BLM03HD331SN1D

Reference Only Spec.No.JENF243A-0020AD-01 P1/9 Chip Ferrite Bead BLM03□□□□□SN1□ Reference Specification 1.Scope This reference specification applies to Chip Ferrite Bead BLM03_SN Series. 2.Part Numbering (ex.) BL M 03 AG 121 S N 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk) 3.Rating Customer Part Number MURATA Part Number Impedance (Ω) (at 100MHz,Under Standard Testing Condition) Typical BLM03AG100SN1D BLM03AG100SN1B BLM03AG700SN1D BLM03AG700SN1B BLM03AG800SN1D BLM03AG800SN1B BLM03AG121SN1D BLM03AG121SN1B BLM03AG241SN1D BLM03AG241SN1B BLM03AG601SN1D BLM03AG601SN1B BLM03AG102SN1D BLM03AG102SN1B BLM03AX100SN1D BLM03AX100SN1B BLM03AX800SN1D BLM03AX800SN1B BLM03AX121SN1D BLM03AX121SN1B BLM03AX241SN1D BLM03AX241SN1B BLM03AX601SN1D BLM03AX601SN1B BLM03AX102SN1D BLM03AX102SN1B BLM03PG220SN1D BLM03PG220SN1B BLM03PG330SN1D BLM03PG330SN1B BLM03PX220SN1D BLM03PX220SN1B BLM03PX330SN1D BLM03PX330SN1B BLM03PX800SN1D BLM03PX800SN1B BLM03PX121SN1D BLM03PX121SN1B DC Resistance (Ω max.) Initial Values Values After at 85℃ at 125℃ Testing Rated Current (mA) 5 to 15 10 500 0.1 0.15 40 to 100 70 200 0.4 0.5 80±25％ 80 200 0.4 0.5 120±25% 120 200 0.5 0.6 240±25% 240 200 0.8 0.9 600±25% 600 100 1.5 1.6 1000±25% 1000 100 2.5 2.6 5～15 10 1000 0.05 0.10 80±25％ 80 500 0.18 0.23 120±25％ 120 450 0.23 0.28 240±25％ 240 350 0.38 0.43 600±25％ 600 250 0.85 0.90 1000±25％ 1000 200 1.25 1.30 22±25% 22 900 0.065 0.115 33±25% 33 750 0.090 0.140 22±25％ 22 1800*1 1450*1 0.040 0.045 33±25％ 33 1500*1 1200*1 0.055 0.060 80±25％ 80 1000*1 800*1 0.130 0.135 120±25％ 120 900*1 700*1 0.160 0.210 MURATA MFG.CO.,LTD. Remark For general use For DC power Line Reference Only Spec.No.JENF243A-0020AD-01 Customer Part Number MURATA Part Number P2/9 Impedance (Ω) (at 100MHz,Under Standard Testing Condition) Typical 10±25% 10 300 0.4 0.5 22±25% 22 200 0.5 0.6 47±25% 47 200 0.7 0.8 75±25% 75 200 1.0 1.1 120±25% 120 100 1.5 1.6 33±25％ 33 150 0.85 0.90 56±25％ 56 100 1.05 1.10 80±25％ 80 100 1.40 1.45 75 300 0.4 0.5 120 250 0.5 0.6 240 200 0.8 0.9 470 215 1.5 1.6 600 200 1.7 1.8 1000 170 1.70 1.75 1800 140 2.50 2.55 BLM03BC800SN1B BLM03BD750SN1D 75±25% BLM03BD750SN1B BLM03BD121SN1D 120±25% BLM03BD121SN1B BLM03BD241SN1D 240±25% BLM03BD241SN1B BLM03BD471SN1D 470±25％ BLM03BD471SN1B BLM03BD601SN1D 600±25％ BLM03BD601SN1B BLM03BX102SN1D 1000±25% BLM03BX102SN1B BLM03BX182SN1D 1800±25% BLM03BX182SN1B ■Operating Temperature : -55°C to +125°C (Note) As for the Rated current marked with *1, Rated Current is derated as right figure depending on the operating temperature. Remark For high speed signal Line ■Storage Temperature : -55°C to +125°C R a te d C u rre n t ( A ) BLM03BB100SN1D BLM03BB100SN1B BLM03BB220SN1D BLM03BB220SN1B BLM03BB470SN1D BLM03BB470SN1B BLM03BB750SN1D BLM03BB750SN1B BLM03BB121SN1D BLM03BB121SN1B BLM03BC330SN1D BLM03BC330SN1B BLM03BC560SN1D BLM03BC560SN1B BLM03BC800SN1D DC Resistance (Ω max.) Initial Values Values After at 85℃ at 125℃ Testing Rated Current (mA) Rated current at 85°C Rated current at 125°C 0 85 125 Operating Temperature (°C) MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-0020AD-01 P3/9 4.Style and Dimensions 0.3±0.03 0.6±0.03 0.3±0.03 ■ Equivalent Circuit 0.15±0.05 ( Resistance element becomes dominant at high frequencies. ) : Electrode (in mm) ■ Unit Mass(Typical value) 0.0003g 5.Marking No marking. 6.Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 7.Specifications 7-1.Electrical Performance No. Item 7-1-1 Impedance Specification Meet item 3. 7-1-2 Meet item 3. DC Resistance Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter * Except resistance of the Substrate and Wire 7-2.Mechanical Performance No. Item 7-2-1 Appearance and Dimensions 7-2-2 Bending Strength Specification Meet item 4. Meet Table 1. Table 1 Appearance Impedance Change (at 100MHz) DC Resistance No damage Test Method Visual Inspection and measured with Measuring Microscope. It shall be soldered on the Glass-epoxy substrate. Substrate : 100mm×40mm×0.8mm Deflection : 1.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s Pressure jig Within ±30% R340 Meet item 3. Deflection 45mm 7-2-3 Vibration 7-2-4 Resistance to Soldering Heat 7-2-5 Solderability F The electrodes shall be at least 95% covered with new solder coating. 45mm Product It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h±4h. Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 3s±1s Immersion and emersion rates : 25mm/s MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-0020AD-01 P4/9 7-3.Environmental Performance It shall be soldered on the substrate. No. Item Specification 7-3-1 Temperature Meet Table 1. Cycle 7-3-2 Humidity 7-3-3 Heat Life 7-3-4 Cold Resistance Test Method 1 cycle : 1 step : -55 °C(+0 °C,-3 °C) / 30min±3min 2 step : Ordinary temp. / 10min to 15min 3 step : +125 °C(+3 °C,-0 °C) / 30min±3min 4 step : Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Temperature : 125°C±3°C Applying Current : Rated Current (at 125℃) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Temperature : -55±2°C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. +0.1 0.66(Typ.) 3.5±0.05 φ 1.5 - 0 0.36(Typ.) 8.0±0.3 2.0±0.05 2.0±0.05 4.0±0.1 1.75±0.1 8.Specification of Packaging 8-1.Appearance and Dimensions (8mm-wide paper tape) Direction of Feed 0.55max. (in mm) (1)Taping Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed by cover tape . (2)Sprocket hole: The sprocket holes are to the right as the tape is pulled toward the user. (3)Spliced point:The base tape and cover tape have no spliced point (4)Cavity:There shall not be burr in the cavity. (5)Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2.Tape Strength (1)Pull Strength Cover tape 5N min. (2)Peeling off force of Cover tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min 165 to 180 degree MURATA MFG.CO.,LTD. Cover tape F Base tape Reference Only Spec.No.JENF243A-0020AD-01 P5/9 8-3.Taping Condition (1)Standard quantity per reel Quantity per 180mm reel 15000 pcs. / reel (2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows. (3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ (1) (1) Factory Code (2) Date OOOO ××× (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking(∗2) , Quantity , etc) (6)Dimensions of reel and taping(leader-tape, trailer-tape) Leader Trailer 2.0±0.5 160 min. 190 min. Label Empty tape 210 min. Cover tape φ 13.0±0.2 1 φ 60± 0 φ 21.0±0.8 9± 10 Direction of feed 13±1.4 (in mm) 0 φ 180± 3 8-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 9. ！ Caution 9-1.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (vehicles, trains, ships, etc.) (4)Power plant control equipment (9) Data-processing equipment (5)Medical equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-0020AD-01 P6/9 10. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1.Land pattern designing • Standard land dimensions (Reflow soldering) < For BLM03 series (except BLM03PG, BLM03PX, BLM03AX type) > Chip Ferrite Bead Type a b BLM03 0.2 to 0.3 0.6 to 0.9 (except 03PG, PX, AX Type) c 0.3 c Solder Resist Pattern a b (in mm) < For BLM03PG, BLM03PX, BLM03AX type > Chip Ferrite Bead d c Rated Current (A) max.0.9 max.1.8 Land pad thickness and dimension d 18µm 35µm 70µm 0.3 0.3 0.3 0.2 to 0.3 0.6 to 0.9 0.3 1.2 0.7 0.3 (in mm) a b c ∗The excessive heat by land pads may cause deterioration at joint of products with substrate. a b Solder Resist Pattern 10-2.Soldering Conditions (1) Flux,Solder Flux Solder Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 150 μm MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-0020AD-01 P7/9 (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times 10-3. Reworking with soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) seconds. • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4.Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Recommendable 1/3T≦t≦T (T:Chip thickness) t Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-5.Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a Products shall be located in the sideways direction (Length:a D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-6.Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7.Cleaning Conditions Products shall be cleaned on the following conditions. (1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max. (3)Cleaner 1.Alternative cleaner · Isopropyl alcohol (IPA) 2.Aqueous agent · PINE ALPHA ST-100S (4)There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5)Other cleaning Please contact us. 10-8. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-0020AD-01 P9/9 10-9. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11.Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11 . ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD.