MP86957
TM
Intelli-Phase Solution (Integrated
HS/LS-FETs and Driver) in 5mmx6mm LGA
DESCRIPTION
FEATURES
The MP86957 is a monolithic half-bridge with
built-in internal power MOSFETs and gate
drivers. It achieves 70A of continuous output
current over a wide input supply range.
The MP86957 is a monolithic IC approach that
can drive up to 70A per phase. Integration of
drivers and MOSFETs results in high efficiency
due to optimal dead time and parasitic
inductance reduction. This small 5mmx6mm
LGA device can operate from 100kHz to 3MHz.
The MP86957 offers many features to simplify
system design. This device works through
controllers with a tri-state PWM signal. It also
comes with Accu-SenseTM current sense to
monitor the inductor current, and temperature
sense to report junction temperature.
The MP86957 is ideal for server applications
where efficiency and small size are at a premium.
Wide 3V to 16V Operating Input Range
70A Output Current
Current Sense: Accu-SenseTM
Temperature Sense
Accepts Tri-State PWM Signal
Current Limit Fault Flag
Over-Temperature Fault Flag
Low-Side Catastrophic Fault Flag and
Protection
Available in a 5mmx6mm LGA Package
APPLICATIONS
Server Core Voltage
Graphic Card Core Regulators
Power Modules
All MPS parts are lead-free, halogen-free, and adhere to the RoHS directive.
For MPS green status, please visit the MPS website under Quality
Assurance. “MPS”, the MPS logo, and “Simple, Easy Solutions” are
registered trademarks of Monolithic Power Systems, Inc. or its subsidiaries.
TYPICAL APPLICATION
3.3V
VDRV
VDD
MP86957 VIN
Intelli-Phase
VIN
AGND
BST
PWM
EN
IOUT
TOUT/FLT
MP86957 Rev. 1.1
7/10/2020
PWM
SW
VOUT
EN
IOUT
TOUT/FLT
PGND
PGND
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1
MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
ORDERING INFORMATION
*
Part Number
MP86957GMJ
Package
LGA-41 (5mmx6mm)
Top Marking
See Below
* For Tape & Reel, add suffix –Z (e.g. MP86957GMJ–Z).
TOP MARKING
MPS: MPS prefix
YY: Year code
WW: Week code
MP86957: Part number
LLLLLLL: Lot number
PACKAGE REFERENCE
NC
1
AGND
2
VDD
3
VDRV
4
PGND
5
NC
6
BST
PHASE
NC
VIN
36
EN
37
PWM
38
NC
IOUT
39
TOUT/FLT
NC
TOP VIEW
35
34
33
32
31
30
29
PGND
40
MP86957 Rev. 1.1
7/10/2020
12
13
14
15
16
17
SW
18
VIN
27
VIN
26
VIN
25
VIN
24
PGND
23
PGND
22
PGND
21
PGND
20
PGND
19
SW
11
SW
10
SW
9
SW
PGND
SW
8
SW
PGND
SW
7
SW
PGND
41
SW
NC
VIN
28
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2
MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
PIN FUNCTIONS
Pin #
1, 6, 31,
37, 39, 41
2
AGND
3
VDD
4
VDRV
5, 7, 8, 9,
20, 21, 22,
23, 24, 40
10, 11, 12,
13, 14, 15,
16, 17, 18,
19
25, 26, 27,
28, 29, 30
Name
NC
PGND
SW
VIN
Description
No connection.
Analog ground.
Supply voltage for internal circuitry. Connect to the VDRV pin through a 2.2Ω
resistor and decouple with a 1µF capacitor to AGND. Connect AGND and PGND
at the VDD capacitor.
Driver voltage. Connect to 3.3V supply and decouple with a 1µF to 4.7µF ceramic
capacitor.
Power ground.
Phase node.
Input supply voltage. Place input ceramic capacitors (CIN) close to the device to
support the switching current with minimal parasitic inductance.
Switching node for bootstrap capacitor connection. PHASE pin is connected
to SW internally.
Bootstrap. Requires a 0.1µF to 0.22µF capacitor to drive the power switch’s gate
above the supply voltage. Connect the capacitor between PHASE and BST to form
a floating supply across the power switch driver.
32
PHASE
33
BST
34
PWM
35
EN
36
TOUT/FLT
Single-pin temperature sense and fault reporting. When a fault occurs, the pin
is pulled up to the VDD voltage.
38
IOUT
Current sense output. Use an external resistor to adjust the voltage proportional
to the inductor current.
MP86957 Rev. 1.1
7/10/2020
Pulse-width modulation input. Leave PWM floating or drive to mid-state to put
SW in high-impedance state.
Enable. Pull low to disable the device and place SW in a high-impedance state.
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3
MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
θJB
θJC_TOP
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance (3)
Supply voltage (VIN) ..................................... 18V
VIN to VPHASE (DC).............................. -0.3V to 25V
VIN to VPHASE (10ns) ............................... -5V to 32V
VSW to PGND(DC)................... -0.3 V to VIN + 0.3V
VSW to PGND(25ns) ............................... -5V to 25V
VBST .................................................. VPHASE + 4V
VDD, VDRV ........................................ -0.3V to +4V
All other pins ........................ -0.3V to VDD + 0.3V
Instantaneous current ................................ 95A
Junction temperature ................................150°C
Lead temperature .....................................260°C
Storage temperature ............... -65°C to +150°C
LGA- 41 (5mmx6mm) .............2.2 ..... 8.7...C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The device is not guaranteed to function outside of its operating
conditions.
3) θJB: Thermal resistance from junction to board around PGND
soldering point.
θJC_TOP: Thermal resistance from junction to top of package.
Recommended Operating Conditions (2)
Supply voltage (VIN) ......................... 3.0V to 16V
Driver voltage (VDRV) ....................... 3.0V to 3.6V
Logic voltage (VDD).......................... 3.0V to 3.6V
Operating junction temp (TJ). .. -40°C to +125°C
MP86957 Rev. 1.1
7/10/2020
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MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
ELECTRICAL CHARACTERISTICS
VIN = 12V, VDRV = VDD = EN = 3.3V; TA = 25°C for typical value and TJ = -40°C to +125°C for max
and min values, unless otherwise noted.
Parameter
IIN shutdown
VIN under-voltage lockout threshold
rising
VIN under-voltage lockout threshold
hysteresis
IVDRV quiescent current
IVDD quiescent current
VDD voltage UVLO rising
VDD voltage UVLO hysteresis
High-side current limit (4)
Symbol
Condition
EN = low
PWM = low
PWM = low
ILIM_FLT
Cycle-by-cycle up to 8
cycles
Low-side current limit tolerance (4)
Negative current limit low-side off
time (4)
High-side current limit fault flag
counter (4)
High-side current limit fault flag
clear counter (4)
Dead time at SW rising (4)
MP86957 Rev. 1.1
7/10/2020
2.5
3.0
V
mV
350
2.95
95
A
-40
A
+15%
200
ns
8
times
4
times
2
ns
Positive inductor
current
6
ns
Negative inductor
current
28
ns
20
20
40
30
40
30
30
0
5
V
V
ns
ns
ns
ns
ns
ns
ns
%
μA/A
2.30
0.8
tRising
tFalling
tLT
tTL
tHT
tTH
20A ≤ ISW ≤ 70A
GIOUT
μA
mA
V
mV
+15%
-15%
(4)
Minimum PWM pulse width (4)
IOUT sense gain accuracy (4)
IOUT sense gain
Units
μA
250
3
2.75
300
Negative current limit,
cycle-by-cycle, no fault
report
PWM tri-state to SW Hi-Z delay (4)
Max
180
-15%
Low-side current limit (4)
EN input high threshold voltage
EN input low threshold voltage
PWM high to SW rising delay (4)
PWM low to SW falling delay (4)
Typ
90
450
High-side current limit tolerance (4)
Dead time at SW falling
Min
-2
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5
MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
ELECTRICAL CHARACTERISTICS (continued)
VIN = 12V, VDRV = VDD = EN = 3.3V; TA = 25°C for typical value and TJ = -40°C to +125°C for max
and min values, unless otherwise noted.
Parameter
Symbol
ISW = 0A, VIOUT = 1.2V,
TJ = 25°C
EN = low, VIOUT = 1.2V
IOUT sense offset
IOUT pin voltage range (4)
TOUT/FLT sense gain (4)
TOUT/FLT sense offset (4)
Over-temperature fault flag (4)
Over-temperature fault tolerance (4)
Over-temperature fault hysteresis (4)
TOUT/FLT when fault (4)
Condition
VIOUT
Min
Typ
Max
Units
-2
0
2
μA
-1
0.7
0
1
2.1
μA
V
mV/°C
mV
°C
8
800
145
TJ = 25°C
-10%
3.0
Pull up, EN = high
Pull down, EN = high
PWM resistor
PWM logic high voltage
PWM tri-state region
PWM logic low voltage
+10%
12
3.3
6
5
2.30
1.10
1.80
0.80
°C
V
kΩ
kΩ
V
V
V
Note:
4) Guaranteed by design or characterization data, not tested in production.
MP86957 Rev. 1.1
7/10/2020
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6
MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
PWM TIMING DIAGRAM
PWM
SW
Hi-Z
tRising
tFalling
tLT
Hi-Z
tHT
tTH
tTL
Figure 1: PWM Timing Diagram
MP86957 Rev. 1.1
7/10/2020
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MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
TYPICAL CHARACTERISTICS
Efficiency and Loss
VDD UVLO
18
96%
16
94%
14
92%
12
90%
10
MP86957 (1.2V)
88%
8
MP86957 (1.8V)
86%
6
84%
4
82%
2
80%
3
VDD UVLO THRESHOLD (v)
98%
LOSS (W)
EFFICIENCY
VIN = 12V, L = 150nH, fSW = 500kHz
2.9
2.8
2.7
2.6
2.4
2.3
0
-50
0 5 10 15 20 25 30 35 40 45 50 55 60
OUTPUT CURRENT (A)
0
50
100
150
TEMPERATURE (℃)
EN_HI
PWM_LO
2
1.5
PWM_LO THRESHOLD (v)
EN_Hi THRESHOLD (v)
VDD rising
VDD falling
2.5
1.9
1.8
1.7
1.6
EN_Hi rising
1.5
EN_Hi falling
1.4
1.3
1.2
1.3
1.1
0.9
PWM_Lo rising
0.7
PWM_Lo falling
0.5
-50
0
50
100
150
TEMPERATURE (℃)
-50
0
50
100
TEMPERATURE (℃)
150
PWM_HI
PWM_Hi THRESHOLD (v)
2.3
PWM_Hi rising
2.2
PWM_Hi falling
2.1
2
1.9
1.8
-50
0
50
100
150
TEMPERATURE (℃)
MP86957 Rev. 1.1
7/10/2020
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MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
TYPICAL PERFORMANCE CHARACTERISTICS
Switching
Dead Time @ SW Ringing
VIN=12V, VOUT=1.8V, L=100nH, fSW=800kHz,
Load=30A
Load = 30A
.
CH1: VSW
1V/div.
CH1: VSW
4V/div.
100ns/div.
2ns/div.
IOUT Output
IOUT Output
Load = 0A
Load = 30A
CH3: VIOUT
200mV/div.
CH3: VIOUT
200mV/div.
CH1: VSW
5V/div.
CH1: VSW
5V/div.
400ns/div.
MP86957 Rev. 1.1
7/10/2020
400ns/div.
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MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
FUNCTIONAL BLOCK DIAGRAM
VDD
RDY
VDRV
UVLO
BST
VIN
VIN
VDD
6k
HS Current
Limit
PWM
5k
Level
Shift
HS Current
Limit
HS-FET
VIN
SW
SW
HS ON
Inductor
Current
Crossed Zero
Control
Logic
EN
ZCD
SW
PGND
VDRV
LS ON
Negative
Current Limit
AGND
Temperature
Sense & Fault
Indicator
Current
Sense
TOUT/FLT
IOUT
LS-FET
Negative
Current Limit
SW
PGND
SW
PGND
PGND
Figure 2: Functional Block Diagram
MP86957 Rev. 1.1
7/10/2020
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MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
OPERATION
The MP86957 is a 70A, monolithic half-bridge
driver with MOSFETs ideally suited for
multiphase buck regulators.
An external 3.3V is required to supply both VDD
and VDRV.
When EN transitions from low to high and the
VDD and VDRV signals are sufficiently high,
operation begins.
MP86957 Rev. 1.1
7/10/2020
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11
MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
APPLICATION INFORMATION
PWM
The PWM input pin is capable of tri-state input.
When the PWM input signal is within the tri-state
threshold window for 40ns (typical), THT or TLT,
the high-side MOSFET (HS-FET) turns off
immediately and the low-side MOSFET (LS-FET)
remains in diode emulation mode until zero
current detection. The tri-state PWM input can
be from a forced middle voltage PWM signal.
Alternately, the PWM input can be floated and
the internal current source will charge the signal
to a middle voltage. The PWM timing diagram
shows the propagation delay definition from
PWM to the SW node (see Figure 1).
Place a resistor divider (e.g. 1.2kΩ to VDD and
1kΩ to GND) at the PWM pin to anticipate when
the controller’s PWM tri-state enters Hi-Z (High
impedance) mode. This function prevents the
LS-FET from turning on if the TOUT/FLT signal
is pulled up after a fault occurs and the controller
responds the fault and shuts down by placing
PWM to HiZ mode. The PWM pin does not
require a resistor divider if the controller’s PWM
tri-state is at a middle voltage.
Diode Emulation Mode
In diode emulation mode, when PWM is at either
low or tri-state input, the LS-FET turns on
whenever the inductor current is positive. The
LS-FET is off if the inductor current is negative
or after it has crossed zero current. Diode
emulation mode can be enabled by:
1. Driving PWM to middle state
2. Floating the PWM pin
Current Sense
The IOUT pin is a bi-directional current source
proportional to the inductor current. The current
sensing gain is 5μA/A, and a resistor is used to
program the voltage gain proportional to the
inductor current if needed.
The IOUT pin output has two states (see Table
1). In disable mode (EN = low), the current sense
circuit is disabled and IOUT is in Hi-Z (highimpedance) state.
MP86957 Rev. 1.1
7/10/2020
Table 1: IOUT Output States
PWM
EN
IOUT
PWM
High
Active
x
Low
Hi-Z
The IOUT pin voltage range of 0.7V to 2.1V is
required to get IOUT’s accurate current output.
In general, there is a resistor (RIOUT) connected
from IOUT to an external voltage, which is
capable of sinking a small current to provide
enough voltage to meet the required operating
voltage range. Determine a proper reference
voltage (VCM) and/or RIOUT value using Equation
(1) and Equation (2):
0.7V IIOUT RIOUT VCM 2.1V
(1)
IIOUT ISW GIOUT
(2)
Where VCM is a reference voltage connected to
RIOUT.
The Intelli-PhaseTM current sense output can be
used to accurately monitor the output current.
The cycle-by-cycle current information from
IOUT can be used for phase current balancing,
over-current protection, and active voltage
positioning (output voltage droop).
Positive and Negative Inductor Current Limit
When HS-FET over-current is detected, the HSFET on-pulse is truncated for that PWM cycle. If
an HS current limit event is detected for eight
consecutive cycles, the TOUT/FLT pin is pulled
high to VDD, during which time the driver
continues responding to PWM. Once four
consecutive normal cycles are detected,
TOUT/FLT is cleared.
When the LS-FET detects a -40A valley current,
the part turns off the LS-FET and turns on the
HS-FET for 200ns to limit the negative current.
The LS-FET negative current limit will not trigger
a fault report.
Over-Temperature Fault Flag
If the junction temperature rises above 145°C,
TOUT/FLT is pulled to VDD, during which time
the driver continues responding to PWM. Once
the junction temperature falls below 133°C, the
fault flag clears.
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12
MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
Low-Side Catastrophic Failure Protection
If the HS-FET VDS is greater than 0.7V when the
HS-FET is on, the low-side catastrophic failure
protection is triggered. The MP86957 stops
responding to PWM and latches, and TOUT/FLT
is pulled high immediately. After 200ns, the
PWM impedance becomes 10k to GND. The
MPS multiphase controller can detect this
impedance and record which phase experiences
this failure.
This fault latch can be released by toggling EN
or recycling VDD/VIN.
Temperature Sense Output with Fault
Indicator (TOUT/FLT)
TOUT/FLT reports junction temperature. It
sources a voltage proportional to the junction
temperature when VDD is higher than the UVLO
threshold. The gain is 8mV/°C, and the offset is
+800mV at 25°C. TOUT pins from multi-phase
topologies can be tied together to report the
highest TMON signals to the controller.
TOUT/FLT are pulled to VDD when a fault event
is detected. It reports three fault events: HS-FET
over-current limit, over-temperature, low-side
catastrophic failure.
For multiphase operation, connect TOUT/FLT of
each Intelli-PhaseTM together (see Figure 3).
Intelli-PhaseTM
Power Stage
VIN
VIN
IntelliPhase TM
L2
VOUT
TOUT/FLT
Multiphase
Controller
COUT
PWM
VIN
VIN
IntelliPhase TM
1. Place the input MLCC capacitors as close to
VIN and PGND as possible. The major
MLCC capacitors should be placed on the
same layer as the MP86957.
2. Place as many VIN and PGND vias
underneath the package as possible, inbetween VIN or PGND long pads.
3. Place a VIN copper plane on the second
inner layer to form the PCB stacking in a +//+ pattern to reduce the parasitic impedance
from the input MLCC cap to the MP86957.
The copper plane on inner layer must at least
cover the VIN vias underneath the package
and the input MLCC capacitors.
4. Place more PGND vias close to the PGND
pin/pad to minimize parasitic resistance and
impedance, as well as thermal resistance.
5. Place the BST and VDRV capacitors as
close to the device’s pins as possible. Use a
≥20 mil width trace to route the path. Avoid
the via for the BST driving path. It is
recommended to use 0.1µF to 0.22µF for the
bootstrap capacitor.
6. Place the VDD decoupling capacitor close to
the device. Connect AGND and PGND at the
point of the VDD capacitor’s ground
connection.
7. Keep the IOUT signal trace away from highcurrent paths, such as SW and PWM.
PWM2
Temperature
ADC
PCB Layout Guidelines
PCB layout plays an important role in achieving
stable operation. For optimal performance, refer
to Figure 4 and follow the guidelines below:
L1
TOUT/FLT
PWM
PWM1
Figure 3: Multiphase Temperature Sense
Utilization
MP86957 Rev. 1.1
7/10/2020
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MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
PGND
VDRV
VDD
AGND
NC
6
5
4
3
2
1
7
NC
PGND
IOUT
33
32
31
NC
30
34
SW
SW
19
35
PHASE
18
36
BST
SW
17
37
PGND
40
SW
16
PWM
SW
15
EN
SW
14
NC
TOUT/FLT
SW
13
40
PGND
NC
38
41
39
41
12
NC
11
SW
8
9
10
SW
PGND
PGND
SW
VIN
29 VIN
29
28 VIN
28
27 VIN
27
26 VIN
26
25 VIN
25
24
24 PGND
23
23 PGND
22
22 PGND
21
21 PGND
20
20 PGND
Figure 4: Example of PCB Layout (Placement & Top layer PCB)
Input Capacitor: 0805 package (top side & bottom side) & 0402 package (Top side)
Inductor: 11x8 package
VDD/BST/VDRV Capacitor: 0402 package
Via Size: 20/10 mils
MP86957 Rev. 1.1
7/10/2020
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14
MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
PACKAGE INFORMATION
LGA-41 (5mmx6mm)
MP86957 Rev. 1.1
7/10/2020
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15
MP86957 – INTELLI-PHASETM SOLUTION IN 5MMX6MM LGA
Revision History
Revision #
1.0
1.1
Revision
Date
05/08/2019
07/08/2020
Description
Initial Release
Update the descriptions for pin 32.
Add (VIN to VPHASE) to Absolute Maximum Ratings
Update recommended operating conditions for VIN from 3.0V to
16V
Update the typical dead-time for negative inductor current at SW
falling edge to 28ns
Update the typical propagation delay from PWM to SW
Update the typical minimum PWM pulse width to 30ns
Add Typical Characteristics for threshold of EN, PWM and VDD
UVLO
Update typical performance characteristics
Update the application information for PWM section
Update Figure 3
Correct the BST capacitor’s capacitance to 0.22μF
Update the recommended Land Pattern and Stencil Design
Add revision history page
Pages
Updated
3
4
4
5
5
5
8
9
12
13
13
15
16
NOTICE: The information in this document is subject to change without notice. Please contact MPS for current specifications.
Users should warrant and guarantee that third-party Intellectual Property rights are not infringed upon when integrating MPS
products into any application. MPS will not assume any legal responsibility for any said applications.
MP86957 Rev. 1.1
7/10/2020
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