560CAA200M000BBGR

Ultra Series™ Crystal Oscillator Si560 Data Sheet Ultra Low Jitter Any-Frequency XO (90 fs), 0.2 to 3000 MHz KEY FEATURES The Si560 Ultra Series™ oscillator utilizes Silicon Laboratories’ advanced 4th generation DSPLL® technology to provide an ultra-low jitter, low phase noise clock at any output frequency. The device is factory-programmed to any frequency from 0.2 to 3000 MHz with 6 digits Reel R Tape and Reel Coil Tape Frequency Code3 Description Mxxxxxx FCLK < 1 MHz xxxxMxx xxxxxx Notes: 1. Contact Silicon Labs for non-standard configurations. 2. Total stability includes temp stability, initial accuracy, load pulling, VDD variation, and 20 year aging at 70 °C. 3. For example: 156.25 MHz = 156M250; 25 MHz = 25M0000. Create custom part numbers at www.silabs.com/oscillators. 1.1 Technical Support Frequently Asked Questions (FAQ) www.silabs.com/Si560-FAQ Oscillator Phase Noise Lookup Utility www.silabs.com/oscillator-phase-noise-lookup Quality and Reliability www.silabs.com/quality Development Kits www.silabs.com/oscillator-tools silabs.com | Building a more connected world. Rev. 1.2 | 2 Si560 Data Sheet Electrical Specifications 2. Electrical Specifications Table 2.1. Electrical Specifications VDD = 1.8 V, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC Parameter Temperature Range Frequency Range Supply Voltage Supply Current Symbol Test Condition/Comment Min Typ Max Unit –40 — 85 ºC LVPECL, LVDS, CML 0.2 — 3000 MHz HCSL 0.2 — 400 MHz CMOS, Dual CMOS 0.2 — 250 MHz 3.3 V 3.135 3.3 3.465 V 2.5 V 2.375 2.5 2.625 V 1.8 V 1.71 1.8 1.89 V LVPECL (output enabled) — 110 160 mA LVDS/CML (output enabled) — 90 130 mA HCSL (output enabled) — 85 130 mA CMOS (output enabled) — 85 135 mA Dual CMOS (output enabled) — 95 145 mA Tristate Hi-Z (output disabled) — 73 — mA Frequency stability Grade A –20 — 20 ppm TA FCLK VDD IDD Temperature Stability Total Stability1 FSTAB Frequency stability Grade A –50 — 50 ppm Rise/Fall Time (20% to 80% VPP) TR/TF LVPECL/LVDS/CML — — 350 ps CMOS / Dual CMOS, (CL = 5 pF) — 0.5 1.5 ns HCSL, FCLK >50 MHz — — 550 ps All formats 45 — 55 % Duty Cycle DC Output Enable (OE)2 VIH 0.7 × VDD — — V VIL — — 0.3 × VDD V Powerup Time Powerup VDD Ramp Rate LVPECL Output Option3 TD Output Disable Time, FCLK > 10 MHz — — 3 µs TE Output Enable Time, FCLK > 10 MHz — — 20 µs tOSC Time from 0.9 × VDD until output frequency (FCLK) within spec — — 10 ms VRAMP Fastest VDD ramp rate allowed on startup — — 9 V/ms VOC Mid-level VDD – 1.42 — VDD – 1.25 V VO Swing (diff, FCLK < 1.5 GHz) 1.1 — 1.9 VPP Swing (diff, FCLK > 1.5 GHz)6 0.55 — 1.7 VPP silabs.com | Building a more connected world. Rev. 1.2 | 3 Si560 Data Sheet Electrical Specifications Parameter Symbol Test Condition/Comment Min Typ Max Unit VOC Mid-level (2.5 V, 3.3 V VDD) 1.125 1.20 1.275 V Mid-level (1.8 V VDD) 0.8 0.9 1.0 V Swing (diff, FCLK < 1.4 GHz) 0.6 0.7 0.9 VPP Swing (diff, FCLK > 1.4 GHz) 6 0.25 0.5 0.8 VPP VOH Output voltage high 660 800 850 mV VOL Output voltage low –150 0 150 mV VC Crossing voltage 250 410 550 mV CML Output Option (AC-Coupled) VO Swing (diff, FCLK ≤ 1.5 GHz) 0.6 0.8 1.0 VPP Swing (diff, FCLK > 1.5 GHz)6 0.3 0.55 0.9 VPP CMOS Output Option VOH IOH = 8/6/4 mA for 3.3/2.5/1.8 V VDD 0.85 × VDD — — V VOL IOL = 8/6/4 mA for 3.3/2.5/1.8 V VDD — — 0.15 × VDD V LVDS Output Option4 VO HCSL Output Option5 Notes: 1. Total Stability includes temperature stability, initial accuracy, load pulling, VDD variation, and aging for 20 yrs at 70 ºC. 2. OE includes a 50 kΩ pull-up to VDD for OE active high, or includes a 50 kΩ pull-down to GND for OE active low. 3. Rterm = 50 Ω to VDD – 2.0 V (see Figure 4.1). 4. Rterm = 100 Ω (differential) (see Figure 4.2). 5. Rterm = 50 Ω to GND (see Figure 4.2). 6. Refer to the figure below for Typical Clock Output Swing Amplitudes vs Frequency. Figure 2.1. Typical Clock Output Swing Amplitudes vs. Frequency silabs.com | Building a more connected world. Rev. 1.2 | 4 Si560 Data Sheet Electrical Specifications Table 2.2. Clock Output Phase Jitter and PSNR VDD = 1.8 V, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC Parameter Phase Jitter (RMS, 12 kHz - 20 MHz)1 All Differential Formats Symbol Test Condition/Comment Min Typ Max Unit ϕJ FCLK ≥ 200 MHz — 90 140 fs 100 MHz ≤ FCLK < 200 MHz — 105 160 fs LVPECL @ 156.25 MHz — 95 135 fs 10 MHz ≤ FCLK < 250 MHz — 200 — fs ϕJ Phase Jitter (RMS, 12 kHz - 20 MHz)1 CMOS / Dual CMOS Formats Spurs Induced by External Power Supply Noise, 50 mVpp Ripple. LVDS 156.25 MHz Output PSNR 100 kHz sine wave -83 200 kHz sine wave -83 500 kHz sine wave -82 1 MHz sine wave -85 dBc Note: 1. Guaranteed by characterization. Jitter inclusive of any spurs. Table 2.3. 3.2 x 5 mm Clock Output Phase Noise (Typical) Offset Frequency (f) 156.25 MHz LVDS 200 MHz LVDS 644.53125 MHz LVDS 100 Hz –105 –100 –92 1 kHz –129 –126 –116 10 kHz –136 –133 –125 100 kHz –142 –140 –131 1 MHz –150 –148 –138 10 MHz –159 –161 –153 20 MHz –160 –162 –154 Offset Frequency (f) 156.25 MHz LVPECL 200 MHz LVPECL 644.53125 MHz LVPECL 100 Hz –109 –102 –92 1 kHz –131 –126 –119 10 kHz –135 –134 –124 100 kHz –143 –141 –130 1 MHz –150 –148 –138 10 MHz –160 –162 –154 20 MHz –161 –163 –155 silabs.com | Building a more connected world. Unit dBc/Hz Unit dBc/Hz Rev. 1.2 | 5 Si560 Data Sheet Electrical Specifications Figure 2.2. Phase Jitter vs. Output Frequency Phase jitter measured with Agilent E5052 using a differential-to-single ended converter (balun or buffer). Measurements collected for >700 commonly used frequencies. Phase noise plots for specific frequencies are available using our free, online Oscillator Phase Noise Lookup Tool at www.silabs.com/oscillators. silabs.com | Building a more connected world. Rev. 1.2 | 6 Si560 Data Sheet Electrical Specifications Table 2.4. Environmental Compliance and Package Information Parameter Test Condition Mechanical Shock MIL-STD-883, Method 2002 Mechanical Vibration MIL-STD-883, Method 2007 Solderability MIL-STD-883, Method 2003 Gross and Fine Leak MIL-STD-883, Method 1014 Resistance to Solder Heat MIL-STD-883, Method 2036 Moisture Sensitivity Level (MSL): 3.2 x 5, 5 x 7 packages 1 Moisture Sensitivity Level (MSL): 2.5 x 3.2 package 2 Contact Pads: 3.2x5, 5x7 packages Au/Ni (0.3 - 1.0 µm / 1.27 - 8.89 µm) Contact Pads: 2.5x3.2 packages Au/Pd/Ni (0.03 - 0.12 µm / 0.1 - 0.2 µm / 3.0 - 8.0 µm) Note: 1. For additional product information not listed in the data sheet (e.g. RoHS Certifications, MDDS data, qualification data, REACH Declarations, ECCN codes, etc.), refer to our "Corporate Request For Information" portal found here: www.silabs.com/support/ quality/Pages/RoHSInformation.aspx. Table 2.5. Thermal Conditions1 Max Junction Temperature = 125° C Package 2.5 x 3.2 mm 6-pin DFN2 3.2 × 5 mm 6-pin CLCC 5 × 7 mm 6-pin CLCC Parameter Symbol Test Condition Value Unit Thermal Resistance Junction to Ambient ΘJA Still Air, 85 °C 72 ºC/W Thermal Parameter Junction to Board ΨJB Still Air, 85 °C 38 ºC/W Thermal Parameter Junction to Top Center ΨJT Still Air, 85 °C 15 ºC/W Thermal Resistance Junction to Ambient ΘJA Still Air, 85 °C 55 ºC/W Thermal Parameter Junction to Board ΨJB Still Air, 85 °C 20 ºC/W Thermal Parameter Junction to Top Center ΨJT Still Air, 85 °C 20 ºC/W Thermal Resistance Junction to Ambient ΘJA Still Air, 85 °C 53 ºC/W Thermal Parameter Junction to Board ΨJB Still Air, 85 °C 26 ºC/W Thermal Parameter Junction to Top Center ΨJT Still Air, 85 °C 26 ºC/W Note: 1. Based on PCB Dimensions: 4.5" x 7", PCB Thickness: 1.6 mm, Number of Cu Layers: 4. 2. For best 2.5x3.2mm thermal performance, use 2 GND vias as shown in the Si5xxUC-EVB eval board layout silabs.com | Building a more connected world. Rev. 1.2 | 7 Si560 Data Sheet Electrical Specifications Table 2.6. Absolute Maximum Ratings1 Parameter Symbol Rating Unit TAMAX 95 ºC TS –55 to 125 ºC Supply Voltage VDD –0.5 to 3.8 ºC Input Voltage VIN –0.5 to VDD + 0.3 V ESD HBM (JESD22-A114) HBM 2.0 kV Solder Temperature2 TPEAK 260 ºC TP 20–40 sec Maximum Operating Temp. Storage Temperature Solder Time at TPEAK2 Notes: 1. Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device reliability. 2. The device is compliant with JEDEC J-STD-020. silabs.com | Building a more connected world. Rev. 1.2 | 8 Si560 Data Sheet Dual CMOS Buffer 3. Dual CMOS Buffer Dual CMOS output format ordering options support either complementary or in-phase signals for two identical frequency outputs. This feature enables replacement of multiple XOs with a single Si560 device. ~ Complementary Outputs ~ In-Phase Outputs Figure 3.1. Integrated 1:2 CMOS Buffer Supports Complementary or In-Phase Outputs silabs.com | Building a more connected world. Rev. 1.2 | 9 Si560 Data Sheet Recommended Output Terminations 4. Recommended Output Terminations The output drivers support both AC-coupled and DC-coupled terminations as shown in figures below. VDD VDD (3.3V, 2.5V) CLK+ Rp R1 R1 CLK+ 50 Ω CLK- Si56x VDD VDD (3.3V, 2.5V) Rp R2 R2 LVPECL Receiver VDD (3.3V, 2.5V) CLK+ VDD Si56x Rp Rp 50 Ω R2 VDD (3.3V, 2.5V) R1 VTT CLK+ 50 Ω LVPECL Receiver 50 Ω VDD CLK- 50 Ω R2 R2 DC-Coupled LVPECL – Thevenin Termination 50 Ω CLK- 50 Ω Si56x AC-Coupled LVPECL – Thevenin Termination R1 50 Ω CLK- 50 Ω R1 LVPECL Receiver AC-Coupled LVPECL - 50 Ω w/VTT Bias 50 Ω Si56x R1 VTT R2 50 Ω 50 Ω LVPECL Receiver DC-Coupled LVPECL - 50 Ω w/VTT Bias Figure 4.1. LVPECL Output Terminations AC-Coupled LVPECL Termination Resistor Values DC-Coupled LVPECL Termination Resistor Values VDD R1 R2 Rp VDD R1 R2 3.3 V 127 Ω 82.5 Ω 130 Ω 3.3 V 127 Ω 82.5 Ω 2.5 V 250 Ω 62.5 Ω 90 Ω 2.5 V 250 Ω 62.5 Ω silabs.com | Building a more connected world. Rev. 1.2 | 10 Si560 Data Sheet Recommended Output Terminations (3.3V, 2.5V, 1.8V) VDD CLK+ (3.3V, 2.5V, 1.8V) VDD 50 Ω CLK+ 33 Ω 100 Ω CLK50 Ω Si56x LVDS Receiver CLK+ 50 Ω HCSL Receiver Source Terminated HCSL (3.3V, 2.5V, 1.8V) VDD 50 Ω CLK+ 100 Ω CLK50 Ω Si56x 50 Ω 50 Ω Si56x DC-Coupled LVDS (3.3V, 2.5V, 1.8V) VDD 50 Ω CLK- 33 Ω 50 Ω CLK- LVDS Receiver 50 Ω 50 Ω Si56x AC-Coupled LVDS 50 Ω HCSL Receiver Destination Terminated HCSL Figure 4.2. LVDS and HCSL Output Terminations (3.3V, 2.5V, 1.8V) VDD CLK+ VDD (3.3V, 2.5V, 1.8V) 50 Ω CLK 10 Ω 100 Ω CLK- NC 50 Ω Si56x CML Receiver CLK+ Single CMOS Termination VDD (3.3V, 2.5V, 1.8V) 50 Ω 50 Ω CLK+ 50 Ω CLK- VCM CLK- Si56x CMOS Receiver Si56x CML Termination without VCM (3.3V, 2.5V, 1.8V) VDD 50 Ω 50 Ω CML Receiver CML Termination with VCM 10 Ω 10 Ω 50 Ω 50 Ω Si56x CMOS Receivers Dual CMOS Termination Figure 4.3. CML and CMOS Output Terminations silabs.com | Building a more connected world. Rev. 1.2 | 11 Si560 Data Sheet Package Outline 5. Package Outline 5.1 Package Outline (5×7 mm) The figure below illustrates the package details for the 5×7 mm Si560. The table below lists the values for the dimensions shown in the illustration. Figure 5.1. Si560 (5×7 mm) Outline Diagram Table 5.1. Package Diagram Dimensions (mm) Dimension Min Nom Max Dimension Min Nom Max A 1.13 1.28 1.43 L 1.17 1.27 1.37 A2 0.50 0.55 0.60 L1 0.05 0.10 0.15 A3 0.50 0.55 0.60 p 1.70 — 1.90 b 1.30 1.40 1.50 R 0.70 REF c 0.50 0.60 0.70 aaa 0.15 bbb 0.15 ccc 0.08 D D1 5.00 BSC 4.30 4.40 4.50 e 2.54 BSC ddd 0.10 E 7.00 BSC eee 0.05 E1 6.10 6.20 6.30 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. silabs.com | Building a more connected world. Rev. 1.2 | 12 Si560 Data Sheet Package Outline 5.2 Package Outline (3.2×5 mm) The figure below illustrates the package details for the 3.2×5 mm Si560. The table below lists the values for the dimensions shown in the illustration. Figure 5.2. Si560 (3.2×5 mm) Outline Diagram Table 5.2. Package Diagram Dimensions (mm) Dimension Min Nom Max A 1.06 1.17 1.33 b 0.54 0.64 0.74 c 0.35 0.45 0.55 D D1 3.20 BSC 2.55 2.60 e 1.27 BSC E 5.00 BSC 2.65 E1 4.35 4.40 4.45 H 0.45 0.55 0.65 L 0.80 0.90 1.00 L1 0.05 0.10 0.15 p 1.36 1.46 1.56 R 0.32 REF aaa 0.15 bbb 0.15 ccc 0.08 ddd 0.10 eee 0.05 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. silabs.com | Building a more connected world. Rev. 1.2 | 13 Si560 Data Sheet Package Outline 5.3 Package Outline (2.5x3.2 mm) The figure below illustrates the package details for the 2.5x3.2 mm Si560. The table below lists the values for the dimensions shown in the illustration. Figure 5.3. Si560 (2.5×3.2 mm) Outline Diagram Table 5.3. Package Diagram Dimensions (mm) Dimension Min Nom Max A 0.90 0.95 1.00 A1 0.36 REF A2 0.53 REF W 0.55 0.60 D 3.2 BSC E 2.5 BSC e 1.10 BSC L 0.65 0.70 n 5 D1 2.2 BSC E1 1.589 BSC aaa 0.10 bbb 0.10 ddd 0.08 0.65 0.75 Notes: 1. The dimensions in parentheses are reference. 2. All dimensions in millimeters (mm). 3. Dimensioning and Tolerancing per ANSI Y14.5M-1994. silabs.com | Building a more connected world. Rev. 1.2 | 14 Si560 Data Sheet PCB Land Pattern 6. PCB Land Pattern 6.1 PCB Land Pattern (5×7 mm) The figure below illustrates the 5×7 mm PCB land pattern for the Si560. The table below lists the values for the dimensions shown in the illustration. Figure 6.1. Si560 (5×7 mm) PCB Land Pattern Table 6.1. PCB Land Pattern Dimensions (mm) Dimension (mm) C1 4.20 E 2.54 X1 1.55 Y1 1.95 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. silabs.com | Building a more connected world. Rev. 1.2 | 15 Si560 Data Sheet PCB Land Pattern 6.2 PCB Land Pattern (3.2×5 mm) The figure below illustrates the 3.2×5.0 mm PCB land pattern for the Si560. The table below lists the values for the dimensions shown in the illustration. Figure 6.2. Si560 (3.2×5 mm) PCB Land Pattern Table 6.2. PCB Land Pattern Dimensions (mm) Dimension (mm) C1 2.60 E 1.27 X1 0.80 Y1 1.70 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. silabs.com | Building a more connected world. Rev. 1.2 | 16 Si560 Data Sheet PCB Land Pattern 6.3 PCB Land Pattern (2.5×3.2 mm) The figure below illustrates the 2.5×3.2 mm PCB land pattern for the Si560. The table below lists the values for the dimensions shown in the illustration. Figure 6.3. Si560 (2.5×3.2 mm) PCB Land Pattern Table 6.3. PCB Land Pattern Dimensions (mm) Dimension Description Value (mm) X1 Width - leads on long sides 0.85 Y1 Height - leads on long sides 0.7 D1 Pitch in X directions of XLY1 leads 1.639 E1 Lead pitch XLY1 leads 1.10 Notes: The following notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine-tune their SMT process as required for their application and tooling. General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 0.8:1 for the pads. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. silabs.com | Building a more connected world. Rev. 1.2 | 17 Si560 Data Sheet Top Markings 7. Top Markings 7.1 Top Marking (5x7 and 3.2x5 mm Package) The figure below illustrates the mark specification for the Si560 5x7 and 3.2x5 package sizes. The table below lists the line information. Figure 7.1. Mark Specification Table 7.1. Si560 Top Mark Description Line Position Description 1 1–8 "Si560", xxx = Ordering Option 1, Option 2, Option 3 (e.g. Si560AAA) 2 1–7 Frequency Code (e.g. 100M000 or 6-digit custom code as described in the Ordering Guide) Trace Code 3 Position 1 Pin 1 orientation mark (dot) Position 2 Product Revision (B) Position 3–5 Tiny Trace Code (3 alphanumeric characters per assembly release instructions) Position 6–7 Year (last two digits of the year), to be assigned by assembly site (ex: 2017 = 17) Position 8–9 Calendar Work Week number (1–53), to be assigned by assembly site silabs.com | Building a more connected world. Rev. 1.2 | 18 Si560 Data Sheet Top Markings 7.2 Top Marking (2.5x3.2 Package) The figure below illustrates the mark specification for the Si560 2.5x3.2 package sizes. The table below lists the line information. J C CC CC T TTT TT Y Y WW Figure 7.2. Mark Specification Table 7.2. Si560 Top Mark Description Line Position 1 1–6 2 J = Si560, CCCCC = Custom Mark Code. Trace Code 1–6 Position 1 3 Description Six-digit trace code per assembly release instructions. Pin 1 orientation mark (dot). Position 2–3 Year (last two digits of the year), to be assigned by assembly site (e.g., 2017 = 17). Position 4–5 Calendar Work Week number (1–53), to be assigned by assembly site. silabs.com | Building a more connected world. Rev. 1.2 | 19 Si560 Data Sheet Revision History 8. Revision History Revision 1.2 September, 2020 • Added 2.5 x 3.2 mm package option. • Updated Table 2.2, Powerup VDD Ramp Rate and LVDS Swing. Revision 1.1 July, 2020 • Added 2.5 x 3.2 mm package option. Revision 1.0 June, 2018 • Initial release. silabs.com | Building a more connected world. Rev. 1.2 | 20 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. Available for Windows and iOS (CBGo only). www.silabs.com/CBPro Timing Portfolio www.silabs.com/timing SW/HW www.silabs.com/CBPro Quality www.silabs.com/quality Support and Community community.silabs.com Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required, or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. Trademark Information Silicon Laboratories Inc.®, Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, ClockBuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, Gecko OS, Gecko OS Studio, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® , Zentri, the Zentri logo and Zentri DMS, ZWave®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders. Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 USA http://www.silabs.com