MP86972
60A, Intelli-Phase SolutionTM with
Integrated HS-FETs, LS-FETs, and Driver
in a TLGA-35 (3mmx6mm) Package
DESCRIPTION
FEATURES
The MP86972 is a monolithic half-bridge driver
with built-in internal power MOSFETs and gate
drivers. It achieves 60A of continuous output
current across a wide input supply range.
The device can drive up to 60A per phase. The
integrated drivers and MOSFETs result in high
efficiency due to an optimal dead time and
reduced parasitic inductance. The device
operates from 100kHz to 3MHz.
The MP86972 offers many features to simplify
system design, and works with controllers with a
tri-state PWM signal. It also comes with an
accurate current sense to monitor the inductor
current, and temperature sense to report junction
temperature.
MP86972 is ideal for server applications where
efficiency and small size are a premium. The
device is available in a TLGA-35 (3mmx6mm)
package.
Wide 3V to 12V Operating Input Range
60A Output Current
Accu-SenseTM Current Sense
Temperature Sense
Accepts Tri-State PWM Signal
Current-Limit Protection
Over-Temperature Protection (OTP)
Fault Reporting
Available in a TLGA (3mmx6mm) Package
APPLICATIONS
Server Core Voltages
Graphic Card Core Regulators
Power Modules
All MPS parts are lead-free, halogen-free, and adhere to the RoHS directive.
For MPS green status, please visit the MPS website under Quality
Assurance. “MPS”, the MPS logo, and “Simple, Easy Solutions” are
trademarks of Monolithic Power Systems, Inc. or its subsidiaries.
TYPICAL APPLICATION
VDRV
VDD
AGND
MP86972 Rev. 1.0
6/28/2021
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
ORDERING INFORMATION
Part Number
Package
Top Marking
MSL Rating
MP86972GLJTH*
TLGA-35 (3mmx6mm)
See Below
3
* For Tape & Reel, add suffix -Z (e.g. MP86972GLJTH-Z).
TOP MARKING
MP: MPS prefix
Y: Year code
W: Week code
86972: First five digits of the part number
LLL: Lot number
TH: Thin package
PACKAGE REFERENCE
VTEMP/
FLT
1
SW
2
SW
3
CS
SYNC
PWM
29
AGND
30
VDD
BST
TOP VIEW
28
27
26
25
31
VIN
32
35
SW
VIN
24
VIN
23
VIN
22
VIN
SW
4
21
VIN
SW
5
20
PGND
SW
6
19
PGND
SW
7
18
PGND
SW
8
17
PGND
9
16
PGND
10
11
12
13
14
15
SW
SW
VDRV
PGND
PGND
34
PGND
SW
SW
33
SW
TLGA-35 (3mmx6mm)
MP86972 Rev. 1.0
6/28/2021
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
PIN FUNCTIONS
Pin #
1
Name
Description
Single-pin temperature sense and fault reporting. If a fault occurs, this pin is pulled
VTEMP/FLT
up to 3.3V.
2, 3, 4, 5,
6, 7, 8, 9,
10, 11, 12,
32, 33
SW
13
VDRV
Driver voltage. Connect VDRV to a 3.3V supply and decouple it with a 1µF to 4.7µF
ceramic capacitor.
PGND
Power ground.
14, 15, 16,
17, 18, 19,
20, 34
21, 22, 23,
24, 31, 35
VIN
25
PWM
26
SYNC
27
CS
28
AGND
29
VDD
30
BST
MP86972 Rev. 1.0
6/28/2021
Phase node.
Supply voltage. Place a capacitor (CIN) close to the device to support the switching
current and reduce voltage spikes at the input.
Pulse-width modulation input. Float the PWM pin or drive it to a middle-state to put
SW in a high impedance state.
Diode emulation mode and standby mode selection. Float the SYNC pin or drive
SYNC to a middle-state to enter standby mode. Pull SYNC high for continuous
conduction mode (CCM). Pull SYNC low to enable diode emulation mode.
Current-sense output. Use an external resistor to adjust the voltage so that it is
proportional to the inductor current.
Analog ground.
Internal circuitry voltage. Connect VDD to VDRV via a 2.2Ω resistor. Decouple VDD
with a 1µF capacitor connected to AGND. Connect AGND and PGND at the VDD
capacitor.
Bootstrap. BST requires a 0.1µF to 1µF capacitor to drive the power switch’s gate
above the supply voltage. Connect the capacitor between the SW and BST pins to form
a floating supply across the power switch driver.
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
θJB
θJC_TOP
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance (3)
VIN to PGND................................. -0.3V to +16V
VIN to VSW ..................................... -0.3V to +16V
VIN to VSW (10ns) ..........................................22V
VSW to PGND ............................... -0.3V to +14V
VSW to PGND (25ns) ..................... -10V to +20V
VBST .....................................................VSW + 4V
VDD, VDRV........................................ -0.3V to +4V
All other pins ........................ -0.3V to VDD + 0.3V
Instantaneous current ................................95A
Junction temperature ............................... 150°C
Lead temperature .................................... 260°C
Storage temperature ................ -65°C to +150°C
TLGA-35 (3mmx6mm)...........2.2.......8.0....°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The device is not guaranteed to function outside of its operating
conditions.
3) θJB: Thermal resistance from the junction to the board around
the PGND soldering point.
θJC_TOP: Thermal resistance from the junction to the top of the
package.
ESD Ratings
Human body model (HBM) ........................ ±2kV
Charged device model (CDM) ................. ±1.5kV
Recommended Operating Conditions (2)
Supply voltage (VIN) ........................... 3V to 12V
Driver voltage (VDRV) ...................... 3.0V to 3.6V
Logic voltage (VDD)......................... 3.0V to 3.6V
Operating junction temp (TJ) .... -40°C to +125°C
MP86972 Rev. 1.0
6/28/2021
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
ELECTRICAL CHARACTERISTICS
VIN = 6V, VDRV = VDD = SYNC = 3.3V, TA = 25°C for typical values, TJ = -40°C to +125°C for maximum
and minimum values, unless otherwise noted.
Parameter
Symbol
IIN shutdown
VIN under-voltage lockout
threshold rising
VIN under-voltage lockout
threshold hysteresis
IVDRV quiescent current
IIN_OFF
Min
SYNC = Hi-Z
PWM = low
ILIM_FLT
Cycle by cycle up to 4
cycles
Negative current limit,
cycle by cycle, no fault
report
Positive inductor current
Dead-time falling (4)
Negative inductor current
VDD = 3V
VDD = 3.6V
SYNC logic high voltage
VDD = 3V
VDD = 3.6V
VDD = 3V
VDD = 3.6V
180
μA
2.5
2.9
V
mV
400
μA
2.9
mA
V
mV
90
A
-30
A
200
ns
4
Times
2
ns
8
ns
35
ns
V
V
2.4
2.6
tRISING
tFALLING
15
15
tLT
tTL
tHT
tTH
40
50
40
50
ns
ns
ns
ns
SYNC logic low voltage
MP86972 Rev. 1.0
6/28/2021
90
V
V
V
V
ns
ns
SYNC tri-state region
(4)
Units
3
2.75
250
Negative current limit low-side
off time (4)
High-side current limit shutdown
counter (4)
Dead-time rising (4)
PWM tri-state to SW Hi-Z delay
Max
PWM = low
Low-side current limit (4)
PWM high to SW rising delay (4)
PWM low to SW falling delay (4)
Typ
450
IVDD quiescent current
VDD voltage UVLO rising
VDD voltage UVLO hysteresis
High-side current limit (4)
Condition
1.1
1.3
1.65
1.95
0.6
0.7
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
ELECTRICAL CHARACTERISTICS (continued)
VIN = 6V, VDRV = VDD = SYNC = 3.3V, TA = 25°C for typical values, TJ = -40°C to +125°C for maximum
and minimum values, unless otherwise noted.
Parameter
Symbol
Condition
Min
Typ
(4)
Minimum PWM pulse width
Current-sense gain accuracy (4)
Max
Units
+2
ns
%
20
20A ≤ ISW ≤ 60A
-2
Current-sense gain
μA/A
8
ISW = 0A, VCS = 1.2V,
TJ = 25°C
SW Hi-Z, VCS = 1.2V
-2
+2
μA
-1
0.7
+1
2.1
10
-100
μA
V
mV/°C
mV
Over-temperature shutdown and
fault flag (4)
160
°C
VTEMP/FLT if a fault occurs (4)
VDD
V
6
kΩ
5
1.8
1.8
0.8
kΩ
V
V
V
V
V
0.8
V
Current-sense offset
(4)
CS voltage range
VTEMP/FLT sense gain (4)
VTEMP/FLT sense offset (4)
VCS
TJ = 25°C
Pull-up, SYNC= low or
high
Pull down
VDD = 3V
VDD = 3.6V
VDD = 3V
VDD = 3.6V
VDD = 3V
PWM resistor
PWM logic high voltage
PWM tri-state region
PWM logic low voltage
2.4
2.4
1.1
1.1
VDD = 3.6V
Notes:
4) Guaranteed by design or characterization data. Not tested in production.
PWM TIMING DIAGRAM
PWM
SW
Hi-Z
tRISING
tFALLING
tLT
tHT
tTH
MP86972 Rev. 1.0
6/28/2021
Hi-Z
tTL
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
TYPICAL CHARACTERISTICS
Efficiency
VDD UVLO THRESHOLD (V)
96
94
EFFICIENCY (%)
VDD UVLO Threshold vs.
Temperature
VIN = 6V, L = 50nH, fSW = 1MHz
92
90
88
86
84
MP86972 0.8V
82
MP86972 1.2V
80
0
20
40
OUTPUT CURRENT (A)
3
VDD rising
2.9
VDD falling
2.8
2.7
2.6
2.5
2.4
2.3
-50
60
1.3
SYNC_LO rising
1.2
SYNC_LO falling
1.1
1
0.9
0.8
0.7
0.6
-50
0
50
100
TEMPERATURE ( C)
PWM_LO falling
1
0.9
0.8
0.7
0.6
-50
MP86972 Rev. 1.0
6/28/2021
0
50
100
TEMPERATURE ( C)
150
SYNC_HI falling
2.3
2.2
2.1
2
1.9
1.8
-50
PWM HIGH THRESHOLD (V)
PWM LOW THRESHOLD (V)
PWM_LO rising
SYNC_HI rising
2.4
150
1.3
1.1
150
2.5
PWM Low Threshold vs.
Temperature
1.2
50
100
TEMPERATURE ( C)
SYNC High Threshold vs.
Temperature
SYNC HIGH THRESHOLD (V)
SYNC LOW THRESHOLD (V)
SYNC Low Threshold vs.
Temperature
0
2.5
0
50
100
TEMPERATURE ( C)
150
PWM High Threshold vs.
Temperature
PWM_HI rising
2.4
PWM_HI falling
2.3
2.2
2.1
2
1.9
1.8
-50
0
50
100
TEMPERATURE ( C)
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7
MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
TYPICAL PERFORMANCE CHARACTERISTICS
Switching Waveform
Dead Time at SW Rising
VIN = 6V,L = 50nH, IOUT = 30A
IOUT = 30A
CH3: VSW
0.3V/div.
CH3: VSW
2V/div.
100ns/div.
2.5ns/div.
CS Output Waveform
CS Output Waveform
IOUT = 0A
IOUT = 30A
CH1: VIOUT
300mV/div.
CH1: VIOUT
300mV/div.
CH3: VSW
5V/div.
CH3: VSW
5V/div.
500ns/div.
500ns/div.
High-Side Current Limit
CH1: VFAULT
5V/div.
CH2: VSW
10V/div.
CH2: IL
20A/div
CH1: PWM
5V/div.
2µs/div.
MP86972 Rev. 1.0
6/28/2021
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
FUNCTIONAL BLOCK DIAGRAM
VDD
RDY
UVLO
VDRV
BST
VIN
VIN
VDD
6kΩ
HS Current
Limit
PWM
5kΩ
Level
Shift
HS Current
Limit
HS-FET
VIN
SW
SW
HS On
Inductor
Current
Crossed Zero
Control
Logic
SYNC
ZCD
SW
PGND
VDRV
LS On
Negative
Current Limit
AGND
Temperature
Sense and Fault
Indicator
Current
Sense
VTEMP/FLT
CS
LS-FET
Negative
Current Limit
SW
PGND
SW
PGND
PGND
Figure 1: Functional Block Diagram
MP86972 Rev. 1.0
6/28/2021
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
OPERATION
The MP86972 is a 60A, monolithic half-bridge
driver with MOSFETs. It is well-suited for multiphase buck regulators. An external 3.3V is
required to supply both VDD and VDRV. When
the VIN and VDD signals are sufficiently high,
operation begins.
PWM
The PWM input pin is capable of tri-state input. If
the PWM input signal is within the tri-state
threshold window for about 50ns (tHL or tLT), the
high-side MOSFET (HS-FET) turns off
immediately. The low-side MOSFET (LS-FET)
enters diode emulation mode, and stays on until
zero-current detection (ZCD).
The tri-state PWM input is enabled by forcing a
middle-voltage PWM signal, or by floating the
PWM input. The internal current source charges
the signal to a middle voltage. See the PWM
Timing Diagram on page 6 to define the
propagation delay from PWM to the SW node.
Standby Mode
When the SYNC pin is floating or forced to a
middle-state voltage for 2µs, the MP86972
enters standby mode. While in standby mode,
the MP86972 shuts down, and both the CS and
VTEMP/FLT outputs are disabled. The fault
(VTEMP/FLT) latch is not be reset by entering
standby mode.
The CS output has two states (see Table 1). In
standby mode, the CS circuit is disabled. It takes
the device 40µs to exit standby mode and enter
active mode.
Table 1: CS Output States
PWM
SYNC
CS
PWM
High
Active
PWM
Low
Active
x
Hi-Z (or middle)
Standby
To obtain an accurate CS output up to +480μA/240μA (e.g. +60A/-30A), the CS pin’s voltage
must be between 0.7V and 2.1V. Generally,
there is a resistor (RCS) connected from the CS
pin to an external voltage that is capable of
sinking small currents. This provides a sufficient
voltage level to meet the required operating
voltage range.
Choose a value for RCS to determine a proper
reference voltage (VCM). The relationship
between RCS and VCM can be calculated with
Equation (1):
0.7V ICS R CS VCM 2.1V
(1)
Where VCM is a reference voltage connected to
RCS, and ICS can be estimated with Equation (2):
ICS IL GCS
(2)
Diode Emulation Mode
When PWM is low or in tri-state input in diode
emulation mode, the LS-FET turns on when the
inductor current is positive. The LS-FET turns off
if the inductor current reaches 0A or becomes
negative. There are three ways to enable diode
emulation mode, listed below:
The Intelli-Phase’sTM current-sense output can
be used by the controller to accurately monitor
the output current. The cycle-by-cycle current
information from the CS pin can be used for
phase
current
balancing,
over-current
protection, and active voltage positioning (output
voltage droop).
Positive and Negative Inductor Current limit
If an over-current (OC) condition is detected on
the HS-FET, the HS-FET turns off for that PWM
cycle. If the OC conditions lasts four consecutive
cycles, the HS-FET latches off, VTEMP/FLT is
pulled up to VDD, and the LS-FET turns on, and
stays on until ZCD. To release the latch and
restart the device, power must be cycled on VIN
or VDD.
Pull the SYNC pin low.
Drive the PWM pin to s middle-state.
Float the PWM pin.
Current Sense (CS)
CS is a bidirectional current source that is
proportional to the inductor current. The currentsense gain is 8μA/A. If required, a resistor can
be used to configure the voltage gain
proportional to the inductor current.
If the LS-FET detects a -30A current, the part
turns off the LS-FET for 200ns to limit the
MP86972 Rev. 1.0
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
negative current. The LS-FET’s negative current
limit does not trigger a fault report.
Temperature-Sense Output with Fault
Indication (VTEMP/FLT)
The VTEMP/FLT pin can sense the junction
temperature or indicate if certain faults have
occurred.
Junction Temperature Sense
When VDD exceeds its under-voltage lockout
(UVLO) threshold and the part is in active mode,
the VTEMP/FLT pin has an output voltage that is
proportional to the junction temperature. The
gain is 10mV/°C, and it has a -100mV offset at
25°C. For example, the voltage is 0V when TJ <
10°C, 0.15V when TJ = 25°C, and 0.9V when
TJ = 100°C.
Fault Indication
If any fault occurs, VTEMP/FLT is typically pulled
up to 3.3V (or a 3.0V minimum) to report the fault
event, regardless of the temperature. After the
fault occurs for 200ns, the PWM impedance
changes according to the fault type. Table 2 lists
how the PWM status changes for each fault type.
Table 2: PWM Resistance if a Fault Occurs
Fault Type
PWM
Current-limit protection
Over-temperature protection
SW-to-PGND short protection
10kΩ to AGND
20kΩ to AGND
1kΩ to VDD
The three fault events are described below:
1. Over-current limit: The current limit fault
condition must remain for eight consecutive
cycles to trigger this fault. If this fault occurs,
the part latches off to turn off the HS-FET.
The LS-FET turns on and stays on until the
current reaches 0A. The PWM pin is pulled
to GND through a 10kΩ resistor to indicate
this fault type.
2. Over-temperature fault when TJ > 160°C: If
an over-temperature fault occurs, the part
latches off, and the HS-FET turns off. The
LS-FET turns on and stays on until the
current reaches 0A. The PWM is pulled to
GND through a 20kΩ resistor to indicate this
fault type.
3. SW-to-PGND short: If a short fault occurs,
the part latches off to turn off the HS-FET.
The PWM pin is pulled high (1kΩ to VDD)
to indicate the fault type.
The fault latch is not be reset by entering standby
mode. The fault latch can be released by cycling
power on VIN or VDD.
For multi-phase operation,
VTEMP/FLT pins of each
together (see Figure 2).
connect the
Intelli-PhaseTM
Intelli-PhaseTM
Power Stage
VIN
Intelli-Phase TM
L2
VIN
VOUT
VTEMP
Multi-Phase
Controller
COUT
PWM
PWM2
Temperature
ADC
VIN
Intelli-PhaseTM
VIN
L1
VTEMP
PWM
PWM1
Figure 2: Multi-Phase Temperature Sense Utilization
MP86972 Rev. 1.0
6/28/2021
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
APPLICATION INFORMATION
6. Place more PGND vias close to the PGND
pin/pad to minimize parasitic resistance,
parasitic impedance, and thermal resistance.
PCB Layout Guidelines
PCB layout is critical for stable operation. For the
best results, refer to Figure 3 and follow the
guidelines below:
7. Place the BST capacitor and VDRV capacitor
as close to the device’s pins as possible,
using trace paths at least 20mils wide.
1. Place the input MLCC capacitors as close to
the VIN and PGND pins as possible.
8. Avoid using a via for the BST driving path. It
is recommended to use a 0.1µF to 1µF
bootstrap capacitor.
2. Place the major MLCC capacitors on the
same layer as the MP86972.
3. Place as many VIN and PGND vias
underneath the package as possible, as well
as between the VIN or PGND long pads.
9. Place the VDD decoupling capacitor close to
the device.
10. Connect AGND and PGND at the VDD
capacitor’s ground connection.
4. Place a VIN copper plane on the second inner
layer to form the PCB stack as
positive/negative/positive to reduce the
parasitic impedance from the input MLCC
capacitor.
11. Keep the CS signal trace away from highcurrent paths, such as SW and PWM.
5. Ensure that the inner layer copper planes
cover the VIN vias that are beneath the
package and input MLCC capacitors.
RVD D
VDD
29
28
27
26
25
BST
30
31
1
VIN
24
23
2
3
32
35
SW
VIN
22
CIN
CIN
20
5
19
6
7
33
34
SW
PGND
18
8
17
9
16
10
CIN
CIN
21
CIN
SW
OUT
4
11
12
13
14
15
VDR V
Figure 3: Recommended PCB Layout (Placement and Top Layer)
Input Capacitor: 0603 Package (Top Side and Bottom Side) and 0402 Package (Top Side)
Inductor: 6mmx7mm Package
VDD/BST/VDRV Capacitor: 0402 Package
Via Size: 20/10mils
MP86972 Rev. 1.0
6/28/2021
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MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
TYPICAL APPLICATION CIRCUIT
VDRV
VDD
AGND
Figure 4: Typical Application Circuit
MP86972 Rev. 1.0
6/28/2021
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13
MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
PACKAGE INFORMATION
TLGA-35 (3mmx6mm)
PIN 1 ID
MARKING
PIN 1 ID
0.20X45º TYP
PIN 1 ID
INDEX AREA
TOP VIEW
BOTTOM VIEW
SIDE VIEW
RECOMMENDED LAND PATTERN
NOTES:
RECOMMENDED STENCIL DESIGN
MP86972 Rev. 1.0
6/28/2021
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) LEAD COPLANARITY SHALL BE 0.10
MILLIMETERS MAX.
3) JEDEC REFERENCE IS MO-303.
4) DRAWING IS NOT TO SCALE.
MonolithicPower.com
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© 2021 MPS. All Rights Reserved.
14
MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
CARRIER INFORMATION
1
Pin1
1
ABCD
1
1
ABCD
ABCD
ABCD
Feed Direction
Part Number
Package
Description
Quantity/
Reel
Quantity/
Tube
Quantity/
Tray
Reel
Diameter
Carrier
Tape
Width
Carrier
Tape
Pitch
MP86972GLJTH-Z
TLGA-35
(3mmx6mm)
5000
N/A
N/A
13in
12mm
8mm
MP86972 Rev. 1.0
6/28/2021
MonolithicPower.com
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© 2021 MPS. All Rights Reserved.
15
MP86972 – 60A, INTELLI-PHASETM SOLUTION IN TLGA-35 (3MMX6MM) PACKAGE
REVISION HISTORY
Revision #
Revision Date
1.0
06/28/2021
Description
Pages Updated
Initial Release
-
Notice: The information in this document is subject to change without notice. Please contact MPS for current specifications.
Users should warrant and guarantee that third-party Intellectual Property rights are not infringed upon when integrating MPS
products into any application. MPS will not assume any legal responsibility for any said applications.
MP86972 Rev. 1.0
6/28/2021
MonolithicPower.com
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2021 MPS. All Rights Reserved.
16