NB648
High Effeciency 8A, 25V, 580kHz
Synchronous Step-down Converter
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The NB648 is a high frequency synchronous
rectified step-down switch mode converter with
built in internal power MOSFETs. It offers a
very compact solution to achieve 8A continuous
output current over a wide input supply range
with excellent load and line regulation. The
NB648 operates at high efficiency over a wide
output current load range.
•
•
•
•
•
•
•
•
•
•
Current mode operation provides fast transient
response and eases loop stabilization.
Full protection features include OCP and thermal
shut down.
Wide 4.5V to 25V Operating Input Range
8A Output Current
Low RDS(ON) Internal Power MOSFETs
Proprietary Switching Loss Reduction
Technique
Fixed 580kHz Switching Frequency
Sync from 300kHz to 2MHz External Clock
Internal Compensation
OCP Protection and Thermal Shutdown
Output Adjustable from 0.8V to 15V
Available in 30-pin QFN 5x6mm Package
APPLICATIONS
The NB648 requires a minimum number of
readily available standard external components
and is available in a space saving 5mx6mm 30pin QFN package.
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•
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•
•
Notebook Systems and I/O Power
Networking Systems
Digital Set Top Boxes
Personal Video Recorders
Flat Panel Television and Monitors
Distributed Power Systems
“MPS” and “The Future of Analog IC Technology” are Registered Trademarks of
Monolithic Power Systems, Inc.
TYPICAL APPLICATION
Efficiency
VO=3.3V
VIN
100
22
IN
VCC
R4
49.9k
30
AAM
BST
16-19
SW
NB648
R5
10k
BG
25
R3
100k
FB
EN/SYNC
PG
GND
9-15,20
VIN=12V
95
23
VOUT
D1
B140
Optional
R1
40.2k
24
R2
32.4k
5-8
26
C8
NS
ON OFF
EFFICIENCY(%)
27-29
90
VIN=19V
85
80
75
70
65
60
0
1
2
3
4
5
6
7
8
9
IO(A)
NB648 Rev. 0.9
12/10/2013
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1
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
NB648EQJ
(5x6mm) QFN30
N648EQJ
–20°C to +85°C
For Tape & Reel, add suffix –Z (eg. NB648EQJ–Z).
For RoHS compliant packaging, add suffix –LF (eg.NB648EQJ–LF–Z)
AAM
IN
IN
IN
EN/SYNC
PG
FB
PACKAGE REFERENCE
30
29
28
27
26
25
24
NC
1
23
BST
NC
2
22
Vcc
NC
3
21
NC
NC
4
20
GND
BG
5
19
SW
BG
6
18
SW
BG
7
17
SW
BG
8
16
SW
11
12
13
GND
GND
GND
GND
ABSOLUTE MAXIMUM RATINGS (1)
Supply Voltage VIN .......................................28V
VSW ......................................–0.3V to VIN + 0.3V
VBS ..................................................... VSW + 6V
All Other Pins................................ –0.3V to +6V
(2)
Continuous Power Dissipation (TA = +25°C)
………………………………..……………..3.79W
Junction Temperature.............................. 150°C
Lead Temperature ................................... 260°C
Storage Temperature.............. –65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage VIN .......................... 4.5V to 25V
Output Voltage VOUT........................ 0.8V to 15V
Operating Junct. Temp (TJ)..... –20°C to +125°C
NB648 Rev. 0.9
12/10/2013
14
15
GND
10
GND
9
GND
SW
Thermal Resistance
(4)
θJA
θJC
5x6mm QFN30....................... 33 ....... 7.... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
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2
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
ELECTRICAL CHARACTERISTICS
VIN = 12V, TA = +25°C, unless otherwise noted.
Parameters
Symbol
Supply Current (Shutdown)
IIN
Supply Current (Quiescent)
(5)
HS Switch On Resistance
(5)
LS Switch On Resistance
IIN
HSRDS-ON
LSRDS-ON
Switch Leakage
SW LKG
(5)
Current Limit
Oscillator Frequency
Maximum Duty Cycle
ILIMIT
FSW
DMAX
Sync Frequency Range
Feedback Voltage
Feedback Current
EN/SYNC Input Low Voltage
EN/SYNC Input High Voltage
FSYNC
VFB
IFB
VILEN
VIHEN
EN Input Current
IEN
EN Turn Off Delay
Power Good Rising Threshold
Power Good Falling Threshold
Power Good Delay
Power Good Sink Current
Capability
Power Good Leakage Current
VIN Under Voltage Lockout
Threshold Rising
VIN Under Voltage Lockout
Threshold Hysteresis
VCC Regulator
VCC Load Regulation
Thermal Shutdown
Condition
Min
VEN = 0V
VEN = 2V, VFB = 1V
VEN = 0V, VSW = 0V or
12V
VFB = 0.75V
VFB = 700mV
9.5
450
85
0.3
788
VFB = 800mV
Max
Units
0
1
μA
0.7
50
8
1
mA
mΩ
mΩ
10
200
nA
730
A
kHz
%
580
90
808
10
2
828
100
0.4
2
VEN = 2V
VEN = 0V
ENTd-Off
PGVth-Hi
PGVth-Lo
PGTd
VPG
Sink 4mA
IPG_LEAK
VPG = 3.3V
INUVVth
3.8
INUVHYS
4.5
Icc=5mA
MHz
mV
nA
V
V
2
0.1
μA
15
0.71
0.53
25
μsec
V
V
μs
0.4
V
1
100
nA
4.0
4.2
V
880
VCC
TSD
Typ
mV
5.5
5
150
%
°C
Note:
5) Guaranteed by design.
NB648 Rev. 0.9
12/10/2013
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3
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
PIN FUNCTIONS
Pin #
Name
1—4
5—8
NC
BG
9—15, 21
GND
Description
No Connect.
Low Side Gate Drive
System Ground. This pin is the reference ground of the regulated output voltage.
For this reason care must be taken in PCB layout.
16—19
Exposed Pad
22
SW
Switch Output. Use wide PCB traces and multiple vias to make the connection.
VCC
23
BST
24
FB
25
PG
26
EN/SYNC
27—29
IN
30
AAM
Bias Supply. Decouple with 1µF capacitor.
Bootstrap. A capacitor connected between SW and BS pins is required to form a
floating supply across the high-side switch driver.
Feedback. An external resistor divider from the output to GND, tapped to the FB
pin, sets the output voltage.
Power Good Output, the output of this pin is open drain. Power good threshold is
90% low to high and 70% high to low of regulation value. There is a 20μs delay to
pull PG if the output voltage is lower than 10% of regulation value.
EN=1 to enable the NB648. External clock can be applied to EN pin for changing
switching frequency. For automatic start-up, connect EN pin to VIN with 100kΩ
resistor.
Supply Voltage. The NB648 operates from a +4.5V to +25V input rail. C1 is
needed to decouple the input rail. Use wide PCB traces and multiple vias to make
the connection.
Connects to a voltage set by 2 resistor dividers forces NB648 into nonsynchronous mode when load is small.
NB648 Rev. 0.9
12/10/2013
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4
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 12.6V, VOUT = 3.3V, L = 1.5µH, TA = +25ºC, unless otherwise noted.
Enable Supply Current
vs. Input Voltage
Disable Supply Current
vs. Input Voltage
716
VCC Regulator Line Regulation
5.6
0.15
5.2
714
712
4.8
0.1
708
VCC (V)
710
0.05
706
704
10
20
INPUT VOLTAGE (V)
-0.05
30
10
15
20
25
INPUT VOLTAGE (V)
10
8
6
4
2
0.2
0.4
0.6
0.8
Dmax Limit
10
Minimum on time Limit
1
0
1
0.1
0.05
Half Load
-0.05
Full Load
-0.15
5
NB648 Rev. 0.9
12/10/2013
20
25
30
10
15
20
25
INPUT VOLTAGE (V)
30
0.2
VIN =19V
0.1
0
VIN =12.6V
-0.1
-0.2
-0.3
0
2
4
6
8
10
Efficiency
80
100
70
95
60
90
50
40
30
20
10
0
30
OUTPUT CURRENT(A)
EFFICIENCY(%)
CASE TEMPERATURE RISE(”C)
0.2
0
15
10
15
20
25
INPUT VOLTAGE (V)
0.3
Case Temperature vs.
Output Current
0.15
-0.1
10
5
INPUT VOLTAGE (V)
Line Regulation
0
5
0
Load Regulation
0.1
0
2.4
30
Operating Range
DUTY CYCLE (%)
NORMALIZED OUTPUT VOLTAGE(%)
5
100
OUTPUT VOLTAGE (V)
PEAK CURRENT (A)
0
NORMALIZED OUTPUT VOLTAGE(%)
0
12
-0.2
3.6
2.8
Peak Current vs. Duty Cycle
0
4
3.2
0
702
700
4.4
VIN=12V
VIN=19V
85
80
75
70
65
0
2
4
6
8
OUTPUT CURRENT(A)
10
60
0
1
2
3
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4
5
6
7
8
9
IO(A)
5
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 12.6V, VOUT = 3.3V, L = 1.5µH, TA = +25ºC, unless otherwise noted.
Short Entry
Enable Startup without Load
Short Recovery
VOUT
2V/div
VOUT
2V/div
VOUT
2V/div
BG
5V/div
BG
5V/div
VEN
5V/div
VSW
10V/div
VSW
10V/div
VSW
5V/div
IINDUCTOR
10A/div
IINDUCTOR
10A/div
IINDUCTOR
1A/div
2ms/div
Enable Startup
with 8A Load
VOUT
2V/div
VEN
5V/div
VSW
10V/div
IINDUCTOR
10A/div
2ms/div
Enable Shutdown
without Load
Enable Shutdown
with 8A Load
VOUT
2V/div
VOUT
2V/div
VEN
5V/div
VEN
5V/div
VSW
10V/div
VSW
10V/div
IINDUCTOR
1A/div
IINDUCTOR
10A/div
2ms/div
400ms/div
Load Transient Response
Input Ripple Voltage
Output Ripple Voltage
IOUT=4A-8A, 1A/us
IOUT=8A
IOUT=8A
VOUT
50mV/div
VSW
10V/div
IOUT
5A/div
NB648 Rev. 0.9
12/10/2013
VOUT
500mV/div
VOUT
20mV/div
VSW
10V/div
VSW
10V/div
IINDUCTOR
10A/div
IINDUCTOR
10A/div
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6
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
BLOCK DIAGRAM
IN
+
-
VCC
Regulator
VCC
RSEN
Current Sense
Amplifer
Boost
Regulator
PGOOD
MN3
Oscillator
+
HS
Driver
-
PG Comparator
+
C1
Reference
EN/SYNC
1MEG
FB
BS
C1
1pF
50pF
R1
Current Limit
Comparator
SW
Comparator
On Time Control
Logic Control
400K
+
+
-
VCC
LS
Driver
SDRV
GND
Error Amplifier
AAM
BG
Figure 2—Function Block Diagram
NB648 Rev. 0.9
12/10/2013
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7
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
OPERATION
The NB648 is a high frequency synchronous
rectified step-down switch mode converter with
built in internal power MOSFETs. It offers a very
compact solution to achieve 8A continuous
output current over a wide input supply range
with excellent load and line regulation.
The NB648 operates in a fixed frequency, peak
current control mode to regulate the output
voltage. A PWM cycle is initiated by the internal
clock. The high-side power MOSFET is turned on
and remains on until its current reaches the value
set by the COMP voltage. When the power
switch is off, it remains off until the next clock
cycle starts. If, in 90% of one PWM period, the
current in the power MOSFET does not reach the
COMP set current value, the power MOSFET will
be forced to turn off.
Error Amplifier
The error amplifier compares the FB pin voltage
with the internal 0.808V reference (REF) and
outputs a current proportional to the difference
between the two. This output current is then used
to charge or discharge the internal compensation
network to form the COMP voltage, which is used
to control the power MOSFET current. The
optimized
internal
compensation
network
minimizes the external component counts and
simplifies the control loop design.
Internal Regulator
Most of the internal circuitries are powered from
the 5V internal regulator. This regulator takes the
VIN input and operates in the full VIN range.
When VIN is greater than 5.0V, the output of the
regulator is in full regulation. When VIN is lower
than 5.0V, the output decreases. Since this
internal regulator provides the bias current for the
bottom gate driver that requires significant
amount of current depending upon the external
MOSFET selection, a 1uF ceramic capacitor for
decoupling purpose is required.
Enable/Sync Control
The NB648 has a dedicated Enable/Sync control
pin (EN/SYNC). By pulling it high or low, the IC
can be enabled and disabled by EN. Tie EN to
VIN for automatic start up. To disable the part,
EN must be pulled low for at least 5µs.
NB648 Rev. 0.9
12/10/2013
The NB648 can be synchronized to external
clock range from 300kHz up to 2MHz through the
EN/SYNC pin. The internal clock rising edge is
synchronized to the external clock rising edge.
Under-Voltage Lockout (UVLO)
Under-voltage lockout (UVLO) is implemented to
protect the chip from operating at insufficient
supply voltage. The NB648 UVLO comparator
monitors the output voltage of the internal
regulator, VCC. The UVLO rising threshold is
about 4.0V while its falling threshold is a
consistent 3.2V.
Internal Soft-Start
The soft-start is implemented to prevent the
converter output voltage from overshooting
during startup. When the chip starts, the internal
circuitry generates a soft-start voltage (SS)
ramping up from 0V to 1.2V. When it is lower
than the internal reference (REF), SS overrides
REF so the error amplifier uses SS as the
reference. When SS is higher than REF, REF
regains control.
Over-Current-Protection and Hiccup
The NB648 has cycle-by-cycle over current limit
when the inductor current peak value exceeds
the set current limit threshold. Meanwhile, output
voltage starts to drop until FB is below the UnderVoltage (UV) threshold, typically 30% below the
reference. Once a UV is triggered, the NB648
enters hiccup mode to periodically restart the part.
This protection mode is especially useful when
the output is dead-short to ground. The average
short circuit current is greatly reduced to alleviate
the thermal issue and to protect the regulator.
The NB648 exits the hiccup mode once the over
current condition is removed.
Thermal Shutdown
Thermal shutdown is implemented to prevent the
chip from operating at exceedingly high
temperatures. When the silicon die temperature
is higher than 150°C, it shuts down the whole
chip. When the temperature is lower than its
lower threshold, typically 140°C, the chip is
enabled again.
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8
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
Floating Driver and Bootstrap Charging
The floating power MOSFET driver is powered by
an external bootstrap capacitor. This floating
driver has its own UVLO protection. This UVLO’s
rising threshold is 2.2V with a hysteresis of
150mV. The bootstrap capacitor voltage is
regulated internally by VIN through D1, M3, C4,
L1 and C2 (Figure 2). If (VIN-VSW) is more than
5V, U2 will regulate M1 to maintain a 5V BST
voltage across C4.
SW
Table 1—Resistor Selection for Common
Output Voltages
VOUT (V)
R1 (kΩ)
R2 (kΩ)
1.8
2.5
3.3
31.6 (1%)
31.6 (1%)
31.6 (1%)
25.5 (1%)
14.7(1%)
10(1%)
5
31.6 (1%)
6.04 (1%)
Selecting the Inductor
A 1µH to 10µH inductor with a DC current rating
of at least 25% percent higher than the maximum
load current is recommended for most
applications. For highest efficiency, the inductor
DC resistance should be less than 15mΩ. For
most designs, the inductance value can be
derived from the following equation.
L=
VOUT × ( VIN − VOUT )
VIN × ΔIL × f OSC
Figure 2—Internal Bootstrap Charging Circuit
Where ΔIL is the inductor ripple current.
Startup and Shutdown
If both VIN and EN are higher than their
appropriate thresholds, the chip starts. The
reference block starts first, generating stable
reference voltage and currents, and then the
internal regulator is enabled. The regulator
provides stable supply for the remaining
circuitries.
Choose inductor current to be approximately
30% if the maximum load current, 8A. The
maximum inductor peak current is:
Three events can shut down the chip: EN low,
VIN low and thermal shutdown. In the shutdown
procedure, the signaling path is first blocked to
avoid any fault triggering. The COMP voltage and
the internal supply rail are then pulled down. The
floating driver is not subject to this shutdown
command.
Setting the Output Voltage
The external resistor divider is used to set the
output voltage (see the schematic on front page).
The feedback resistor R1 also sets the feedback
loop bandwidth with the internal compensation
capacitor (see Figure 1). Choose R1 to be
around 31.6kΩ for optimal transient response. R2
is then given by:
R2 =
NB648 Rev. 0.9
12/10/2013
R1
VOUT
−1
0.808V
IL(MAX ) = ILOAD +
ΔIL
2
Under light load conditions below 100mA, larger
inductance is recommended for improved
efficiency.
Selecting the Input Capacitor
The input current to the step-down converter is
discontinuous, therefore a capacitor is required to
supply the AC current to the step-down converter
while maintaining the DC input voltage. Use low ESR
capacitors for the best performance. Ceramic
capacitors with X5R or X7R dielectrics are highly
recommended because of their low ESR and
small temperature coefficients. For most
applications, a 22µF capacitor is sufficient.
Since the input capacitor (C1) absorbs the input
switching current it requires an adequate ripple
current rating. The RMS current in the input capacitor
can be estimated by:
I C1 = ILOAD ×
VOUT ⎛⎜ VOUT
× 1−
VIN ⎜⎝
VIN
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⎞
⎟
⎟
⎠
9
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
The worse case condition occurs at VIN =2VOUT,
where:
IC1 =
ILOAD
2
For simplification, choose the input capacitor
whose RMS current rating greater than half of the
maximum load current. The input capacitor can
be electrolytic, tantalum or ceramic. When using
electrolytic or tantalum capacitors, a small, high
quality ceramic capacitor, i.e. 0.1μF, should be
placed as close to the IC as possible. When
using ceramic capacitors, make sure that they
have enough capacitance to provide sufficient
charge to prevent excessive voltage ripple at
input. The input voltage ripple caused by
capacitance can be estimated by:
ΔVIN =
⎛
ILOAD
V
V
× OUT × ⎜1 − OUT
fS × C1 VIN ⎜⎝
VIN
⎞
⎟⎟
⎠
Selecting the Output Capacitor
The output capacitor (C2) is required to maintain
the DC output voltage. Ceramic, tantalum, or low
ESR electrolytic capacitors are recommended.
Low ESR capacitors are preferred to keep the
output voltage ripple low. The output voltage
ripple can be estimated by:
ΔVOUT =
VOUT ⎛
V
× ⎜⎜1 − OUT
fS × L ⎝
VIN
The characteristics of the output capacitor also
affect the stability of the regulation system. The
NB648 can be optimized for a wide range of
capacitance and ESR values.
External Bootstrap Diode
An external bootstrap diode may enhance the
efficiency of the regulator, the applicable
conditions of external BST diode are:
z
VOUT is 5V or 3.3V; and
z
Duty cycle is high: D=
VOUT
>65%
VIN
In these cases, an external BST diode is
recommended from the output of the voltage
regulator to BST pin, as shown in Fig.3
External BST Diode
IN4148
BST
CBST
NB648
SW
L
+
COUT
5V or 3.3V
Figure 3—Add Optional External Bootstrap
Diode to Enhance Efficiency
The recommended external BST diode is IN4148,
and the BST cap is 0.1~1µF.
⎞
⎞ ⎛
1
⎟
⎟⎟ × ⎜ R ESR +
⎜
8 × f S × C2 ⎟⎠
⎠ ⎝
Where L is the inductor value and RESR is the
equivalent series resistance (ESR) value of the
output capacitor.
In the case of ceramic capacitors, the impedance
at the switching frequency is dominated by the
capacitance. The output voltage ripple is mainly
caused by the capacitance. For simplification, the
output voltage ripple can be estimated by:
ΔVOUT =
⎞
⎛
V
× ⎜⎜1 − OUT ⎟⎟
VIN ⎠
× L × C2 ⎝
VOUT
8 × fS
2
In the case of tantalum or electrolytic capacitors,
the ESR dominates the impedance at the
switching frequency. For simplification, the output
ripple can be approximated to:
ΔVOUT =
NB648 Rev. 0.9
12/10/2013
VOUT ⎛
V
× ⎜⎜ 1 − OUT
fS × L ⎝
VIN
⎞
⎟⎟ × R ESR
⎠
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10
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
PCB Layout
PCB layout is very important to achieve stable
operation. Please follow these guidelines and
take Figure 4 for references.
The high current paths (GND, IN and SW) should
be placed very close to the device with short,
direct and wide traces. The input capacitor needs
to be as close as possible to the IN and GND
pins. The external feedback resistors should be
placed next to the FB pin. Keep the switching
node SW short and away from the feedback
network.
Inner 1
Top Layer
Inner 2
Bottom Layer
Figure 4—PCB Layout
NB648 Rev. 0.9
12/10/2013
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11
NB648 – 8A, 25V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
PACKAGE INFORMATION
5x6mm QFN30
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
NB648 Rev. 0.9
12/10/2013
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