AX-SFJK, AX-SFJK-API
Ultra-Low Power,
AT Command / API Controlled,
Sigfox) Compliant
Transceiver IC for Up-Link
and Down-Link
www.onsemi.com
OVERVIEW
• 10 GPIO pins
Circuit Description
AX−SFJK and AX−SFJK−API are ultra−low power
single chip solutions for a node on the Sigfox network with
both up− and down−link functionality. The AX−SFJK chip
is delivered fully ready for operation and contains all the
necessary firmware to transmit and receive data from the
Sigfox network in Japan (SIGFOX RCZ3a region). It
connects to the customer product using a logic level RS232
UART. AT commands are used to send frames and configure
radio parameters.
The AX−SFJK−API variant is intended for customers
wishing to write their own application software based on the
AX−SF−LIB−1−GEVK library.
♦
♦
♦
♦
♦
Power Consumption
• Ultra−low Power Consumption:
♦ Charge required to send a Sigfox OOB packet at
13 dBm output power: 0.28 C
♦ Deep Sleep mode current: 100 nA
♦ Sleep mode current: 1.6 mA
♦ Standby mode current: 0.5 mA
♦ Continuous radio RX−mode at 922.2 MHz:
15 mA
♦ Continuous radio TX−mode at 923.2 MHz
45 mA @ 13 dBm
Features
Functionality and Ecosystem
• Sigfox up−link and down−link functionality controlled
by AT commands or API
• The AX−SFJK and AX−SFJK−API ICs are part of a
whole development and product ecosystem available
from ON Semiconductor for any Sigfox requirement.
Other parts of the ecosystem include
♦ Ready to go development kit
DVK−SFJK−[API]−1−GEVK including a 2 year
Sigfox subscription
♦ Sigfox Ready® certified reference design for the
AX−SFJK and AX−SFJK−API ICs
High Performance Narrow−band Sigfox RF Transceiver
• Receiver
♦ Carrier frequency 922.2 MHz
♦ Data rate 600 bps FSK
♦ Sensitivity
−126 dBm @ 600 bps, 922.2 MHz, GFSK
♦ 0 dBm maximum input power
• Transmitter
♦ Carrier frequency 923.2 MHz
♦ Data rate 100 bps PSK
♦ High efficiency, high linearity integrated power
amplifier
♦ Maximum output power 13 dBm
General Features
• QFN40 5 mm x 7 mm package
• Supply range 1.8 V*−3.6 V
• −40°C to 85°C
• Temperature sensor
• Supply voltage measurements
*The device is operational from 1.8 V to 3.6 V. However, a supply
voltage below 2.0 V is considered an extreme condition.
Details see Table 4.
© Semiconductor Components Industries, LLC, 2017
April, 2019 − Rev. 4
2 GPIO pins with selectable voltage measure
functionality, differential (1 V or 10 V range) or
single ended (1 V range) with 10 bit resolution
2 GPIO pins with selectable sigma delta DAC
output functionality
2 GPIO pins with selectable output clock
3 GPIO pins selectable as SPI master interface
Integrated RX/TX switching with differential
antenna pins
Applications
Sigfox networks up−link and down−link.
1
Publication Order Number:
AX−SFJK/D
AX−SFJK, AX−SFJK−API
BLOCK DIAGRAM
AX−SFEU / AX−SFEU−API
CLKP
CLKN
ANTP
ANTN
TCXO
interface
FILT
Receive
RX/TX
switch and
antenna
interface
UARTRX
UARTTX
CAL
RF synthesis
Communication
controller
Transmit
UART
DAC
GPIO[9:0]
GPIO
CPU
ADC
power mode control
RAM
Program
memory
(FLASH)
Sigfox identity (ID, PAC)
RESET_N
Sigfox compliant
application
(AX−SFEU only)
VTCXO
RX_LED
VDD_IO
TX_LED
dedicated
status
outputs
VDD_ANA
CPU_LED
GND
RADIO_LED
Figure 1. Functional Block Diagram of the AX−SFJK / AX−SFJK−API
www.onsemi.com
2
AX−SFJK, AX−SFJK−API
Table 1. PIN FUNCTION DESCRIPTIONS
Pin(s)
Type
VDD_ANA
Symbol
1
P
Analog power output, decouple to neighboring GND
Description
GND
2
P
Ground, decouple to neighboring VDD_ANA
ANTP
3
A
Differential antenna input/output
ANTN
4
A
Differential antenna input/output
NC
5
N
Do not connect
GND
6
P
Ground, decouple to neighboring VDD_ANA
VDD_ANA
7
P
Analog power output, decouple to neighboring GND
GND
8
P
Ground
FILT
9
A
Synthesizer filter
L2
10
A
Must be connected to pin L1
L1
11
A
Must be connected to pin L2
NC
12
N
Do not connect
GPIO8
13
I/O/PU
General purpose IO
GPIO7
14
I/O/PU
General purpose IO, selectable SPI functionality (MISO)
GPIO6
15
I/O/PU
General purpose IO, selectable SPI functionality (MOSI)
GPIO5
16
I/O/PU
General purpose IO, selectable SPI functionality (SCK)
GPIO4
17
I/O/PU
General purpose IO, selectable SD DAC functionality, selectable clock
functionality
CPU_LED
18
O
CPU activity indicator
RADIO_LED
19
O
Radio activity indicator
VTCXO
20
O
TCXO power
GPIO9
21
I/O/PU
UARTTX
22
O
UART transmit
UARTRX
23
I/PU
UART receive
RX_LED/
DBG_DATA
24
O
I/O
Receive activity indicator in AX−SFJK
Debugger data line in AX−SFJK−API
TX_LED/
DBG_CLK
25
O
I
Transmit activity indicator in AX−SFJK
Debugger clock line in AX−SFJK−API
NC/
DBG_EN
26
PD
PD
Do not connect in AX−SFJK
Debugger enable line in AX−SFJK−API
RESET_N
27
I/PU
Optional reset pin. Internal pull−up resistor is permanently enabled,
nevertheless it is recommended to connect this pin to VDD_IO if it is not used.
GND
28
P
Ground
VDD_IO
29
P
Unregulated power supply
GPIO0
30
I/O/A/PU
General purpose IO, selectable ADC functionality, selectable SD DAC
functionality, selectable clock functionality
GPIO1
31
I/O/A/PU
General purpose IO, selectable ADC functionality
GPIO2
32
I/O/A/PU
General purpose IO, selectable ADC functionality
NC
33
N
Do not connect
NC
34
N
Do not connect
GPIO3
35
I/O/A/PU
VDD_IO
36
P
Unregulated power supply
CAL
37
A
Connect to FILT as shown in the application diagram
NC
38
N
Do not connect
CLKN
39
A
TCXO interface
General purpose IO, wakeup from deep sleep
General purpose IO, selectable ADC functionality
www.onsemi.com
3
AX−SFJK, AX−SFJK−API
Table 1. PIN FUNCTION DESCRIPTIONS (continued)
Symbol
Pin(s)
Type
Description
CLKP
40
A
TCXO interface
GND
Center pad
P
Ground on center pad of QFN, must be connected
A = analog input
I = digital input signal
O = digital output signal
PU = pull−up
I/O = digital input/output signal
N = not to be connected
P = power or ground
PD = pull−down
Table 2.
All digital inputs are Schmitt trigger inputs, digital input
and output levels are LVCMOS/LVTTL compatible. Pins
GPIO[3:0] must not be driven above VDD_IO, all other
digital inputs are 5 V tolerant. All GPIO pins and UARTRX
start up as input with pull−up. For explanations on how to
use the GPIO pins, see chapter “AT Commands”.
Pin
Possible GPIO Modes
GPIO0
0, 1, Z, U, A, T
GPIO1
0, 1, Z, U, A
GPIO2
0, 1, Z, U, A
GPIO3
0, 1, Z, U, A
GPIO4
0, 1, Z, U, T
GPIO5
0, 1, Z, U
GPIO6
0, 1, Z, U
GPIO7
0, 1, Z, U
GPIO8
0, 1, Z, U
GPIO9
0, 1, Z, U
0 = pin drives low
1 = pin drives high
Z = pin is high impedance input
U = pin is input with pull−up
A = pin is analog input
T = pin is driven by clock or DAC
CLKN
NC
CAL
VDD_IO
GPIO3
NC
NC
GPIO2
GPIO1
GPIO0
VDD_IO
40
39
38
37
36
35
34
33
32
31
30
29
1
28
GND
GND
2
27
RESET_N
ANTP
3
26
NC/DBG_EN
ANTN
4
25
TXLED/DBG_CLK
ANTP1
5
24
RXLED/DBG_DATA
GND
6
23
UARTRX
7
22
UARTTX
8
21
GPIO9
NOTE:
16
18
19
20
VTCXO
17
RADIO_LED
15
CPU_LED
14
GPIO4
13
GPIO5
12
GPIO6
11
GPIO7
10
GPIO8
FILT
9
NC
GND
QFN40
L1
VDD_ANA
AX−SFJK / AX−SFJK−API
L2
VDD_ANA
CLKP
Pinout Drawing
Pins 24−26 have different functionalities in AT command and API versions, so for these pins AX−SFJK/AX−SFJK−API explanations
are shown respectively.
Figure 2. Pinout Drawing (Top View)
www.onsemi.com
4
AX−SFJK, AX−SFJK−API
SPECIFICATIONS
Table 3. ABSOLUTE MAXIMUM RATINGS
Symbol
Description
Condition
VDD_IO
Supply voltage
IDD
Supply current
Ptot
Total power consumption
Pi
Absolute maximum input power at receiver input
II1
DC current into any pin except ANTP, ANTN, ANTP1
II2
DC current into pins ANTP, ANTN, ANTP1
IO
Output Current
Via
Input voltage ANTP, ANTN, ANTP1 pins
Input voltage digital pins
Min
Max
Units
−0.5
5.5
V
200
mA
800
mW
10
dBm
−10
10
mA
−100
100
mA
40
mA
−0.5
5.5
V
−0.5
5.5
V
−2000
2000
V
ANTP and ANTN
pins in RX mode
Ves
Electrostatic handling
HBM
Tamb
Operating temperature
−40
85
°C
Tstg
Storage temperature
−65
150
°C
Tj
Junction Temperature
150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
www.onsemi.com
5
AX−SFJK, AX−SFJK−API
DC Characteristics
Table 4. SUPPLIES
Conditions for all current and charge values unless otherwise specified are for the hardware configuration described in the AX−SFJK
Application Note: Sigfox Compliant Reference Design.
Symbol
Description
Condition
Min
Typ
Max
Units
TAMB
Operational ambient temperature
−40
27
85
°C
VDDIO
I/O and voltage regulator supply
voltage
1.8*
3.3
3.6
V
VDDIO_R1
I/O voltage ramp for reset activation
(Note 1)
Ramp starts at VDD_IO ≤ 0.1 V
0.1
V/ms
VDDIO_R2
I/O voltage ramp for reset activation
(Note 1)
Ramp starts at 0.1 V < VDD_IO < 0.7 V
3.3
V/ms
IDS
Deep Sleep mode current
AT$P=2
350
ISLP
Sleep mode current
AT$P=1
1.6
mA
ISTDBY
Standby mode current
(Note 2)
0.5
mA
IRX_CONT
Current consumption continuous RX
AT$TM=3,255
10
mA
QSFX_OOB_14
Charge to send a Sigfox out of band
message, 13 dBm
AT$SO
0.28
C
QSFX_BIT_14
Charge to send a bit, 13 dBm
AT$SB=0
0.21
C
QSFX_BITDL_14
Charge to send a bit with downlink
receive, 13 dBm
AT$SB=0,1
0.56
C
QSFX_LFR_14
Charge to send the longest possible
Sigfox frame (12 byte) , 13 dBm
AT$SF=00112233445566778899aabb
0.34
C
QSFX_LFRDL_14
Charge to send the longest possible
Sigfox frame (12 byte) with downlink
receive, 13 dBm
AT$SF=00112233445566778899aabb,1
0.67
C
ITXMOD14AVG
Modulated Transmitter Current
Pout=13 dBm; average
45
mA
nA
*The device is operational from 1.8 V to 3.6 V. However, a supply voltage below 2.0 V is considered an extreme condition and operation can
lead to reduced output power and increased spurious emission.
1. If VDD_IO ramps cannot be guaranteed, an external reset circuit is recommended, see the AX8052 Application Note: Power On Reset
2. Internal 20 MHz oscillator, voltage conditioning and supervisory circuit running.
Battery Life Examples
• Four maximum length frames with downlink receive
Scenario:
• 2 AAA Alkaline batteries in series
• One OOB frame transmitter per day at Pout=13 dBm
per day at Pout=13 dBm
• Device in Sleep
• Neglecting battery self discharge
2 AAA alkaline capacity
1500 mAh * 3600 s/h
5400 C
Sleep charge per day
1.8 mA * 86400 s
0.16 C/day
OOB frame transmission
Frame transmission with downlink
0.34 C/day
4 * 0.67 C/day
2.68 C/day
Total Charge consumption
3.18 C/day
Battery life
4.7 Years
www.onsemi.com
6
AX−SFJK, AX−SFJK−API
Table 5. LOGIC
Symbol
Description
Condition
Min
Typ
Max
Units
Digital Inputs
VDD_IO = 3.3 V
VT+
Schmitt trigger low to high threshold point
1.55
V
VT−
Schmitt trigger high to low threshold point
1.25
V
VIL
Input voltage, low
VIH
Input voltage, high
2.0
VIPA
Input voltage range, GPIO[3:0]
−0.5
VDD_IO
V
VIPBC
Input voltage range, GPIO[9:4], UARTRX
−0.5
5.5
V
IL
Input leakage current
−10
10
mA
RPU
Programmable Pull−Up Resistance
0.8
V
V
65
kW
Digital Outputs
IOH
Output Current, high
Ports GPIO[9:0], UARTTX, TXLED, RXLED,
TXLED, CPULED
VOH = 2.4 V
8
mA
IOL
Output Current, low
GPIO[9:0], UARTTX, TXLED, RXLED, TXLED,
CPULED
VOL = 0.4 V
8
mA
IOZ
Tri−state output leakage current
−10
10
mA
AC Characteristics
Table 6. TCXO REFERENCE INPUT
Symbol
fTCXO
Description
TCXO frequency
Condition
Min
A passive network between the TCXO output
and the pins CLKP and CLKN is required.
For detailed TCXO network recommendations
depending on the TCXO output swing refer to
the AX5043 Application Note: Use with a
TCXO Reference Clock.
For TCXO recommendations see the AX−
SFJK Application Note: Sigfox Compliant Reference Design
Typ
Max
48
Units
MHz
Table 7. TRANSMITTER
Conditions for transmitter specifications unless otherwise specified with the antenna network from AX−SFJK Application Note: Sigfox
Compliant Reference Design and at 923.2 MHz.
Symbol
Description
Condition
Min
Typ
Max
Units
SBR
Signal bit rate
PTX
Highest Transmitter output power
AT$CW=923200000,1
dTXtemp
Transmitter power variation vs. temperature
−40°C to +85°C
dTXVdd
Transmitter power variation vs. VDD_IO
1.8 to 3.6 V
±0.5
dB
PTXharm2
Emission @ 2nd harmonic
−50
dBc
PTXharm3
Emission @ 3rd harmonic
−67
PTXharm4
Emission @ 4th harmonic
−65
www.onsemi.com
7
100
bps
13
dBm
±0.5
dB
AX−SFJK, AX−SFJK−API
* RBW 1 MHz
Ref
0 dBm
* Att
Marker 3 [T1 ]
−65.24 dBm
3.692307692 GHz
* VBW 3 MHz
* SWT 10 s
10 dB
Marker 1 [T1 ]
−50.37
1.846153846
Marker 2 [T1 ]
−67.09
2.769230769
0
−10
1 PK *
CLRWR
−20
dBm
GHz
A
dBm
GHz
−30
ARIB
−40
1
−50
3DB
−60
3
2
−70
−80
−90
−100
Center
3 GHz
400 MHz/
Span 4 GHz
Figure 3. Typical Spectrum with Harmonics at 13 dBm Output Power
Table 8. RECEIVER
Conditions for receiver specifications unless otherwise specified with the antenna network from AX−SFJK Application Note: Sigfox
Compliant Reference Design and at 922.2 MHz.
Symbol
SBR
Description
Signal bit rate
ISBER905
BLK905
Condition
AT$SB=x,1, AT$SF=x,1,
AT$TM=3,x PER < 0.1
Blocking at ±10 MHz
offset
Channel/Blocker @ PER = 0.1, wanted signal
level is +3 dB above the typical sensitivity, the
blocker signal is CW
www.onsemi.com
8
Min
Typ
Max
Units
600
bps
−126
dBm
78
dB
AX−SFJK, AX−SFJK−API
Table 9. ADC / TEMPERATURE SENSOR
Symbol
Description
Condition
Min
Typ
Max
10
Units
ADCRES
ADC resolution
VADCREF
ADC reference voltage
ZADC00
Input capacitance
DNL
Differential nonlinearity
±1
LSB
INL
Integral nonlinearity
±1
LSB
OFF
Offset
3
LSB
GAIN_ERR
Gain error
0.8
%
0.95
1
Bits
1.05
V
2.5
pF
ADC in Differential Mode
VABS_DIFF
Absolute voltages & common mode voltage in
differential mode at each input
VFS_DIFF01
Full swing input for differential signals
VFS_DIFF10
0
VDD_IO
V
Gain x1
−500
500
mV
Gain x10
−50
50
mV
ADC in Single Ended Mode
VMID_SE
Mid code input voltage in single ended mode
VIN_SE00
Input voltage in single ended mode
VFS_SE01
Full swing input for single ended signals
0.5
V
0
VDD_IO
V
Gain x1
0
1
V
Temperature Sensor
AT$RLNG
Temperature range
AT$T?
−40
85
°C
TERR_CAL
Temperature error
AT$T?
−2
2
°C
www.onsemi.com
9
AX−SFJK, AX−SFJK−API
COMMAND INTERFACE
General Information
When using Deep Sleep mode, keep two things in mind:
Everything is turned off, timers are not running at all and all
settings will be lost (use AT$WR to save settings to flash
before entering Deep Sleep mode). Out−of−band messages
will therefore not be sent. The pins states are frozen in Deep
Sleep mode. The user must ensure that this will not result in
condition which would draw a lot of current.
The chapter “Command Interface” is a documentation of
the AT−Command set for devices which do not have an
API−interface. To see whether the device is capable of
receiving AT−Commands, please refer to the table “Device
Versions”. If the device has been shipped with the
API−Interface, please refer to the SW manual and
“apiexample” code delivered with AX−SF−LIB−1−GEVK
for an introduction on how to setup a project and how to use
the API−Interface.
AT Commands
Numerical Syntax
hexdigit ::= [0−9A−Fa−f]
hexnum ::= “0x” hexdigit+
decnum ::= “0” | [1−9] [0−9]*
octnum ::= “0” [0−7]+
binnum ::= “0b” [01]+
bit
::= [01]
optnum ::= “−1”
frame
::= (hexdigit hexdigit)+
uint
::= hexnum | decnum | octnum | binnum
uint_opt ::= uint | optnum
Serial Parameters: 9600, 8, N, 1
The AX−SFJK uses the UART (pins UARTTX,
UARTRX) to communicate with a host and uses a bitrate of
9600 baud, no parity, 8 data bits and one stop bit.
Power Modes
Command Syntax
A command starts with ‘AT’ (everything is case
sensitive!), continues with the actual command followed by
parameters (if any) and ends with any kind of whitespace
(space, tab, newline etc.)
If incorrect syntax is detected (“parsing error”) all input
is ignored up until the next whitespace character.
Also note that any number can be entered in any format
(Hexadecimal, Decimal, Octal and binary) by adding the
corresponding prefix (‘0x’, ‘0’, ‘0b’). The only exception is
the ‘Send Frame’ command (AT$SF) which expects a list of
hexadecimal digits without any prefix.
Standby
After Power−Up and after finishing a SIGFOX
transmission, AX−SFJK enters Standby mode. In Standby
mode, AX−SFJK listens on the UART for commands from
the host. Also, OOB frames are transmitted whenever the
OOB timer fires. To conserve power, the AX−SFJK can be
put into Sleep or turned off (Deep Sleep) completely.
Return Codes
A successful command execution is indicated by sending
‘OK’. If a command returns a value (e.g. by querying
a register) only the value is returned.
Examples
Bold text is sent to AX−SFJK.
AT$I=0
AX−Sigfox 1.1−RCZ3
Here, we execute command ‘I’ to query some general
information.
AT$SF=aabb1234
OK
This sends a Sigfox frame containing { 0xAA : 0xBB : 0x12
: 0x34 } without waiting for a response telegram.
AT$SF=0011223344,1
OK
RX=AA BB CC DD
This sends a Sigfox frame containing { 0x00 : 0x11 : 0x22
: 0x33 : 0x44 }, then waits for a downlink response telegram,
Sleep
The command AT$P=1 is used to put the AX−SFJK into
Sleep mode. In this mode, only the wakeup timer for
out−of−band messages is still running. To wake the
AX−SFJK up from Sleep mode toggle the serial UARTRX
pin, e.g. by sending a break (break is an RS232 framing
violation, i.e. at least 10 bit durations low). When an Out of
Band (OOB) message is due, AX−SFJK automatically
wakes up to transmit the message, and then returns to Sleep
mode.
Deep Sleep
In Deep Sleep mode, the AX−SFJK is completely turned
off and only draws negligible leakage current. Deep Sleep
mode can be activated with AT$P=2. To wake−up from
Deep Sleep mode, GPIO9 is pulled to GND.
www.onsemi.com
10
AX−SFJK, AX−SFJK−API
AT$P=1
OK
This transitions the device into sleep mode. Out−of−band
transmissions will still be triggered. The UART is powered
down. The device can be woken up by a low level on the
UART signal, i.e. by sending break.
which in this example contains { 0xAA : 0xBB : 0xCC :
0xDD }.
AT$CB=0xAA,1
OK
The ‘CB’ command sends out a continuous pattern of bits,
in this case 0xAA = 0b10101010.
Table 10. COMMANDS
Command
Name
Description
AT
Dummy Command
Just returns ‘OK’ and does nothing else. Can be used to check
communication.
AT$SB=bit[,bit]
Send Bit
Send a bit status (0 or 1). Optional bit flag indicates if AX−SFJK
should receive a downlink frame.
AT$SF=frame[,bit]
Send Frame
Send payload data, 1 to 12 bytes. Optional bit flag indicates if
AX−SFJK should receive a downlink frame.
AT$SO
Manually send out of band
message
Send the out−of−band message.
AT$TR?
Get the transmit repeat
Returns the number of transmit repeats. Default: 2
AT$TR=?
Get transmit repeat range
Returns the allowed range of transmit repeats.
AT$TR=uint
Set transmit repeat
Sets the transmit repeat, sets only for transmit with downlink frame.
ATSuint?
Get Register
Query a specific configuration register’s value. See the table
“Registers” for a list of registers.
ATSuint=uint
Set Register
Change a configuration register.
ATSuint=?
Get Register Range
Returns the range of allowed register values.
AT$IF=uint
Set TX Frequency
Set the output carrier macro channel for Sigfox frames.
AT$IF?
Get TX Frequency
Get the currently chosen TX frequency.
AT$DR=uint
Set RX Frequency
Set the reception carrier macro channel for Sigfox frames.
AT$DR?
Get RX Frequency
Get the currently chosen RX frequency.
AT$CW=uint,bit[,uint_opt]
Continuous Wave
To run emission tests for Sigfox certification it is necessary to send
a continuous wave, i.e. just the base frequency without any
modulation. Parameters:
AT$CB=uint_opt,bit
Test Mode: TX constant byte
Name
Range
Description
Frequency
800000000− Continuous wave frequency in Hz.
999999999, 0 Use 923200000 for Sigfox or 0 to
keep previous frequency.
Mode
0, 1
Enable or disable carrier wave.
Power
14
dBm of signal | Default: 14
For emission testing it is useful to send a specific bit pattern. The
first parameter specifies the byte to send. Use ‘−1’ for a
(pseudo−)random pattern. Parameters:
Name
Range
Description
Pattern
0−255, −1
Byte to send. Use ‘−1’ for a
(pseudo−)random pattern.
Mode
0, 1
Enable or disable pattern test mode.
AT$T?
Get Temperature
Measure internal temperature and return it in 1/10th of a degree
Celsius.
AT$V?
Get Voltages
Return current voltage and voltage measured during the last
transmission in mV.
www.onsemi.com
11
AX−SFJK, AX−SFJK−API
Table 10. COMMANDS (continued)
Command
Name
Description
AT$I=uint
Information
Display various product information:
0: Software Name & Version
Example Response: AX−Sigfox 1.1 RCZ3
1: Contact Details
Example Response: support@axsem.com
2: Silicon revision lower byte
Example Response: 8F
3: Silicon revision upper byte
Example Response: 51
4: Major Firmware Version
Example Response: 1
5: Minor Firmware Version
Example Response: 1
7: Firmware Variant (Frequency Band etc. (EU/US))
Example Response: RCZ3
9: SIGFOX Library Version
Example Response: UDL1−1.8.9
10: Device ID
Example Response: 00012345
11: PAC
Example Response: 0123456789ABCDEF
AT$P=uint
Set Power Mode
To conserve power, the AX−SFJK can be put to sleep manually.
Depending on power mode, you will be responsible for waking up the
AX−SFJK again!
0: software reset (settings will be reset to values in flash)
1: sleep (send a break to wake up)
2: deep sleep (toggle GPIO9 or RESET_N pin to wake up;
the AX−SFJK is not running and all settings will be reset!)
AT$WR
Save Config
Write all settings to flash (RX/TX frequencies, registers) so they
survive reset/deep sleep or loss of power.
Use AT$P=0 to reset the AX−SFJK and load settings from flash.
AT:Pn?
Get GPIO Pin
Return the setting of the GPIO Pin n; n can range from 0 to 9.
A character string is returned describing the mode of the pin,
followed by the actual value. If the pin is configured as analog pin,
then the voltage (range 0…1 V) is returned. The mode characters
have the following meaning:
Mode
Description
0
1
Z
U
A
T
Pin drives low
Pin drives high
Pin is high impedance input
Pin is input with pull−up
Pin is analog input (GPIO pin 0…3 only)
Pin is driven by clock or DAC (GPIO pin 0 and 4 only)
The default mode after exiting reset is U on all GPIO pins.
AT:Pn=?
Get GPIO Pin Range
Print a list of possible modes for a pin. The table below lists the
response.
Pin
P0
P1
P4
P5
P6
P7
P8
P9
AT:Pn=mode
Set GPIO Pin
Modes
0, 1, Z, U, A, T
0, 1, Z, U, A
0, 1, Z, U, T
0, 1, Z, U
0, 1, Z, U
0, 1, Z, U
0, 1, Z, U
0, 1, Z, U
Set the GPIO pin mode.
For a list of the modes see the command AT:Pn?
www.onsemi.com
12
AX−SFJK, AX−SFJK−API
Table 10. COMMANDS (continued)
Command
Name
Description
AT:ADC Pn[−Pn[(1V|10V)]]?
Get GPIO Pin Analog Voltage
Measure the voltage applied to a GPIO pin. The command also
allows measurement of the voltage difference across two GPIO pins.
In differential mode, the full scale range may also be specified as 1 V
or 10 V. Note however that the pin input voltages must not exceed
the range 0..VDD_IO. The command returns the result as fraction of
the full scale range (1 V if none is specified). The GPIO pins
referenced should be initialized to analog mode before issuing this
command.
AT:SPI[(A|B|C|D)]=bytes
SPI Transaction
This command clocks out bytes on the SPI port. The clock frequency is
312.5 kHz. The command returns the bytes read on MISO during output. Optionally the clocking mode may be specified (default is A):
Mode
A
B
C
D
Clock Inversion
Clock Phase
normal
normal
inverted
inverted
normal
alternate
normal
alternate
Note that SEL, if needed, is not generated by this command,
and must instead be driven using standard GPIO commands
(AT:Pn=0|1).
AT:CLK=freq,reffreq
Set Clock Generator
Output a square wave on the pin(s) set to T mode. The frequency of
the square wave is (freq / 216) × reffreq. Possible values for reffreq
are 20000000, 10000000, 5000000, 2500000, 1250000, 625000,
312500, 156250. Possible values for freq are 0…65535.
AT:CLK=OFF
Turn off Clock Generator
Switch off the clock generator
AT:CLK?
Get Clock Generator
Return the settings of the clock generator. Two numbers are
returned, freq and reffreq.
AT:DAC=value
Set SD DAC
Output a SD DAC value on the pin(s) set to T mode. Parameter
value may be in the range −32768…32767. The average output
voltage is (1/2 + value / 217) × VDD.
An external low pass filter is needed to get smooth output voltages.
The modulation frequency is 20 MHz. A possible low pass filter
choice is a simple RC low pass filter with R = 10 kW and C = 1 mF.
AT:DAC=OFF
Turn off SD DAC
Switch off the DAC
AT:DAC?
Get SD DAC
Return the DAC value
www.onsemi.com
13
AX−SFJK, AX−SFJK−API
Table 10. COMMANDS (continued)
Command
Name
Description
AT$TM=mode,config
Activates the Sigfox Testmode
Available test modes:
0. TX BPSK
Send only BPSK with Synchro Bit + Synchro frame +
PN sequence: No hopping centered on the TX_frequency.
Config bits 0 to 6 define the number of repetitions. Setting config
bit 7 to 1 removes the delay between frames.
1. TX Protocol:
Tx mode with full protocol with Sigfox key: Send Sigfox protocol
frames with initiate downlink flag = True. Config defines the
number of repetitions.
2. RX Protocol:
This mode tests the complete downlink protocol in Downlink only.
Config defines the number of repetitions.
3. RX GFSK:
RX mode with known pattern with SB + SF + Pattern on
RX_frequency (internal comparison with received frame ⇔ known
pattern = AA AA B2 27 1F 20 41 84 32 68 C5 BA AE 79 E7 F6 DD
9B. Config defines the RX on time in seconds.
4. RX Sensitivity:
Does uplink + downlink frame with Sigfox key and specific timings.
This test is specific to SIGFOX’s test equipments & softwares.
5. TX Synthesis:
Does one uplink frame on each Sigfox channel to measure
frequency synthesis step
AT$SE
Starts AT$TM=3,255 indefinitely
Convenience command for sensitivity tests
AT$SL[=frame]
Send local loop
Sends a local loop frame with optional payload of 1 to 12 bytes.
Default payload: 0x84, 0x32, 0x68, 0xC5, 0xBA, 0x53, 0xAE, 0x79,
0xE7, 0xF6, 0xDD, 0x9B.
AT$RL
Receive local loop
Starts listening for a local loop.
Table 11. REGISTERS
Number
Name
300
Out Of Band
Period
400
LBT Mask
410
Encryption Key
Configuration
800
LBT RSSI Offset
Description
AX−SFJK sends periodic static
messages to indicate that they are
alive. Set to 0 to disable.
LBT configurations to be used.
Default
Range
Units
24
0−24
hours
,0
Set to zero for normal operation. Set
to one for use with the SIGFOX
Network Emulator Kit (SNEK)
0
0−1
0: private key
1: public key
Shifts the carrier sense threshold.
Positive values result in a lower
threshold.
0
−128−127
dB
www.onsemi.com
14
AX−SFJK, AX−SFJK−API
APPLICATION INFORMATION
Typical Application Diagrams
Typical AX−SFJK / AX−SFJK−API Application Diagram
Figure 4. Typical Application Diagram
For detailed application configuration and BOM see the
AX−SFJK Application Note: Sigfox Compliant Reference
Design.
www.onsemi.com
15
AX−SFJK, AX−SFJK−API
QFN40 Soldering Profile
Preheat
Reflow
Cooling
tP
TP
Temperature
TL
tL
TsMAX
TsMIN
ts
25°C
T25°C to Peak
Time
Figure 5. QFN40 Soldering Profile
Table 12.
Profile Feature
Pb−Free Process
Average Ramp−Up Rate
3°C/s max.
Preheat Preheat
Temperature Min
TsMIN
150°C
Temperature Max
TsMAX
200°C
Time (TsMIN to TsMAX)
ts
60–180 sec
Time 25°C to Peak Temperature
T25°C to Peak
8 min max.
Liquidus Temperature
TL
217°C
Time over Liquidus Temperature
tL
60–150 s
Peak Temperature
tp
260°C
Time within 5°C of actual Peak Temperature
Tp
20–40 s
Reflow Phase
Cooling Phase
Ramp−down rate
6°C/s max.
1. All temperatures refer to the top side of the package, measured on the package body surface.
www.onsemi.com
16
AX−SFJK, AX−SFJK−API
QFN40 Recommended Pad Layout
1. PCB land and solder masking recommendations
are shown in Figure 6.
A = Clearance from PCB thermal pad to solder mask opening, 0.0635 mm minimum
B = Clearance from edge of PCB thermal pad to PCB land, 0.2 mm minimum
C = Clearance from PCB land edge to solder mask opening to be as tight as possible
to ensure that some solder mask remains between PCB pads.
D = PCB land length = QFN solder pad length + 0.1 mm
E = PCB land width = QFN solder pad width + 0.1 mm
Figure 6. PCB Land and Solder Mask Recommendations
3. For the PCB thermal pad, solder paste should be
printed on the PCB by designing a stencil with an
array of smaller openings that sum to 50% of the
QFN exposed pad area. Solder paste should be
applied through an array of squares (or circles) as
shown in Figure 7.
4. The aperture opening for the signal pads should be
between 50−80% of the QFN pad area as shown in
Figure 8.
5. Optionally, for better solder paste release, the
aperture walls should be trapezoidal and the
corners rounded.
6. The fine pitch of the IC leads requires accurate
alignment of the stencil and the printed circuit
board. The stencil and printed circuit assembly
should be aligned to within + 1 mil prior to
application of the solder paste.
7. No−clean flux is recommended since flux from
underneath the thermal pad will be difficult to
clean if water−soluble flux is used.
2. Thermal vias should be used on the PCB thermal
pad (middle ground pad) to improve thermal
conductivity from the device to a copper ground
plane area on the reverse side of the printed circuit
board. The number of vias depends on the package
thermal requirements, as determined by thermal
simulation or actual testing.
3. Increasing the number of vias through the printed
circuit board will improve the thermal
conductivity to the reverse side ground plane and
external heat sink. In general, adding more metal
through the PC board under the IC will improve
operational heat transfer, but will require careful
attention to uniform heating of the board during
assembly.
Assembly Process
Stencil Design & Solder Paste Application
1. Stainless steel stencils are recommended for solder
paste application.
2. A stencil thickness of 0.125 – 0.150 mm
(5 – 6 mils) is recommended for screening.
Figure 7. Solder Paste Application on Exposed Pad
www.onsemi.com
17
AX−SFJK, AX−SFJK−API
Minimum 50% coverage
62% coverage
Maximum 80% coverage
Figure 8. Solder Paste Application on Pins
Life Support Applications
and agree to fully indemnify ON Semiconductor for any
damages resulting from such improper use or sale.
This product is not designed for use in life support
appliances, devices, or in systems where malfunction of this
product can reasonably be expected to result in personal
injury. ON Semiconductor customers using or selling this
product for use in such applications do so at their own risk
Device Information
The following device information can be queried using
the AT−Commands AT$I=4, AT$I=5 for the APP version
and AT$I=2, AT$I=3 for the chip version.
Table 13. DEVICE VERSIONS
APP Version
Chip Version
Product
Part Number
[0]
[1]
[0]
[1]
AX−SFJK
AX−SFJK−1−01−XXXX1
0x01
0x01
0x8F
0x51
AX−SFJK−API
AX−SFJK−API−1−01−XXXX1
0x01
0x01
0x8F
0x51
1. TB05 for Reel 500, TX30 for Reel 3000 reel
Sigfox and Sigfox Ready are registered trademarks of Sigfox SARL.
www.onsemi.com
18
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN40 7x5, 0.5P
CASE 485EG
ISSUE B
1 40
SCALE 2:1
PIN ONE
REFERENCE
2X
ÉÉ
ÉÉ
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
0.15 C
2X
0.15 C
EXPOSED Cu
TOP VIEW
(A3)
DETAIL B
0.10 C
0.08 C
A1
C
D2
40X
9
SEATING
PLANE
L
40X
b
0.10 C A B
0.05 C
1
NOTE 3
29
40
e
e/2
BOTTOM VIEW
7.30
PACKAGE
OUTLINE
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
7.00 BSC
5.30
5.50
5.00 BSC
3.30
3.50
0.50 BSC
0.30
0.50
−−−
0.15
GENERIC
MARKING DIAGRAM*
XXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
RECOMMENDED
SOLDERING FOOTPRINT*
5.60
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
XXXXXXXXXXXX
XXXXXXXXXXXX
AWLYYWW
21
E2
MOLD CMPD
ALTERNATE
CONSTRUCTION
SIDE VIEW
DETAIL A
ÉÉ
ÉÉ
ÇÇ
DETAIL B
A
NOTE 4
L
L
A B
D
DATE 26 APR 2017
40X
0.60
1
3.60
5.30
40X
0.50
PITCH
0.32
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON04197G
QFN40 7X5, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
