Spec. No. JENF243A-9104G-01
Reference Only
P.1/9
GHz Noise Suppression Chip Ferrite Bead BLM18H□□□□SH1□
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM18H_SH Series
based on AEC-Q200.
2. Part Numbering
(ex.)
BL
(1)
M
(2)
18
(3)
HG
(4)
601
(5)
(1)Product ID
(2)Type
(3)Dimension (L×W)
(4)Characteristics
(5)Typical Impedance at 100MHz
S
(6)
H
(7)
1
(8)
D
(9)
(6)Performance
(7)Category(for Automotive Electronics)
(8)Numbers of Circuit
(9)Packaging (D:Taping )
3. Rating
Customer
Part Number
MURATA
Part Number
Impedance ()
(Under Standard Testing Condition)
(*1) (refer to below comment)
at 1GHz
at 100MHz
BLM18HG471SH1D
BLM18HG601SH1D
BLM18HG102SH1D
BLM18HD471SH1D
BLM18HD601SH1D
BLM18HD102SH1D
BLM18HE601SH1D
BLM18HE102SH1D
BLM18HE152SH1D
Rated
Current
(mA)
470±25%
600±25%
1000±25%
470±25%
600±25%
1000±25%
600±25%
1000±25%
1500±25%
Typical
400 min.
450 min.
750 min.
700 min.
850 min.
1100 min.
300 min.
500min.
750min.
Operating Temperature : -55°C to +125°C
600
700
1000
1000
1200
1700
600
1000
1500
at
at
125℃
200
200
100
100
100
50
800(*2) 600(*2)
600(*2) 500(*2)
500(*2) 400(*2)
85℃
DC Resistance
( max. )
(*1) (refer to
below comment)
Initial
Values
Values After
Testing
0.85
1.0
1.6
1.2
1.5
1.8
0.25
0.35
0.50
Remark
0.95 For
1.1 general
1.7 use
1.3 For
1.6 high speed
1.9 signal line
0.30
For
0.40
power line
0.55
Storage Temperature : -55°C to +125°C
(*1)
Standard Testing Conditions
(Note) As for the Rated current marked with (*2),
Rated Current is derated as right figure
depending on the operating temperature.
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
R a te d C u rre n t ( A )
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Rated current
at 85°C
Rated current
at 125°C
0
85
125
Operating Temperature (°C)
MURATA MFG.CO., LTD.
ESD Rank
1C:1kV
1C
Spec. No. JENF243A-9104G-01
Reference Only
P.2/9
4. Style and Dimensions
1.6±0.15
0.8±0.15
0.8±0.15
■ Equivalent Circuit
0.4±0.2
(
: Electrode
)
Resistance element becomes
dominant at high frequencies.
■ Unit Mass (Typical value)
0.005g
(in mm)
5. Marking
No marking.
6. Specifications
6-1. Electrical Performance
No.
Item
6-1-1 Impedance
Specification
Meet item 3.
6-1-2 DC Resistance
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : KEYSIGHT 4291A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
6-2. Mechanical Performance
(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
No.
Stress
3
4
High
Temperature
Exposure
Temperature
Cycling
AEC-Q200
Test Method
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
1000cycles
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Murata Specification / Deviation
Meet Table A after testing.
Table A
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
No damage
Within ±30%
Meet item 3.
Meet Table B after testing.
Table B
Appearance
No damage
Impedance
Within ±30%
Change
(BLM18HE
(at 100MHz) Within±50%)
DC
Resistance
5
7
Destructive
Physical Analysis
Biased Humidity
8
Operational Life
9
External Visual
Meet item 3.
Per EIA469
No defects
No electrical tests
1000hours at 85 deg C, 85%RH Meet Table B after testing.
Apply max rated current.
Apply 125 deg C 1000hours
Meet Table B after testing.
Set for 24hours at room
temperature, then measured
Visual inspection
No abnormalities
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9104G-01
Reference Only
AEC-Q200
Stress
Test Method
Physical Dimension Meet ITEM 4
(Style and Dimensions)
Resistance to
Per MIL-STD-202 Method 215
Solvents
Mechanical Shock
Per MIL-STD-202 Method 213
Condition F
1500g(14.7N)/0.5ms/Half sine
Not Applicable
14
Vibration
5g's(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Meet Table A after testing.
15
Resistance
to Soldering Heat
17
ESD
Solder temperature
260C+/-5 deg C
Immersion time 10s
Per AEC-Q200-002
18
Solderability
Per J-STD-002
No.
10
12
13
19
Electrical
Characterization
Murata Specification / Deviation
No defects
Meet Table A after testing.
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table B after testing.
Meet Table A after testing.
ESD Rank:Meet Item 3. (Rating)
Method b : Not Applicable
95% of the terminations is to be soldered.
Measured : Impedance
No defects
20
Flammability
Per UL-94
Not Applicable
21
Board Flex
Epoxy-PCB 1.6mm
Deflection 2mm(min)
60s minimum holding time
Meet Table A after testing.
22
Terminal Strength
Per AEC-Q200-006
No defects
30
Electrical
Transient
Conduction
Per ISO-7637-2
Not Applicable
MURATA MFG.CO., LTD.
P.3/9
Reference Only
2.0±0.05
4.0±0.1
4.0±0.1
1.75±0.1
7. Specification of Packaging
7-1. Appearance and Dimensions (8mm-wide paper tape)
P.4/9
+0.1
1.85±0.1
3.5±0.05
1.5 -0
8.0±0.3
Spec. No. JENF243A-9104G-01
1.05±0.1
1.1max.
(in mm)
Direction of feed
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point
The base tape and top tape have no spliced point
(4) Cavity
There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
7-2. Tape Strength
(1)Pull Strength
Top tape
Bottom tape
5N min.
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
165 to 180 degree
Bottom tape
Top tape
F
Base tape
7-3. Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc)
1) « Expression of Inspection No. »
□□
(1)
(1) Factory Code
(2) Date
OOOO
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9104G-01
Reference Only
P.5/9
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
7-4. Specification of Outer Case
Label
H
D
Outer Case Dimensions
Standard Reel Quantity in Outer
(mm)
Case (Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an order.
W
8. ! Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product
may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3. Fail Safe
Be sure to provide an appropreate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (trains, ships, etc.)
(9)Data-processing equipment
(10)Applications of similar complexity and /or reliability requirements to the applications listed in the above
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9104G-01
Reference Only
P.6/9
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1. Land pattern designing
Standard land dimensions (Flow and Reflow soldering)
Chip Ferrite Bead
c
a
Solder Resist
b
Pattern
Soldering
Flow
Reflow
a
0.8
0.7
b
2.5
2.0
c
0.7
0.7
(in mm)
9-2. Soldering conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Time. (s)
60s min.
Pre-heating
Heating
Cycle of flow
Standard Profile
Standard Profile
150°C, 60s min.
250°C, 4s~6s
2 times
Limit Profile
265°C±3°C, 5s max.
2 times
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9104G-01
P.7/9
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
9-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min
Tip temperature: 350°C max.
Soldering time : 3(+1,-0) seconds.
Time. (s)
Standard Profile
150°C~180°C, 90s±30s
above 220°C, 30s~60s
245°C±3°C
2 times
Limit Profile
above 230°C, 60s max.
260°C, 10s
2 times
Soldering iron output: 80W max.
Tip diameter:φ3mm max.
Times : 2times max.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
ferrite material due to the thermal shock.
9-4. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T (T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9104G-01
P.8/9
9-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
a
Products shall be located in the sideways direction
(Length:ab) to the mechanical stress.
b
〈 Poor example 〉
〈 Good example 〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Perforation
Stress Level
A > D *1
A > B
A > C
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw Hole
Recommended
9-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9104G-01
Reference Only
P.9/9
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
9-9. Cleaning Conditions
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or
broken solder joints. Before starting your production process,
test your cleaning equipment / process to insure it does not degrade this product.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress such as bending or twisting to the substrate when
cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the Product.
Bending
Twisting
9-11. Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10 .
! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.