MPQ6626
40V, 0.8A, Hex Half-Bridge Motor Driver
with Serial Input Control,
AEC-Q100 Qualified
DESCRIPTION
FEATURES
The MPQ6626 is a 6-channel half-bridge DMOS
output driver with integrated power MOSFETs.
The input voltage ranges from 5.5V to 40V, with
the up to 0.8A output current capability.
The six half-bridges of the MPQ6626 can be
controlled separately via a standard serial data
interface, and have various diagnostic functions.
The device has very low quiescent current in
standby mode.
Full protections include short-circuit protection
(SCP), under-voltage protection (UVP), and
thermal shutdown.
The MPQ6626 requires a minimal number of
readily available, standard external components.
It is available in a TSSOP-28 EP package.
Wide 5.5V to 40V Operating Input Range
High-Side and Low-Side Drivers Connected
in Half-Bridge Configurations
Up to 0.8A Output Current
Typical 1.3Ω RDS(ON) (HS + LS)
Very Low Quiescent Current in Standby
Mode versus Total Temperature Range
Outputs are Short-Circuit Protected
Over-Temperature Protection and PreWarning
Under-Voltage Lockout (UVLO) and OverVoltage Lockout (OVLO)
Serial Data Interface
Diagnostic Functions Include: Shorted
Output, Open Load, Over-Temperature
(OT), Over-Voltage (OV), and UnderVoltage (UV)
Serial Interface Clock Frequency Up to
5MHz
Supports 3.3V and 5V Systems
Available in a TSSOP-28 EP Package
Available in AEC-Q100 Grade 1
APPLICATIONS
Automotive and Industrial Applications
DC Motors
All MPS parts are lead-free, halogen-free, and adhere to the RoHS directive.
For MPS green status, please visit the MPS website under Quality
Assurance. “MPS”, the MPS logo, and “Simple, Easy Solutions” are
trademarks of Monolithic Power Systems, Inc. or its subsidiaries.
MPQ6626 Rev. 1.0
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
TYPICAL APPLICATION
VS
VBATT
VS
CS
OUT1
DI
MCU
M
CLK
OUT2
DO
OUT3
EN
M
OUT4
OUT5
VCC
M
VCC
OUT6
GND
MPQ6626 Rev. 1.0
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
ORDERING INFORMATION
Part Number*
MPQ6626GF-AEC1
Package
TSSOP-28 EP
Top Marking
See Below
MSL Rating
2A
* For Tape & Reel, add suffix -Z (e.g. MPQ6626GF-AEC1-Z).
TOP MARKING
MPS: MPS prefix
YY: Year code
WW: Week code
MP6626: Part number
LLLLLLLLL: Lot number
PACKAGE REFERENCE
NC
NC
GND
GND
OUT1
OUT2
OUT5
NC
NC
VS1
DI
CLK
VCC
DO
Exposed Pad
On Bottom
CS
TEST
EN
TEST
NC
VS2
OUT6
NC
OUT4
OUT3
GND
GND
NC
NC
TSSOP-28 EP
MPQ6626 Rev. 1.0
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
PIN FUNCTIONS
Pin #
Name
1, 5, 10, 14,
15, 18, 25, 28
2, 13, 16, 27
3
4
6
7
GND
OUT1
OUT5
DI
VCC
8
DO
9
EN
11
12
17
19
20, 21
22
OUT6
OUT4
OUT3
VS2
TEST
CS
23
CLK
24
VS1
26
OUT2
NC
Description
No connection.
Ground.
Half-bridge output 1.
Half-bridge output 5.
Serial data input.
Logic supply voltage
Serial data output.
Enable pin. Pull this pin low to set the MPQ6626 to standby mode; pull it high to
set the MPQ6626 to normal operation.
Half-bridge output 6.
Half-bridge output 4.
Half-bridge output 3.
Power supply for drivers 3, 4 and 6. Connect this pin to VS1 externally.
Test pin for internal use. Connect this pin to ground.
Chip select input, active low.
Serial clock input.
Power supply for drivers 1, 2 and 5, all pre−drivers, and the charge pump.
Connect this pin to VS2 externally.
Half-bridge output 2.
MPQ6626 Rev. 1.0
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
θJA
θJC
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance (5)
Supply voltage (VVS) ....................................45V
VOUTx .................................... -0.3V to VVS + 0.3V
Logic supply voltage (VVCC) ............ -0.3V to +6V
Logic input voltage ............... -0.3 to VVCC + 0.3V
Logic output voltage............. -0.3 to VVCC + 0.3V
All other pins ............................... -0.3V to +6.5V
Continuous power dissipation (TA = 25°C) (2) ......
TSSOP-28EP ............................................3.9W
Junction temperature ............................... 150°C
Lead temperature .................................... 260°C
Storage temperature ................ -65°C to +150°C
TSSOP-28EP….….….….….….32…....6….°C/W
ESD Ratings (3)
Human body model (OUTx and VSx) ........... 4kV
Human body model (all other pins) .............. 2kV
Machine mode (MM) ..................................200V
Charge device model (CDM)......................750V
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature, TJ (MAX), the junction-toambient thermal resistance, θJA, and the ambient temperature,
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX) - TA)/ θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) Devices are ESD-sensitive. It is recommended to handle them
with caution.
4) The device is not guaranteed to function outside of its operating
conditions.
5) Measured on JESD51-7, 4-layer PCB.
Recommended Operating Conditions (4)
Supply voltage (VVS) ....................... 5.5V to 40V
Logic supply voltage (VVCC) ........ 3.15V to 5.25V
Operating junction temp (TJ) .... -40°C to +150°C
MPQ6626 Rev. 1.0
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
ELECTRICAL CHARACTERISTICS
5.5V ≤ VVS ≤ 40V, 3.15V ≤ VVCC ≤ 5.25V, EN = VVCC, TJ = -40°C to +125°C, unless otherwise noted.
Parameters
Symbol
Condition
Min
Typ
Max
Units
Operating supply current (VS)
IVSO
VVS < 28V, EN = VCC, no load
5.5
6.5
mA
Operating supply current (VCC)
IVCCO
3.15V < VVCC < 5.25V, EN = high,
DI = CLK = ;ow, CS = high, no load
100
150
μA
Quiescent current (VS)
IVSQ
VVS = 13.2V, VVCC = 0V or
VVCC = 5V, EN = low
1
5
μA
Quiescent current (VCC)
IVCCQ
3.15V < VVCC < 5.25V, EN = low,
DI = CLK = low, CS = high
1
5
μA
Discharge current (VSx)
IVS
Power-on reset threshold
VVCC
Power-on reset delay
VS under-voltage lockout
threshold
VS under-voltage lockout
threshold hysteresis
VS under-voltage lockout delay
time
VUVOFF
VS over-voltage lockout threshold
VOVOFF
VVS
VVS = 40V, EN = low
3
mA
VCC increasing
2.3
2.7
3
V
After switching on VVCC
30
100
160
μs
VS decreasing
3.5
4.5
V
0.5
V
21
ms
0.1
7
OVLO = 1, VS increasing
VS over-voltage lockout threshold
hysteresis
Output specification
HS + LS switch on resistance
Over-current limit
RDS(ON)
tDOC
Open load detection current
IOLD
Open load delay time
Output enable time
Output disable time
tDOLD
Output rise time
Output fall time
33
36
39
V
1
2.5
4
V
1.3
2.2
2.8
Ω
Ω
1
1.3
2.5
A
10
25
50
μs
1
16
45
mA
200
350
50
50
600
65
65
μs
75
105
μs
65
95
27
20
42
27
TJ = -40°C to +125°C
TJ = 150°C
IOCP
Over-current shutdown delay time
Delay time
0.3
VVS = 13.2V
VVS = 13.2V, LS switch on
VVS = 13.2V, RLOAD = 50Ω
HBCNFx high to OUTx high
VVS = 13.2V, RLOAD = 50Ω
HBCNFx low to OUTx low
VVS = 13.2V, RLOAD = 50Ω
VVS =13.2V, 10% to 90% VOUT,
RLOAD = 50Ω
13
11
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μs
6
MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
ELECTRICAL CHARACTERISTICS (continued)
5.5V ≤ VVS ≤ 40V, 3.15V ≤ VVCC ≤ 5.25V, TJ = -40°C to +125°C, unless otherwise noted.
Parameters
Symbol Condition
VVS = 13V, RLOAD = 50Ω
Dead time
EN Input
EN low-level threshold
EN high-level threshold
EN threshold hysteresis
Pull-down resistor
Serial Interface: Logic Inputs DI, CLK, CS
Typ
0.6
V
V
V
kΩ
0.6
V
V
0.4
125
VEN = VVCC
2.0
150
125
125
VDI, VCLK = VVCC
VCS = 0V
CIN
15
mV
kΩ
kΩ
pF
0.4
V
VVCC 0.6
High-level output
Leakage current (tri-state)
Thermal Shutdown and Pre-Warning (6)
0V < VDO < VVCC, VCS = VVCC
V
-5
TJW
120
TJSD
150
1.05
Units
μs
1.5
Low-level output
Thermal pre-warning threshold
Thermal pre-warning hysteresis
Thermal shutdown threshold
Thermal shutdown hysteresis
Ratio thermal shutdown/thermal
pre-warning
Max
2.0
Input low-level threshold
Input high-level threshold
Input threshold hysteresis
Pull-down resistor of DI, CLK pin
Pull-up current of CS pin
Input capacitance (6)
Serial Interface: Logic Output DO
Min
140
20
175
20
+5
μA
170
°C
°C
°C
°C
200
1.2
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
SERIAL INTERFACE TIMING CHARACTERISTICS (6)
5.5V < VVS < 40V, 3.15V ≤ VVCC ≤ 5.25V, TJ = -40°C to +125°C, unless otherwise noted.
Parameters
Symbol
CLK frequency
fCLK
CLK period time
tPCLK
Condition
Min
VCC = 5V
200
VCC = 3.3V
CLK high time
CLK low time
CLK set-up time (high to low)
CLK set-up time (low to high)
DI set-up time
DI hold time
t5
t6
t7
t3
t11
t12
500
85
85
85
85
50
50
CS set-up time (low to high)
CS set-up time (high to low)
CS high time
DO enable after CS falling
edge
DO disable after CS rising
edge
DO falling/rising time
DO valid time
t8
t4
t9
100
100
5
EN low valid time
Typ
Max
Units
5
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
μs
t1
CDO = 40pF
200
ns
t2
CDO = 40pF
200
ns
25
50
ns
ns
t10
CDO = 40pF
CDO = 40pF
VCC = 5V, EN high to low (50%)
to OUTx turning off (50%)
10
20
EN high to SPI valid
Time between two
consecutive SRR
commands
μs
50
100
100
μs
μs
Note:
6) Not tested in production. Specified by design.
MPQ6626 Rev. 1.0
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
SERIAL INTERFACE TIMING DIAGRAM
1
2
CS
DO
9
CS
4
7
CLK
5
3
8
6
DI
11
CLK
10
12
DO
Inputs DI, CLK, CS: High Level = 0.7 x V CC, Low Level = 0.3 x VCC
Output DO: High Level = 0.8 x VCC, Low Level = 0.2 x VCC
MPQ6626 Rev. 1.0
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
TYPICAL PERFORMANCE CHARACTERISTICS
VVS = 13V, VVCC = 3.3V, TA = 25°C, unless otherwise noted.
Start-Up through VS
Shutdown through VS
HS on, IOUT = 800mA
HS on, IOUT = 800mA
CH1: VOUT
CH1: VOUT
CH2: VVS
CH2: VVS
CH4: IOUT
CH4: IOUT
Start-Up through VS
Shutdown through VS
LS on, IOUT = 800mA
LS on, IOUT = 800mA
CH1: VOUT
CH1: VOUT
CH2: VVS
CH2: VVS
CH4: IOUT
CH4: IOUT
SCP
SCP
OUT short to GND
OUT short to VVS
CH1: VOUT1
CH1: VOUT1
CH4: IOUT
CH4: IOUT
MPQ6626 Rev. 1.0
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VVS = 13V, VVCC = 3.3V, TA = 25°C, unless otherwise noted.
SCP
Two outputs short circuit
CH1: VOUT1
CH2: VOUT2
CH4: IOUT
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
FUNCTIONAL BLOCK DIAGRAM
Charge
Pump
GH1
GH2
DI
CLK
.
.
.
HS Gate
Driver
CS
Serial
Interface
GH5
GH6
Control
Logic
VS1/VS2
GL1
GL2
DO
EN
.
.
.
LS Gate
Driver
GL5
GL6
VS1
VS2
GH1
GH2
GH3
GH4
GH5
GH6
OUT1
OUT2
OUT3
VCC
Power-On
Reset
OUT4
OUT5
OUT6
Fault
Handling
GND
UVLO and
OVLO
OverCurrent and
Under-Load
Thermal Warning
and Shutdown
GL1
GL2
GL3
GL4
GL5
GL6
GND
Figure 1: Functional Block Diagram
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
OPERATION
The MPQ6626 is a 6-channel half-bridge DMOS
output driver with integrated power MOSFETs.
The six half-bridges of the MPQ6626 can be
controlled separately from a standard serial data
interface, and have various diagnostic functions.
falling edge of CS. In addition to the 16-bit status
data, a pseudo-bit (PRE_15) can also be
retrieved from the DO output. The latched
thermal shutdown (TSD) status bit (PRE_15) is
available on DO until the first rising CLK edge
after CS goes low. DO changes its state with the
rising edge of CLK, and remains stable until the
next rising edge of CLK. When CS is high, the
DO pin is in a tri-state condition.
Serial Interface
Data transfer starts with the falling edge of the
CS signal. Execution of new input data is
enabled on the rising edge of the CS signal. Data
must appear when the DI pin is synchronized to
the CLK pin. Then the data is accepted on the
falling edge of the CLK signal. For DI, the MSB
(SRR, bit[15]) has to be transferred first. The last
16 bits clocked into DI are transferred to the
device’s data register if there no frame error.
Otherwise, all DI data is ignored, and the
previous input data is preserved.
The following conditions must be met for a valid
TSD read to be captured:
CLK and DI are low before the CS cycle
CS transitions from high to low
CS set-up time is satisfied
Figure 2 shows the SPI communication. Table 1
lists the input control registers. Table 2 lists the
output diagnostic registers.
The output data at the DO pin is enabled on the
CS
DI
15
CLK
DO
DO
15
PRE_15
15
14
14
14
13
13
13
12
12
11
11
12
10
10
11
9
9
10
8
8
9
7
7
8
6
6
7
5
5
6
4
4
5
3
3
4
2
2
3
1
1
2
0
0
1
0
Figure 2: Data Transfer
Table 1: Input Control Registers
Input Data (7)
Bit
Input Register
Function
This bit resets the status register.
15
SRR
14
CH_SEL (8)
CH_SEL = 0.
OLSD_EN
This bit enables open load detection shutdown (OLD_SD) for half-bridges 1–6. This
feature allows the affected output stage to be switched off if a true open load or
under-load condition has been detected.
13
1: Reset. The errors bits of the corresponding status register in the output data
register are set to low
1: Enabled
Enables half-bridge 6.
12
HBEN6
11
HBEN5
1: Half-bridge 6 is active
0: Half-bridge 6 is in Hi-Z
Enables half-bridge 5.
1: Half-bridge 5 is active
0: Half-bridge 5 is in Hi-Z
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
Enables half-bridge 4.
10
HBEN4
1: Half-bridge 4 is active
0: Half-bridge 4 is in Hi-Z
Enables half-bridge 3.
9
HBEN3
1: Half-bridge 3 is active
0: Half-bridge 3 is in Hi-Z
Enables half-bridge 2.
8
HBEN2
1: Half-bridge 2 is active
0: Half-bridge 2 is in Hi-Z
Enables half-bridge 1.
7
HBEN1
1: Half-bridge 1 is active
0: Half-bridge 1 is in Hi-Z
Configures half-bridge 6.
6
HBCNF6
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
Configures half-bridge 5.
5
HBCNF5
4
HBCNF4
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
Configures half-bridge 4.
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
Configures half-bridge 3.
3
HBCNF3
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
Configures half-bridge 2.
2
HBCNF2
1
HBCNF1
0
OVLO
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
Configures half-bridge 1.
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
This bit enables VSx over-voltage lockout (OVLO).
1: Enabled
Note:
7)
8)
All input bits are set to 0 after a VCC power-on reset.
CH_SEL enables bridge selection for the MPQ6527 and MPQ6628 devices. It is recommended to set the MPQ6626’s CH_SEL bit to 0.
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
Table 2: Output Diagnostic Registers
Output Data
Bit
PRE_15
Input Register
TSD
Function
This bit indicates if latched thermal shutdown occurs. The error is latched and the
corresponding output is switched off if thermal shutdown occurs. The bit can only
be reset via SRR or a power-on reset.
1: Thermal shutdown has occurred
15
OC
This bit indicates if latched over-current (OC) shutdown occurs. If an OC fault
(e.g. an overload or short-circuit fault) is detected on any half-bridge between
half-bridge 1 and half-bridge 6, the error is latched, and the corresponding output
is switched off. The bit can only be reset via SRR or a power-on reset.
1: An OC fault has occurred
14
PSF
This bit indicates if a power supply failure occurs. This bit is set if there is an overvoltage or under-voltage condition on VS1 or VS2, and all outputs switch off. This
bit automatically resets if VSx returns to its normal operating range.
1: A power supply failure has occurred
13
OLD
This bit indicates if an open load fault has occurred. If there is a true open load
or under-load condition on any half-bridge between half-bridge 1 and half-bridge
6, the error is latched. The corresponding output is switched off if input bit[13]
(OLD_SD) is high. The bit can only be reset via SRR or a power-on reset.
1: An open load fault has occurred
Half-bridge 6 output status.
12
SHBEN6
11
SHBEN5
10
SHBEN4
1: Half-bridge 6 is active
0: Half-bridge 6 is in Hi-Z
Half-bridge 5 output status.
1: Half-bridge 5 is active
0: Half-bridge 5 is in Hi-Z
Half-bridge 4 output status.
1: Half-bridge 4 is active
0: Half-bridge 4 is in Hi-Z
Half-bridge 3 output status.
9
SHBEN3
8
SHBEN2
1: Half-bridge 3 is active
0: Half-bridge 3 is in Hi-Z
Half-bridge 2 output status.
1: Half-bridge 3 is active
0: Half-bridge 2 is in Hi-Z
Half-bridge 1 output status.
7
SHBEN1
6
HBCNF6
1: Half-bridge 1 is active
0: Half-bridge 1 is in Hi-Z
Half-bridge 6 configuration status.
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
Half-bridge 5 configuration status.
5
HBCNF5
4
HBCNF4
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
Half-bridge 4 configuration status.
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
Half-bridge 3 configuration status.
3
HBCNF3
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
Half-bridge 2 configuration status.
2
HBCNF2
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
Half-bridge 1 configuration status.
1
0
HBCNF1
TW
1: The high-side (HS) half-bridge is on, and the low-side (LS) half-bridge is off
0: The HS half-bridge is off, and the LS half-bridge is on
This bit indicates if a thermal warning has been detected. This bit is treated as an
early warning, and is set high if the junction temperature reaches T JW. The output
remains on until one or more sensors reach TSD. This bit automatically resets if
the junction temperature drops below the thermal warning recovery point.
1: A thermal warning has been detected
Enable Control (EN)
The MPQ6626 enters low-power mode (or sleep
mode) when the EN pin is pulled low. The EN
input has an internal pull-down resistor. In sleep
mode, all output stages turn off, and the SPI
register banks are reset. The output stages can
be activated again by pulling EN high.
Status Register Reset (SRR)
The status register reset (SRR) command bit is
executed at the end of the SPI transmission (CS
low to high). Sending SRR = 1 clears the status
memory and reactivates faulted outputs for
channels.
If a fault is still present when SRR is sent, the
protection can be triggered, and the device may
shutdown again. The device can be reset by
toggling the EN pin or by a VCC power-on reset.
Open Load Detection
While the device is on, open load detection (OLD)
is implemented in the low-side (LS) switches of
the bridge outputs. If the current through the LS
transistor is below the reference current (IOLD) for
longer than the OLD delay time (tDOLD), the
corresponding OLD diagnostic bit is set. If an
under-load condition occurs in another channel
after the global timer has started, the delay for
any subsequent under-load condition is the
remainder of the timer. The timer runs
continuously if the under-load condition remains.
If the OLSD_EN bit is set, and an open load is
detected on the LS switch, the respective output
is disabled, and the open load error bit is latched.
Otherwise, the output remains on, and only the
open load error bit is set. If OLSD_EN is set, the
error remains latched, and the output stays off
until an SRR or power-on reset is performed.
For example, consider a motor that is connected
between outputs OUT1 and OUT2 with a broken
wire (see Figure 3). Table 3 shows the
corresponding diagnostic information.
Open Load
OUT1
M
OUT2
Figure 3: Half-Bridge Open Load Example
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
Table 3: Open Load Diagnostic Example
Control
LS1
0
1
0
0
1
HS1
0
0
1
1
0
LS2
0
0
1
0
1
HS2
0
1
0
1
0
In motor applications, it is often advantageous to
actively brake the motor by turning on both highside (HS) or low-side (LS) drivers in two halfbridge channels. If the configuration has two LS
drivers (LS brake), an under-load condition
occurs as the motor current decays normally.
Use an HS brake to avoid an under-load
notification.
Discharge Circuit
Many typical applications use an inverse-polarity
protection diode, such as D1 in Figure 4.
D1
MPQ6626
C1 VBATT
VPK
Figure 4: Functional Principle of the Discharger
Circuit
Diagnostic Information
Motor
Motor
Connected Disconnected
OLD (Output Bit[13])
0
0
0
1
0
1
0
0
1
1
However, this method poses certain risks.
During inhibit mode, the IC consumes an
extremely low current (IVS) that is about 20μA
maximum. Any peaks on the supply voltage
gradually charge the blocking capacitor.
D1 prevents the capacitor from discharging via
the power supply. Due to the extremely small
quiescent current, discharging via the IC can
also be ignored. This means that during long
periods in inhibit mode, the IC’s supply voltage
could increase continuously, until the device
exceeds the maximum supply voltage limit
(about 40V). This could damage the IC.
The MPQ6626 features a discharger circuit to
protect the device. If the VS voltage exceeds its
threshold (about 37V), the blocking capacitor is
discharged via an integrated resistor until VS
falls below the threshold.
Diagnostics and Protections Overview
Table 4 lists diagnostic protections.
Table 4: Diagnostic Classes and Functions
Fault
Qualifier
Thermal Shutdown
Over-Current Shutdown
OLSD_EN = 1
OLSD_EN = 0
OVLO = 1
OVLO = 0
-
Open Load Detection
Over-Voltage Lockout
Under-Voltage Lockout
Thermal Warning
OUTx
State and Recovery
Output Register
Hi-Z, use SRR to
reset
Unaffected
Hi-Z, non-latched (9)
Unaffected
Hi-Z, non-latched (9)
Unaffected
TSD = 1, use SRR to reset
OC = 1, use SRR to reset
OLD = 1, use SRR to reset
PSF = 1, non-latched (10)
TW = 1, non-latched (10)
Notes:
9) OUTx returns to its previous state if the fault is removed.
10) The corresponding output register returns to its no-fault state if the fault is removed
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
Over-Current Protection (OCP)
The MPQ6626 has internal overload and shortcircuit protection (SCP). The currents in both the
high-side and low-side MOSFETs are
measured, and if the current exceeds the current
limit, an internal timer starts. If the permanent
over-current shutdown delay time (tOC) is
reached, the short-circuit detection bit (OC) is set,
and the shorted output is disabled. Reset the OC
bit and enable the disabled output by writing a
high to the SRR bit in the input register.
Thermal Shutdown and Pre-Warning
Thermal monitoring is integrated into the
MPQ6626. Each half-bridge monitors the driver
pair’s (one channel including the high-side and
low-side MOSFETs) thermal sensor. If the
junction temperature rises above the thermal
pre-warning threshold, the temperature prewarning bit (TW) in the output register is set.
When the temperature falls below the thermal
pre-warning threshold, this bit is reset.
If the junction temperature rises above the
thermal shutdown threshold, the channel’s HS
and LS drivers latch off, the TW bit remains set,
and the TSD (PRE_15) bit is set. The TSD bit is
cleared, and all affected channels in a group
resume immediately once the following
conditions are met:
The junction temperature falls below the
thermal shutdown threshold
A high has been written to the SRR bit in the
input register.
The thermal pre-warning and
thresholds have hysteresis values.
VS Under-Voltage Lockout (UVLO)
If the voltage on the VS pin falls below the undervoltage lockout (UVLO) threshold, an internal
timer starts. The power supply fail bit (PSF) in
the output register is set, and all outputs are
disabled if the permanent UVLO delay time is
reached. Operation resumes immediately when
VS rises above the UVLO threshold, and the
PSF bit is cleared.
VCC Under-Voltage Lockout (UVLO)
The SPI interface does not function if VCC is
below the under-voltage lockout (UVLO)
threshold. If this occurs, all outputs turn off, then
the input and status output registers are cleared.
Once the VCC voltage rises above the UVLO
threshold, the under-voltage event is cleared,
and SRR is released.
VS Over-Voltage Lockout (OVLO)
If the supply voltage on VS rises above the
switch off voltage (VOVOFF), all outputs switch off
if the over-voltage lockout input bit is set (OVLO
= 1), and the PSF error bit is set. The error is not
latched. This means that if the VS voltage falls
below the switch-on threshold, the power stages
restart, and the error flags reset.
shutdown
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
APPLICATION INFORMATION
PCB Layout Guidelines
PCB layout is critical for the stable operation. For
the best results, follow the guidelines below:
1. Place a supply-rated X5R or X7R bypass
capacitor as close as possible to the IC.
2. Place as much copper as possible on the
long pads.
3. Place thermal vias inside the pad area to
dissipate heat to the copper layers. Place
vias just outside the pad area if via-in-pad
construction is not applicable.
4. Place a bulk capacitor on the VS pin to
absorb the energy flowing from the motor or
power supply. This capacitor should be sized
according to the application requirements.
Figure 5: Recommended PCB Layout
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
PACKAGE INFORMATION
TSSOP-28 EP
6.00
TYP
9.60
9.80
0.65
BSC
0.40
TYP
28
15
1.60
TYP
4.30
4.50
PIN 1 ID
3.20
TYP
6.20
6.60
5.80
TYP
14
1
TOP VIEW
RECOMMENDED LAND PATTERN
0.80
1.05
1.20 MAX
SEATING PLANE
0.19
0.30
0.65 BSC
0.00
0.15
SEE DETAIL "A"
FRONT VIEW
SIDE VIEW
GAUGE PLANE
0.25 BSC
5.40
5.90
0o-8o
DETAIL A
2.60
3.10
BOTTOM VIEW
NOTE:
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,
PROTRUSION, OR GATE BURR.
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH
OR PROTRUSION.
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.10 MILLIMETERS MAX.
5) DRAWING CONFORMS TO JEDEC MO-153, VARIATION AET.
6) DRAWING IS NOT TO SCALE.
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MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
CARRIER INFORMATION
Pin1
1
1
1
1
ABCD
ABCD
ABCD
ABCD
Feed Direction
Part Number
Package
Description
Quantity/Reel
Quantity/Tube
Reel
Diameter
MPQ6626GF-AEC1-Z
TSSOP-28EP
2500
50
13in
Carrier
Tape
Width
16mm
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Carrier
Tape
Pitch
8mm
21
MPQ6626 – 40V, 0.8A, HEX HALF-BRIDGE DRIVER WITH SERIAL INPUT, AEC-Q100
REVISION HISTORY
Revision #
1.0
Revision
Date
9/24/2021
Description
Pages Updated
Initial Release
-
Notice: The information in this document is subject to change without notice. Please contact MPS for current specifications.
Users should warrant and guarantee that third-party Intellectual Property rights are not infringed upon when integrating MPS
products into any application. MPS will not assume any legal responsibility for any said applications.
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22