Spec.No.JENF243A-0023N-01
Reference Only
P.1/8
GHz Noise Suppression Chip Ferrite Bead
BLM15E□□□□SN1□ Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM15E_SN series.
2.Part Numbering
(ex.)
BL
M
15
EG
121
S
N
1
D
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Customer
Part Number
MURATA
Part Number
Impedance (Ω)
(Under Standard
Testing Condition)
at 1GHz
at 100MHz
Typical
RatedCurrent
(mA)
at 85℃
at 125℃
DC Resistance
(Ω max.)
Values Remark
Initial
After
Values
Testing
R a te d C u rre n t ( A )
BLM15EG121SN1D
0.095
900*1
120±25% 100min 145
1500*1
BLM15EG121SN1B
BLM15EG221SN1D
500*1
0.28
220±25% 180min 270
700*1
BLM15EG221SN1B
BLM15EX121SN1D
1200*1
0.075
120±25%
170±40%
1800*1
BLM15EX121SN1B
BLM15EX221SN1D
850*1
0.140
220±25%
300±40%
1300*1
BLM15EX221SN1B
BLM15EX331SN1D
700*1
0.205
330±25%
450±40%
1100*1
BLM15EX331SN1B
BLM15EX471SN1D
470±25%
630±40%
950*1
600*1
0.280
BLM15EX471SN1B
■Operating Temperature : -55°C to +125°C
■Storage Temperature : -55°C to +125°C
(Note) As for the Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
0.37
0.085
0.155
0.225
0.310
Rated current
at 85°C
Rated current
at 125°C
0
4.Style and Dimensions
85
125
Operating Temperature (°C)
0.5±0.05
■ Equivalent Circuit
0.5±0.05
1.0±0.05
0.13
(
0.25±0.1
Resistance element becomes
dominant at high frequencies.
: Electrode
(in mm)
■ Unit Mass (Typical value)
0.001g
5.Marking
No marking.
6.Standard Testing Conditions
< Unless otherwise specified >
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
< In case of doubt >
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
MURATA MFG.CO.,LTD.
)
For
general
use
Spec.No.JENF243A-0023N-01
Reference Only
P.2/8
7.Specifications
7-1.Electrical Performance
No.
Item
7-1-1 Impedance
Specification
Meet item 3.
7-1-2
Meet item 3.
DC Resistance
Test Method
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
7-2. Mechanical Performance
No.
Item
7-2-1 Appearance and
Dimensions
7-2-2 Bonding
Strength
Specification
Meet item 4.
Test Method
Visual Inspection and measured with Slide Calipers.
Meet Table 1.
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
Table 1
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
No damage
Side view
Ｆ
Within ±30%
Ｆ
R0.5
Meet item 3.
Substrate
7-2-3
Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Pressure jig
R340
F
Deflection
45mm
7-2-4
Vibration
7-2-5
Resistance
to Soldering
Heat
7-2-6
Drop
Products shall be no failure
after tested.
45mm
Product
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz
for 20 min
Total Amplitude 1.5mm or Acceleration 196m/s2
whichever is smaller
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction
(Total 9 times)
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0023N-01
No.
Item
7ｰ2-7 Solderability
Reference Only
Specification
The electrodes shall be at
least 95% covered with new
solder coating.
P.3/8
Test Method
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Heat Shock
Meet Table 1.
7-3-2
Humidity
7-3-3
Heat Life
7-3-4
Cold
Resistance
Test Method
1 cycle :
1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : +125 °C(+3 °C,-0 °C) / 30min±3min
Shift Time:30s max
Total of 500 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 70°C±2°C
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
Applying Current : Rated Current (at Test temperature)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
1.15(Typ.)
0.65(Typ.)
8.0 ±0.3
+0.1
φ 1.5 -0
3.5±0.05
2.0±0.05
2.0±0.05 4.0±0.1
1.75 ±0.1
8. Specification of Packaging
8-1.Appearance and Dimensions (8mm-wide paper tape)
0.8max.
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
Direction of Feed
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0023N-01
P.4/8
8-2.Tape Strength
(1)Pull Strength
Top tape
5N min.
Bottom tape
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
165 to 180 degree
Bottom tape
Top tape
F
Base tape
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel
10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc)
∗1) « Expression of Inspection No. »
(1) Factory Code
(2) Date
□□
(1)
OOOO ×××
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(∗2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
8-4. Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
∗ Above Outer Case size is typical. It depends on a quantity of an
order.
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0023N-01
P.5/8
9. ！ Caution
9-1. Surge current
Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment
(7)Traffic signal equipment
(3)Undersea equipment
(8)Transportation equipment (vehicles, trains, ships, etc.)
(4)Power plant control equipment
(9) Data-processing equipment
(5)Medical equipment
(10)Applications of similar complexity and /or reliability
requirements to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
• Standard land dimensions (Reflow soldering)
Chip Ferrite Bead
c
a
Solder Resist
b
Pattern
Soldering
Reflow
a
0.4
b
1.2
c
0.5
(in mm)
Chip Ferrite Bead
ｄ
ｃ
Land pad thickness
and dimension d
18µm 35µm 70µm
0.5
0.5
0.5
1.2
0.4
0.5
1.2
0.7
0.5
(in mm)
∗The excessive heat by land pads may cause
deterioration at joint of products with substrate.
Rated
Current
(A)
1.3 Max
1.8 Max
Solder Resist
ａ
Pattern
ｂ
a
b
c
10-2.Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux
Solder
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0023N-01
P.6/8
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time. (s)
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
2 times
Limit Profile
above 230°C、60s max.
260°C,10s
2 times
10-3. Reworking with soldering iron
• Pre-heating : 150°C, 1 min
• Tip temperature : 350°C max.
• Soldering time : 3(+1,-0) seconds.
• Soldering iron output : 80W max.
• Tip diameter :φ3mm max.
• Times : 2times max.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4.Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0023N-01
P.7/8
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
a
b
〈 Poor example 〉
Products shall be located in the sideways
direction (Length:a D *1
A > B
A > C
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as
possible.
Screw Hole
Recommended
10-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0023N-01
Reference Only
P.8/8
10-7.Cleaning
When cleaning this product, observe the following conditions.
Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product
before use.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature
shall be 40°C max.
(2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the
substrate vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always
perform a test cleaning beforehand using an actual cleaning device, and then check the quality of the products.
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner.
When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that
no cleaner is left.
* For other cleaning, please consult our technical department.
10-8. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance
of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-9. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11.Storage Conditions
(1)Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
• Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Avoid storing the product by itself bare (i.e.exposed directly to air).
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11 . !
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD.
