BLE18PK160SN1D

Reference Only Spec. No. JENF243A-0080D-01 P.1/8 Chip Power Bead BLE18□□□□□SN1□ Reference Specification 1.Scope This reference specification applies to Chip Power Bead BLE18_SN Series. 2.Part Numbering (ex.) BL E 18 PS 080 S N 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk) 3.Rating Customer Part Number Impedance (Ω) (at 100MHz, Under Standard Testing Condition) MURATA Part Number Typical Impedance (Ω) (at 1GHz, Under Standard Testing Condition) Typical Rated Current (mA) at 85℃ at 125℃ (Notes) Rated Current is derated as right figure depending on the operating temperature. R a te d C u rre n t ( A ) BLE18PS080SN1D 8.5±25％ 8.5 8000 5000 BLE18PS080SN1B BLE18PK100SN1D 10±25％ 10 45 6000 3500 BLE18PK100SN1B BLE18PK160SN1D 16±25％ 16 70 5000 2800 BLE18PK160SN1B • Operating Temperature : -55°C to +125°C • Storage Temperature : -55°C to +125°C Values After Testing 0.004 0.005 0.008 0.013 0.012 0.018 Rated current at 125°C 0 85 125 Operating Temperature (°C) ■ Equivalent Circuit 0.8±0.1 5 BLE18PS:0.6±0.15 BLE18PK:0.8±0.15 0.4 ±0.2 Initial Values Rated current at 85°C 4.Style and Dimensions 1.6±0.1 5 DC Resistance (Ω max.) : Ele ctrode ( ■ Unit Mass (Typical value) BLE18PS: 0.004g BLE18PK: 0.006g (in mm) 5.Marking No marking. 6.Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa MURATA MFG.CO., LTD. ) Resistance element becomes dominant at high frequencies. Reference Only Spec. No. JENF243A-0080D-01 7.Specifications 7-1.Electrical Performance No. Item 7-1-1 Impedance Specification Meet item 3. 7-1-2 DC Resistance Meet item 3. P.2/8 Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT 4991A or the equivalent Test Fixture : KEYSIGHT 16192A or the equivalent Measuring Equipment : YOKOGAWA 755611 or the equivalent Test Fixture : KEYSIGHT 16044A or the equivalent ＊Except resistance of the Substrate and Wire 7-2.Mechanical Performance No. Item 7-2-1 Appearance and Dimensions 7-2-2 Bonding Strength Specification Meet item 4. Test Method Visual Inspection and measured with Slide Calipers. Meet Table 1. It shall be soldered on the substrate. Applying Force(F) : 6.8N Applying Time : 5s±1s Applied direction :Parallel to substrate Table 1 Appearance No damage Impedance Change Within ±30% (at 100MHz) DC Meet item 3. Resistance 7-2-3 Bending Strength Side view Ｆ Ｆ R0.5 Substrate It shall be soldered on the substrate. Substrate: Glass-epoxy 100mm×40mm×1.6mm Deflection : 1.0mm Pressure jig Speed of Applying Force : 0.5mm/s Keeping Time : 30s R340 F Deflection 45mm 7-2-4 Vibration 7-2-5 Resistance to Soldering Heat 7-2-6 Drop 7-2-7 Solderability Meet Table 2. Table 2 Appearance Impedance Change (at 100MHz) DC Resistance Products shall after tested. No damage Within ±50% 45mm Product It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 4 to 48 h. Meet item 3. be no failure The electrodes shall be at least 95% covered with new solder coating. It shall be dropped on concrete or steel board. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction(Total 9 times) Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 3s±1s Immersion and emersion rates : 25mm/s MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0080D-01 7-3.Environmental Performance It shall be soldered on the substrate. No. Item Specification 7-3-1 Temperature Meet Table 2. Cycle 7-3-2 Humidity 7-3-3 Heat Life 7-3-4 Cold Resistance P.3/8 Test Method 1 cycle: 1 step:-55 °C(+0 °C,-3 °C) / 30min±3min 2 step:Ordinary temp. / 10min to 15min 3 step:+125 °C(+3 °C,-0 °C) / 30min±3min 4 step: Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 4 to 48 h. Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 4 to 48 h. Temperature : 125°C±2°C Applying Current : Rated Current (at 125°C) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 4 to 48 h. Temperature : -55±2°C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 4 to 48 h. 8.Specification of Packaging 8-1.Appearance and Dimensions (8mm-wide paper tape) Appearance and Dimensions 8mm-wide Paper tape 4mm-pitch 1.85±0.1 BLE18PS080SN1D BLE18PK***SN1D +0.1 φ 1.5 -0 3.5±0.05 2.0±0.05 4.0±0.1 4.0±0.1 8.0±0.3 Type 1.75±0.1 Part Number 1.05±0.1 a Direction of feed Item BLE18PS080SN1D BLE18PK***SN1D Dimension “a” 0.85 max. 1.1 max (in mm) (1) Taping Products shall be packaged in the cavity of the base tape continuously and sealed by top tape and bottom tape. (2) Sprocket hole:The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point:The base tape and top tape have no spliced point (4) Cavity:There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0080D-01 P.4/8 8-2.Tape Strength (1)Pull Strength Top tape Bottom tape 5N min. 165 to 180 degree (2)Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min Bottom tape Top tape F Base tape 8-3.Taping Condition (1)Standard quantity per reel Type BLE18PS080SN1D BLE18PK***SN1D Quantity per 180mm reel 4000 pcs. / reel (2)There shall be leader-tape (top tape and empty tape ) and trailer- tape (empty tape) as follows. (3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4)Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day ∗2) « Expression of RoHS Marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) (5)Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS discrimination(∗2), Quantity, etc) (6)Dimensions of reel and taping(leader-tape, trailer-tape) 8-4. Specification of Outer Case Label H D W Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0080D-01 9. P.5/8 Caution 9-1.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Disaster prevention / crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Transportation equipment (vehicles,trains,ships,etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 9-3. Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1.Land pattern designing • Standard land dimensions Chip Ferrite Bead Type c d a Rated Current Soldering (A) BLE18PK*** 5-6 BLE18PS080 8 a b Flow Flow Flow/ 0.8 2.5 Reflow Reflow Reflow 0.7 2.0 c Land pad thickness and dimension d 18µm 35µm 70µm 6.4 3.3 1.65 - 6.4 3.3 0.7 b (in mm) Solder Resist Pattern ∗The excessive heat by land pads may cause deterioration at joint of products with substrate. 10-2.Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0080D-01 (3)soldering profile □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile Time. (s) Standard Profile 150℃、60s min. 250℃、4～6s 2 times Limit Profile 265℃±3℃、5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Time. (s) Limit Profile above 230°C、60s~150s 260°C,10s 2 times 10-3.Reworking with soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) seconds. • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. MURATA MFG.CO., LTD. P.6/8 Reference Only Spec. No. JENF243A-0080D-01 P.7/8 10-4.Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T: Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-5.Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a b 〈 Poor example〉 Products shall be located in the sideways direction (Length: a D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-6.Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. MURATA MFG.CO., LTD. Spec. No. JENF243A-0080D-01 Reference Only P.8/8 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9. Cleaning Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this product. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11.Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Avoid storing the product by itself bare (i.e.exposed directly to air). (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.