BLA2ABB221SN4D

Spec. No. JENF243A-0016T-01 Reference Only P. 1/ 9 Chip Ferrite Bead Array BLA2A□□□□□SN4□ Reference Specification 1. Scope This reference specification is applied to Chip Ferrite Bead Array BLA2A Series used for electronic machinery. 2. Part Numbering (ex.) BL A 2A AG (1) (2) (3) (4) (1) Product ID (4) Characteristics (7) Category 121 S N 4 D (5) (6) (7) (8) (9) (2) Type (5) Typical Impedance at 100MHz (8) Numbers of Circuit (3) Dimension (L×Ｗ) (6) Performance (9) Packaging (D : Taping / B : Bulk) 3. Rating Customer Part Number MURATA Part Number BLA2AAG121SN4D BLA2AAG121SN4B BLA2AAG221SN4D BLA2AAG221SN4B BLA2AAG601SN4D BLA2AAG601SN4B BLA2AAG102SN4D BLA2AAG102SN4B BLA2ABB100SN4D BLA2ABB100SN4B BLA2ABB220SN4D BLA2ABB220SN4B BLA2ABB470SN4D BLA2ABB470SN4B BLA2ABB121SN4D BLA2ABB121SN4B BLA2ABB221SN4D BLA2ABB221SN4B BLA2ABD750SN4D BLA2ABD750SN4B BLA2ABD121SN4D BLA2ABD121SN4B BLA2ABD221SN4D BLA2ABD221SN4B BLA2ABD471SN4D BLA2ABD471SN4B BLA2ABD601SN4D BLA2ABD601SN4B BLA2ABD102SN4D BLA2ABD102SN4B Impedance (Ω) at 100MHz, (Under Standard Testing Condition) Rated Current (mA) 120 ± 25 % 100 DC Resistance (Ω max.) Values Initial After Values Testing 0.5 0.6 0.7 0.8 1.1 1.2 1000 ± 25 % 1.3 1.4 10 ± 25 % 0.1 0.2 0.2 0.3 47 ± 25 % 0.35 0.45 120 ± 25 % 0.6 0.7 0.9 1.0 0.20 0.30 120 ± 25 % 0.35 0.45 220 ± 25 % 0.40 0.50 0.65 0.75 0.80 0.90 1.00 1.10 220 ± 25 % 600 ± 25 % 22 ± 25 % 50 200 50 220 ± 25 % 75 ± 25 % 200 470 ± 25 % 100 600 ± 25 % 1000 ± 25 % · Operating Temperature: - 55 °C to + 125 °C 50 Insulation Resistance between Elements Remark For general use 100MΩ min. For high speed signal Line · Storage Temperature: - 55 °C to + 125 °C MURATA MFG CO., LTD. Reference Only Spec. No. JENF243A-0016T-01 P. 2/ 9 4. Style and Dimensions 0.2±0.15 1.0±0.2 ■ Equivalent Circuit 0.5 ±0.1 2.0±0.2 0.25±0.15 : Electrode 0.5 ±0.1 No polarity (in mm) ■ Unit Mass (Typical value) 0.005g 5. Marking No marking. 6. Standard Testing Conditions < Unless otherwise specified > < In case of doubt > Temperature : Ordinary Temp. 15 ºC to 35 °C Temperature: 20 °C ± 2 °C Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106 kPa 7. Electrical Performance No. 7.1 Item Impedance Specification Meet item 3. 7.2 DC Resistance Meet item 3. 7.3 Insulation Resistance between Elements Meet item 3. Test Method Measuring Frequency : 100 MHz ± 1 MHz Measuring Equipment : KEYSIGHT 4291A or the equivalent (OSC = 0.05 V) Test Fixture : KEYSIGHT 16192A Measuring Equipment : Digital multi meter * Except resistance of the Substrate and Wire Measuring Voltage : 5 V(DC) Measuring Time : 1 min max. 8. Mechancal Performance No. 8.1 8.2 8.3 Item Appearance and Dimensions Bonding Strength Bending Strength Specification Meet item 4. Meet Table 1. Table 1 Appearance Impedance Change (at 100MHz) DC Resistance Test Method Visual Inspection and measured with Slide Calipers or Micrometer or Measuring Microscope. It shall be soldered on the substrate. Applying Force(F) : 9.8 N F Product Applying Time : 5 s ± 1 s No damage Within ± 30 % Substrate Meet item 3. It shall be soldered on the substrate. Subtrate : Glass-epoxy substrate (100mm × 40mm × 1.0mm) Deflection : 2.0 mm Speed of Applying Force : 0.5 mm / s Keeping Time : 30 s Pressure jig R340 F Deflection 45 MURATA MFG CO., LTD. 45 Product Spec. No. JENF243A-0016T-01 Reference Only No. 8.4 Item Solderability Specification The electrodes shall be at least 95 % covered with new solder coating. 8.5 Resistance to Soldering Heat Meet Table 1. 8.6 Vibration 8.7 Drop Product shall be no failure after tested. P. 3/ 9 Test Method Flux : Ethanol solution of rosin, 25 (wt)% Pre-Heating : 150 °C ± 10 °C, 60 s ~ 90 s Solder :Sn-3.0Ag-0.5Cu Solder Temperature : 240 °C ± 5 °C Immersion Time : 3 s ± 1 s Immersion and emersion rates : 25 mm / s Flux : Ethanol solution of rosin, 25 (wt)% Pre-Heating : 150 °C ± 10 °C, 60 s ~ 90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 °C ± 5 °C Immersion Time : 10 s ± 1 s Immersion and emersion rates : 25 mm / s Then measured after exposure in the room condition for 48 h ± 4 h. It shall be soldered on the substrate. Osclilation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5 mm Testing Time : A period of 2 hours in each of 3 mutually erpendicular directions. It shall be dropped on concrete or steel board. Method : free fall Height : 75 cm Attitude from which the product is dropped : 3 directions The Number of Time : 3 times for each direction (Total 9 times) 9. Environmental Performance (It shall be soldered on the substrate.) No. 9.1 Item Temperature Cycle 9.2 Humidity 9.3 Heat Life 9.4 Cold Resistance Specification Meet Table 1. Test Method 1 cycle 1 step : -55 °C (+0 °C , -3 °C ) / 30min ± 3min 2 step: Ordinary temp. / 10min to 15min 3 step : +125 °C (+3 °C , -0 °C) / 30min ± 3min 4 step: Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48 h ± 4 h. Temperature : 40 °C ± 2 °C Humidity : 90 %(RH) to 95 %(RH) Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 48 h ± 4 h. Temperature : 125 C ± 3 °C Applying Current : Rated Current Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 48 h ± 4 h. Temperature : - 55 °C ± 2 °C Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 48 h ± 4 h. MURATA MFG CO., LTD. Spec. No. JENF243A-0016T-01 Reference Only P. 4/ 9 10. Specification of Packaging 0.1 φ 1.5± 0 2 .2 ±0 .1 1.2±0.1 8 .0 ±0 .3 4.0±0.1 3 .5 ±0 .1 2.0±0.1 2.0±0.1 1 .7 5 ±0 .1 10.1. Appearance and Dimensions (8 mm-wide paper tape) Direction of feed 0.8 max. (in mm) (1) Taping Products shall be packaged in the cavity of the base tape of 8 mm-wide , 2 mm-pitch continuously and sealed by top tape and bottom tape. (2) The sprocket holes are to the right as the tape is pulled toward the user. (3) Splice point : The base tape and top tape have no spliced point (4) Cavity : There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.2. Tape Strength (1) Pull Strength Top tape Bottom tape 5N min. 165 to 180 degree (2) Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) ∗ Speed of Peeling off : 300 mm / min Bottom tape Top tape F Base tape 10.3. Taping Condition (1) Standard quantity per reel Quantity per 180 mm reel : 10000 pcs. / reel (2) There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. (3) On paper tape, the top tape and the base tape shall no be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1), RoHS discrimination(∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ (1) (1) Factory Code (2) Date OOOO ××× (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS discrimination » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number MURATA MFG CO., LTD. Reference Only Spec. No. JENF243A-0016T-01 P. 5/ 9 (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS discrimination(∗2) , Quantity , etc) (6) Dimensions of reel and taping (leader-tape , trailer-tape) 10-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 11. ! Caution 11.1. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 11.2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Disaster prevention / crime prevention equipment (7) Traffic signal equipment (8) Transportation equipment (vehicles, trains, ships, etc.) (9) Data-processing equipment (10) Application of similar complexity and/or with reliability Requirements to the applications listed in the above. 11.3. Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. MURATA MFG CO., LTD. Reference Only Spec. No. JENF243A-0016T-01 P. 6/ 9 12. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 12.1. Land pattern designing · Standard land dimensions (Reflow soldering) 0.25 0.5 Pattern Solder resist 0.5 1.5 ∗ The excessive heat by land pads may cause deterioration at joint of products with substrate. (in mm) Product 12.2. Soldering Conditions Products can be applied to reflow soldering. (1) Flux , Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 µm Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. Solder (2) Soldering conditions · Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100 °C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. · Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times MURATA MFG CO., LTD. Reference Only Spec. No. JENF243A-0016T-01 P. 7/ 9 12.3. Reworking with soldering iron · Pre-heating : 150 °C , 1 min · Soldering iron output : 80W max. · Tip temperature: 350°C max. · Tip diameter: φ 3mm max. · Soldering time : 3(+1,-0) seconds. ·Times : 2times max. Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 12.4. Solder Volume Solder shall be used not to be exceeded as shown below. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendabl 1/3T≦ t ≦ T (T:Chip thickness) t 12.5. Attention regarding P.C.B bending The following shall be considered when designing and laying out P.C.B.’s (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a Products shall be locatedin the sideways direction (Length : a < b) to the mechanical stress. b 〈 Poor example〉 〈 Good example〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Stress Level A > D *1 A > B A > C C Perforation B D A *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Slit (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended MURATA MFG CO., LTD. Spec. No. JENF243A-0016T-01 Reference Only P. 8/ 9 12.6. Potential between Elements Products should be used within 5 V(DC) between elements. When the products are used the excessive voltage over 5 V(DC) , it may cause breaking of inner electrade and / or decreasing o insulation resistance between elements. 12.7. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 12.8. Cleaning Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this product. 12.9. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 12.10. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 12.11. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 12.12. Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage coditions · Products should be stored in the warehouse on the following conditions. Temperature : - 10 °C to 40 °C : 15 % to 85 % relative humidity Humidity No rapid change on temperature and humidity · Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. · Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. · Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Avoid storing the product by itself bare (i.e. exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG CO., LTD. Spec. No. JENF243A-0016T-01 Reference Only P. 9/ 9 13. ! Notes (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD.