Spec No.: JENF243A_0018AN-01
P1/11
CHIP FERRITE BEAD BLM15□□□□□SN1□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip ferrite bead BLM15_SN series for general electronic equipment.
2. Part Numbering
(Ex.)
BL
Product
ID
M
Type
15
Dimension
(L × W)
AG
Characteristics
100
S
N
Impedance Performance Category
(Typical value
at 100 MHz)
1
Numbers of
circuit
D
Packaging
D: taping
3. Part Number and Rating
Operating temperature range
Storage temperature range
Customer
Part number
Murata
Part number
-55°C to +125°C
-55°C to +125°C
Impedance
(Ω)
at 100 MHz
Rated current*1
(mA)
Typ.
Ambient
Ambient
temperature temperature
85°C
125°C
DC resistance
(Ω) max.
Initial
values
Values
after
testing
Remark
BLM15AG100SN1D
5 to 15
10
-
1000
0.025
0.05
For general use
BLM15AG700SN1D
40 to 100
70
-
600
0.15
0.20
For general use
BLM15AG121SN1D
120±25%
120
-
550
0.19
0.29
For general use
BLM15AG221SN1D
220±25%
220
-
450
0.29
0.39
For general use
BLM15AG601SN1D
600±25%
600
-
300
0.52
0.62
For general use
BLM15AG102SN1D
1000±25%
1000
-
300
0.65
0.75
For general use
BLM15AX100SN1D
5 to 15
10
-
1740
0.015
0.025
For general use
BLM15AX300SN1D
30±25%
30
-
1100
0.06
0.11
For general use
BLM15AX700SN1D
70±25%
70
-
780
0.10
0.15
For general use
BLM15AX121SN1D
120±25%
120
-
700
0.13
0.18
For general use
BLM15AX221SN1D
220±25%
220
-
600
0.18
0.23
For general use
BLM15AX601SN1D
600±25%
600
-
500
0.34
0.39
For general use
BLM15AX102SN1D
1000±25%
1000
-
350
0.49
0.54
For general use
BLM15BA050SN1D
5±25%
5
-
300
0.10
0.15
For high speed
signal line
BLM15BB050SN1D
5±25%
5
-
500
0.08
0.15
For high speed
signal line
BLM15BA100SN1D
10±25%
10
-
300
0.20
0.25
For high speed
signal line
BLM15BB100SN1D
10±25%
10
-
300
0.10
0.15
For high speed
signal line
BLM15BA220SN1D
22±25%
22
-
300
0.30
0.35
For high speed
signal line
BLM15BB220SN1D
22±25%
22
-
300
0.20
0.30
For high speed
signal line
BLM15BA330SN1D
33±25%
33
-
300
0.40
0.45
For high speed
signal line
BLM15BA470SN1D
47±25%
47
-
200
0.60
0.65
For high speed
signal line
BLM15BB470SN1D
47±25%
47
-
300
0.35
0.45
For high speed
signal line
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
Customer
Part number
Murata
Part number
P2/11
Impedance
(Ω)
at 100 MHz
Typ.
Rated current*1
(mA)
Ambient
Ambient
temperature temperature
85°C
125°C
DC resistance
(Ω) max.
Initial
values
Values
after
testing
Remark
BLM15BA750SN1D
75±25%
75
-
200
0.80
0.85
For high speed
signal line
BLM15BB750SN1D
75±25%
75
-
300
0.40
0.50
For high speed
signal line
BLM15BD750SN1D
75±25%
75
-
300
0.20
0.30
For high speed
signal line
BLM15BB121SN1D
120±25%
120
-
300
0.55
0.65
For high speed
signal line
BLM15BD121SN1D
120±25%
120
-
300
0.30
0.40
For high speed
signal line
BLM15BC121SN1D
120±25%
120
-
350
0.45
0.50
For high speed
signal line
BLM15BB221SN1D
220±25%
220
-
200
0.80
0.90
For high speed
signal line
BLM15BD221SN1D
220±25%
220
-
300
0.40
0.50
For high speed
signal line
BLM15BC241SN1D
240±25%
240
-
250
0.70
0.75
For high speed
signal line
BLM15BD471SN1D
470±25%
470
-
200
0.60
0.70
For high speed
signal line
BLM15BD601SN1D
600±25%
600
-
200
0.65
0.75
For high speed
signal line
BLM15BD102SN1D
1000±25%
1000
-
200
0.90
1.0
For high speed
signal line
BLM15BD152SN1D
1500±25%
1500
-
190
1.0
1.1
For high speed
signal line
BLM15BD182SN1D
1800±25%
1800
-
100
1.4
1.5
For high speed
signal line
BLM15BX750SN1D
75±25%
75
-
600
0.15
0.20
For high speed
signal line
BLM15BX121SN1D
120±25%
120
-
600
0.17
0.22
For high speed
signal line
BLM15BX221SN1D
220±25%
220
-
450
0.27
0.32
For high speed
signal line
BLM15BX471SN1D
470±25%
470
-
350
0.41
0.46
For high speed
signal line
BLM15BX601SN1D
600±25%
600
-
350
0.46
0.51
For high speed
signal line
BLM15BX102SN1D
1000±25%
1000
-
300
0.65
0.75
For high speed
signal line
BLM15BX182SN1D
1800±25%
1800
-
250
0.90
1.0
For high speed
signal line
BLM15PG100SN1D
5 to 15
10
-
1000
0.025
0.05
For DC power line
BLM15PD300SN1D
30±25%
30
2200
1400
0.035
0.05
For DC power line
BLM15PD600SN1D
60±25%
60
1700
1100
0.06
0.075
For DC power line
BLM15PD800SN1D
80±25%
80
1500
1000
0.07
0.085
For DC power line
BLM15PD121SN1D
120±25%
120
1300
900
0.09
0.105
For DC power line
BLM15PX330SN1D
33±25%
33
3000
1700
0.022
0.037
For DC power line
BLM15PX600SN1D
60±25%
60
2500
1400
0.032
0.047
For DC power line
BLM15PX800SN1D
80±25%
80
2300
1300
0.038
0.053
For DC power line
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
Customer
Part number
P3/11
Impedance
(Ω)
at 100 MHz
Murata
Part number
Typ.
Rated current*1
(mA)
Ambient
Ambient
temperature temperature
85°C
125°C
DC resistance
(Ω) max.
Initial
values
Values
after
testing
Remark
BLM15PX121SN1D
120±25%
120
2000
1100
0.055
0.070
For DC power line
BLM15PX181SN1D
180±25%
180
1500
800
0.090
0.105
For DC power line
BLM15PX221SN1D
220±25%
220
1400
800
0.10
0.115
For DC power line
BLM15PX331SN1D
330±25%
330
1200
700
0.15
0.165
For DC power line
BLM15PX471SN1D
470±25%
470
1000
600
0.20
0.22
For DC power line
BLM15PX601SN1D
600±25%
600
900
500
0.23
0.25
For DC power line
BLM15KD200SN1D
20±25%
20
3800
2350
0.011
0.016
For DC power line
BLM15KD300SN1D
30±25%
30
3100
1900
0.017
0.022
For DC power line
BLM15KD121SN1D
120±25%
120
1500
930
0.070
0.085
For DC power line
*1 As shown in the diagram below, derating is applied to the rated current of the BLM15PD, BLM15PX, BLM15KD series based on
the operating temperature.
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
Equivalent circuit
Unit mass (typical value): 0.001 g
6. Marking
No marking.
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
P4/11
7. Electrical Performance
No.
Item
7.1
Impedance
Meet chapter 3 ratings.
Specification
Measuring equipment: Keysight 4291A or the
equivalent
Measuring frequency: 100 MHz±1 MHz
Measuring fixture: Keysight 16192A or the equivalent
Test method
7.2
DC resistance
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
Substrate wiring resistance is excluded.
8. Mechanical Performance
The product is soldered on a substrate for test. (Excluding appearance and dimensions, drop, resistance to soldering heat,
and solderability)
(Test shall be done using flux, solder and soldering condition which are specified in chapter 12 except the case of being
specified special condition.)
No.
Item
Specification
Test method
8.1 Appearance and
Meet chapter 5.
Visual inspection and measured with slide calipers.
Dimensions
8.2 Shear test
Appearance: No significant mechanical Applying force: 5 N
damage shall be observed.
Holding time: 5 s±1 s
Impedance change rate (at 100 MHz):
Force application direction:
within ±30%
DC resistance: Meet chapter 3 ratings.
8.3 Bending test
Appearance: No significant mechanical
damage shall be observed.
Impedance change rate (at 100 MHz):
within ±30%
DC resistance: Meet chapter 3 ratings.
Test substrate: glass-epoxy substrate (100 mm × 40
mm × 0.8 mm)
Pressurizing speed: 0.5 mm/s
Pressure jig: R340
Deflection: 2.0 mm
Holding time: 30 s
8.4 Vibration
Appearance: No significant mechanical
damage shall be observed.
Impedance change rate (at 100 MHz):
within ±30%
DC resistance: Meet chapter 3 ratings.
Appearance: No significant mechanical
damage shall be observed.
Impedance change rate (at 100 MHz):
within ±30%
DC resistance: Meet chapter 3 ratings.
Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for
approx. 1 min
Total amplitude: 1.5 mm
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
Flux: ethanol solution with a rosin content of 25(wt)%
Pre-heating: 150°C±10°C/60 s to 90 s
Solder: Sn-3.0Ag-0.5Cu solder
Solder temperature: 270°C±5°C
Immersion time: 10 s±0.5 s
Immersion and emersion rates: 25 mm/s
Post-treatment: left at a room condition for 48 h±4 h
The product shall be dropped on concrete or steel
board.
Method: free fall
Height: 75 cm
Attitude from which the product is dropped: 3 directions
Number of times: 3 times for each direction (Total 9
times)
8.5 Resistance to
soldering heat
8.6 Drop
Appearance shall have no significant
mechanical damage.
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
No.
Item
8.7 Solderability
P5/11
Specification
Test method
95% or more of the outer electrode shall Flux: ethanol solution with a rosin content of 25(wt)%
be covered with new solder seamlessly. Pre-heating: 150°C±10°C/60 s to 90 s
Solder: Sn-3.0Ag-0.5Cu solder
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
Immersion and emersion rates: 25 mm/s
9. Environmental Performance
The product is soldered on a glass-epoxy substrate for test.
(Test shall be done using flux, solder and soldering condition which are specified in chapter 12 except the case of being
specified special condition.)
No.
Item
Specification
Test method
9.1 Temperature cycle
Appearance: No significant mechanical Single cycle conditions:
damage shall be observed.
Step 1: -55°C (+0°C, -3°C)/30 min±3 min
Impedance change rate (at 100 MHz):
Step 2: ordinary temperature/10 min to 15 min
within ±30%
Step 3: +125°C (+3°C, -0°C)/30 min±3 min
DC resistance: Meet chapter 3 ratings.
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 100 cycles
Post-treatment: left at a room condition for 48 h±4 h
9.2 Humidity
Appearance: No significant mechanical Temperature: 40°C±2°C
damage shall be observed.
Humidity: 90% (RH) to 95% (RH)
Impedance change rate (at 100 MHz):
Test time: 1000 h (+48 h, -0 h)
within ±30%
Post-treatment: left at a room condition for 48 h±4 h
DC resistance: Meet chapter 3 ratings.
9.3 Heat life
Appearance: No significant mechanical Temperature: 125°C±3°C
damage shall be observed.
Applied current: rated current at test temperature
Impedance change rate (at 100 MHz):
Test time: 1000 h (+48 h, -0 h)
within ±30% (within ±40% for BLM15PD) Post-treatment: left at a room condition for 48 h±4 h
DC resistance: Meet chapter 3 ratings.
9.4 Cold resistance
Appearance: No significant mechanical Temperature: -55°C±2°C
damage shall be observed.
Test time: 1000 h (+48 h, -0 h)
Impedance change rate (at 100 MHz):
Post-treatment: left at a room condition for 48 h±4 h
within ±30%
DC resistance: Meet chapter 3 ratings.
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/paper tape)
A
(0.65)
B
(1.15)
t
0.8 max.
(in mm)
10.2 Taping specifications
Packing quantity
(Standard quantity)
10000 pcs/reel
Packing method
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom
tape when the cavities of the carrier tape are punched type).
Feed hole position
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
Joint
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are
seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
P6/11
10.3 Break down force of tape
Cover tape (or top tape)
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched
type)
5 N min.
10.4 Peeling off force of tape
Speed of peeling off
Peeling off force
300 mm/min
0.1 N to 0.6 N (The lower limit is for typical value.)
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
(2) Date
□□
○○○○
First digit: year/last digit of year
(1)
(2)
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHSY
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Label
H
D
W
Dimensions of outer box
(mm)
W
D
H
186
186
93
Standard reel quantity
in outer box (reel)
5
* Above outer box size is typical. It depends on a
quantity of an order.
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
11.
P7/11
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea
(4) Power plant
equipment
control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, (7) Traffic signal
(8) Disaster/crime
trains, ships, etc.)
equipment
prevention
equipment
(9) Data-processing
(10) Applications of similar complexity and/or reliability
equipment
requirements to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
11.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering:
a
0.4
b
1.2
c
0.5
(in mm)
Rated
current
(A)
a
1.5 or
lower
0.4
1.2
2.2 or
lower
0.4
3.0 or
lower
4.0 or
lower
b
c
Pattern thickness and
dimension d
18 μm
35 μm
70 μm
0.5
0.5
0.5
0.5
1.2
0.5
1.2
0.7
0.5
0.4
1.2
0.5
2.4
1.2
0.5
0.4
1.2
0.5
2.4
1.2
1.0
If heat generation from patterns is large, please pay attention since
the joint of products with substrates may deteriorate.
(in mm)
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
P8/11
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 200 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
150°C to 180°C/90 s±30 s
Heating
Above 220°C/30 s to 60 s
Above 230°C/60 s max.
245°C±3°C
260°C/10 s
2 times
2 times
Peak temperature
Number of reflow cycles
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
Number of reworking operations
150°C/approx. 1 min
350°C max.
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal
shock.
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
P9/11
12.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
〈 Poor example〉
〈 Good example〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D*1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the
board separation surface.
A>C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
P10/11
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.8 Cleaning
When cleaning this product, observe the following conditions.
Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product before use.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the substrate
vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always perform a test cleaning
beforehand using an actual cleaning device, and then check the quality of the products.
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner.
When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is
left.
* For other cleaning, please consult our technical department.
12.9 Storage and transportation
Storage period
Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading
to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
12.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
MURATA MFG CO., LTD
Spec No.: JENF243A_0018AN-01
P11/11
12.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD