TM
MP86956
Intelli-Phase Solution (Integrated HS/LSFETs and Driver) in LGA and TLGA (5x6mm)
DESCRIPTION
FEATURES
The MP86956 is a monolithic half-bridge with
built-in internal power MOSFETs and gate
drivers. The MP86956 achieves 70A of
continuous output current over a wide input
supply range.
The MP86956 takes a monolithic IC approach
that drives up to 70A of current per phase. The
integration of drivers and MOSFETs results in
high efficiency due to an optimal dead time and
parasitic inductance reduction. The MP86956
can operate from 100kHz to 3MHz.
The MP86956 offers many features to simplify
system design. The MP86956 works with
controllers with a tri-state PWM signal and
comes with an accurate current sense to
monitor the inductor current and temperature
sense to report the junction temperature.
The MP86956 is ideal for server applications
where efficiency and small size are a premium.
The MP86956 is available in LGA and TLGA
(5mmx6mm) packages.
Wide 3V to 16V Operating Input Range
70A Output Current
Current Sense: Accu-SenseTM
Temperature Sense
Accepts Tri-State PWM Signal
Current-Limit Protection
Over-Temperature Protection (OTP)
Fault Reporting
Available in LGA and TLGA (5mmx6mm)
Packages
APPLICATIONS
Server Core Voltage
Graphic Card Core Regulators
Power Modules
All MPS parts are lead-free, halogen-free, and adhere to the RoHS
directive. For MPS green status, please visit the MPS website under
Quality Assurance. “MPS”, the MPS logo, and “Simple, Easy Solutions” are
trademarks of Monolithic Power Systems, Inc. or its subsidiaries.
TYPICAL APPLICATION
MP86956 Rev. 1.3
7/21/2020
www.MonolithicPower.com
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1
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
ORDERING INFORMATION
Part Number*
MP86956GMJ
MP86956GMJT
Package
LGA-41 (5mmx6mm)
TLGA-41 (5mmx6mm)
Top Marking
See Below
* For Tape & Reel, add suffix –Z (e.g.: MP86956GMJ–Z, MP86956GMJT–Z).
TOP MARKING (MP86956GMJ)
MPS: MPS prefix
YY: Year code
WW: Week code
MP86956: Part number
LLLLLLL: Lot number
TOP MARKING (MP86956GMJT)
MPS: MPS prefix
YY: Year code
WW: Week code
MP86956: Part number
LLLLLLL: Lot number
T: Thin
PACKAGE REFERENCE
TOP VIEW
LGA-41 (5mmx6mm), TLGA-41 (5mmx6mm)
MP86956 Rev. 1.3
7/21/2020
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2
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
PIN FUNCTIONS
Pin #
1, 6, 31,
37, 39, 41
2
Pin Name
3
VDD
4
VDRV
5, 7 - 9,
20 - 24, 40
10 - 19
NC
AGND
PGND
SW
25 - 30
VIN
32
PHASE
33
BST
34
PWM
35
EN
36
TOUT/FLT
38
IOUT
Descriptions
No connection.
Analog ground.
Supply voltage for internal circuitry. Connect VDD to VDRV through a 2.2Ω
resistor. Decouple VDD with a 1µF capacitor to AGND. Connect AGND and
PGND at the VDD capacitor.
Driver voltage. Connect VDRV to a 3.3V supply. Decouple VDRV with a 1µF to
a 4.7µF ceramic capacitor.
Power ground.
Phase node.
Input supply voltage. Place input ceramic capacitors (CIN) close to the device to
support the switching current with minimal parasitic inductance.
Switching node for the bootstrap capacitor connection. PHASE pin is
connected to SW internally.
Bootstrap. BST requires a 0.1µF to 0.22µF capacitor to drive the power switch’s
gate above the supply voltage. Connect the capacitor between SW and BST to
form a floating supply across the power switch driver.
Pulse-width modulation input. Leave PWM floating or drive PWM to a midstate level to put SW in a high impedance state.
Enable. Pull EN low to disable the MP86956 and place SW in a high impedance
state.
Single-pin temperature sense and fault reporting. TOUT/FLT is pulled up to
the VDD voltage when a fault occurs.
Current sense output. Use an external resistor to adjust the voltage
proportional to the inductor current.
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance (3)
Supply voltage (VIN) ...................................... 18V
VIN to VPHASE (DC) ............................... -0.3V to 25V
VIN to VPHASE (10ns) ................................ -5V to 32V
VSW to PGND (DC) ................... -0.3V to VIN + 0.3V
VSW to PGND (25ns) ............................... -5V to 25V
VBST................................................... VPHASE + 4V
VDD, VDRV ......................................... -0.3V to +4V
All other pins ...................... -0.3V to VDD + 0.3V
Instantaneous current ................................ 125A
Junction temperature ................................ 150°C
Lead temperature...................................... 260°C
Storage temperature .................-65°C to +150°C
LGA-41 (5mmx6mm) ........... 2.2 ..... 8.7 .... °C/W
TLGA-41 (5mmx6mm) ......... 2.2 ..... 2.0 .... °C/W
θJB θJC_TOP
NOTES:
1) Exceeding these ratings may damage the device.
2) The device is not guaranteed to function outside of its
operating conditions.
3) θJB: Thermal resistance from the junction to board around the
PGND soldering point.
θJC_TOP: Thermal resistance from the junction to the top of the
package.
Recommended Operating Conditions (2)
Supply voltage (VIN) ......................... 3.0V to 16V
Driver voltage (VDRV) .................... 3.0V to 3.6V
Logic voltage (VDD) ........................ 3.0V to 3.6V
Operating junction temp. (TJ). ...-40°C to +125°C
MP86956 Rev. 1.3
7/21/2020
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© 2020 MPS. All Rights Reserved.
3
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
ELECTRICAL CHARACTERISTICS
VIN = 12V, VDRV = VDD = EN = 3.3V, TA = 25°C for typical value, TJ = -40°C to 125°C for max and
min values, unless otherwise noted.
Parameter
IIN shutdown
VIN under-voltage lockout
threshold rising
VIN under-voltage lockout
threshold hysteresis
IVDRV quiescent current
IVDD quiescent current
VDD voltage UVLO rising
VDD voltage UVLO hysteresis
High-side current limit (4)
Symbol
Condition
EN = low
Min
PWM = low
PWM = low
ILIM_FLT
Cycle-by-cycle up to 8 cycles
Negative current limit, cycleby-cycle, no fault report
Positive inductor current
Negative inductor current
Dead time at SW is falling (4)
(4)
Minimum PWM pulse width (4)
IOUT sense gain accuracy (4)
IOUT sense gain
IOUT pin voltage range
MP86956 Rev. 1.3
7/21/2020
2.5
3.0
V
mV
350
2.95
A
200
ns
8
Times
2
6
28
ns
ns
ns
V
V
ns
ns
ns
ns
ns
ns
ns
%
μA/A
0.8
tRising
tFalling
tLT
tTL
tHT
tTH
20A ≤ ISW ≤ 70A
-2
GIOUT
ISW = 0A, VIOUT = 1.2V, TJ =
25°C
SW = Hi-Z, VIOUT = 1.2V
VIOUT
μA
mA
V
mV
A
-35
2.30
IOUT sense offset
(4)
Units
μA
250
3
2.75
300
110
Negative current limit low-side
off time (4)
High-side current limit shutdown
counter (4)
Dead time at SW is rising (4)
PWM tri-state to SW Hi-Z delay
Max
180
450
Low-side current limit (4)
EN input high threshold voltage
EN input low threshold voltage
PWM high to SW rising delay (4)
PWM low to SW falling delay (4)
Typ
90
20
20
40
30
40
30
30
0
5
+2
-2
0
2
μA
-1
0.7
0
1
2.1
μA
V
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4
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
ELECTRICAL CHARACTERISTICS (continued)
VIN = 12V, VDRV = VDD = EN = 3.3V, TA = 25°C for typical value and TJ= -40°C to 125°C for max
and min values, unless otherwise noted.
Parameter
TOUT/FLT sense gain (4)
TOUT/FLT sense offset(4)
Over-temperature shutdown and
fault flag (4)
TOUT/FLT when fault (4)
Symbol
Condition
Min
TJ = 25°C
3.0
Pull up, EN = high
Pull down, EN = high
PWM resistor
PWM logic high voltage
PWM tri-state region
PWM logic low voltage
Typ
8
800
Max
Units
mV/°C
mV
160
°C
3.3
6
5
V
kΩ
kΩ
V
V
V
2.30
1.10
1.8
0.80
NOTE:
4) Guaranteed by design or characterization data, not tested in production.
PWM TIMING DIAGRAM
MP86956 Rev. 1.3
7/21/2020
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5
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
TYPICAL CHARACTERISTICS
VDD UVLO
Efficiency and Loss
18
96%
16
94%
14
92%
12
90%
10
MP86956 (1.2V)
88%
8
MP86956 (1.8V)
86%
6
84%
4
82%
2
80%
3
VDD UVLO THRESHOLD (v)
98%
LOSS (W)
EFFICIENCY
VIN = 12V, L = 150nH, FSW = 500kHz
2.9
2.8
2.7
2.6
2.4
2.3
0
-50
0 5 10 15 20 25 30 35 40 45 50 55 60
OUTPUT CURRENT (A)
50
100
150
PWM_LO
2
1.5
1.9
PWM_LO THRESHOLD (v)
EN_Hi THRESHOLD (v)
0
TEMPERATURE (℃)
EN_HI
VDD rising
VDD falling
2.5
1.8
1.7
1.6
EN_Hi rising
1.5
EN_Hi falling
1.4
1.3
1.2
-50
0
50
100
150
TEMPERATURE (℃)
1.3
1.1
0.9
PWM_Lo rising
0.7
PWM_Lo falling
0.5
-50
0
50
100
TEMPERATURE (℃)
150
PWM_HI
PWM_Hi THRESHOLD (v)
2.3
PWM_Hi rising
2.2
PWM_Hi falling
2.1
2
1.9
1.8
-50
0
50
100
150
TEMPERATURE (℃)
MP86956 Rev. 1.3
7/21/2020
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6
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
TYPICAL PERFORMANCE CHARACTERISTICS
Switching
Dead Time @ SW Ringing
VIN = 12V, L = 150nH, Load = 30A
Load = 30A
.
CH1: VSW
4V/div.
CH1: VSW
1V/div.
100ns/div.
2ns/div.
IOUT Output
IOUT Output
Load = 0A
Load = 30A
CH4: VIOUT
200mV/div.
CH4: VIOUT
200mV/div.
CH1: VSW
5V/div.
CH1: VSW
5V/div.
400ns/div.
400ns/div.
HS Current Limit
CH4: VFAULT
5V/div.
CH3:PWM
5V/div.
CH2: IL
25A/div.
CH1: VSW
4V/div.
1μs/div.
MP86956 Rev. 1.3
7/21/2020
www.MonolithicPower.com
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7
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
BLOCK DIAGRAM
Figure 1: Functional Block Diagram
MP86956 Rev. 1.3
7/21/2020
www.MonolithicPower.com
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8
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
APPLICATION INFORMATION
Operation
The MP86956 is a 70A, monolithic, half-bridge
driver with MOSFETs ideally suited for multiphase buck regulators. An external 3.3V supply
is required to supply both VDD and VDRV.
When EN transitions from low to high and the
VDRV signals are sufficiently high, operation
begins.
Pulse-Width Modulation (PWM)
The pulse-width modulation (PWM) input pin is
capable of tri-state input. When the PWM input
signal is within the tri-state threshold window for
a typical 50ns (THT or TLT), the high-side
MOSFET (HS-FET) turns off immediately, and
the low-side MOSFET (LS-FET) enters diode
emulation mode, which is on until zero-current
detection (ZCD). The tri-state PWM input can
come from a forced mid-voltage PWM signal or
made by floating the PWM input. The internal
current source charges the signal to a middle
voltage. Refer to the PWM timing diagram on
page 5 for the propagation delay definition from
PWM to SW node.
Diode Emulation Mode
In diode emulation mode, when PWM is low or
in a tri-state input, the LS-FET is turned on
whenever the inductor current is positive. The
LS-FET turns off if the inductor current is
negative or after the inductor current crosses
the zero current. Diode emulation mode can be
enabled by driving PWM to a middle state or by
floating PWM.
Current Sense
IOUT is a bidirectional current source pin
proportional to the inductor current. The current
sensing gain is 5μA/A. A resistor is used to
program the voltage gain proportional to the
inductor current, if needed.
The IOUT output has two states (see Table 1).
In disable mode (EN = low), the current sense
circuit is disabled, and IOUT is in Hi-Z (high
impedance) state.
Table 1: IOUT Output States
PWM
EN
IOUT
PWM
High
Active
x
Low
Hi-Z
MP86956 Rev. 1.3
7/21/2020
An IOUT voltage range of 0.7 - 2.1V is required
to achieve an accurate IOUT current output of
up to +350μA/-200μA (i.e.: +70A/-40A).
Generally, there is a resistor (RIOUT) connected
from IOUT to an external voltage that is capable
of sinking small currents to provide enough
voltage level to meet the required operating
voltage range. A proper reference voltage, VCM,
and RIOUT values can be determined with
Equation (1) and Equation (2):
0.7V IIOUT RIOUT VCM 2.1V
(1)
IIOUT ISW GIOUT
(2)
Where VCM is a reference voltage connected to
RIOUT.
Intelli-Phase’s current sense output can be
used by the controller to monitor the output
current accurately. The cycle-by-cycle current
information from IOUT can be used for phasecurrent balancing, over-current protection, and
active-voltage positioning (output voltage
droop).
Positive and Negative Inductor Current Limit
When HS-FET over-current is detected, the HSFET turns off for that PWM cycle. If there are
eight consecutive cycles of an HS-FET current
limit event, the HS-FET latches off, TOUT/FLT
pulls high to VDD, and the LS-FET turns on
until ZCD. Toggle EN or recycle VIN or VDD to
release the latch and restart the device.
When the LS-FET detects a -35A valley current,
the MP86956 turns off the LS-FET and turns on
the HS-FET for 200ns to limit the negative
current. The LS-FET negative current limit will
not trigger a fault report.
Temperature Sense
indicator (TOUT/FLT)
Output
with
Fault
TOUT/FLT is a pin with two functions: junction
temperature sense and fault detection.
TOUT/FLT is a voltage output proportional to
the junction temperature whenever VDD is
higher than its UVLO and the part is in active
mode. The gain is 8mV/°C and has a +800mV
offset at 25°C. For example, 0.8V @ TJ = 25°C
and 1.6V @ TJ = 125°C.
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9
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
When any fault occurs, TOUT/FLT is pulled to
the VDD voltage to report the fault event
regardless of the temperature. 200ns after the
fault has occurred, the PWM impedance
changes accordingly to indicate the fault type.
Table 2 shows the PWM status regarding each
fault event.
Table 2: PWM Resistance when a Fault Occurs
Fault Type
PWM
HS-FET current limit protection
10kΩ to AGND
Over-temperature protection
20kΩ to AGND
SW-PGND short protection
1kΩ to VDD
TOUT/FLT can monitor three fault events.
1. Over-current limit (HS-FET): To trip the
over-current fault, the current limit must be
exceeded eight consecutive times. Once a
fault occurs, the MP86956 latches off to
turn off the HS-FET. The LS-FET turns OFF
when the inductor current reaches zero.
PWM uses a 10kΩ resistor to AGND to
indicate the fault type.
2. Over-temperature fault at TJ > 160°C: Once
a fault occurs, the MP86956 latches off to
turn off the HS-FET. The LS-FET turns off
when the inductor current reaches zero.
PWM uses a 20kΩ resistor to AGND to
indicate the fault type.
3. SW to PGND shorted: Once a fault occurs,
the MP86956 latches off to turn off the HSFET. PWM is pulled high (1kΩ to VDD) to
indicate the fault type.
The fault latch can be released by toggling EN
or by recycling VIN or VDD.
For multi-phase operation, connect TOUT/FLT
of each Intelli-Phase together (see Figure 3).
Intelli-Phase
Power Stage
Vin
IntelliPhase
Vin
L2
VOUT
TOUT/FLT
Multi-Phase
Controller
COUT
PWM
PWM2
Temperature
ADC
Vin
IntelliPhase
Vin
L1
TOUT/FLT
PWM
PWM1
Figure 3: Multi-Phase Temperature Sense Utilization
MP86956 Rev. 1.3
7/21/2020
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10
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
PCB Layout Guidelines
Efficient PCB layout is critical for stable
operation. For best results, refer to Figure 4 and
follow the guidelines below.
1. Place the input MLCC capacitors as close to
VIN and PGND as possible.
2. Place the major MLCC capacitors on the
same layer as the MP86956.
3. Place as many VIN and PGND vias
underneath the package as possible.
7. Place more PGND vias close to the PGND
pin/pad to minimize both parasitic
resistance/impedance
and
thermal
resistance.
8. Place BST capacitor and VDRV capacitor
as close to the MP86956’s pins as possible.
9. Use a trace width of 20 mils or higher to
route the path.
10. Avoid placing vias on the BST driving path.
11. Use a 0.1 - 0.22µF bootstrap capacitor.
4. Place the vias between the VIN or PGND
long pads.
12. Place the VDD decoupling capacitor close
to the device.
5. Place a VIN copper plane on the second
inner layer to form the PCB stack as
positive/negative/positive to reduce the
parasitic impedance from the input MLCC
capacitor to the MP86956.
13. Connect AGND and PGND at the point of
the VDD capacitor's ground connection.
14. Keep the IOUT signal trace away from highcurrent path like SW and PWM.
6. Ensure that the copper plane on the inner
layer at least covers the VIN vias
underneath the package and input MLCC
capacitors.
Figure 4: Example of PCB Layout (Placement and Top Layer PCB)
Input Capacitor: 0805 package (top and bottom sides) and 0402 package (top side)
Inductor: 11x8 package
VDD/BST/VDRV capacitor: 0402 package
Via size: 20/10 mils
MP86956 Rev. 1.3
7/21/2020
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11
MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
PACKAGE INFORMATION
LGA-41 (5mmx6mm)
PIN 1 ID
0.20x45° T YP.
PIN 1 ID
MARKING
PIN 1 ID
INDEX AREA
BOTTOM VIEW
TOP VIEW
0.20X45º
SIDE VIEW
RECOMMENDED LAND PATTERN
NOTE:
RECOMMENDED STENCIL DESIGN
MP86956 Rev. 1.3
7/21/2020
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) LEAD COPLANARITY SHALL BE 0.10
MILLIMETERS MAX.
3) JEDEC REFERENCE IS MO-303.
4) DRAWING IS NOT TO SCALE.
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MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
PACKAGE INFORMATION (continued)
TLGA-41 (5mmx6mm)
PIN 1 ID
0.20x45° T YP.
PIN 1 ID
MAR KING
PIN 1 ID
INDEX AR EA
BOTTOM VIEW
TOP VIEW
0.20X45º
SIDE VIEW
RECOMMENDED LAND PATTERN
NOTE:
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) LEAD COPLANARITY SHALL BE 0.10
MILLIMETERS MAX.
3) JEDEC REFERENCE IS MO-303.
4) DRAWING IS NOT TO SCALE.
RECOMMENDED STENCIL DESIGN
MP86956 Rev. 1.3
7/21/2020
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MP86956 – INTELLI-PHASE SOLUTION IN 5X6MM LGA AND TLGA
Revision History
Revision #
1.1
Revision
Date
4/27/2020
1.2
07/10/2020
1.3
07/20/2020
Description
Remove all TLGA information
Update the descriptions for pin 32
Add (VIN to VPHASE) to Absolute Maximum Ratings
Update the typical NOCP LS off time to 200ns
Update the typical minimum PWM pulse width to 30ns
Revise Typical Characteristics for threshold of EN
Revise the figure of temperature sense utilization for
multi-phase operation
Correct the BST capacitor’s capacitance to 0.22uF
Update the recommended Land Pattern and Stencil
Design
Add TLGA information
Pages
Updated
Page1-13
P3
P3
P4
P4
P6
P10
P11
P12
Page1-13
NOTICE: The information in this document is subject to change without notice. Please contact MPS for current specifications.
Users should warrant and guarantee that third party Intellectual Property rights are not infringed upon when integrating MPS
products into any application. MPS will not assume any legal responsibility for any said applications.
MP86956 Rev. 1.3
7/21/2020
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14