 Rev 1.0
4/29/2019
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© 2019 MPS. All Rights Reserved.
19