BLM18EG221SZ1D

Reference Only Spec. No. JENF243A-9124A-01 P.1/8 GHz Noise Suppression Chip Ferrite Bead BLM18EG□□□□Z1□ Murata Standard Reference Specification [AEC-Q200] 1. Scope This reference specification applies to Chip Ferrite Bead BLM18EG_□Z Series for Automotive Electronics based on AEC-Q200 except for Power train and Safety. 2. Part Numbering (ex.) BL M 18 EG 601 S Z 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (2)Type (3)Dimension(L×W) (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance (7)Category(for Automotive Electronics) (8)Numbers of Circuit (9)Packaging(D:Taping) 3. Rating Customer Part Number Impedance (Ω) (Under Standard Testing Condition) (*1) (refer to below comment) MURATA Part Number Rated Current (mA) at 1GHz at 100MHz Typical BLM18EG101TZ1D BLM18EG221TZ1D BLM18EG331TZ1D BLM18EG391TZ1D BLM18EG121SZ1D BLM18EG221SZ1D 100±25% 80 min. 140 2000 220±25% 180 min. 300 1000 280 min. 450 500 330±25% 390±25% 320 min. 520 500 120±25% 90 min. 145 2000 220±25% 160 min. 260 2000 470±25% BLM18EG471SZ1D 340 min. 550 500 BLM18EG601SZ1D 600±25% 450 min. 700 500 • Operating Temperature : -55°C to +125°C • Storage Temperature : -55°C to +125°C (*1) DC Resistance (Ω max. ) (*1) refer to below comment) Initial Values Values After Testing 0.045 0.07 0.15 0.21 0.21 0.30 0.30 0.40 0.04 0.06 0.05 0.06 0.21 0.35 0.30 0.45 Remark ESD Rank 2:2kV For general use (Thin type) 2 For general use 2 Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa As for BLM18EG type,Rated Current is derated as right figure depending on the operating temperature. 3 t n e r r u C d e t a R 2 2A 1 0 125 Operating Temperature（ ℃ ） 4. Style and Dimensions 0.8±0.15 ■ Equivalent Circuit T 1.6±0.15 85 ( 0.4±0.2 : Electrode Part Number BLM18EG∗∗∗TZ1 BLM18EG∗∗∗SZ1 Dimension(T) 0.5±0.15 0.8±0.15 ■ Unit Mass (Typical value) BLM18EG∗∗∗TZ1 : 0.004g BLM18EG∗∗∗SZ1 : 0.005g (in mm) MURATA MFG.CO., LTD. ) Resistance element becomes dominant at high frequencies. Reference Only Spec. No. JENF243A-9124A-01 P.2/8 5. Marking No marking. 6. Specifications 6-1. Electrical Performance No. Item Specification 6-1-1 Impedance Meet item 3. 6-1-2 DC Resistance Meet item 3. Test Method Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz Measuring Equipment : KEYSIGHT 4291A or the equivalent Test Fixture : KEYSIGHT 16192A or the equivalent Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire 6-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 Murata Specification / Deviation No. Stress Test Method 3 High 1000hours at 125 deg C Meet Table A after testing. Temperature Set for 24hours at room Table A Exposure temperature, then measured. Appearance No damage Impedance Change Within ±30% (at 100MHz) DC Meet item 3. Resistance 4 Temperature Cycling 1000cycles -55 deg C to +125 deg C Set for 24hours at room temperature, then measured. Meet Table B. Table B Appearance Impedance Change (at 100MHz) DC Resistance No damage Within +50%/-10% Meet item 3. 5 Destructive Physical Analysis Per EIA469 No electrical tests No defects 7 Biased Humidity 1000hours at 85 deg C, 85%RH Apply max rated current. Meet Table A after testing. 9 8 External Visual Operational Life Visual inspection Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured No abnormalities Meet Table A after testing. If the rated current of parts exceed 1A, the operating temperature should be 85 deg C. 10 Physical Dimension Meet ITEM 4 （Style and Dimensions） 12 Resistance to Solvents Per MIL-STD-202 Method 215 13 Mechanical Shock 14 Vibration 15 Resistance to Soldering Heat Per MIL-STD-202 Method 213 Condition F 1500g's (14.7N)/0.5ms/ Half sine 5g's(0.049N) for 20 minutes, 12cycles each of 3 orientations Test from 10-2000Hz. Solder temperature 260C+/-5 deg C Immersion time 10s No defects Not Applicable Meet Table A after testing. Meet Table A after testing. Pre-heating:150C +/-10 deg,60s to 90s Meet Table A after testing. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9124A-01 P.3/8 AEC-Q200 No. 17 ESD Stress Murata Specification / Deviation Test Method Per AEC-Q200-002 Meet Table A after testing. ESD Rank: Meet Item 3.(Rating) 18 Solderability Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. 19 Electrical Characterization Measured : Impedance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Per AEC-Q200-006 Meet Table A after testing. Per ISO-7637-2 Not Applicable 22 Terminal Strength 30 Electrical Transient Conduction No defects +0.1 1.85±0.1 3.5±0.05 φ 1.5 -0 8.0±0.3 2.0±0.05 4.0±0.1 4.0±0.1 1.75±0.1 7. Specification of Packaging 7-1. Appearance and Dimensions (8mm-wide paper tape) Part Number BLM18EG∗∗∗TZ1 BLM18EG∗∗∗SZ1 Dimension (a) 0.85 max. 1.1 max. (in mm) a 1.05±0.1 (1) Taping Direction of feed Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed by top tape and bottom tape. (2) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point The base tape and top tape have no spliced point (4) Cavity There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous.The specified quantity per reel is kept. 7-2. Tape Strength (1)Pull Strength Top tape Bottom tape 165 to 180 degree 5N min. (2)Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) ∗Speed of Peeling off:300mm/min Bottom tape MURATA MFG.CO., LTD. Top tape F Base tape Reference Only Spec. No. JENF243A-9124A-01 P.4/8 7-3. Taping Condition (1) Standard quantity per reel Quantity per 180mm reel: 4000 pcs. / reel (2) There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1), RoHS marking (∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (1) Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking(∗2) , Quantity , etc) (6) Dimensions of reel and taping(leader-tape, trailer-tape) Leader Trailer 2.0±0.5 160 min. 190 min. 210 min. Empty tape Top tape Label φ 13.0±0.2 1 φ 60± 0 φ 21.0±0.8 9± 10 Direction of feed 13±1.4 0 φ 180± 3 (in mm) 7-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9124A-01 P.5/8 8. ！ Caution 8-1.Rating Do not use products beyond the Operating Temperature Range and Rated Current. 8-2.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 8-3. Fail Safe Be sure to provide an appropreate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 8-4. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment (7)Traffic signal equipment (8)Transportation equipment (trains, ships, etc.) (9)Data-processing equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above. 9. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 9-1. Land pattern designing • Standard land dimensions (Flow and Reflow soldering) Chip Ferrite Bead c a Solder Resist b Pattern Soldering Flow Reflow a 0.8 0.7 b 2.5 2.0 c 0.7 0.7 (in mm) 9-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9124A-01 P.6/8 □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile 60s min. Pre-heating Heating Cycle of flow Time. (s) Standard Profile 150°C, 60s min. 250°C, 4s~6s 2 times Limit Profile 265°C±3°C, 5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow 9-3. Reworking with soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) s Standard Profile 150°C~180°C, 90s±30s above 220°C, 30s~60s 245°C±3°C 2 times Time. (s) Limit Profile above 230°C, 60s max. 260°C, 10s 2 times • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9124A-01 P.7/8 9-4. Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 9-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are are not subject to the mechanical stress for board warpage. a b 〈 Poor example〉 Products shall be located in the sideways direction (Length:a D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Recommended 9-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9124A-01 P.8/8 9-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 9-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 9-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA) (2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max. (3)Cleaner 1.Cleaner •Isopropyl alcohol (IPA) 2.Aqueous agent •PINE ALPHA ST-100S (4)There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5)Other cleaning Please contact us. 9-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 9-11. Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 10. ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.