BLM03AX100SZ1D

Reference Only Spec.No.JENF243A-9126K-01 P.1/9 Chip Ferrite Bead BLM03□□□□□SZ1D Murata Standard Reference Specification [AEC-Q200] 1.Scope This reference specification applies to Chip Ferrite Bead BLM03_SZ series for Automotive Electronics based on AEC-Q200 except for Power train and Safety. 2.Part Numbering (ex.) BL M 03 AG 102 S Z 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (4)Characteristics (7)Category(for Automotive Electronics) (2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit (3)Dimension (L×W) (6)Performance (9)Packaging (D:Taping) 3.Rating Customer Part Number MURATA Part Number Rated Current (mA)（*2） Impedance (Ω) (at 100MHz)(*1) (refer to below comment) at 85°C at 125°C 500 200 200 DC Resistance (Ω max.) (*1) (refer to below comment) Initial Values Values After Testing 0.1 0.4 0.4 0.15 0.5 0.5 BLM03AG100SZ1D BLM03AG700SZ1D BLM03AG800SZ1D 5～15 40～100 80±25% BLM03AG121SZ1D BLM03AG241SZ1D BLM03AG601SZ1D BLM03AG102SZ1D BLM03AX100SZ1D BLM03AX800SZ1D BLM03AX121SZ1D BLM03AX241SZ1D BLM03AX601SZ1D BLM03AX102SZ1D 120±25% 240±25% 600±25% 1000±25% 5～15 80±25% 120±25% 240±25% 600±25% 1000±25% 200 200 100 100 1000 500 450 350 250 200 0.5 0.8 1.5 2.5 0.05 0.18 0.23 0.38 0.85 1.25 0.6 0.9 1.6 2.6 0.10 0.23 0.28 0.43 0.90 1.30 BLM03BB100SZ1D BLM03BB220SZ1D BLM03BB470SZ1D BLM03BB750SZ1D 10±25% 22±25% 47±25% 75±25% 300 200 200 200 0.4 0.5 0.7 1.0 0.5 0.6 0.8 1.1 BLM03BB121SZ1D BLM03BC330SZ1D BLM03BC560SZ1D BLM03BC800SZ1D BLM03BD750SZ1D 120±25% 33±25% 56±25% 80±25% 75±25% 100 150 100 100 300 1.5 0.85 1.05 1.40 0.4 1.6 0.90 1.10 1.45 0.5 BLM03BD121SZ1D BLM03BD241SZ1D BLM03BD471SZ1D BLM03BD601SZ1D BLM03PG220SZ1D BLM03PG330SZ1D BLM03PX220SZ1D 120±25% 240±25% 470±25% 600±25% 22±25% 33±25% 22±25% 250 200 215 200 900 750 1800*2 1450*2 0.5 0.8 1.5 1.7 0.065 0.09 0.040 0.6 0.9 1.6 1.8 0.115 0.140 0.045 BLM03PX330SZ1D 33±25% BLM03PX800SZ1D 80±25% BLM03PX121SZ1D 120±25% ■Operating Temperature : -55°C to +125°C Remark For general use 2 For high speed signal Line For DC 1500*2 1200*2 0.055 0.060 power Line 800*2 1000*2 0.130 0.135 *2 900 700*2 0.160 0.210 ■Storage Temperature : -55°C to +125°C MURATA MFG.CO.,LTD. ESD Rank 2 :2kV Reference Only Spec.No.JENF243A-9126K-01 P.2/9 (*1) Standard Testing Conditions < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa R a te d C u rre n t ( A ) < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) (*2) As for the Rated current marked with *2 Rated Current is derated as right figure Dependind on the operating temperature. Rated current at 85°C Rated current at 125°C 0 85 125 Operating Temperature (°C) 4.Style and Dimensions 0.3±0.03 ■ Equivalent Circuit 0.3±0.03 0.6±0.03 0.15±0.05 : Electrode ( ) Resistance element becomes dominant at high frequencies. ■ Unit Mass (Typical value) 0.3mg 5.Marking No marking. 6.Specifications 6-1.Electrical Performance No. Item 6-1-1 Impedance Specification Meet item 3. 6-1-2 Meet item 3. DC Resistance Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter * Except resistance of the Substrate and Wire MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9126K-01 P.3/9 6-2.Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No. Stress Test Method 3 High 1000hours at 125 deg C Temperature Set for 24hours Exposure at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance Impedance Change (at 100MHz) DC Resistance No damage Within ±30% Meet item 3. 4 Temperature Cycling 1000cycles -55 deg C to +125 deg C Set for 24hours at room temperature, then measured. Meet Table A after testing. 5 Destructive Physical Analysis Per EIA469 No electrical tests No defects 7 Biased Humidity Meet Table A after testing. 8 Operational Life 9 10 External Visual Physical Dimension 12 13 Resistance to Solvents Mechanical Shock 1000hours at 85 deg C, 85%RH Apply max rated current. Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured Visual inspection Meet ITEM 4 （Style and Dimensions） Per MIL-STD-202 Method 215 14 Vibration 15 Resistance to Soldering Heat 17 ESD 18 Solderability 19 Electrical Characterization Measured : Impedance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.0mm) Deflection 2mm(min) 60s minimum holding time Meet Table A after testing. 22 Terminal Strength Per AEC-Q200-006 Per MIL-STD-202 Method 213 Condition F: 1500g's(14.7N)/0.5ms/Half sine Meet Table A after testing. If the rated current of parts exceed 1A, the operating temperature should be 85 deg C. No abnormalities No defects Not Applicable Meet Table A after testing. 5g's(0.049N) for 20 minutes Meet Table A after testing. 12cycles each of 3 oritentations Test from 10-2000Hz. Solder temperature Pre-heating: 150C +/-10 deg C, 60s to 90s 260C+/-5 deg C Immersion time 10s Meet Table A after testing. Per AEC-Q200-002 Meet Table A after testing. ESD Rank: Meet Item 3. (Rating) Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. Murata deviation request: 5N No defects 30 Electrical Transient Conduction Per ISO-7637-2 Not Applicable MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9126K-01 P.4/9 +0.1 0.66(Typ.) 3.5±0.05 φ 1.5 - 0 0.36(Typ.) 8.0±0.3 2.0±0.05 2.0±0.05 4.0±0.1 1.75±0.1 7.Specification of Packaging 7-1.Appearance and Dimensions (8mm-wide paper tape) 0.55max. Direction of Feed (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed by top tape and bottom tape. (2) Sprocket hole: The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point:The base tape and top tape have no spliced point (4) Cavity:There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 7-2.Tape Strength (1)Pull Strength Cover tape 165 to 180 degree 5N min. (2)Peeling off force of Cover tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min Cover tape F Base tape 7-3.Taping Condition (1)Standard quantity per reel Quantity per 180mm reel 10000 pcs. / reel (2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows. (3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4)Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) (5)Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking(∗2) ,Quantity, etc) MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9126K-01 P.5/9 (6)Dimensions of reel and taping(leader-tape, trailer-tape) 7-4. Specification of Outer Case Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It is depend on a quantity of an order. Label H D W 8. ！ Caution 8-1.Rating Do not use products beyond the Operating Temperature Range and Rated Current. 8-2.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 8-3.Fail Safe Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 8-4.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (trains,ships,etc.) (4)Power plant control equipment (9) Data-processing equipment (5)Medical equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9126K-01 P.6/9 9. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 9-1.Land pattern designing • Standard land dimensions (Reflow soldering) < For BLM03 series (except BLM03PG, BLM03PX, BLM03AX type) > Type BLM03 (except 03PG, PX, AX Type) Chip Ferrite Bead a b c 0.25 0.80 0.30 c Solder Resist Pattern a b (in mm) < For BLM03PG, BLM03PX, BLM03AX type > Chip Ferrite Bead d c Rated Current (A) max.0.9 max.1.8 a b c 0.25 0.80 0.30 Land pad thickness and dimension d 18µm 35µm 70µm 0.3 0.3 0.3 1.2 0.7 0.3 (in mm) ∗The excessive heat by land pads may cause deterioration at joint of products with substrate. a b Solder Resist Pattern MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9126K-01 P.7/9 9-2.Soldering Conditions Products can be applied to reflow soldering. (1) Flux,Solder Flux Solder Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 150 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (3) Soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times 9-3. Soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) seconds. • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 9-4.Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9126K-01 P.8/9 9-5.Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:a D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 9-6.Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 9-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9126K-01 P.9/9 9-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 9-9. Cleaning When cleaning this product, observe the following conditions. Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product before use. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the substrate vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always perform a test cleaning beforehand using an actual cleaning device, and then check the quality of the products. (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, please consult our technical department. 9-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 9-11.Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Avoid storing the product by itself bare (i.e.exposed directly to air). (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 10 . ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD.