BLM15AX601SZ1D

Reference Only Spec.No.JENF243A-9118J-01 P1/10 Chip Ferrite Bead BLM15□□□□□SZ1D Murata Standard Reference Specification [AEC-Q200] 1.Scope This reference specification applies to Chip Ferrite Bead BLM15_SZ series based on AEC-Q200 except for Power train and Safety. 2.Part Numbering (ex.) BL M 15 AG 102 S Z 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (4)Characteristics (7)Category(for Automotive Electronics) (2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit (3)Dimension (L×Ｗ) (6)Performance (9)Packaging (D:Taping) 3.Rating Customer Part Number DC Resistance (Ω max.) (*1) (refer to below ESD Rank comment) 2 :2kV Values Initial After Values Testing 0.025 0.05 0.15 0.20 0.19 0.29 0.29 0.39 0.52 0.62 0.65 0.75 0.015 0.025 0.06 0.11 0.1 0.15 MURATA Part Number Impedance (Ω) (at 100MHz)(*1) (refer to below comment) Rated Current (mA) BLM15AG100SZ1D BLM15AG700SZ1D BLM15AG121SZ1D BLM15AG221SZ1D BLM15AG601SZ1D BLM15AG102SZ1D BLM15AX100SZ1D BLM15AX300SZ1D BLM15AX700SZ1D 5～15 40～100 120±25% 220±25% 600±25% 1000±25% 5～15 30±25% 70±25% 1000 600 550 450 300 300 1740 1100 780 BLM15AX121SZ1D 120±25% 700 0.13 0.18 BLM15AX221SZ1D BLM15AX601SZ1D BLM15AX102SZ1D 220±25% 600±25% 1000±25% BLM15BA050SZ1D BLM15BA100SZ1D BLM15BA220SZ1D BLM15BA330SZ1D BLM15BA470SZ1D BLM15BA750SZ1D BLM15BB050SZ1D 5±25% 10±25% 22±25% 33±25% 47±25% 75±25% 5±25％ 10±25％ 22±25％ 47±25％ 75±25％ 120±25％ 220±25％ 120±25％ 240±25％ 75±25％ 120±25％ 220±25％ 470±25％ 600±25％ 600 500 350 300 300 300 300 200 200 500 300 300 300 300 300 200 350 250 300 300 300 200 200 0.18 0.34 0.49 0.1 0.2 0.3 0.4 0.6 0.8 0.08 0.10 0.20 0.35 0.40 0.55 0.80 0.45 0.7 0.2 0.3 0.4 0.60 0.65 0.23 0.39 0.54 0.15 0.25 0.35 0.45 0.65 0.85 0.15 0.15 0.30 0.45 0.50 0.65 0.90 0.50 0.75 0.3 0.4 0.5 0.70 0.75 BLM15BB100SZ1D BLM15BB220SZ1D BLM15BB470SZ1D BLM15BB750SZ1D BLM15BB121SZ1D BLM15BB221SZ1D BLM15BC121SZ1D BLM15BC241SZ1D BLM15BD750SZ1D BLM15BD121SZ1D BLM15BD221SZ1D BLM15BD471SZ1D BLM15BD601SZ1D MURATA MFG.CO.,LTD. 2 Reference Only Spec.No.JENF243A-9118J-01 Customer Part Number MURATA Part Number P2/10 Impedance (Ω) (at 100MHz)(*1) (refer to below comment) BLM15BD102SZ1D 1000±25％ BLM15BD152SZ1D BLM15BD182SZ1D BLM15BX750SZ1D BLM15BX121SZ1D BLM15BX221SZ1D BLM15BX471SZ1D BLM15BX601SZ1D BLM15BX102SZ1D BLM15BX182SZ1D BLM15PG100SZ1D BLM15PD300SZ1D BLM15PD600SZ1D BLM15PD800SZ1D BLM15PD121SZ1D BLM15PX330SZ1D BLM15PX600SZ1D BLM15PX800SZ1D BLM15PX121SZ1D BLM15PX181SZ1D BLM15PX221SZ1D BLM15PX331SZ1D BLM15PX471SZ1D BLM15PX601SZ1D 1500±25％ 1800±25％ 75±25％ 120±25％ 220±25％ 470±25％ 600±25％ 1000±25％ 1800±25％ 5~15 30±25％ 60±25％ 80±25％ 120±25％ 33±25％ 60±25％ 80±25％ 120±25％ 180±25％ 220±25％ 330±25％ 470±25％ 600±25％ ■Operating Temperature : -55°C to +125°C Rated Current (mA)(*2) at85℃ DC Resistance (Ω max.) (*1) (refer to below ESD Rank 2 :2kV comment) Values Initial at125℃ After Values Testing 200 190 200 600 600 450 350 350 300 250 1000 2200 1700 1400 1100 0.90 1.0 1.4 0.15 0.17 0.27 0.41 0.46 0.65 0.90 0.025 0.035 0.06 1.0 1.1 1.5 0.20 0.22 0.32 0.46 0.51 0.75 1.00 0.05 0.05 0.075 1500 1000 0.07 0.085 1300 900 0.09 0.105 3000 1700 0.022 0.037 2500 1400 0.032 0.047 2300 1300 0.038 0.053 2000 1100 0.055 0.070 1500 800 0.09 0.105 1400 800 0.100 0.115 1200 700 0.150 0.165 1000 600 0.20 0.22 900 500 0.23 0.25 ■Storage Temperature : -55°C to +125°C (*1) Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa (*2) As for the Rated current marked with *2 Rated Current is derated as right figure Dependind on the operating temperature. MURATA MFG.CO.,LTD. 2 Reference Only Spec.No.JENF243A-9118J-01 P3/10 4.Style and Dimensions 1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.1 ■ Equivalent Circuit ( ) Resistance element becomes dominant at high frequencies. : Electrode (in mm) ■ Unit Weight (Typical value) 0.001g 5.Marking No marking. 6.Specifications 6-1.Electrical Performance No. Item 6-1-1 Impedance Specification Meet item 3. 6-1-2 Meet item 3. DC Resistance Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire 6-2.Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No. Stress Test Method 3 High 1000hours at 125 deg C Temperature Set for 24hours Exposure at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance Impedance Change (at 100MHz) DC Resistance No damage Within ±30% Meet item 3. 4 Temperature Cycling 1000cycles -55 deg C to +125 deg C Set for 24hours at room temperature, then measured. Meet Table A after testing. 5 Destructive Physical Analysis Per EIA469 No electrical tests No defects 7 Biased Humidity 1000hours at 85 deg C, 85%RH Meet Table A after testing. Apply max rated current. MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9118J-01 P4/10 AEC-Q200 Stress No. 8 Operational Life Murata Specification / Deviation Test Method Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured Meet Table A after testing. If the rated current of parts exceed 1A, the operating temperature should be 85 deg C. Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 4 （Style and Dimensions） No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Meet Table A after testing. Condition F: 1500g's(14.7N)/0.5ms/Half sine 14 Vibration 5g's(0.049N) for 20 minutes Meet Table A after testing. 12cycles each of 3 oritentations Test from 10-2000Hz. 15 Resistance to Soldering Heat Solder temperature 260C+/-5 deg C Immersion time 10s Pre-heating: 150C +/-10 deg C, 60s to 90s 17 ESD Per AEC-Q200-002 ESD Rank: Meet Item 3 (Rating) BLM15BB/BD series: Meet Table B after testing. Table B Appearance No damage Impedance Within ±40% Change (at 100MHz) DC Meet item 3. Resistance Other BLM15 sereis: Meet Table A after testing. 18 Solderability Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. 19 Electrical Characterization Measured : Impedance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Meet Table A after testing. 22 Terminal Strength Per AEC-Q200-006 Murata deviation request: 5N 9 External Visual Meet Table A after testing. No defects 30 Electrical Transient Conduction Per ISO-7637-2 Not Applicable MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9118J-01 P5/10 +0.1 φ 1.5 -0 8.0±0.3 1.15(Typ.) 3.5±0.05 2.0±0.05 2.0±0.05 4.0±0.1 1.75±0.1 7.Specification of Packaging 7-1.Appearance and Dimensions (8mm-wide paper tape) 0.8max. 0.65(Typ.) (in mm) Direction of Feed (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed by top tape and bottom tape. (2) Sprocket hole:Sprocket hole shall be located on the left hand side toward the direction of feed. (3) Spliced point:The base tape and top tape have no spliced point (4) Cavity:There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept.. 7-2.Tape Strength (1)Pull Strength Top tape Bottom tape 5N min. 165 to 180 degree (2)Peeling off force of Cover tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min Bottom tape Top tape F Base tape 7-3.Taping Condition (1)Standard quantity per reel Quantity per 180mm reel 10000 pcs. / reel (2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows. (3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4)Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (1) Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5)Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking(∗2) ,Quantity, etc) MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9118J-01 P6/10 (6)Dimensions of reel and taping(leader-tape, trailer-tape) 7-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It is depend on a quantity of an order. 8. ！ Caution 8-1.Rating Do not use products beyond the Operating Temperature Range and Rated Current. 8-2.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 8-3.Fail Safe Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 8-4.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (trains, ships, etc.) (4)Power plant control equipment (9) Data-processing equipment (5)Medical equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above 9. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 9-1.Land pattern designing • Standard land dimensions (Reflow soldering) < For BLM15 series (except BLM15P□, BLM15AX type) > Chip Ferrite Bead c a Solder Resist b Pattern Soldering Reflow a 0.4 b 1.2 c 0.5 (in mm) MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9118J-01 P7/10 < For BLM15P□, BLM15AX type > Chip Ferrite Bead Rated Current (A) 1.5 Max 2.2 Max 3.0 Max ｄ ｃ a b c 0.4 1.2 0.5 Land pad thickness and dimension d 18µm 35µm 70µm 0.5 0.5 0.5 1.2 0.7 0.5 2.4 1.2 0.5 Solder Resist ａ (in mm) ∗The excessive heat by land pads may cause deterioration at joint of products with substrate. Pattern ｂ 9-2.Soldering Conditions Products can be applied to reflow soldering. (1) Flux,Solder Flux Solder Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (3) Soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times 9-3. Soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) seconds. • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9118J-01 P8/10 9-4.Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 9-5.Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:a D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9118J-01 9-6.Mounting density P9/10 Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 9-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 9-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 9-9.Cleaning When cleaning this product, observe the following conditions. Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product before use. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the substrate vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always perform a test cleaning beforehand using an actual cleaning device, and then check the quality of the products. (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, please consult our technical department. 9-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 9-11.Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Avoid storing the product by itself bare (i.e.exposed directly to air). (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG.CO.,LTD. Reference Only Spec.No.JENF243A-9118J-01 10 . ! P10/10 Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD.