MP6924, MP6924A
Fast Turn-off,
CCM/DCM Compatible
Dual LLC Synchronous Rectifier
with low Sleep Mode Current
DESCRIPTION
FEATURES
The MP6924, MP6924A is a dual, fast turn-off,
intelligent rectifier for synchronous rectification
in LLC resonant converters.
•
•
•
•
•
The IC drives two N-channel MOSFETs,
regulates their forward voltage drop to
Vfwd(MP6924:45mV,MP6924A:29mV), and turns
the MOSFETs off before the switching current
goes negative.
•
•
The MP6924, MP6924A has a light-load
function to latch off the gate driver under lightload conditions, limiting the current to 175μA.
•
The MP6924, MP6924A’s fast turn-off enables
both continuous conduction mode (CCM) and
discontinuous conduction mode (DCM).
•
Works with Standard and Logic Level
MOSFETs
Compatible with Energy Star
Fast Turn-Off Total Delay of 35ns
Wide 4.2V ~ 35V VDD Operating Range
175µA Low Quiescent Current in Light-Load
Mode
Supports CCM, CrCM, and DCM Operation
Supports
High-Side
and
Low-Side
Rectification
Power Savings of Up to 1.5W in a Typical
Notebook Adapter
Available in a SOIC-8 Package
APPLICATIONS
•
•
•
•
The MP6924, MP6924A requires a minimal
number of readily available, standard, external
components and is available in a SOIC-8
package.
AC/DC Adapters
PC Power Supplies
LCD and LED TVs
Isolated DC/DC Power Converters
All MPS parts are lead-free, halogen-free, and adhere to the RoHS directive.
For MPS green status, please visit the MPS website under Quality
Assurance. “MPS” and “The Future of Analog IC Technology” are registered
trademarks of Monolithic Power Systems, Inc.
Table 1: MP6924A vs. MP6924
Turn-off Blanking
1.75μs vs. 210ns
Time
Improve noise immunity
Be half
Driving Capability
Improve EMI performance
29mV vs. 45mV
Forward Voltage
Improve efficiency
TYPICAL APPLICATION
Q1
Cs
S1
Ls
Cin
Q2
Lm
VOUT
Cout
S2
GND
MP6924
MP6924A
C2
VG2
VG1
2
PGND
VDD
7
LL
VD1
6
VD2
VSS
3
R2
R1
1
4
8
5
C1
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
ORDERING INFORMATION
Part Number*
MP6924GS
MP6924AGS
Package
Top Marketing
SOIC-8
See Below
* For Tape & Reel, add suffix –Z (e.g. MP6924GS–Z)
TOP MARKING (MP6924GS)
MP6924: Part number
LLLLLLLL: Lot number
MPS: MPS prefix
Y: Year code
WW: Week code
TOP MARKING (MP6924AGS)
MP6924A: Part number
LLLLLLLL: Lot number
MPS: MPS prefix
Y: Year code
WW: Week code
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
PACKAGE REFERENCE
TOP VIEW
VG2
1
PGND
2
MP6924
MP6924A
8
VG1
7
VDD
LL
3
6
VD1
VD2
4
5
VSS
SOIC-8
ABSOLUTE MAXIMUM RATINGS
(1)
VDD to VSS .................................... -0.3V to +38V
PGND to VSS ............................... -0.3V to +0.3V
VG to VSS ...................................... -0.3V to +20V
VD to VSS ....................................... -1V to +180V
LL to VSS ..................................... -0.3V to +6.5V
Continuous power dissipation (TA = +25°C) (2)
SOIC-8 ......................................................1.4W
Junction temperature ............................... 150°C
Lead temperature (solder) ....................... 260°C
Storage temperature ................ -55°C to +150°C
Recommended Operation Conditions (3)
Thermal Resistance (4)
θJA
θJC
SOIC-8 ................................... 90 ...... 45 ... °C/W
NOTES:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)TA)/θJA. Exceeding the maximum allowable power dissipation
produces an excessive die temperature, causing the regulator
to go into thermal shutdown. Internal thermal shutdown
circuitry protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
VDD to VSS ....................................... 4.2V to 35V
Operating junction temp. (TJ). .. -40°C to +125°C
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
ELECTRICAL CHARACTERISTICS
VDD = 12V, -40°C ≤ TJ ≤ +125°C, unless otherwise noted.
Parameter
VDD voltage range
VDD UVLO rising
VDD UVLO hysteresis
Symbol
Operating current
ICC
Quiescent current
IQ
Shutdown current
Conditions
Min
4.2
3.7
0.13
CLOAD = 4.7nF,
FSW = 100kHz
VSS - VD = 0.5V
VDD = 4V, LL = 0V
VDD = 20V, LL = 0V
Light-load mode current
MP6924
Thermal shutdown (5)
MP6924A
Thermal shutdown hysteresis(5)
Control Circuitry Section
MP6924
VSS - VD forward
voltage
MP6924A
Turn off threshold (VSS - VD)
MP6924
MP6924A
Turn-on delay
MP6924
MP6924A
Input bias current on VD
Turn-on blanking time
Turn-off blanking time
(5)
MP6924
MP6924A
Turn-off blanking VDS
threshold(MP6924A disabled)
tDon
CLOAD = 4.7nF, VGS = 2V
tDon
CLOAD = 10nF, VGS = 2V
tB_ON
VD = 180V
CLOAD = 4.7nF
tB_OFF
CLOAD = 4.7nF
VB_OFF
Light-load enter pulse width
Light-load turn-on pulse width
hysteresis
MP6924
Light-load enter delay
MP6924A
Gate disable threshold on LL
Turn-on threshold (VDS)
Gate Driver Section
VG (low)
TLL
RLL = 100kΩ
TLL-H
RLL = 100kΩ
TLL-D
VLL_DIS
VLL_DS
VG_L
VG (high)
VG_H
Turn-off propagation delay
tDoff
Turn-off total delay
tDoff
Maximum source
current (6)
Pull-down impedance
28
17
-56
Vfwd
VDD = 12V
ILOAD = 1mA
VDD > 10V
VDD ≤ 10V
VD = VSS
VD = VSS, CLOAD = 4.7nF,
RGATE = 0Ω, VGS = 2V
VD = VSS, CLOAD = 10nF,
RGATE = 0Ω, VGS = 2V
MP6924
MP6924A
NOTES:
5)
Guaranteed by characterization.
0.75
Typ
3.95
0.185
Max
35
4.2
0.24
Units
V
V
V
16
20
mA
4.6
135
155
175
150
175
10
6
190
210
225
mA
45
29
-40
80
190
90
270
58
41
-20
140
300
180
410
1
1.65
1.1
µA
°C
°C
210
1750
mV
mV
ns
ns
µA
µs
ns
1
1.7
2.5
V
1.7
2.3
3
µs
0.45
0.5
45
0.1
-330
1
78
0.2
-230
11.5
VDD
15
µs
1.52
121
0.3
-130
ms
µs
V
mV
0.1
13
V
V
ns
35
80
ns
45
100
ns
0.5
0.13
0.6
6)
µA
A
1.5
Ω
Guaranteed by design.
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
TYPICAL PERFORMANCE CHARACTERISTICS
VDD = 12V, MP6924/MP6924A, unless otherwise noted.
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VDD = 12V, unless otherwise noted.
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VDD = 12V, unless otherwise noted.
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
PIN FUNCTIONS
Pin #
(SOIC-8)
1
2
Name
Description
VG2
PGND
3
LL
4
5
6
VD2
VSS
VD1
MOSFET 2 gate driver output.
Power ground. PGND is the power switch return.
Light-load timing setting. Connect a resistor to LL to set the light-load timing. Leave LL
open to prevent the IC from entering light-load mode. Pull LL low to disable the gate driver.
MOSFET 2 drain voltage sense.
Source pin used as reference for VD1 and VD2.
MOSFET 1 drain voltage sense.
7
8
VDD
VG1
Supply voltage.
MOSFET 1 gate driver output.
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
BLOCK DIAGRAM
LL
VDD
PGND
VD1
VG1
VSS
VG2
VD2
Figure 1: Functional Block Diagram
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
OPERATION
The
MP6924,
MP6924A
operates
in
discontinuous
conduction
mode
(DCM),
continuous conduction mode (CCM), and
critical conduction mode (CrCM). When the
MP6924, MP6924A operates in either DCM or
CrCM, the control circuitry controls the gate in
forward mode, and the gate turns off when the
MOSFET current is low. In CCM, the control
circuitry turns off the gate during very fast
transients.
Turn-On Phase
When the switch current flows through the body
diode of the MOSFET, there is a negative
voltage drop (VD - VSS) across the body diode.
VDS is much lower than the turn-on threshold of
the control circuitry (VLL-DS), which triggers a
maximum 500mA of charge current to turn on
the MOSFET (see Figure 3).
Under-Voltage Lockout (UVLO)
When VDD is below the VDD UVLO threshold, the
MP6924, MP6924A falls into sleep mode and
VG1,2 remains at a low level.
Turn-On Blanking
The control circuitry contains a blanking
function that ensures that when the MOSFET
turns on or off, it remains in that state for tB_ON
(~1.1µs), which determines the minimum on
time. During the turn-on blanking period, the
turn-off threshold is not blanked completely, but
changes to about +100mV (instead of +40mV).
This ensures that the part can always turn off,
even during the turn-on blanking period,
although it does so slower. Avoid setting the
synchronous period below tB_ON in CCM
condition in the LLC converter to eliminate
shoot-through.
Enable
If LL is pulled low, the MP6924, MP6924A is in
shutdown mode, which consumes 175µA of
shutdown current. If LL is pulled high during the
rectification cycle, the gate driver will not
appear until the next rectification cycle begins
(see Figure 2).
Conduction Phase
When VDS rises above the forward voltage drop
(-Vfwd) according to the decrease of the
switching current, the MP6924, MP6924A pulls
down the gate voltage level to make the on
resistance of the synchronous MOSFET larger
to ease the rise of VDS.
VD Clamp
Because VD1,2 can go as high as 180V, a highvoltage JFET is used at the input. To prevent
excessive currents when VDS1,2 goes below
-0.7V, a 1kΩ resistor is recommended between
VD1,2 and the drain of the external MOSFET.
VDS
VDS
+40mV
-Vfwd
-230mV
VGS
Driver begin to
be pulled down
VGS
Driver turn off
Will not start
gate driver until
next cycle
LL
Turn On
Blanking
Turn Off
Blanking
Figure 3: Turn-On/-Off Timing Diagram
Figure 2: LL Control Scheme
Thermal Shutdown
If the junction temperature of the chip exceeds
thermal shutdown threshold, VG1,2 is pulled low,
and the MP6924, MP6924A stops switching.
The IC resumes normal function after the
junction temperature drops 10°C.
The control scheme in Figure 3 shows VDS
adjusted to be around -Vfwd, even when the
current through the MOSFET is fairly low. This
function puts the driver voltage at a very low
level when the synchronous MOSFET is turning
off, which boosts the turn-off speed.
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
Turn-Off Phase
When VDS rises to trigger the turn-off threshold
(+40mV), the gate voltage is pulled to zero after
a very short turn-off delay (see Figure 3).
Turn-Off Blanking
After the gate driver is pulled to zero by VDS
reaching the turn-off threshold (+40mV), turn-off
blanking is triggered to ensure that the gate
driver is off for at least tB_ON to prevent an error
trigger on VDS.
Light-Load Latch-Off Function
The gate driver of the MP6924, MP6924A is
latched off to save driver loss in light-load
condition and improve efficiency.
When the MOSFET’s switching
cycle
conducting period falls below TLL, the MP6924,
MP6924A enters light-load mode and latches
off the MOSFET after a light-load enter delay,
TLL-D (see Figure 4).
Light-Load Mode
tLL+tLL-H
Light-Load Mode
tLL+tLL-H
tLL+tLL-H
Secondary Side Current
Figure 5: MP6924, MP6924A Exiting Light-Load
Mode
If the light-load mode of the MP6924, MP6924A
ends during the rectification cycle, the gate
driver signal does not appear until the next
rectification cycle starts (see Figure 6).
VDS
VGS
Normal Mode
tLL+tLL-H
Normal Mode
Will not start
gate driver until
next cycle
TLL-D
Light Load Mode
tLL
Normal Mode
tLL
Figure 6: Gate Driver Starts After Exiting LightLoad Mode
tLL
Anti-Bounce Logic (MP6924)
The MP6924 has anti-bounce logic, which helps
protect the two-channel driver against cross
conduction. MP6924A disables this feature.
Secondary Side Current
Figure 4: MP6924, MP6924A Entering Light-Load
Mode
During light-load mode, the MP6924, MP6924A
monitors the body diode conduction time. If this
time exceeds TLL + TLL-H, the IC exits light-load
mode and initiates the gate driver in the next
new switching cycle (see Figure 5 and Figure 6).
Light-load enter timing (TLL) is programmable by
connecting a resistor (RLL) to LL. By monitoring
the LL current (the LL voltage is kept at ~2V
internally), TLL can be calculated with Equation
(1):
TLL = RLL (k)
2.3us
100k
Figure 7 shows the anti-bounce logic for the
two-channel driver. When channel 1 or 2 are
turned off, the corresponding channel gate
driver is blanked until another channel is
switched off.
VDS2
VDS1
VGS1
VGS2
(1)
VGS1 Blanking
VGS2 Blanking
Figure 7: Anti-Bounce Logic of the Gate Driver
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
APPLICATION INFORMATION
Layout Considerations
Listed below are the main recommendations
that should be taken into consideration when
designing the PCB.
Sensing for VD/VS
1. Keep the sensing connections (VD1/VSS,
VD2/VSS) as close to each of the MOSFETs
(drain/source) as possible.
2. Keep the two channels’ sensing loops
separated from each other.
3. Make the sensing loop as small as possible
(see Figure 8).
System Power Loop
1. Keep the two channels’ power loops
separated from each other (see Figure 10).
This minimizes the interaction between the
two channels’ power loops, which may
affect the voltage sensing of the IC.
2. Make the power loop as small as possible to
reduce parasitic inductance.
S1
T
Power loops
separated from
each other
VOUT
Cout
MP6924
MP6924A
S2
GND
VD1
Sensing loop as
small as
possible
G D
S
Sensing
connections close
to MOSFET
VSS
VD2
Sensing loops separated
from each other
G D
S
Figure 8: Sensing for VD/VS
Figure 9 shows a layout example of the
MP6924, MP6924A driving PowerPAK SO8
package MOSFETs with two, separate, small
sensing loops.
MP6924/24A
Figure 10: System Power Loop
Figure 11 shows a layout example of the power
loop trace, which has a minimized loop length.
The two channel power traces do not cross
each other.
It is highly recommended to place the driver’s
sensing loop trace away from the power loop
trace (see Figure 11). The sensing loop trace
and power loop trace can be placed on different
layers to keep them separate from each other.
Do not place the driver IC inside the power loop;
this may affect MOSFET voltage sensing.
Q2
COUT
Q1
Q2
LAYOUT TRACE
COMPONENTS PAD
Figure 9: Layout Example for Sensing Loop
and VDD Decoupling
Q1
VDD Decoupling Capacitor
LAYOUT TRACE
1. Place a decoupling capacitor no smaller
than 1µF from VDD to PGND close to the IC
for adequate filtering (see Figure 10).
COMPONENTS PAD
Figure 11: Layout Example for System Power
Loop
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
SR MOSFET Selection and Driver Ability
Power MOSFET selection is a trade-off
between RDS(ON) and Qg. To achieve high
efficiency, a MOSFET with a smaller RDS(ON) is
recommended. A larger Qg with a smaller
RDS(ON) makes the turn-on/-off speed lower and
the power loss larger. For the MP6924,
MP6924A, VDS is adjusted at Vfwd during the
driving period. A MOSFET with a small RDS(ON)
is not recommended because the gate driver
may be kept at a fairly low level with a small
RDS(ON), even when the system load is high,
which makes the advantage of the low RDS(ON)
inconspicuous.
Qg of the MOSFET affects the turn-on and turnoff delay. Figure 3 indicates the turn-on delay
(tDon) and the turn-off delay (tDoff). tDon indicates
how long the body diode conducts before the
MOSFET is turned on, while tDoff indicates how
long the driver takes to turn off the MOSFET.
With a higher turn-on delay, the body diode
conduction duration of the MOSFET is longer,
which brings down the total efficiency. However,
with a higher turn-off delay, the shoot-through
risk is higher in CCM operation.
Figure 13 and Figure 14 show the tDon and tDoff
of the MP6924, MP6924A according to different
Cload values.
Figure 12 shows the typical waveform of the
LLC on the secondary side. To achieve a fairly
high usage of the MOSFET’s RDS(ON), it is
expected that the MOSFET driver voltage is
kept at the maximum level until the last 25% of
the SR conduction period. Calculate VDS with
Equation (2):
VDS = −Rds(ON)
2
Ipeak = −Rds(ON) IOUT = − Vfwd (2)
2
Where VDS is drain-source voltage of the
MOSFET.
The MOSFET’s RDS(ON) is recommended to be
no lower than ~Vfwd/IOUT (mΩ). For example, in a
10A application with Vfwd at 45mV, the RDS(ON) of
the MOSFET is recommended to be no lower
than 4.5mΩ.
Figure 13: Turn-On Delay vs. Cload
ISR
Ipeak
VG
25% SR
Conduction Period
Figure 12: Synchronous Rectification Typical
Waveform in LLC
Figure 14: Turn-Off Delay vs. Cload
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
When plugging the values from Equation (4)
and Equation (5) into Equation (3), the turn-on
delay power loss through the SR MOSFET’s
body diode can be derived with Equation (6):
Ipeak
VDS IDS
Pon =
Body diode
conducts
VF
VGS
tDon
Figure 15: Turn-On Delay Effect on Efficiency
Figure 15 shows how tDon affects system
efficiency. During tDon, the body diode of the SR
MOSFET conducts, which leads to a power loss
that can be calculated with Equation (3):
V I
Pon F F 2fs tDon = VF IF fs tDon
2
(3)
Where VF is the body diode forward voltage
drop, IF is the switching current when the turnon delay (tDon) has ended, and fs is the
switching frequency.
When considering the switching current as a
complete sine wave, IF can be estimated with
Equation (4) and Equation (5):
IF = Ipeak sin(2 fs tDon )
Ipeak
Iout
2
(4)
(5)
Where Ipeak is the peak switching current
through the MOSFET, and Iout is the system
output current.
Iout VF fs tDon sin(2 fs tDon ) (6)
2
Figure 16 shows how different turn-on delay
values affect efficiency according to different
output voltages. To keep the body diode
conduction loss at a fairly low level (below 0.5%
of the output power), the turn-on delay is
recommended to be less than 5% of the
switching cycle. For example, in a fsw = 200kHz
LLC system, the switching cycle is ~5µs, and it
is recommended to select the MOSFET to
make tDon < 250ns.
6
Ratio of Body-diode Conduction
Loss to Output Power (%)
IF
Vout=5V
Vout=12V
Vout=24V
5
4
3
2
1
0
0
5
10
15
20
25
Ratio of Turn-on Delay to Switching Cycle (%)
Figure 16: Turn-On Delay vs. Power Loss
The turn-off delay (tDoff) is critical in some fast
transient CCM applications. Choose the
MOSFET to make tDoff below the CCM current
transient duration. Otherwise, the MOSFET
may need to be selected with a lower Qg, or an
external totem pole driver circuit may be added
to prevent shoot-through.
MP6924, MP6924A Rev. 1.02
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MP6924, MP6924A – FAST TURN-OFF, CCM/DCM COMPATIBLE DUAL LLC SYNCHRONOUS RECTIFIER
PACKAGE INFORMATION
SOIC-8
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP6924, MP6924A Rev. 1.02
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