BGM210P Wireless Gecko Bluetooth
Module Data Sheet
The BGM210P is a module designed and built to meet the performance, security, and reliability requirements of line-powered
IoT products for Bluetooth networks.
KEY FEATURES
Based on the EFR32BG21 SoC, it enables Bluetooth® Low Energy and Bluetooth Mesh
connectivity while delivering best-in-class RF range and performance, future-proof capability for feature and OTA firmware updates, state-of-the-art security, low active current
consumption, and a temperature rating suited for operation in demanding environmental
conditions.
• Bluetooth 5.1 and Bluetooth Mesh
connectivity
• Built-in antenna and RF pin
• +10 and +20 dBm TX power variants
• -97.0 dBm Bluetooth RX sensitivity at 1
Mbps
• 32-bit ARM Cortex-M33 core at 38.4 MHz
The BGM210P is a complete solution that comes with robust and fully-upgradeable software stacks, world-wide regulatory certifications, advanced development and debugging
tools, and support that will simplify and minimize the development cycle and deployment
of your end-product helping to accelerate its time-to-market.
• 1024/96 kB of Flash/RAM memory
The BGM210P is targeted for a broad range of applications, including:
• Smart home
• Connected lighting
• Building automation and security
• Factory automation
• -40 to +125 oC
Core / Memory
ARM CortexTM M33 processor
with DSP extensions,
FPU and TrustZone
ETM
Secure Debug
Crystal
Flash Program
Memory
Secure Boot
with RTSL
• Optimal set of MCU peripherals
• 20 GPIO pins
• 12.9 mm x 15.0 mm x 2.2 mm
Clock Management
HF Crystal
Oscillator
38.4
MHz
Extended
Unique Identifier
EM2 HF RC
Oscillator
LDMA
Controller
LF Crystal
Oscillator
RAM Memory
• Secure Element or Secure Vault
HF
RC Oscillator
Energy
Management
Fast Startup
RC Oscillator
LF
RC Oscillator
Crypto Acceleration
Voltage
Regulator
Brown-Out
Detector
Ultra LF RC
Oscillator
Security
TRNG
DPA Countermeasures
Power-On
Reset
Secure Debug
Authentication
Anti-Tamper
32-bit bus
Peripheral Reflex System
Antenna
Radio Transceiver
Matching
FRC
LNA
I
Q
PGA
IFADC
BUFC
DEMOD
RF Frontend
Chip
Antenna
Serial
Interfaces
Timers and Triggers
Analog I/F
USART
External
Interrupts
Timer/Counter
Protocol Timer
ADC
I2C
General
Purpose I/O
Low Energy
Timer
Watchdog
Timer
Analog
Comparator
PA
RAC
Frequency
Synth
PA
CRC
AGC
RF Pin
I/O Ports
MOD
Pin Reset
Real Time
Capture Counter
Pin Wakeup
Back-Up Real
Time Counter
Lowest power mode with peripheral operational:
EM0—Active
EM1—Sleep
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EM2—Deep Sleep
EM3—Stop
EM4—Shutoff
Rev. 1.1
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Features
1. Features
• Supported Protocols
• Bluetooth 5.1
• Bluetooth Low Energy
• Bluetooth Mesh
• AoA/AoD
• Wireless System-on-Chip
• 2.4 GHz radio
• TX power up to +20 dBm
• High-performance 32-bit ARM Cortex-M33® with DSP instruction and floating-point unit for efficient signal processing
• 1024 kB flash program memory
• 96 kB RAM data memory
• Embedded Trace Macrocell (ETM) for advanced debugging
• Receiver Performance
• -104.5 dBm sensitivity (0.1% BER) at 125 kbps GFSK
• -100.1 dBm sensitivity (0.1% BER) at 500 kbps GFSK
• -97.0 dBm sensitivity (0.1% BER) at 1 Mbps GFSK
• -94.1 dBm sensitivity (0.1% BER) at 2 Mbps GFSK
• Current Consumption
• 9.3 mA RX current at 1 Mbps GFSK
• 16.1 mA TX current at 0 dBm (BGM210Px22)
• 34.1 mA TX current at 10 dBm (BGM210Px22)
• 173 mA TX current at 20 dBm (BGM210Px32)
• 50.9µA/MHz in Active Mode (EM0)
• 5.1μA EM2 DeepSleep current (RTCC running from LFXO,
Bluetooth Stack not running)
• 8.5μA EM2 DeepSleep current (RTCC running from LFXO,
Bluetooth Stack running)
• Regulatory Certifications
• CE
• ISED
• FCC
• South Korea
• Japan
• Operating Range
• 1.71 to 3.8 V
• -40 to +125 °C
• Dimensions
• 12.9 mm x 15.0 mm x 2.2 mm
• Security2
• Secure Boot with Root of Trust and Secure Loader (RTSL)1
• Hardware Cryptographic Acceleration for AES128/192/256,
ChaCha20-Poly1305, SHA-1, SHA-2/256/384/512, ECDSA
+ECDH (P-192, P-256, P-384, P-521), Ed25519 and
Curve25519, J-PAKE, PBKDF2
• True Random Number Generator (TRNG) compliant with
NIST SP800-90 and AIS-31
• ARM® TrustZone®
• Secure Debug Interface lock/unlock
• DPA Countermeasures1
• Secure Key Management with PUF
• Anti-Tamper
• Secure Attestation
• MCU Peripherals
• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
• 2 × Analog Comparator (ACMP)
• 20 General Purpose I/O pins with output state retention and
asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 3 × 16-bit Timer/Counter
(3 Compare/Capture/PWM channels)
• 1 × 32-bit Timer/Counter
(3 Compare/Capture/PWM channels)
• 32-bit Real Time Counter
• 24-bit Low Energy Timer for waveform generation
• 2 × Watchdog Timer
• 3 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
• 2 × I2C interface with SMBus support
1. With Secure Element (SE) firmware v1.1.2 or newer
2. See Table 3.2 Security Features and Levels on page 7 for details on security level differences between BGM210PB and
BGM210PA part numbers.
silabs.com | Building a more connected world.
Rev. 1.1 | 2
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Ordering Information
2. Ordering Information
Table 2.1. Ordering Information
Flash
(kB)
RAM
(kB)
Built-in
and RF
pin
1024
96
20
-40 to 125 °C
Cut Tape
Secure Element
Built-in
and RF
pin
1024
96
20
-40 to 125 °C
Reel
20 dBm
Secure Element
Built-in
and RF
pin
1024
96
20
-40 to 125 °C
Cut Tape
Bluetooth 5.1
20 dBm
Secure Element
Built-in
and RF
pin
1024
96
20
-40 to 125 °C
Reel
BGM210PB22JIA2
Bluetooth 5.1
10 dBm
Secure
Vault
Built-in
and RF
pin
1024
96
20
-40 to 125 °C
Cut Tape
BGM210PB22JIA2R
Bluetooth 5.1
10 dBm
Secure
Vault
Built-in
and RF
pin
1024
96
20
-40 to 125 °C
Reel
BGM210PB32JIA2
Bluetooth 5.1
20 dBm
Secure
Vault
Built-in
and RF
pin
1024
96
20
-40 to 125 °C
Cut Tape
BGM210PB32JIA2R
Bluetooth 5.1
20 dBm
Secure
Vault
Built-in
and RF
pin
1024
96
20
-40 to 125 °C
Reel
TX Power
Security
Level
Ordering Code
Protocol Stack
BGM210PA22JIA2
Bluetooth 5.1
10 dBm
Secure Element
BGM210PA22JIA2R
Bluetooth 5.1
10 dBm
BGM210PA32JIA2
Bluetooth 5.1
BGM210PA32JIA2R
Antenna
GPIO Temp Range Packaging
All BGM210P devices operate in the 2.4 GHz ISM frequency band.
Refer to 4.5 RF Transmitter General Characteristics for maximum TX power figures.
End-product manufacturers must verify that the module is configured to comply with the proper regulatory limits for each region, in accordance with the formal certification test reports for the device.
BGM210P modules are pre-programmed with BGAPI UART DFU bootloader.
Devices may be referred to by their product family name (BGM210P), model name (BGM210P22A / BGM210P32A) or full ordering
code throughout this document.
The SLWSTK6102A Wireless Gecko Module Starter Kit is available for BGM210P evaluation and development, as well as the
SLWRB4308A (+20 dBm TX, Secure Element), SLWRB4308B (+10 dBm TX, Secure Element), SLWRB4308C (+20 dBm TX, Secure
Vault) and SLWRB4308D (+10 dBm TX, Secure Vault) radio boards.
silabs.com | Building a more connected world.
Rev. 1.1 | 3
Table of Contents
1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 Block Diagram .
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. 6
3.2 EFR32BG21 SoC .
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3.3 Antenna .
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. 6
3.4 Power Supply .
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. 7
3.5 Security . . . . . . . . . . . . . . . . . . .
3.5.1 Secure Boot with Root of Trust and Secure Loader (RTSL)
3.5.2 Cryptographic Accelerator. . . . . . . . . . . .
3.5.3 True Random Number Generator . . . . . . . . .
3.5.4 Secure Debug with Lock/Unlock. . . . . . . . . .
3.5.5 DPA Countermeasures. . . . . . . . . . . . .
3.5.6 Secure Key Management with PUF . . . . . . . .
3.5.7 Anti-Tamper . . . . . . . . . . . . . . . .
3.5.8 Secure Attestation . . . . . . . . . . . . . .
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4. Electrical Specifications
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4.1 Absolute Maximum Ratings.
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.10
4.2 General Operating Conditions .
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.11
4.3 MCU Current Consumption at 3.0V .
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.12
4.4 Radio Current Consumption at 3.0V .
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.13
4.5 RF Transmitter General Characteristics
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.14
4.6 RF Receiver General Characteristics
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.15
4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps .
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.16
4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps .
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.17
4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps .
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.18
4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps .
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.19
4.11 High-Frequency Crystal
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.20
4.12 GPIO Pins .
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.21
4.13 Microcontroller Peripherals
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.22
4.14 Typical Performance Curves . . . .
4.14.1 Antenna Radiation and Efficiency .
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.22
.23
5. Reference Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . .
24
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5.1 Network Co-Processor (NCP) Application with UART Host .
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.24
5.2 SoC Application
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.25
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6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.1 Module Pinout .
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silabs.com | Building a more connected world.
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.26
Rev. 1.1 | 4
6.2 Alternate Pin Functions .
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.27
6.3 Analog Peripheral Connectivity
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.27
6.4 Digital Peripheral Connectivity .
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.28
7. Design Guidelines
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7.1 Layout and Placement .
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.31
7.2 Proximity to Other Materials
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.33
7.3 Proximity to Human Body .
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.33
7.4 Reset .
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.33
7.5 Debug .
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.33
7.6 Packet Trace Interface (PTI) .
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.34
8. Package Specifications
8.1 Package Outline
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.35
8.2 PCB Land Pattern .
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.36
8.3 Package Marking .
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.37
9. Soldering Recommendations
10. Tape and Reel
. . . . . . . . . . . . . . . . . . . . . . . . 38
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
10.1 Tape and Reel
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.39
10.2 Moisture Sensitivity Level .
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.39
11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
11.1 Qualified Antennas .
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.40
11.2 CE
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.40
11.3 FCC .
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.40
11.4 ISED Canada .
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.43
11.5 Japan
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.45
11.6 KC South Korea .
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.46
11.7 Proximity to Human Body .
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.46
11.8 Bluetooth Qualification .
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.46
12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
47
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silabs.com | Building a more connected world.
.
Rev. 1.1 | 5
BGM210P Wireless Gecko Bluetooth Module Data Sheet
System Overview
3. System Overview
3.1 Block Diagram
The BGM210P module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4 GHz
wireless connectivity and support robust networking capabilities via multiple protocols.
Built around the EFR32BG21 Wireless Gecko SoC, the BGM210P includes, both, a built-in antenna and a 50 Ω-matched RF pin, RF
matching networks (optimized for transmit power efficiency), supply decoupling and filtering components, a 38.4 MHz reference crystal,
and an RF shield. Also, it allows using an external 32 kHz crystal as a low frequency reference signal via GPIO pins.
Since the RF matching networks are optimized for transmit power efficiency, modules rated for +20 dBm will show non-optimal current
consumption and performance when operated at a lower output power (e.g. +10 or 0 dBm). The same applies for modules rated for +10
dBm.
VDD
Supply Decoupling
Antenna
IOVDD
RF Match
RFPIN
Silicon Labs
EFR32BG21
RF Match
HF XTAL
(up to 20)
External LF XTAL option
RF SHIELD
GPIO
GND
Figure 3.1. BGM210P Block Diagram
3.2 EFR32BG21 SoC
The EFR32BG21 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1 MB of Flash memory, a dedicated
core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG21
Wireless Gecko Reference Manual and the EFR32BG21 Data Sheet for details.
3.3 Antenna
BGM210P modules include a built-in antenna with the characteristics detailed in the table below. They also include a 50 Ω-matched RF
pin to enable the use of an external antenna instead of the one built-in. See Section 4.14.1 Antenna Radiation and Efficiency and Section 11.1 Qualified Antennas for other relevant details. Antenna diversity is not supported.
Table 3.1. Antenna Efficiency and Peak Gain
Parameter
With optimal layout Note
Efficiency
-1 to -2 dB
Peak gain
1.86 dBi
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Antenna efficiency, gain and radiation pattern are highly dependent on the application PCB layout and mechanical design. Refer
to the Design Guidelines for recommendations to achieve optimal
antenna performance.
Rev. 1.1 | 6
BGM210P Wireless Gecko Bluetooth Module Data Sheet
System Overview
3.4 Power Supply
The BGM210P requires a single nominal supply level of 3.0 V to operate. However, it can support use cases needing different levels for
the main supply (VDD) and for digital IO (IOVDD).
The DECOUPLE pin exposes the SoC's on-chip digital supply regulator output and allows introducing an external digital supply source
via a PMIC, for example. The default recommendation is to leave the DECOUPLE pin disconnected.
All necessary components for supply decoupling and filtering are included in the module.
3.5 Security
BGM210P modules support one of two levels in the Security Portfolio offered by Silicon Labs: Secure Vault or Secure Element.
Secure Vault is a collection of technologies that deliver state-of-the-art security and upgradability features to protect and future-proof
IoT devices against costly threats, attacks and tampering. Secure Element is the hardware-based subsystem at the core of Secure
Vault that enables a subset of its features only. BGM210PB part numbers support Secure Vault and BGM210PA part numbers support
Secure Element.
Table 3.2. Security Features and Levels
Feature
Secure Element
Secure Vault
Secure Boot with Root of Trust and Secure Loader (RTSL)
X
X
Cryptographic Accelerator
X
X
ARM TrustZone
X
X
True Random Number Generator (TRNG)
X
X
Secure Debug with Lock/Unlock
X
X
DPA Countermeasures
X
X
Secure Key Management with PUF
X
Anti-Tamper
X
Secure Attestation
X
3.5.1 Secure Boot with Root of Trust and Secure Loader (RTSL)
The Secure Boot with RTSL authenticates a chain of trusted firmware that begins from an immutable memory (ROM).
It prevents malware injection, prevents rollback, ensures that only authentic firmware is executed and protects Over The Air updates.
More information on this feature can be found in the Application Note AN1218: Series 2 Secure Boot with RTSL.
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Rev. 1.1 | 7
BGM210P Wireless Gecko Bluetooth Module Data Sheet
System Overview
3.5.2 Cryptographic Accelerator
The Cryptographic Accelerator is an autonomous hardware accelerator with Differential Power Analysis (DPA) countermeasures to protect keys.
It supports AES encryption and decryption with 128/192/256-bit keys, ChaCha20 encryption, and Elliptic Curve Cryptography (ECC) to
support public key operations and hashes.
Supported block cipher modes of operation for AES include:
• ECB (Electronic Code Book)
• CTR (Counter Mode)
• CBC (Cipher Block Chaining)
• CFB (Cipher Feedback)
• GCM (Galois Counter Mode)
• CCM (Counter with CBC-MAC)
• CBC-MAC (Cipher Block Chaining Message Authentication Code)
• GMAC (Galois Message Authentication Code)
The Cryptographic Accelerator accelerates Elliptical Curve Cryptography and supports the NIST (National Institute of Standards and
Technology) recommended curves including P-192, P-256, P-384, and P-521 for ECDH (Elliptic Curve Diffie-Hellman) key derivation
and ECDSA (Elliptic Curve Digital Signature Algorithm) sign and verify operations. Also supported is the non-NIST Curve25519 for
ECDH and Ed25519 for EdDSA (Edwards-curve Digital Signature Algorithm) sign and verify operations.
Secure Vault also supports ECJ-PAKE (Elliptic Curve variant of Password Authenticated Key Exchange by Juggling) and PBKDF2
(Password-Based Key Derivation Function 2).
Supported hashes include SHA-1, SHA-2/256/384/512 and Poly1305.
This implementation provides a fast and energy efficient solution to state of the art cryptographic needs.
3.5.3 True Random Number Generator
The True Random Number Generator module is a non-deterministic random number generator that harvests entropy from a thermal
energy source. It includes start-up health tests for the entropy source as required by NIST SP800-90B and AIS-31 as well as online
health tests required for NIST SP800-90C.
The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator.
3.5.4 Secure Debug with Lock/Unlock
For obvious security reasons, it is critical for a product to have its debug interface locked before being released in the field.
In addition, the Secure Vault also provides a secure debug unlock function that allows authenticated access based on public key cryptography. This functionality is particularly useful for supporting failure analysis while maintaining confidentiality of IP and sensitive enduser data.
More information on this feature can be found in the Application Note AN1190: Series 2 Secure Debug.
3.5.5 DPA Countermeasures
The AES and ECC accelerators have Differential Power Analysis (DPA) countermeasures support. This makes it very expensive from a
time and effort standpoint to use DPA to recover secret keys.
3.5.6 Secure Key Management with PUF
Key material in Secure Vault is protected by what is called "key wrapping" with a standardized symmetric encryption mechanism. This
method has the advantage of being able to protect a virtually unlimited number of keys, limited only by the storage that is accessible by
the M33 (which includes off-chip storage as well). The symmetric key used for this wrapping and unwrapping must be highly secure as
it can expose all other key material in the system. The Secure Vault Key Management system uses a Physically Unclonable Function
(PUF) to generate a persistent device-unique seed key on power up to dynamically generate this critical wrapping/unwrapping key
which is only visible by the AES encryption engine and is not retained when the device loses power.
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Rev. 1.1 | 8
BGM210P Wireless Gecko Bluetooth Module Data Sheet
System Overview
3.5.7 Anti-Tamper
There are internal tampers monitoring the system such as voltage, temperature, and electro-mechanical pulses as well as detecting
tamper of the security sub-system itself. There are also 8 external configurable tamper pins for supporting external tamper sources like
case tamper switches.
For each tamper event, the user is able to select the severity of the tamper response ranging from an interrupt, to a reset, to destroying
the PUF reconstruction data which will make all the protected key material un-recoverable and effectively render the device inoperable.
The tamper system also has an internal resettable event counter with programmable trigger threshold and refresh periods to mitigate
false positive tamper events.
3.5.8 Secure Attestation
Secure Attestation begins with a secure identity that is created during the Silicon Labs manufacturing process. During device production, each device generates its own public/private keypair and securely stores the wrapped private key into immutable OTP memory,
and this key never leaves the device. The corresponding public key is extracted from the device and inserted into a binary DER-encoded X.509 device certificate which is signed into a Silicon Labs CA chain and then programmed back into the chip into an immutable
OTP memory.
This secure identity can be used to authenticate the chip at any time in the life of the product. The production certification chain can be
requested remotely from the product. This certification chain can be used to verify that the device was authentically produced by Silicon
Labs. The device unique public key is also bound to the device certificate in the certification chain. A challenge can be sent to the chip
at any point in time to be signed by the device private key. The public key in the device certificate can then be used to verify the challenge response, proving that the device has access to the securely-stored private key, which prevents counterfeit products or impersonation attacks.
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Rev. 1.1 | 9
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4. Electrical Specifications
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on TA=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization.
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
4.1 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter
Symbol
Storage temperature range
Test Condition
Min
Typ
Max
Unit
TSTG
-50
—
+150
°C
Voltage on any supply pin
VDDMAX
-0.3
—
3.8
V
Voltage ramp rate on VDD
supply pin
VDDRAMPMAX
—
—
1.0
V / µs
DC voltage on any GPIO pin
VDIGPIN
-0.3
—
VIOVDD +
0.3
V
Total current into VDD power IVDDMAX
lines
Source
—
—
200
mA
Total current into GND pin
IGNDMAX
Sink
—
—
200
mA
Current per I/O pin
IIOMAX
Sink
—
—
50
mA
Source
—
—
50
mA
Sink
—
—
200
mA
Source
—
—
200
mA
Current for all I/O pins
IIOALLMAX
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Rev. 1.1 | 10
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.2 General Operating Conditions
This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum
values of all other tables are specifed over this operating range, unless otherwise noted.
Table 4.2. General Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Operating ambient temperature range
TA
-I temperature grade
-40
—
+125
°C
VDD Supply Voltage
VDD
1.71
3.0
3.8
V
1.71
3.0
3.8
V
MODE = WS1, RAMWSEN = 11
—
—
80
MHz
MODE = WS1, RAMWSEN = 01
—
—
50
MHz
MODE = WS0, RAMWSEN = 01
—
—
39
MHz
IOVDD operating supply volt- VIOVDD
age (All IOVDD pins)
HCLK and Core frequency
fHCLK
PCLK frequency
fPCLK
—
—
50
MHz
EM01 Group A clock frequency
fEM01GRPACLK
—
—
80
MHz
HCLK Radio frequency
fHCLKRADIO
38
38.4
40
MHz
Note:
1. Flash wait states are set by the MODE field in the MSC_READCTRL register. RAM wait states are enabled by setting the RAMWSEN bit in the SYSYCFG_DMEM0RAMCTRL register.
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Rev. 1.1 | 11
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.3 MCU Current Consumption at 3.0V
Unless otherwise indicated, typical conditions are: VDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the
worst conditions across process variation at TA = 25 °C.
Table 4.3. MCU Current Consumption at 3.0V
Parameter
Symbol
Min
Typ
Max
Unit
80 MHz HFRCO, CPU running
Prime from flash
—
50.9
—
µA/MHz
80 MHz HFRCO, CPU running
while loop from flash
—
45.6
55.5
µA/MHz
80 MHz HFRCO, CPU running
CoreMark loop from flash
—
59.8
—
µA/MHz
38.4 MHz crystal, CPU running
while loop from flash
—
63.8
—
µA/MHz
Current consumption in EM1 IEM1
mode with all peripherals disabled1
80 MHz HFRCO
—
28.7
37.6
µA/MHz
38.4 MHz crystal
—
46.9
—
µA/MHz
Current consumption in EM2 IEM2
mode
Full RAM retention and RTC running from LFXO (Bluetooth Stack
not running)
—
5.1
—
µA
Full RAM retention, RTCC running, and Bluetooth Stack running
from LFXO
—
8.5
—
µA
1 bank (16 kB) RAM retention and
RTC running from LFRCO
—
4.5
10.5
µA
Full RAM retention and RTC running from ULFRCO
—
4.8
11.4
µA
1 bank (16 kB) RAM retention and
RTC running from ULFRCO
—
4.3
—
µA
Current consumption in EM4 IEM4
mode
No BURTC, no LF oscillator
—
0.21
0.5
µA
Current consumption during
reset
IRST
Hard pin reset held
—
146
—
µA
Current consumption per retained 16kB RAM bank in
EM2
IRAM
—
0.10
—
µA
Current consumption in EM0 IACTIVE
mode with all peripherals disabled1
Current consumption in EM3 IEM3
mode
Test Condition
Note:
1. The typical EM0/EM1 current measurement includes some current consumed by the security core for periodical housekeeping
purposes. This does not include current consumed by user-triggered security operations, such as cryptographic calculations.
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Rev. 1.1 | 12
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.4 Radio Current Consumption at 3.0V
RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = 3.0V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across
process variation at TA = 25 °C.
Table 4.4. Radio Current Consumption at 3.0V
Parameter
Symbol
Test Condition
Current consumption in receive mode, active packet
reception
IRX_ACTIVE
Current consumption in receive mode, Stack running
Current consumption in
transmit mode
IRX_LISTEN
ITX
Min
Typ
Max
Unit
125 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
9.3
—
mA
500 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
9.3
—
mA
1 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
9.3
—
mA
2 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
9.9
—
mA
125 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
9.1
—
mA
500 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
9.1
—
mA
1 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
9.1
—
mA
2 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooh stack running
—
9.8
—
mA
f = 2.4 GHz, CW, 10 dBm Module,
0 dBm output power
—
16.1
—
mA
f = 2.4 GHz, CW, 10 dBm Module,
10 dBm output power
—
34.1
—
mA
f = 2.4 GHz, CW, 20 dBm Module,
10 dBm output power, VDD = 3.0
V
—
59.7
—
mA
f = 2.4 GHz, CW, 20 dBm Module,
POUT =19.2 dBm, VDD = 3.3 V 1
—
173
—
mA
Note:
1. The maximum power for Bluetooth Low-Energy is limited to 19.2 dBm.
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Rev. 1.1 | 13
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.5 RF Transmitter General Characteristics
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on
RF2G4_IO2 port.
Table 4.5. RF Transmitter General Characteristics
Parameter
Symbol
RF tuning frequency range
FRANGE
Maximum TX output power 1 POUTMAX
Minimum active TX Power
Output power step size
Output power variation vs
VDD supply voltage, Freq =
2450MHz
Output power variation vs
temperature, Freq =
2450MHz
POUTMIN
POUTSTEP
POUTVAR_V
POUTVAR_T
Output power variation vs RF POUTVAR_F
frequency
Test Condition
Min
Typ
Max
Unit
2400
—
2483.5
MHz
20 dBm Module, BLE, VDD =
3.3V2
—
19.2
—
dBm
10 dBm Module
—
10
—
dBm
20 dBm Module, VDD = 3.3 V
—
-20.5
—
dBm
10 dBm Module
—
-19.3
—
dBm
10 dBm Module, -5 dBm < POUT <
0 dBm
—
1.5
—
dB
10 dBm Module, 0 dBm < POUT <
10 dBm
—
1.0
—
dB
20 dBm Module, 0 dBm < POUT <
5 dBm
—
0.7
—
dB
20 dBm Module, 5 dBm < POUT <
POUTMAX
—
0.5
—
dB
20 dBm Module, POUT =
POUTMAX VDD swept from 3.0V
to 3.8V.
—
1.0
—
dB
10 dBm Module, POUT =
POUTMAX VDD swept from 1.8V
to 3.0V.
—
0.2
—
dB
20 dBm Module, POUT =
POUTMAX, VDD = 3.3V, temperature swept from -40 to +125 °C.
—
1.5
—
dB
10 dBm Module, POUT =
POUTMAX, VDD = 3.0V, temperature swept from -40 to +125 °C.
—
0.3
—
dB
20 dBm Module, POUT =
POUTMAX, VDD = 3.3V, Freq.
swept from 2400 to 2483.5 MHz
—
0.2
—
dB
10 dBm Module, POUT =
POUTMAX, VDD = 3.0V, Freq.
swept from 2400 to 2483.5 MHz
—
0.2
—
dB
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices covered in this data sheet can be found in the TX Power column of the Ordering Information Table.
2. The maximum power for Bluetooth Low-Energy.
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Rev. 1.1 | 14
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.6 RF Receiver General Characteristics
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on
RF2G4_IO2 port.
Table 4.6. RF Receiver General Characteristics
Parameter
Symbol
RF tuning frequency range
FRANGE
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Test Condition
Min
Typ
Max
Unit
2400
—
2483.5
MHz
Rev. 1.1 | 15
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2.
Table 4.7. RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal, packet
length is 37 bytes1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload1
—
-97.0
—
dBm
With non-ideal signals2 1
—
-96.7
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 3
—
+6.6
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 4 3 5
—
-8.3
—
dB
Interferer is reference signal at -1
MHz offset1 4 3 5
—
-8.7
—
dB
Interferer is reference signal at +2
MHz offset1 4 3 5
—
-42.1
—
dB
Interferer is reference signal at -2
MHz offset1 4 3 5
—
-48.9
—
dB
Interferer is reference signal at +3
MHz offset1 4 3 5
—
-42.4
—
dB
Interferer is reference signal at -3
MHz offset1 4 3 5
—
-54.8
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 5
—
-42.1
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 5
—
-42.4
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 5
—
-8.3
—
dB
n=36
—
-23
—
dBm
Intermodulation performance IM
Note:
1. 0.1% Bit Error Rate.
2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
3. Desired signal -67 dBm.
4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
5. With allowed exceptions.
6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4
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Rev. 1.1 | 16
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2.
Table 4.8. RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal, packet
length is 37 bytes1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload1
—
-94.1
—
dBm
With non-ideal signals2 1
—
-93.9
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 3
—
+6.0
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +2
MHz offset1 4 3 5
—
-8.0
—
dB
Interferer is reference signal at -2
MHz offset1 4 3 5
—
-8.8
—
dB
Interferer is reference signal at +4
MHz offset1 4 3 5
—
-42.2
—
dB
Interferer is reference signal at -4
MHz offset1 4 3 5
—
-50.3
—
dB
Interferer is reference signal at +6
MHz offset1 4 3 5
—
-54.4
—
dB
Interferer is reference signal at -6
MHz offset1 4 3 5
—
-55.4
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 5
—
-8.0
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +2 MHz with 1
MHz precision1 5
—
-42.2
—
dB
Interferer is reference signal at image frequency -2 MHz with 1 MHz
precision1 5
—
+6.0
—
dB
n = 36
—
-22.3
—
dBm
Intermodulation performance IM
Note:
1. 0.1% Bit Error Rate.
2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
3. Desired signal -67 dBm.
4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
5. With allowed exceptions.
6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4
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Rev. 1.1 | 17
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2.
Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal, packet
length is 37 bytes1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal1
—
-100.1
—
dBm
With non-ideal signals2 1
—
-99.3
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 3
—
+2.1
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 4 3 5
—
-9.0
—
dB
Interferer is reference signal at -1
MHz offset1 4 3 5
—
-9.5
—
dB
Interferer is reference signal at +2
MHz offset1 4 3 5
—
-44.4
—
dB
Interferer is reference signal at -2
MHz offset1 4 3 5
—
-51.9
—
dB
Interferer is reference signal at +3
MHz offset1 4 3 5
—
-44.3
—
dB
Interferer is reference signal at -3
MHz offset1 4 3 5
—
-58.3
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 5
—
-44.4
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 5
—
-44.3
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 5
—
-9.0
—
dB
Note:
1. 0.1% Bit Error Rate.
2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
3. Desired signal -72 dBm.
4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
5. With allowed exceptions.
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2.
Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal, packet
length is 37 bytes1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal1
—
-104.5
—
dBm
With non-ideal signals2 1
—
-104.2
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 3
—
+0.8
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 4 3 5
—
-13.1
—
dB
Interferer is reference signal at -1
MHz offset1 4 3 5
—
-13.6
—
dB
Interferer is reference signal at +2
MHz offset1 4 3 5
—
-49.5
—
dB
Interferer is reference signal at -2
MHz offset1 4 3 5
—
-56.9
—
dB
Interferer is reference signal at +3
MHz offset1 4 3 5
—
-47.0
—
dB
Interferer is reference signal at -3
MHz offset1 4 3 5
—
-63.1
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 5
—
-49.5
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 5
—
-47.0
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 5
—
-13.1
—
dB
Note:
1. 0.1% Bit Error Rate.
2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
3. Desired signal -79 dBm.
4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
5. With allowed exceptions.
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Rev. 1.1 | 19
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.11 High-Frequency Crystal
Table 4.11. High-Frequency Crystal
Parameter
Symbol
Crystal frequency
Min
Typ
Max
Unit
fHFXTAL
—
38.4
—
MHz
Initial calibrated accuracy
ACCHFXTAL
-10
—
+10
ppm
Temperature drift
DRIFTHFXTAL
-30
—
+30
ppm
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Test Condition
Across specified temperature
range
Rev. 1.1 | 20
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.12 GPIO Pins
Unless otherwise indicated, typical conditions are: VDD = IOVDD = 3.0 V.
Table 4.12. GPIO Pins
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Leakage current
ILEAK_IO
MODEx = DISABLED, IOVDD =
1.71V
—
1.9
—
nA
MODEx = DISABLED, IOVDD =
3.0 V
—
2.5
—
nA
MODEx = DISABLED, IOVDD =
3.8 V TA = 125 °C
—
—
200
nA
Input low voltage1
VIL
Any GPIO pin
—
—
0.3*IOVDD
V
Input high voltage1
VIH
Any GPIO pin
0.7*IOVDD
—
—
V
Output low voltage
VOL
Sinking 20mA, IOVDD = 3.0 V
—
—
0.2 *
IOVDD
V
Sinking 8mA, IOVDD = 1.62 V
—
—
0.4 *
IOVDD
V
Sourcing 20mA, IOVDD = 3.0 V
0.8 *
IOVDD
—
—
V
Sourcing 8mA, IOVDD = 1.62 V
0.6 *
IOVDD
—
—
V
IOVDD = 3.0V, Cload = 50pF,
SLEWRATE = 4, 10% to 90%
—
8.4
—
ns
IOVDD = 1.7V, Cload = 50pF,
SLEWRATE = 4, 10% to 90%
—
13
—
ns
IOVDD = 3.0V, Cload = 50pF,
SLEWRATE = 4, 90% to 10%
—
7.1
—
ns
IOVDD = 1.7V, Cload = 50pF,
SLEWRATE = 4, 90% to 10%
—
11.9
—
ns
pull-up: MODEn = DISABLE
DOUT=1, pull-down: MODEn =
WIREDORPULLDOWN DOUT =
0
35
44
55
kΩ
MODE = INPUT, DOUT = 1
—
26
—
ns
Output high voltage
GPIO rise time
GPIO fall time
Pull up/down resistance2
VOH
TGPIO_RISE
TGPIO_FALL
RPULL
Maximum filtered glitch width TGF
Note:
1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to VDD.
2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to VDD.
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.13 Microcontroller Peripherals
The MCU peripherals set available in BGM210P modules includes:
• 12-bit 1 Msps ADC
• Analog Comparators
• 16-bit and 32-bit Timers/Counters
• 24-bit Low Energy Timer for waveform generation
• 32-bit Real Time Counter
• USART (UART/SPI/SmartCards/IrDA/I2S)
• I2C peripheral interfaces
• 12 Channel Peripheral Reflex System
For details on their electrical performance, consult the relevant portions of Section 4 in the SoC's datasheet.
To learn which GPIO ports provide access to every peripheral, consult Section 6.3 Analog Peripheral Connectivity and 6.4 Digital Peripheral Connectivity.
4.14 Typical Performance Curves
Typical performance curves indicate typical characterized performance under the stated conditions.
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.14.1 Antenna Radiation and Efficiency
Typical BGM210P radiation patterns and efficiency for the on-board chip antenna under optimal operating conditions are plotted in the
figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the
module is mounted on, as well as on the proximity of any mechanical design to the antenna.
Figure 4.1. Typical 2D Antenna Radiation Patterns and Efficiency
Top Left: Phi 0o, Top Right: Phi 90o, Bottom Left: Theta 90o, Bottom Right: Radiation Efficiency vs Application Board GND Plane Width
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Reference Diagrams
5. Reference Diagrams
The interconnection labels in the following diagrams correspond to supported pin functions as described in Sections 7.5 Debug,
7.6 Packet Trace Interface (PTI) and 6.4 Digital Peripheral Connectivity.
5.1 Network Co-Processor (NCP) Application with UART Host
The BGM210P can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, refer to AN958: Debugging
and Programming Interfaces for Custom Designs. For an example of how to enable the virtual COM port (VCOM) when relevant, see
radio board user guides UG388 or UG389.
Figure 5.1. UART NCP Configuration
In systems where IOVDD is not equal to VDD, pin 1 of the mini simplicity debug connector should be connected to the IOVDD pin of the
BGM210P module, and the module should be powered through an external power supply.
If the host CPU is operated at a different voltage level than the BGM210P, then IOVDD and pin 1 of the mini simplicity debug connector
should be powered with the same voltage level as the host CPU or, else, an external voltage level shifter will be required.
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Reference Diagrams
5.2 SoC Application
The BGM210P can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Interfaces for Custom Designs. For an example of how to enable the virtual COM port (VCOM) when relevant, see radio board user guides
UG388 or UG389.
Figure 5.2. Stand-Alone SoC Configuration
Figure 5.3. Stand-Alone SoC Configuration with External Antenna
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
6. Pin Definitions
6.1 Module Pinout
Pin 1 Index
6
26
PC05
PA03
7
25
PC04
PA04
8
24
PC03
PA05
9
23
PC02
PA06
10
22
PC01
DECOUPLE
11
21
PC00
GND
12
20
GND
19
RESETn
PA02
18
27
PD00
5
17
GND
PA01
PD01
28
16
4
PD02
RF2G4_IO2
PA00
15
29
PD03
3
14
GND
PB00
PD04
GND
30
13
31
2
VDD
1
IOVDD
GND
PB01
Figure 6.1. BGM210P Module Pinout
The next table shows the BGM210P pinout and general descriptions for each pin. Refer to Sections 6.2 Alternate Pin Functions,
6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity for details on functions and peripherals supported by GPIOs.
Table 6.1. BGM210P Module Pin Definitions
Pin Name
No.
Description
Pin Name
No.
Description
GND
1
Ground
PB01
2
GPIO
PB00
3
GPIO
PA00
4
GPIO
PA01
5
GPIO
PA02
6
GPIO
PA03
7
GPIO
PA04
8
GPIO
PA05
9
GPIO
PA06
10
GPIO
DECOUPLE
11
Decouple output for on-chip voltage
regulator. Do Not Connect 3.
GND
12
Ground
VDD
13
Power supply
IOVDD
14
Digital IO power supply
PD04
15
GPIO
PD03
16
GPIO
PD02
17
GPIO
PD01
18
GPIO
PD00
19
GPIO
GND
20
Ground
PC00
21
GPIO
PC01
22
GPIO
PC02
23
GPIO
PC03
24
GPIO
PC04
25
GPIO
PC05
26
GPIO
RESETn
27
Reset Pin1
GND
28
Ground
RF2G4_IO2
29
2.4 GHz RF input/output2
GND
30
Ground
GND
31
Ground
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
Pin Name
No.
Description
Pin Name
No.
Description
Note:
1. Connected to pull-up resistor to VDD internally. External pull-up is not required.
2. 50 Ohm-matched RF pin for external antenna support. Connect to GND when not used.
3. The DECOUPLE pin exposes the SoC's on-chip digital supply regulator output and allows introducing an external digital supply
source via a PMIC, for example. The default recommendation is to leave the DECOUPLE pin disconnected.
6.2 Alternate Pin Functions
Some GPIOs support alternate functions like debugging, wake-up from EM4, external low frequency crystal access, etc.. The following
table shows which module pins have alternate capabilities and the functions they support. Refer to the SoC's reference manual for
more information.
Table 6.2. GPIO Alternate Functions Table
GPIO
Alternate Function
PB01
GPIO.EM4WU3
PA01
GPIO.SWCLK
PA02
GPIO.SWDIO
PA03
GPIO.SWV
GPIO.TDO
PA04
GPIO.TDI
GPIO.TRACECLK
PA05
GPIO.EM4WU0
PD02
GPIO.EM4WU9
PD01
LFXO.LFXTAL_I
PD00
LFXO.LFXTAL_O
PC00
GPIO.EM4WU6
PC05
GPIO.EM4WU7
GPIO.TRACEDATA0
LFXO.LF_EXTCLK
6.3 Analog Peripheral Connectivity
Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative
inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the
SoC's Reference Manual for more details on the ABUS and analog peripherals.
Table 6.3. ABUS Routing Table
Peripheral
ACMP0
ACMP1
IADC0
Signal
PA
PB
PC
PD
EVEN
ODD
EVEN
ODD
EVEN
ODD
EVEN
ODD
ana_neg
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
ana_pos
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
ana_neg
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
ana_pos
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
ana_neg
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
ana_pos
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
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Rev. 1.1 | 27
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
6.4 Digital Peripheral Connectivity
Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port.
Table 6.4. DBUS Routing Table
Peripheral.Resource
PORT
PA
PB
PC
PD
ACMP0.DIGOUT
Available
Available
Available
Available
ACMP1.DIGOUT
Available
Available
Available
Available
CMU.CLKIN0
Available
Available
CMU.CLKOUT0
Available
Available
CMU.CLKOUT1
Available
Available
FRC.DCLK
Available
Available
FRC.DFRAME
Available
Available
FRC.DOUT
Available
Available
CMU.CLKOUT2
Available
Available
I2C0.SCL
Available
Available
Available
Available
I2C0.SDA
Available
Available
Available
Available
I2C1.SCL
Available
Available
I2C1.SDA
Available
Available
PRS.ASYNCH10
Available
Available
PRS.ASYNCH11
Available
Available
PRS.ASYNCH6
Available
Available
PRS.ASYNCH7
Available
Available
PRS.ASYNCH8
Available
Available
PRS.ASYNCH9
Available
Available
LETIMER0.OUT0
Available
Available
LETIMER0.OUT1
Available
Available
PRS.ASYNCH0
Available
Available
PRS.ASYNCH1
Available
Available
PRS.ASYNCH2
Available
Available
PRS.ASYNCH3
Available
Available
PRS.ASYNCH4
Available
Available
PRS.ASYNCH5
Available
Available
PRS.SYNCH0
Available
Available
Available
Available
PRS.SYNCH1
Available
Available
Available
Available
PRS.SYNCH2
Available
Available
Available
Available
PRS.SYNCH3
Available
Available
Available
Available
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
Peripheral.Resource
PORT
PA
PB
PC
PD
TIMER0.CC0
Available
Available
Available
Available
TIMER0.CC1
Available
Available
Available
Available
TIMER0.CC2
Available
Available
Available
Available
TIMER0.CDTI0
Available
Available
Available
Available
TIMER0.CDTI1
Available
Available
Available
Available
TIMER0.CDTI2
Available
Available
Available
Available
TIMER1.CC0
Available
Available
Available
Available
TIMER1.CC1
Available
Available
Available
Available
TIMER1.CC2
Available
Available
Available
Available
TIMER1.CDTI0
Available
Available
Available
Available
TIMER1.CDTI1
Available
Available
Available
Available
TIMER1.CDTI2
Available
Available
Available
Available
TIMER2.CC0
Available
Available
TIMER2.CC1
Available
Available
TIMER2.CC2
Available
Available
TIMER2.CDTI0
Available
Available
TIMER2.CDTI1
Available
Available
TIMER2.CDTI2
Available
Available
TIMER3.CC0
Available
Available
TIMER3.CC1
Available
Available
TIMER3.CC2
Available
Available
TIMER3.CDTI0
Available
Available
TIMER3.CDTI1
Available
Available
TIMER3.CDTI2
Available
Available
USART0.CLK
Available
Available
Available
Available
USART0.CS
Available
Available
Available
Available
USART0.CTS
Available
Available
Available
Available
USART0.RTS
Available
Available
Available
Available
USART0.RX
Available
Available
Available
Available
USART0.TX
Available
Available
Available
Available
USART1.CLK
Available
Available
USART1.CS
Available
Available
USART1.CTS
Available
Available
USART1.RTS
Available
Available
USART1.RX
Available
Available
USART1.TX
Available
Available
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
Peripheral.Resource
PORT
PA
PC
PD
USART2.CLK
Available
Available
USART2.CS
Available
Available
USART2.CTS
Available
Available
USART2.RTS
Available
Available
USART2.RX
Available
Available
USART2.TX
Available
Available
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PB
Rev. 1.1 | 30
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Design Guidelines
7. Design Guidelines
7.1 Layout and Placement
For optimal performance of the BGM210P,
• Place the module aligned to the edge of the application PCB, as illustrated in the figures below.
• Leave the antenna clearance area void of any traces, components, or copper on all layers of the application PCB if you are going to
use the on-board chip antenna
• Antenna clearance area is not necessary if you are using an external antenna attached to the RF pin.
• For external antenna use cases, use a 50 Ω grounded coplanar transmission line to trace the signal from the RF pin to an external RF connector if applicable (see Figure 7.2 Recommended Layout for BGM210P Using External Antenna on page 32).
• A general rule is to use 50 Ω transmission lines where the length of the RF trace is longer than λ/16 at the fundamental frequency, which for 2.4 GHz is approximately 7.8 mm.
• A U.FL connector can be used in the host PCB for the connection to an external antenna. The use of a U.FL connector is also
recommended for conductive tests. The integrator must use a unique connector, such as a “reverse polarity SMA” or “reverse
thread SMA”, if detachable antenna is offered with the host chassis. This is especially required for the FCC and ISED approvals
to remain valid, and any other kind of direct connector to the antenna might require a permissive change.
• A trace length of 2.6 mm was used in the certifications host board to connect the module RF pin to the U.FL connector.
• For reference, Figure 7.4 RF Trace Design Example on page 33 shows a set of parameters for a 50 Ω trace. Trace impedance
should always be matched to the particular stack-up used on the host board.
• Connect all ground pads directly to a solid ground plane.
• Place the ground vias as close to the ground pads as possible.
• Do not place plastic or any other dielectric material in contact with the antenna.
Align module edge with PCB edge
GND
Place vias close to
each of the
module’s GND pads
Antenna Clearance
No metal in this area
GND
GND
GND
Wireless Module
(Top View)
GND
GND
Place vias along all PCB edges
Figure 7.1. Recommended Layout for BGM210P Using On-Board Chip Antenna
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Design Guidelines
Align module edge with PCB edge (optional, not mandatory)
GND
GND
GND
U.FL
connector
for external
antenna
RF2G4_IO2
Place vias close to
each of the
module’s GND pads
GND
50 Ohm
trace
for RF signal
Wireless Module
(Top View)
GND
GND
Place vias along all PCB edges
Figure 7.2. Recommended Layout for BGM210P Using External Antenna
The figure below illustrates layout scenarios to avoid that will lead to severely degraded RF performance for modules that use the onboard chip antenna. This recommendation is not applicable to design cases using an external antenna.
Copper
Clearance
Area
GND plane width
X
Figure 7.3. Non-Optimal Layout Examples
The width of the application PCB's GND plane under the module will impact the efficiency of the on-board chip antenna. To achieve
optimal performance, a GND plane width of 50 mm is recommended. See Figure 4.1 Typical 2D Antenna Radiation Patterns and Efficiency on page 23 for reference.
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Design Guidelines
Figure 7.4. RF Trace Design Example
7.2 Proximity to Other Materials
Avoid placing plastic or any other dielectric material in close proximity to the antenna.
Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB
ground planes.
7.3 Proximity to Human Body
Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.
7.4 Reset
The BGM210P can be reset by pulling the RESET line low, by the internal watchdog timer, or by software command.
The reset state does not provide power saving functionality and it is not recommended as a means to conserve power.
7.5 Debug
See AN958: Debugging and Programming Interfaces for Custom Designs.
The BGM210P supports hardware debugging via 4-pin JTAG or 2-pin serial-wire debug (SWD) interfaces. It is recommended to expose
the debug pins in your own hardware design for firmware update and debug purposes. The table below lists the required pins for JTAG
and SWD debug interfacing, which are also presented in Section 6.2 Alternate Pin Functions.
If JTAG interfacing is enabled, the module must be power cycled to return to a SWD debug configuration if necessary.
Table 7.1. Debug Pins
Pin Name
Pin Number
JTAG Signal
SWD Signal
PA04
4
TDI
N/A
This pin is disabled after reset. Once enabled the pin
has a built-in pull-up.
PA03
3
TDO
N/A
This pin is disabled after reset.
PA02
2
TMS
SWDIO
Pin is enabled after reset and has a built-in pull-up.
PA01
1
TCK
SWCLK
Pin is enabled after reset and has a built-in pull-down.
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Comments
Rev. 1.1 | 33
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Design Guidelines
7.6 Packet Trace Interface (PTI)
The BGM210P integrates a true PHY-level packet trace interface (PTI) peripheral that can capture packets non-intrusively to monitor
and log device and network traffic without burdening processing resources in the module's SoC. The PTI generates two output signals
that can serve as a powerful debugging tool, especially in conjunction with other hardware and software development tools available
from Silicon Labs. The PTI_DATA and PTI_FRAME signals can be accessed through any GPIO on ports C and D (see FRC.DOUT and
FRC.DFRAME peripheral resources in Table 6.4 DBUS Routing Table on page 28).
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Rev. 1.1 | 34
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Package Specifications
8. Package Specifications
8.1 Package Outline
Figure 8.1. Top and Side Views
Figure 8.2. Bottom View
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Package Specifications
8.2 PCB Land Pattern
Figure 8.3. Recommended Land Pattern for Built-in Antenna Use Case
Figure 8.4. Recommended Land Pattern for RF Pin Use Case
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Package Specifications
8.3 Package Marking
The figure below shows the module markings engraved on the RF shield.
Figure 8.5. BGM210P Top Marking
Mark Description
The package marking consists of:
• BGM210Pxxxxxxx - Part number designation
• Model: BGM210Pxxx - Model number designation
• QR Code: YYWWMMABCDE
• YY – Last two digits of the assembly year
• WW – Two-digit workweek when the device was assembled
• MMABCDE – Silicon Labs unit code
• YYWWTTTTTT
• YY – Last two digits of the assembly year
• WW – Two-digit workweek when the device was assembled
• TTTTTT – Manufacturing trace code. The first letter is the device revision
• Certification marks such as the CE logo, FCC and IC IDs, etc will be engraved on the grayed out area, according to regulatory body
requirements
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Rev. 1.1 | 37
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Soldering Recommendations
9. Soldering Recommendations
It is recommended that final PCB assembly of the BGM210P follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface
mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements.
CLASS 1 General Electronic Products
Includes products suitable for applications where the major requirement is function of the completed assembly.
CLASS 2 Dedicated Service Electronic Products
Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not
critical. Typically the end-use environment would not cause failures.
CLASS 3 High Performance/Harsh Environment Electronic Products
Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated,
end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical
systems.
Note: General SMT application notes are provided in the AN1223 document.
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Tape and Reel
10. Tape and Reel
10.1 Tape and Reel
BGM210P modules are delivered to the customer in cut tape (100 pcs) or reel (1000 pcs) packing with the dimensions below. All dimensions are given in mm unless otherwise indicated. Pin 1 is found in Quadrant 1 (upper left side of carrier) with respect to the direction of feed indicated by the arrow in the figure.
Figure 10.1. Carrier Tape Dimensions
Figure 10.2. Reel Dimensions
10.2 Moisture Sensitivity Level
BGM210P modules are delivered in packing that conforms to moisture sensitivity level 3 (MSL3) requirements.
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BGM210P Wireless Gecko Bluetooth Module Data Sheet
Certifications
11. Certifications
This section details the regulatory certification status of the module in various regions.
The address for the module manufacturer and certification applicant is:
SILICON LABORATORIES FINLAND OY
Alberga Business Park, Bertel Jungin aukio 3,
02600 Espoo, Finland
11.1 Qualified Antennas
BGM210P modules have been tested and certified both with the built-in antenna and with an external antenna attached to the RF pin
(RF2G4_IO2). Performance characteristics for the built-in antenna are presented in Table 3.1 Antenna Efficiency and Peak Gain on
page 6 and Figure 4.1 Typical 2D Antenna Radiation Patterns and Efficiency on page 23. Details for the external antenna qualified are
summarized in the table below.
Table 11.1. Qualified External Antennas for BGM210P
Antenna Type
Maximum Gain
Impedance
Connectorized Coaxial Dipole
2.14 dBi
50 Ω
Any antenna of the same general type and of equal or less directional gain as listed in the above table can be used in the regulatory
areas that have a full modular radio approval (USA, Canada, Korea, Japan) as long as spot-check testing is performed to verify that no
performance changes compromising compliance have been introduced. In countries applying the ETSI standards, like the EU countries,
the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may
violate some of the regulatory limits.
If an antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) with a gain less than or equal to 2.14 dBi is
needed, it can be added as a permissive change, requiring some radiated emission testing. Antenna types with more gain than 2.14 dBi
may require a fully new certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult
your test house and/or certification body for understanding the correct approach. You might also want or need to get in touch with Silicon Labs for any authorization letter that your certification body might ask for.
11.2 CE
The BGM210P module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU). Please note that every application using the BGM210P will need to perform the radio EMC tests on the end
product, according to EN 301 489-17. It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product.
The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF
radiated testing with the end-product assembly. A formal Declaration of Conformity (DoC) is available via https://www.silabs.com/.
11.3 FCC
This device complies with Part 15 of the FCC Rules when operating with the embedded antenna or with the antenna type(s) listed in
Table 11.1. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets the Mobile requirements at a distance of 20 cm
and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. This transmitter also meets the
Portable requirements at distances equal or above 5.3 mm for the BGM210P22A and 44.0 mm for the BGM210P32A. These distances
are reported for convenience also in Table 11.2. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures.
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Rev. 1.1 | 40
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Certifications
OEM Responsibilities to comply with FCC Regulations
This module has been tested for compliance to FCC Part 15.
OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot
checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01.
• General Considerations
This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rule
requirements if applicable.
• Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module in
the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warnings as shown in this manual.
• OEM/Host Manufacturer Responsibilities
OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US
market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC
rules. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and
combined equipment.
Separation
• To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.2 must be maintained
between the human body and the radiator (antenna) at all times. In particular, the minimum distance must be 5.3 mm for the
BGM210P22A and 44.0 mm for the BGM210P32A.
• This transmitter module is tested in a standalone mobile RF exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the
exceptions rules to be applied, a separate additional SAR evaluation will be required, ultimately leading to a Class II Permissive
Change, or more rarely to a new grant.
• Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The evaluation (SAR) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with
the help of the customer's own Telecommunication Certification Body as the grant holder’s agent.
End Product Labeling
BGM210P modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device,
then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case,
the final end product must be labeled in a visible area with the following:
"Contains Transmitter Module FCC ID: QOQGM210P"
Or
"Contains FCC ID: QOQGM210P"
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for
testing their end-product for any additional compliance requirements required with this module installed.
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Rev. 1.1 | 41
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Certifications
Class B Device Notice
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment and receiver
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
• Consult the dealer or an experienced radio/TV technician for help
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Rev. 1.1 | 42
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Certifications
11.4 ISED Canada
ISED
This radio transmitter (IC: 5123A-GM210P) has been approved by Innovation, Science and Economic Development Canada (ISED
Canada, formerly Industry Canada) to operate with the embedded antenna and with the antenna type(s) listed in 11.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain
listed, are strictly prohibited for use with this device.
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:
1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device
RF Exposure Statement
Exception from routine SAR evaluation limits are given in RSS-102 Issue 5.
The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or
greater, in accordance to the limit(s) exposed in the RF Exposure Analysis.
For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal
or above 20 mm for the BGM210P22A and 40 mm for the BGM210P32A.
If the separation distance from the human body is less than the values stated above, which are also reported in Table 11.2 for convenience, the OEM integrator is responsible for evaluating the SAR.
OEM Responsibilities to comply with IC Regulations
The module has been certified for integration into products only by OEM integrators under the following conditions:
• The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate
the RF exposure in order for the ISED authorization to remain valid, and a permissive change will have to be applied with the help of
the customer's own Telecommunication Certification Body typically acting as the certificate holder’s agent.
End Product Labeling
The BGM210P module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the
final end product must be labeled in a visible area with the following:
“Contains Transmitter Module IC: 5123A-GM210P ”
or
“Contains IC: 5123A-GM210P”
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital
device emissions, PC peripheral requirements, etc.).
CAN ICES-003 (B)
This Class B digital apparatus complies with Canadian ICES-003.
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Rev. 1.1 | 43
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Certifications
ISED (Français)
Le présent émetteur radio (IC: 5123A-GM210P) a été approuvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la section 11.1 Qualified Antennas, avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil. .
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNRd’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exemptsde licence. L’exploitation est autorisée aux deux conditions suivantes:
1. L’appareil nedoit pas produire de brouillage;
2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptibled’en compromettre le fonctionnement.
Déclaration d'exposition RF
L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5.
Le module répond aux exigences pour les cas d'utilisation Mobile lorsque la distance minimale de séparation du corps humain est de
20 cm ou plus, conformément à la (aux) limite(s) exposée(s) dans l'analyse de l'exposition RF.
Pour les cas d'utilisation Portables, l'exposition aux fréquences radio ou l'évaluation du SAR n'est pas nécessaire lorsque les distances
de séparation du corps humain sont égales ou supérieures à 20 mm pour le BGM210P22A et à 40 mm pour le BGM210P32A.
Si la distance de séparation du corps humain est inférieure aux valeurs indiquées ci-dessus, également indiquées dans le tableau 11.2
pour des raisons de commodité, l'intégrateur OEM est responsable de l'évaluation du SAR.
Responsabilités du fabricant de se conformer à la réglementation IC
Le module a été certifié pour l'intégration dans les produits uniquement par les intégrateurs OEM dans les conditions suivantes:
• L'antenne doit être installée de manière à maintenir une distance de séparation minimale, comme indiqué ci-dessus, entre le radiateur (antenne) et toutes les personnes.
• Le module émetteur ne doit pas être localisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur.
Remarque Importante: Au cas où ces conditions ne pourraient pas être remplies, le produit final devra être soumis à des tests supplémentaires pour évaluer l'exposition RF, afin que l'autorisation ISED reste valable, et une modification permissive devra être appliquée à
l'aide de propre organisme de certification de télécommunication du client en général agissant en tant que titulaire du certificat mandataire.
Étiquetage des produits finis
Les modules BGM210P est étiqueté avec son propre ID de certification.Si l'ID de certification n'est pas visible lorsque le module est
installé dans un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette faisant
référence au module inclus. Dans ce cas, le produit final doit être étiqueté dans une zone visible avec les éléments suivants:
“Contient le module transmetteur IC: 5123A-GM210P ”
or
“Contient IC: 5123A-GM210P”
L’intégrateur OEM doit être conscient de ne pas fournir à l’utilisateur final d’informations sur la procédure d’installation ou de retrait de
ce module RF ni sur la modification des paramètres liés à la RF dans le manuel d’utilisation du produit final.
Tant que toutes les conditions ci-dessus sont remplies, aucun test supplémentaire de l'émetteur ne sera nécessaire. Toutefois, l’intégrateur OEM reste responsable de l’essai de son produit final pour déterminer les exigences de conformité supplémentaires requises
avec ce module installé (par exemple, émissions d’appareils numériques, exigences relatives aux périphériques PC, etc.)
CAN ICES-003 (B)
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
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Rev. 1.1 | 44
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Certifications
11.5 Japan
The BGM210P22A low power variants are certified in Japan with number 020-190254.
Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host
equipment places the certification mark and certification number on the outside of the host equipment. This combination of mark and
number, and their relative placement, is depicted in Figure 9.1, and depending on the size of the module it might also appear on the top
shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese
language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host
and radio module to verify if they are actually using a radio device which is approved for use in Japan.
Certification Text to be Placed on the Outside Surface of the Host Equipment:
Translation of the text:
“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under
the Radio Law.”
The "Giteki" marking shown in the following figures must be affixed to an easily noticeable section of the specified radio-enabled host
equipment. Note that such section may be required to contain additional information if the end-device embedding the module is also
subject to a telecom approval.
The manufacturer of the final product is also responsible to provide a Japanese language version of the User Manual and/or Installation
Instructions as a companion document coming with the final product when placed on the market in Japan.
Figure 11.1. GITEKI Mark and ID
Figure 11.2. Detail of GITEKI Mark
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Rev. 1.1 | 45
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Certifications
11.6 KC South Korea
The BGM210P22A low-power variants have a RF certification for import and use in South Korea. Their certification number is R-CBGT-GM210P.
When integrating the RF-certified module, an end-product is exempted from doing the RF emission testing as long as the recommended design guidance is followed, and the approved antennas are used.
EMC testing, and any other relevant tests, might still be required for full compliance.
11.7 Proximity to Human Body
When using the module in an application where the radio is located close to the human body, the human RF exposure must be evaluated. FCC, ISED, and CE all have different standards for evaluating the RF exposure, and because of this, each standard requires a
different minimum separation distance between the module and human body. Certification of BGM210P allows for the minimum separation distances detailed in the table below in Portable use cases (less than 20 cm from human body). The module is approved for the
Mobile use case (more than 20 cm) without any need for RF exposure evaluation.
Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption
Certification
BGM210P22A
BGM210P32A
FCC
5.3 mm
44.0 mm
ISED
20 mm
40 mm
CE
The RF exposure must always be evaluated using the end-product when transmitting with power levels higher than 20 mW (13 dBm).
For FCC and ISED, using the module in end-products where the separation distance from the human body is smaller than that listed
above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or
Change of ID to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the endproduct in all cases when transmitting at more than the power level indicated in the table.
Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a
reduced range is to be expected.
11.8 Bluetooth Qualification
The BGM210P modules come at launch with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component having Declaration ID
of D043475 and QDID of 129390, and having a listing date of 2019-04-02.
Because the validity set by the SIG for Tested Components is currently of 3 years, during the product lifetime Silicon Labs will renew
this Component as it expires, whenever applicable. Renewed Tested Components will come with new DIDs and QDIDs, and these will
be then referred to in end-product listings. Such new DIDs and QDIDs can be discovered starting from the original ones.This module’s
RF-PHY Tested Component should be combined with the latest Wireless Gecko Link Layer and Host pre-qualified Components by Silicon Labs, when in the process of qualifying an end-product embedding the BGM210P via the SIG’s Launch Studio.
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Rev. 1.1 | 46
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Revision History
12. Revision History
Revision 1.1
August, 2020
• Updated security wording in Front Page and added Core/Memory and Security components to block diagram enabled with Secure
Vault
• Updated list of security features and corrected number of 16-bit Timer/Counter (from 2 x to 3 x) in 1. Features
• Added BGM210PBxxxxxx part numbers to Table 2.1 Ordering Information on page 3 and updated footnotes
• Added 3.5 Security
• Added VCOM TX/RX pin labels to J1 connector in 5. Reference Diagrams and references to UG388/UG389 for example on how to
enable VCOM
• Added footnote on DECOUPLE pin to Table 6.1 BGM210P Module Pin Definitions on page 26
• Added comment to Figure 7.3 Non-Optimal Layout Examples on page 32 noting that figure applies to module use cases with onboard chip antenna only
• Updated graphic type for Figure 8.1 Top and Side Views on page 35
• Removed top marking figures for BGM210P0 part numbers and added those for BGM210PB part numbers in 8.3 Package Marking
• Added comment on pin 1 orientation in 10.1 Tape and Reel
• Added 10.2 Moisture Sensitivity Level
• Added 11.8 Bluetooth Qualification
Revision 1.0
January, 2020
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Corrected LETIMER's lowest power mode in front page block diagram from EM2 to EM3
Added RF Pin to front page block diagram
Removed BGM210P0xxxxxx part numbers from Ordering Information table
Replaced "Chip" with "Built-in" antenna throughout document
Added sentence in Section 3.3 Antenna clarifying that antenna diversity is not supported
Added text in Section 3.4 Power Supply about DECOUPLE pin
Corrected lower limit for operating voltage range from 1.8 to 1.71 V in Section 4. Electrical Specifications
Resolved remaining TBD entries in Section 4. Electrical Specifications
Changed "3.3V" net label to "VDD" and connected pins U1.20 and U1.29 to GND in Section 5. Reference Diagrams
Added supply connection recommendation for NCP use cases with different IOVDD and VDD levels in Section 5.1 Network Co-Processor (NCP) Application with UART Host
Updated DECOUPLE pin description to "Do Not Connect", and added notes on RESET and RF2G4_IO2 pins to Table
6.1 BGM210P Module Pin Definitions on page 26
Corrected edge-alignment placement recommendation to "Optional, not mandatory" in Figure 7.2 Recommended Layout for
BGM210P Using External Antenna on page 32
Added Sections 7.4 Reset, 7.5 Debug and 7.6 Packet Trace Interface (PTI)
Renamed Section 8.1 Dimensions as 8.1 Package Outline
Renamed Fig 8.1 Module Dimensions as Figure 8.1 Top and Side Views on page 35 and added Figure 8.2 Bottom View on page 35
Added Japan and South Korea certifications
Revision 0.5.1
September, 2019
• Update wording for FCC and ISED certifications section
• Updated Design Guidelines
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Rev. 1.1 | 47
BGM210P Wireless Gecko Bluetooth Module Data Sheet
Revision History
Revision 0.5
September, 2019
• Initial Production Release.
• Updated with latest values, certifications, security, etc
• Updated with OPNs for Reel packaging
• Added System Overview
• Updated Electrical Specifications with latest values
• Added Reference Diagrams
• Updated wording and figures in Design Guidelines
• Updated figures in Package Specifications and added Marking section
• Added Tape and Reel dimensions
• Updated Certifications information
• General wording, spelling, and grammar fixes.
Revision 0.1
April, 2019
• Initial Release.
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Rev. 1.1 | 48
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