MP6231/MP6232
3.3V/5V, Dual-Channel 500mA
Current-Limited Power Distribution Switches
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The MP6231/MP6232 Power Distribution
Switch features internal current limiting to
prevent damage to host devices due to faulty
load conditions. The MP6231/MP6232 analog
switch has 85mΩ on-resistance and operates
from 2.7V to 5.5V input. It is available with
guaranteed current limits, making it ideal for
load
switching
applications.
The
MP6231/MP6232 has built-in protection for both
over current and increased thermal stress. For
over current, the device will limit the current by
changing to a constant current mode.
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As the temperature increases as a result of
short circuit, then the device will shut off. The
device will recover once the device temperature
reduces to approx 120°C.
500mA Continuous Current
Accurate Current Limit
2.7V to 5.5V Supply Range
140μA Quiescent Current
85mΩ MOSFET
Thermal-Shutdown Protection
Under-Voltage Lockout
8ms FLAG Deglitch Time
No FLAG Glitch During Power Up
Reverse Current Blocking
Active High & Active Low Options
UL File # E322138
APPLICATIONS
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The MP6231/MP6232 is available in 8-pin
MSOP, SOIC package with exposed pad and 8pin SOIC w/o exposed pad.
Smartphone and PDA
Portable GPS Device
Notebook PC
Set-top-box
Telecom and Network Systems
PC Card Hot Swap
USB Power Distribution
“MPS” and “The Future of Analog IC Technology” are Trademarks of Monolithic
Power Systems, Inc.
TYPICAL APPLICATION
+5V
1 GND
2 IN
3
4
FLAG1
OUT1
MP6232
EN1
EN2
OUT2
8
To USB Controller
7
6
Output 1
Output 2
FLAG2 5
DUAL-CHANNEL
UL Recognized Component
MP6231/MP6232 Rev. 1.2
3/31/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
1
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
ORDERING INFORMATION
Part Number
Enable
MP6231DN*
MP6231DH
MP6231DS
MP6232DN
MP6232DH
MP6232DS
Switch
Maximum
Typical ShortContinuous Circuit Current
Load Current
@ TA=25C
0.5A
Free Air
Temperature
(TA)
Top
Marking
SOIC8E MP6231DN
MSOP8E
6231D
SOIC8
-40°C to +85°C
SOIC8E MP6232DN
MSOP8E
6232D
SOIC8
Active
High
Dual
Package
750mA
Active
Low
* For Tape & Reel, add suffix –Z (e.g. MP6231DN–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP6231DN–LF–Z)
PACKAGE REFERENCE
TOP VIEW
TOP VIEW
TOP VIEW
GND
1
8
FLAG1
GND
1
8
FLAG1
OUT1
IN
2
7
OUT1
IN
2
7
OUT1
6
OUT2
EN1*
3
6
OUT2
5
FLAG2
EN1*
3
6
OUT2
EN2*
4
5
FLAG2
EN2*
4
5
FLAG2
GND
1
8
FLAG1
IN
2
7
EN1*
3
EN2*
4
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
EXPOSED PAD
ON BACKSIDE
MSOP8E
SOIC8
SOIC8E
MP6231/MP6232Dual-Channel
(* EN is active high for MP6231)
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
IN .................................................-0.3V to +6.0V
EN, FLAG, OUT to GND ..............-0.3V to +6.0V
(2)
Continuous Power Dissipation (TA = +25°C)
SOIC8E...................................................... 2.5W
MSOP8E .................................................. 2.27W
SOIC8 ........................................................ 1.4W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Operating Junct. Temp. ........... -40°C to +125°C
SOIC8E .................................. 50 ...... 10... °C/W
MSOP8E................................. 55 ...... 12... °C/W
SOIC8..................................... 90 ...... 42... °C/W
MP6231/MP6232 Rev. 1.2
3/31/2010
(3)
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) Measured on JESD51-7, 4-layer PCB.
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
2
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
ELECTRICAL CHARACTERISTICS (4)
VIN=5V, TA=+25°C, unless otherwise noted.
Parameter
Condition
IN Voltage Range
Min
Typ
Max
Units
5.5
V
90
120
μA
140
160
μA
2.7
One Channel Enabled, IOUT=0, One
Switch ON
Both Channels Enabled, IOUT=0, Both
Switches ON
Device Disable, VOUT=float, VIN=5.5V
Device Disable, VIN=5.5V
Supply Current
Supply Current
Shutdown Current
Off Switch Leakage
Current Limit
1
1
550
Trip Current
Under-voltage Lockout
Under-voltage Hysteresis
FET On Resistance
EN Input Logic High Voltage
EN Input Logic Low Voltage
FLAG Output Logic Low Voltage
FLAG Output High Leakage
Current
Thermal Shutdown
Thermal Shutdown Hysteresis
Current Ramp (slew rate≤100A/s) on
Output
Rising Edge
ISINK=5mA
VIN=VFLAG=5.5V
Turn Off Time, Toff
CL=100μF, RL=11Ω
FLAG Deglitch Time
ENx Input Leakage
Reverse Leakage Current
250
85
1100
mA
1.6
A
2.65
0.8
0.4
V
mV
mΩ
V
V
V
1
μA
0.5
0.5
3
°C
°C
ms
ms
ms
ms
ms
10
ms
15
ms
μA
μA
130
2
Turn On Time, Ton
VOUT Falling Time, Tf
1.95
IOUT=100mA , and -40°C
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