Reference Only
Spec. No. JENF243A-0021N-01
GHz Noise Suppression Chip Ferrite Bead
BLM18EG□□□□N1□
P.1/8
Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM18EG_□N Series.
2. Part Numbering
M
18
EG
601
S
N
1
D
(ex.)
BL
(1)
(2)
(3)
(4)
(5)
(6) (7) (8)
(9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3. Rating
Customer
Part Number
DC Resistance
( max. )
Rated
Current Initial Values
at 1GHz
(mA) Values After
Typical
Testing
Impedance ()
(Under Standard Testing Condition)
MURATA
Part Number
at 100MHz
BLM18EG101TN1D
BLM18EG101TN1B
BLM18EG221TN1D
BLM18EG221TN1B
BLM18EG331TN1D
BLM18EG331TN1B
BLM18EG391TN1D
BLM18EG391TN1B
BLM18EG121SN1D
BLM18EG121SN1B
BLM18EG221SN1D
BLM18EG221SN1B
BLM18EG471SN1D
BLM18EG471SN1B
BLM18EG601SN1D
BLM18EG601SN1B
Operating Temperature : -55°C to +125°C
100±25%
80 min.
140
2000
0.045
0.07
220±25%
180 min.
300
1000
0.15
0.21
330±25%
280 min.
450
500
0.21
0.30
390±25%
320 min.
520
500
0.30
0.40
120±25%
90 min.
145
2000
0.04
0.06
220±25%
160 min.
260
2000
0.05
0.08
470±25%
340 min.
550
500
0.21
0.30
600±25%
450 min.
700
500
0.35
0.45
For
general
use
(Thin type)
For
general
use
Storage Temperature : -55°C to +125°C
As for BLM18EG type,Rated Current is derated as right figure
depending on the operating temperature.
t
n
e
r
r
u
C
d
e
t
a
R
3
2
2A
1
0
4. Style and Dimensions
1.6±0.15
Remark
85
125
Operating Temperature（ ℃ ）
0.8±0.15
T
■ Equivalent Circuit
0.4±0.2
(
: Electrode
■Unit Mass (Typical value)
BLM18EGTN1 : 0.004g
BLM18EGSN1 : 0.005g
Part Number
BLM18EGTN1
BLM18EGSN1
Dimension(T)
0.5±0.15
0.8±0.15
(in mm)
MURATA MFG.CO., LTD.
)
Resistance element becomes
dominant at high frequencies.
Spec. No. JENF243A-0021N-01
Reference Only
P.2/8
5. Marking
No marking.
6. Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
7. Specifications
7-1. Electrical Performance
No.
Item
Specification
7-1-1 Impedance
Meet item 3.
7-1-2 DC Resistance
Meet item 3.
7-2. Mechanical Performance
No.
Item
Specification
7-2-1 Appearance and Meet item 4.
Dimensions
7-2-2 Bonding
Meet Table 1.
Strength
Table 1
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
Test Method
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : Agilent4291A or the equivalent
Test Fixture : Agilent16192A or the equivalent
Measuring Equipment : Digital multi meter
Test Method
Visual Inspection and measured with Slide Calipers.
It shall be soldered on the substrate.
Applying Force(F) : 10N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
No damage
Side view
Ｆ
Ｆ
Within ±30%
R0.5
Meet item 3.
Substrate
7-2ｰ3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm40mm1.6mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Pressure jig
R340
F
Deflection
45mm
7-2ｰ4 Vibration
7-2-5 Resistance
to Soldering
Heat
7-2-6 Drop
Products shall be no failure
after tested.
45mm
Product
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz
for 20 min
2
Total Amplitude 1.5mm or Acceleration 196m/s
whichever is smaller
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s∼90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition for
48h±4h.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1m
The number of times : 10 times
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0021N-01
No.
Item
7-2-7 Solderability
Reference Only
Specification
The electrodes shall be
at least 95% covered
with new solder coating.
P.3/8
Test Method
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s∼90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Temperature
Meet Table 1.
Cycle
Test Method
1 cycle:
1 step: -55 °C (+0 °C, -3 °C) / 30min±3min
2 step: Ordinary temp. / 3min max.
3 step: +125 °C (+3 °C, -0 °C) / 30min±3min
4 step: Ordinary temp. / 3min max.
Total of 100 cycles
Then measured after exposure in the room condition for
48h±4h.
Temperature : 85°C±2°C
Humidity : 80%(RH) to 85%(RH)
Time : 1000h (+48h, -0h)
Then measured after exposure in the room condition for
48h±4h.
Temperature : 125°C±3°C
Applying Current : Rated Current
Time : 1000h (+48h, -0h)
Then measured after exposure in the room condition for
48h±4h.
Temperature : -55±2°C
Time : 1000h (+48h, -0h)
Then measured after exposure in the room condition for
48h±4h.
7-3-2 Humidity
7-3-3 Heat Life
7-3-4 Cold Resistance
1.85±0.1
8.0±0.3
+0.1
1.5 -0
3.5± 0.05
2.0±0.05
4.0±0.1
4.0±0.1
1.75±0.1
8. Specification of Packaging
8-1. Appearance and Dimensions (8mm-wide paper tape)
Part Number
a
1.05±0.1
Direction of feed
BLM18EGTN1
BLM18EGSN1
Dimension
(a)
0.85 max.
1.1 max.
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 4mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point
The base tape and top tape have no spliced point
(4) Cavity
There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0021N-01
8-2. Tape Strength
(1)Pull Strength
Top tape
Bottom tape
P.4/8
5N min.
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
Speed of Peeling off:300mm/min
165 to 180 degree
Top tape
F
Bottom tape
Base tape
8-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2) There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number (1), RoHS marking (2), Quantity, etc)
1) « Expression of Inspection No. »
□□
OOOO
(1)
(1) Factory Code
(2) Date
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (2), Quantity , etc)
(6) Dimensions of reel and taping (leader-tape, trailer-tape)
Leader
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Empty tape
Top tape
Label
13.0±0.2
1
60± 0
21.0±0.8
9± 10
Direction of feed
13±1.4
0
180± 3
(in mm)
8-4. Specification of Outer Case
Label
H
D
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an order.
W
MURATA MFG.CO., LTD.
Spec.No.JENF243A-0021M-01
Reference Only
P.5/8
9. ！ Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (vehicles, trains, ships, etc.)
(9)Applications of similar complexity and /or reliability requirements to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
Standard land dimensions (Flow and Reflow soldering)
Chip Ferrite Bead
c
a
Solder Resist
b
Pattern
Soldering
Flow
Reflow
a
0.7
b
2.2 to 2.6
1.8 to 2.0
c
0.7
(in mm)
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux, Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
MURATA MFG.CO., LTD.
Reference Only
Spec.No.JENF243A-0021M-01
P.6/8
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time. (s)
Standard Profile
150°C, 60s min.
250°C, 4s~6s
2 times
Pre-heating
Heating
Cycle of flow
Limit Profile
265°C±3°C, 5s max.
2 times
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s∼60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
10-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min
Tip temperature: 350°C max.
Soldering time : 3 (+1, -0) s
Time. (s)
Standard Profile
150°C~180°C, 90s±30s
above 220°C, 30s~60s
245°C±3°C
2 times
Limit Profile
above 230°C, 60s max.
260°C, 10s
2 times
Soldering iron output: 80W max.
Tip diameter: φ3mm max.
Times : 2times max.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite
material due to the thermal shock.
MURATA MFG.CO., LTD.
Reference Only
Spec.No.JENF243A-0021M-01
P.7/8
10-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
(T: Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
a
b
〈 Poor example〉
Products shall be located in the sideways
direction (Length: ab) to the mechanical
stress.
〈 Good example〉
(2)Products location on P.C.B. separation.
Seam
b
C
B
D
A
Slit
Length:a b
Products (A, B, C, D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACB D.
a
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
10-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
MURATA MFG.CO., LTD.
Spec.No.JENF243A-0021M-01
Reference Only
P.8/8
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw
to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11. Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11.
! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
