MP6909
Fast Turn-Off Intelligent Rectifier
with Turn On Slew Rate Detection
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The MP6909 is a low-drop diode emulator IC
that, when combined with an external switch,
replaces Schottky diodes in high-efficiency
flyback converters. The MP6909 regulates the
forward drop of an external synchronous
rectifier (SR) MOSFET to about 40mV, which
switches off once the voltage becomes negative.
The MP6909 can generate its own supply
voltage via an internal linear regulator.
Programmable ringing detection circuitry
prevents the MP6909 from turning on falsely at
VDS
oscillations
during
discontinuous
conduction mode (DCM) and quasi-resonant
operation.
The MP6909 is available in a space-saving
TSOT23-6 package.
Supplied Voltage Internally Regulated
Ringing Detection Prevents False Turn-On
during
DCM
and
Quasi-Resonant
Operations
Works with Standard and Logic Level SR
MOSFETs
Compatible with Energy Star
~30ns Fast Turn-Off and Turn-On Delay
~100µA Quiescent Current
Supports DCM, CCM, and Quasi-Resonant
Operations
Supports both High-Side and Low-Side
Rectification
Available in a TSOT23-6 Package
APPLICATIONS
USB PD Quick Chargers
Adaptors
Flyback Converters
All MPS parts are lead-free, halogen-free, and adhere to the RoHS directive. For
MPS green status, please visit the MPS website under Quality
Assurance. “MPS” and “The Future of Analog IC Technology” are registered
trademarks of Monolithic Power Systems, Inc.
TYPICAL APPLICATION
MP6909 Rev. 1.0
3/6/2018
www.MonolithicPower.com
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© 2018 MPS. All Rights Reserved.
1
MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
ORDERING INFORMATION
Part Number*
MP6909GJ
Package
TSOT23-6
Top Marking
See Below
* For Tape & Reel, add suffix –Z (e.g.: MP6909GJ–Z).
TOP MARKING
BDR: Product code of MP6909GJ
Y: Year code
PACKAGE REFERENCE
TOP VIEW
TSOT23-6
MP6909 Rev. 1.0
3/6/2018
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2
MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
SL to VSS ....................................-0.3V to +6.5V
VR, VG to VSS .............................-0.3V to +14V
VD, VIN to VSS ..............................-1V to +180V
(2)
Continuous power dissipation (TA = +25°C)
................................................................. 0.56W
Junction temperature ................................150°C
Lead temperature (solder) ........................260°C
Storage temperature ............... -55°C to +150°C
TSOT23-6 ............................. 220 .... 110 ... °C/W
Recommended Operation Conditions
(3)
VR to VSS ........................................... 4V to 13V
VD, VIN, to VSS .............................-1V to +150V
Maximum junction temp. (TJ) ....................125°C
MP6909 Rev. 1.0
3/6/2018
(4)
θJA
θJC
NOTES:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)TA)/θJA. Exceeding the maximum allowable power dissipation
produces an excessive die temperature, causing the regulator
to go into thermal shutdown. Internal thermal shutdown
circuitry protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
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3
MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
ELECTRICAL CHARACTERISTICS
VR = 9V, -40°C ≤ TJ ≤ +125°C, unless otherwise noted.
Parameter
Supply Management Section
VR UVLO rising
VR UVLO hysteresis
VR maximum charging current
VR regulation voltage
Symbol
IVR
Operating current
Quiescent current
Shutdown current
Control Circuitry Section
Forward regulation voltage
(VSS - VD)
Turn-on threshold (VDS)
Turn-off threshold (VSS - VD)
Turn-on delay
Turn-off delay
Turn-on blanking time
Turn-off blanking exit threshold
Turn-off threshold during turnon blanking
Turn-on slew rate detection
timer
Gate Driver Section
VG (low)
VG (high)
Maximum source current (5)
Maximum sink current (5)
Pull-down impedance
ICC
Iq(VR)
ISD(VR)
Conditions
VR = 7V, VIN = 40V
VIN = 12V
VR = 9V, CLOAD = 2.2nF,
FSW = 100kHz
VR = 5V, CLOAD = 2.2nF,
FSW = 100kHz
VR = 14V
VR = UVLO - 0.1V
Vfwd
TDon
TDoff
TB-ON
VB-OFF
CLOAD = 2.2nF
CLOAD = 2.2nF
CLOAD = 2.2nF
TSLEW
RSLEW = 400k
VG-L
VG-H
ILOAD = 10mA
ILOAD = 0
Same as VG (low)
Min
Typ
Max
Units
3.55
0.1
3.75
0.2
70
9
3.95
0.3
9.5
V
V
mA
V
2.9
3.5
mA
1.72
2.1
mA
105
135
100
µA
µA
25
40
55
mV
-115
-6
-86
3
30
25
1.1
-57
12
50
45
1.45
3
mV
mV
ns
ns
µs
V
1.3
1.8
2.1
V
51
76
101
ns
0.01
VR
0.5
3
1
0.02
V
V
A
A
Ω
8.5
0.75
2
2
NOTE:
5) Guaranteed by characterization and design.
MP6909 Rev. 1.0
3/6/2018
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4
MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
TYPICAL PERFORMANCE CHARACTERISTICS
Quiescent Current vs. Temperature
Operating Current vs. Temperature
VR = 9V, CLOAD = 2.2nF, FSW = 100kHz
VR = 14V
114
3
2.95
112
2.9
110
2.8
IQ (uA)
ICC (mA)
2.85
2.75
2.7
108
106
2.65
2.6
104
2.55
2.5
102
-50
-25
0
25
50
75
100
125
-50
-25
TEMPERATURE(°C)
0
25
50
75
TEMPERATURE (°C)
100
Turn-On Delay vs. Temperature
Turn-Off Delay vs. Temperature
VR = 9V, CLOAD = 2.2nF
VR = 9V, CLOAD = 2.2nF
45
125
35
40
30
TDOFF (ns)
TDON (ns)
35
30
25
25
20
20
15
15
10
10
-50
-25
0
25
50
75
TEMPERATURE (°C)
100
-50
125
-25
0
25
50
75
TEMPERATURE (°C)
100
125
Turn-On Slew Rate Detection Timer
vs. Temperature
Forward Regulation Voltage (VSS VD) vs. Temperature
RSLEW = 400kΩ
147
50
48
146
145
44
TSLEW (ns)
VFWD (mV)
46
42
40
38
144
143
142
36
34
141
32
140
30
-50
MP6909 Rev. 1.0
3/6/2018
-25
0
25
50
75
TEMPERATURE (°C)
100
125
-50
-25
0
25
50
75
TEMPERATURE (°C)
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100
125
5
MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VR Maximum Charging Current vs.
Temperature
VR = 7V, VIN = 40V
100
90
IVR (mA)
80
70
60
50
40
-50
-25
0
25
50
75
TEMPERATURE (°C)
100
125
MP6909 Rev. 1.0
3/6/2018
www.MonolithicPower.com
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6
MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Operation in 36W Flyback
Application
Operation in 36W Flyback
Application
VIN = 110VAC, VOUT = 12V, IOUT = 3A
VIN = 220VAC, VOUT = 12V, IOUT = 3A
CH1: VDS
50V/div.
CH1: VDS
20V/div.
CH3: VR
5V/div.
CH2: VGS
5V/div.
CH3: VR
5V/div.
CH2: VGS
10V/div.
10μs/div.
MP6909 Rev. 1.0
3/6/2018
20μs/div.
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MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
PIN FUNCTIONS
Pin #
1
2
Name
VIN
VSS
3
SL
4
5
6
VR
VG
VD
MP6909 Rev. 1.0
3/6/2018
Description
Internal linear regulator input.
Ground. VSS is also used as a MOSFET source sense reference for VD.
Programming for turn-on signal slew rate detection. SL prevents the SR controller from
turning on falsely by ringing below the turn-on threshold at VD in discontinuous conduction
mode (DCM) and quasi-resonant mode. Any signal slower than the pre-set slew rate
cannot turn on VG.
Internal linear regulator output. VR is the supply of the MP6909.
Gate drive output.
MOSFET drain voltage sense.
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MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
BLOCK DIAGRAM
Figure 1: Functional Block Diagram
MP6909 Rev. 1.0
3/6/2018
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MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
OPERATION
The
MP6909
supports
operation
in
discontinuous
conduction
mode
(DCM),
continuous conduction mode (CCM), and quasiresonant flyback converters. The control
circuitry controls the gate in forward mode and
turns the gate off when the synchronous
rectification (SR) MOSFET current drops to
zero.
the turn-on blanking time, VGS is pulled low
immediately.
Conduction Phase
When VDS rises above the forward voltage drop
(-40mV) according to the decrease of the
switching current, the MP6909 lowers the gate
voltage level to enlarge the on resistance of the
synchronous MOSFET.
VR Generation
VIN is the input of the internal linear regulator.
VR is the output of the internal linear regulator.
The capacitor at VR supplies power for the IC.
When VIN < 9.3V, the internal linear regulator
regulates VR at VIN-0.3V.
When VIN > 9.3V, the internal linear regulator
regulates VR at 9V.
Start-Up and Under-Voltage Lockout (UVLO)
When VR rises above 3.75V, the MP6909 exits
under-voltage lockout (UVLO) and is enabled.
The MP6909 enters sleep mode, and VGS is
kept low once VR drops below 3.55V.
Turn-On Phase
When VDS drops to ~2V, a turn-on timer begins
to count. This turn-on timer can be programmed
by an external resistor on SL. If VDS reaches the
-86mV turn-on threshold from 2V within the time
(TSLEW) set by the timer, the MOSFET is turned
on after a turn-on delay (about 30ns) (see
Figure 2). If VDS crosses -86mV after the timer
ends, the gate voltage (VG) remains off. This
turn-on timer prevents the MP6909 from turning
on falsely due to ringing from DCM and quasiresonant operations.
TSLEW can be programmed with Equation (1):
TSLEW R SLEW
76ns
400k
(1)
Turn-On Blanking
The control circuitry contains a blanking
function. When the MOSFET turns on, the
control circuit ensures that the on state lasts for
a specific period of time. The turn-on blanking
time is ~1.1µs to prevent an accidental turn-off
due to ringing. However, if VDS reaches the
turn-off threshold during turn-on blanking within
MP6909 Rev. 1.0
3/6/2018
Figure 2: Turn-On/Turn-Off Timing Diagram
With this control scheme, VDS is adjusted to be
around -40mV even when the current through
the MOSFET is fairly low. This function keeps
the driver voltage at a very low level when the
synchronous MOSFET is turned off, which
boosts the turn-off speed and is especially
important for CCM operation.
Turn-Off Phase
When VDS rises to trigger the turn-off threshold
(-3mV), the gate voltage is pulled to zero after a
very short turn-off delay of 25ns (see Figure 2).
Turn-Off Blanking
After the gate driver (VGS) is pulled to zero by
VDS reaching the turn-off threshold (-3mV), a
turn-off blanking time is applied, during which
the gate driver signal is latched off. The turn-off
blanking is removed when VDS rises above the
turn-off blanking exit threshold (2 - 3V) (see
Figure 2).
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MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
APPLICATION INFORMATION
Slew Rate Detection Function
In DCM operations, the demagnetizing ringing
may bring VDS down below 0V. If VDS reaches
the turn-on threshold during the ringing, SR
controllers without the slew rate detection
function may turn on the MOSFET by mistake.
Figure 3 shows the waveform of this false turnon situation. This increases power loss and
may also lead to shoot-through if the primary
side MOSFET is turned on within the turn-on
blanking time.
External Resistor on VD
Since over-voltage conditions may damage the
device, there must be appropriate application
designs to guarantee safe operation, especially
on the high-voltage pin.
A common over-voltage condition is where the
body diode of the SR MOSFET is turned on and
the forward voltage drop may exceed the
negative rating on VD. In this case, an external
resistor should be placed between VD and the
MOSFET drain. Generally, the resistance is
recommended to be no less than 300Ω.
On the other hand, this resistor cannot be too
large, since large resistor values slow down the
slew rate on VDS detection. Generally, it is not
recommended to use any resistance value
larger than 1kΩ but should be checked based
on the slew rate for each practical case.
Typical System Implementations
Figure
5
shows
the
typical
system
implementation for the IC power supply derived
from the output voltage, which is available in
low-side rectification.
Figure 3: False Turn-On (without Slew Rate
Detection)
Considering that the slew rate of the ringing is
always much less than when the primary
MOSFET is actually turned off, this false turnon situation can be prevented by the slew rate
detection function (see Figure 4). When the
slew rate is less than the threshold set by RSLEW,
the IC does not turn on the gate even when VDS
reaches the turn-on threshold.
Figure 5: MP6909 in Low-Side Rectification
Figure 6 shows the circuit configuration for the
auxiliary winding solution for the MP6909 used
in high-side rectification.
Figure 4: Preventing a False Turn-On (with Slew
Rate Detection)
MP6909 Rev. 1.0
3/6/2018
Figure 6: MP6909 in High-Side Rectification
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MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
SR MOSFET Selection
Power MOSFET selection is a tradeoff between
the RDS(ON) and QG. To achieve higher efficiency,
a MOSFET with a smaller RDS(ON) is preferred.
Typically, QG is larger with a smaller RDS(ON),
which makes the turn-on/turn-off speed lower
and leads to larger power loss and driver loss.
Because VDS is adjusted at about -40mV during
the driving period when the switching current is
fairly small, a MOSFET with an RDS(ON) that is
too low is not recommended because the gate
driver is pulled low when VDS = -ISD x RDS(ON)
becomes larger than -40mV. The MOSFET’s
RDS(ON) does not contribute to the conduction
loss. The conduction loss is PCON = -VDS x ISD ≈
ISD x 40mV.
To achieve fairly high use of the MOSFET’s
RDS(ON), the MOSFET should be turned on
completely for at least 50% of the SR
conduction period. Calculate VDS with Equation
(2):
VDS I C RDS ( ON ) I OUT / D RDS ( ON ) V fwd (2)
Where VDS is drain-source voltage of the
MOSFET, D is the duty cycle of the secondary
side, IOUT is output current, and Vfwd is the
forward voltage threshold (~40mV).
Slew Rate Set-Up
Select the slew rate set-up resistor carefully.
Before placing a resistor on SL, measure the
VDS slew rate during normal turn-on and
oscillation during DCM. Choose a resistor that
can guarantee a normal SR driver turn-on. For
example, if the VDS slew rate is -1V/ns during
the normal drop and 0.01V/ns in oscillation, a
0.1V/ns slew rate is a proper target to set up.
PCB Layout Guidelines
Efficient PCB layout is critical for stable
operation. For best results, refer to Figure 8,
Figure 9, Figure 10, and follow the guidelines
below.
Sensing for VD/VSS
1. Make the sensing connection (VD/VSS) as
close as possible to the MOSFET
(drain/source).
2. Make the sensing loop as small as possible.
3. Keep the IC out of the power loop to prevent
the sensing loop and power loop from
interrupting each other (see Figure 8).
Figure 7 shows the typical waveform of a
flyback application. Assume it has a 50% duty
cycle. The MOSFET’s RDS(ON) is recommended
to be no lower than ~20/IOUT (mΩ). For a 5A
application, the RDS(ON) should be no lower than
4mΩ.
Figure 8: Voltage Sensing for VD/VSS
4. Place a decoupling ceramic capacitor from
VR to PGND close to the IC for adequate
filtering.
Figure 7: Synchronous Rectification Typical
Waveforms in a Flyback Application
MP6909 Rev. 1.0
3/6/2018
Gate Driver Loop
1. Make the gate driver loop as small as
possible
to
minimize
the
parasitic
inductance.
2. Keep the driver signal far away from the VD
sensing trace on the layout.
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MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
Layout Example
Figure 9 shows a layout example of a single
layer with a through-hole transformer and a
TO220 package SR MOSFET. RSN and CSN
are the RC snubber network for the SR
MOSFET. The sensing loop (VD and VSS to
the SR MOSFET) is minimized and kept
separate from the power loop. The VR
decoupling capacitor (C2) is placed beside VR.
Figure 10 shows another layout example of a
single layer with a PowerPAK/SO8 package SR
MOSFET, which also has a minimized sensing
loop and power loop to prevent the loops from
interfering with one another.
6
5
4
1
2
3
Figure 10: Layout Example with PowerPAK/SO8
SR MOSFET
Figure 9: Layout Example with TO220 Package
SR MOSFET
MP6909 Rev. 1.0
3/6/2018
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MP6909 – FAST TURN-OFF INTELLIGENT RECTIFIER
PACKAGE INFORMATION
TSOT23-6
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP6909 Rev. 1.0
7/31/2018
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14