BLM03HD182FZ1D

Reference Only Spec.No.JENF243A-9127F-01 P.1/8 Chip Ferrite Bead BLM03H□□□□□Z1D Murata Standard Reference Specification [AEC-Q200] 1.Scope This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM03H_Z series based on AEC-Q200 except for Power train and Safety. 2.Part Numbering (ex.) BL M 03 HG 601 S Z 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (4)Characteristics (2)Type (5)Typical Impedance at 100MHz (3)Dimension (L×W) (6)Performance(S:general/F:Low Rdc) (7)Category(for Automotive Electronics) (8)Numbers of Circuit (9)Packaging (D:Taping) 3.Rating Customer Part Number Impedance (Ω) (Under Standard Testing Condition) MURATA Part Number Rated Current (mA) DC Resistance (Ω max.) (refer to below comment) Initial Values Values After Testing at100MHz at1GHz BLM03HG601SZ1D BLM03HG102SZ1D 600±25％ 1000±25％ 1000±40% 1800±40% 150 125 1.6 2.6 1.7 2.7 BLM03HG122SZ1D BLM03HB191SZ1D BLM03HB401SZ1D BLM03HD331SZ1D BLM03HD471SZ1D BLM03HD601SZ1D BLM03HD102SZ1D BLM03HD102FZ1D BLM03HD152FZ1D BLM03HD182FZ1D 1200±25％ 190±25％ 400±25％ 330±25％ 470±25％ 600±25％ 1000±25％ 1000±25％ 1500±25％ 1800±25％ 2000±40% 1150±40% 1850±40% 750±40% 1000±40% 1500±40% 2300±40% 2300±40% 2700±40% 3000±40% 100 150 125 200 175 150 120 135 120 100 3.5 2.0 2.8 1.0 1.3 1.7 2.9 2.4 3.1 3.8 3.6 2.1 2.9 1.1 1.4 1.8 3.0 2.5 3.2 3.9 ■Operating Temperature : -55°C to +125°C 2 ■Storage Temperature : -55°C to +125°C Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 4.Style and Dimensions 0.15±0.05 0.3±0.03 ■ Equivalent Circuit 0.3±0.03 0.6±0.03 : Electrode ( ) Resistance element becomes dominant at high frequencies. ■ Unit Weight (Typical value) 0.3mg MURATA MFG.CO.,LTD. ESD Rank 2 :2kV Spec.No.JENF243A-9127F-01 Reference Only P.2/8 5.Marking No marking. 6.Specifications 6-1.Electrical Performance No. Item 6-1-1 Impedance Specification Meet item 3. 6-1-2 Meet item 3. DC Resistance Test Method Measuring Frequency : 100MHz±1MHz,1GHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire 6-2.Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No. Stress Test Method 3 High 1000hours at 125 deg C Temperature Set for 24hours Exposure at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance No damage Impedance Change Within ±30% (at 100MHz) DC Meet item 3. Resistance 4 Temperature Cycling 1000cycles -55 deg C to +125 deg C Set for 24hours at room temperature, then measured. Meet Table A after testing. 5 Destructive Physical Analysis Per EIA469 No electrical tests No defects 7 Biased Humidity 1000hours at 85 deg C, 85%RH Meet Table A after testing. Apply max rated current. 8 Operational Life Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured Meet Table A after testing. 9 External Visual Visual inspection No abnormalities Meet ITEM 4 （Style and Dimensions） Per MIL-STD-202 Method 215 No defects 10 Physical Dimension 12 Resistance to Solvents Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Meet Table A after testing. Condition F: 1500g's(14.7N)/0.5ms/Half sine 14 Vibration 5g's(0.049N) for 20 minutes Meet Table A after testing. 12cycles each of 3 oritentations Test from 10-2000Hz. Solder temperature Pre-heating: 150C +/-10 deg C, 60s to 90s 260C+/-5 deg C Immersion time 10s Meet Table A after testing. 15 Resistance to Soldering Heat MURATA MFG.CO.,LTD. Spec.No.JENF243A-9127F-01 Reference Only AEC-Q200 Stress No. 17 ESD P.3/8 Murata Specification / Deviation Test Method Per AEC-Q200-002 Meet Table A after testing. ESD Rank: Meet Item 3. (Rating) 18 Solderability Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. 19 Electrical Characterization Measured : Impedance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Murata deviation request: Epoxy-PCB(0.8mm) Defrection 1mm(min) for BLM03H_FZ Meet Table A after testing. 22 Terminal Strength Per AEC-Q200-006 Murata deviation request: 5N No defects 30 Electrical Transient Conduction Per ISO-7637-2 Not Applicable +0.1 φ 1.5 - 0 0.36(Typ.) 8.0±0.3 0.66(Typ.) 3.5±0.05 2.0±0.05 2.0±0.05 4.0±0.1 1.75±0.1 7.Specification of Packaging 7-1.Appearance and Dimensions (8mm-wide paper tape) 0.55max. Direction of Feed (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed by top tape and bottom tape. (2) Sprocket hole: The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point:The base tape and top tape have no spliced point (4) Cavity:There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept.. 7-2.Tape Strength (1)Pull Strength Cover tape 165 to 180 degree 5N min. (2)Peeling off force of Cover tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min MURATA MFG.CO.,LTD. Cover tape F Base tape Reference Only Spec.No.JENF243A-9127F-01 P.4/8 7-3.Taping Condition (1)Standard quantity per reel Quantity per 180mm reel 10000 pcs. / reel (2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows. (3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4)Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) (5)Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking(∗2) ,Quantity, etc) (6)Dimensions of reel and taping(leader-tape, trailer-tape) 7-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It is depend on a quantity of an order. MURATA MFG.CO.,LTD. Spec.No.JENF243A-9127F-01 Reference Only P.5/8 8. ！ Caution 8-1.Rating Do not use products beyond the Operating Temperature Range and Rated Current. 8-2.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 8-3.Fail Safe Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 8-4.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (trains, ships, etc.) (4)Power plant control equipment (9) Data-processing equipment (5)Medical equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above 8-5. Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 9. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 9-1.Land pattern designing • Standard land dimensions (Reflow soldering) Chip Ferrite Bead c a b c 0.25 0.80 0.30 Solder Resist Pattern a b (in mm) 9-2.Soldering Conditions Products can be applied to reflow soldering. (1) Flux,Solder Flux Solder Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 150 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9127F-01 P.6/8 (3) Soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times 9-3. Soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) seconds. • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 9-4.Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 9-5.Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:a D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 9-6.Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 9-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 9-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. MURATA MFG.CO.,LTD. Spec.No.JENF243A-9127F-01 Reference Only P.8/8 9-9. Cleaning When cleaning this product, observe the following conditions. Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product before use. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the substrate vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always perform a test cleaning beforehand using an actual cleaning device, and then check the quality of the products. (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, please consult our technical department. 9-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 9-11.Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Avoid storing the product by itself bare (i.e.exposed directly to air). (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 10 . ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD.