Spec. No. JENF243A-0004R-01
P.1/9
GHz Noise Suppression Chip Ferrite Bead
BLM18H□□□□SN1□ Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM18H_SN Series.
2. Part Numbering
(ex.)
BL
M
(1)
(2)
18
(3)
HG
(4)
601
(5)
S
(6)
N
(7)
1
(8)
D
(9)
(1)Product ID (2)Type (3)Dimension(L×W) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3. Rating
MURATA
Part Number
BLM18HE601SN1D
BLM18HE601SN1B
BLM18HE102SN1D
BLM18HE102SN1B
BLM18HE152SN1D
BLM18HE152SN1B
BLM18HG471SN1D
BLM18HG471SN1B
BLM18HG601SN1D
BLM18HG601SN1B
BLM18HG102SN1D
BLM18HG102SN1B
BLM18HD471SN1D
BLM18HD471SN1B
BLM18HD601SN1D
BLM18HD601SN1B
BLM18HD102SN1D
BLM18HD102SN1B
BLM18HB121SN1D
BLM18HB121SN1B
BLM18HB221SN1D
BLM18HB221SN1B
BLM18HB331SN1D
BLM18HB331SN1B
BLM18HK331SN1D
BLM18HK331SN1B
BLM18HK471SN1D
BLM18HK471SN1B
BLM18HK601SN1D
BLM18HK601SN1B
BLM18HK102SN1D
BLM18HK102SN1B
at 100MHz
(Note)
Rated Current
(mA)
DC Resistance
( max. )
at
Typical 85℃
at
125℃
Initial
Values
Values
After
Testing
at 1GHz
Remark
600±25%
300 min.
600
800*1
600*1
0.25
0.30
1000±25%
500 min.
1000
600*1
500*1
0.35
For
0.40 Large
Current
1500±25%
750 min.
1500
500*1
400*1
0.50
0.55
470±25%
400 min.
600
200
0.85
600±25%
450 min.
700
200
1.0
For
1.1 general
use
1000±25%
750 min.
1000
100
1.6
1.7
470±25%
700 min.
1000
100
1.2
1.3
600±25%
850 min.
1200
100
1.5
1.6
1000±25%
1100 min.
1700
50
1.8
0.95
120±25%
500±40%
200
0.5
1.9 For
high speed
0.6 signal line
220±25%
1100±40%
100
0.8
0.9
330±25%
1600±40%
50
1.2
1.3
330±25%
400±40%
200
0.5
0.6
470±25%
600±40%
200
0.7
600±25%
700±40%
100
0.9
0.8 For
Digital
1.0 Interface
1000±25%
1200±40%
50
1.5
1.6
Operating Temperature : -55°C to +125°C
Storage Temperature : -55°C to +125°C
(Note) As for the Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
R a te d C u rre n t (A )
Customer
Part Number
Impedance ()
(Under Standard Testing Condition)
Rated current
at 85°C
Rated current
at 125°C
MURATA MFG.CO., LTD.
0
85
125
Operating Temperature (°C)
Spec. No. JENF243A-0004R-01
P.2/9
4. Style and Dimensions
1.6±0.15
0.8±0.15
0.8±0.15
■ Equivalent Circuit
0.4±0.2
(
)
Resistance element becomes
dominant at high frequencies.
: Electrode
(in mm)
■ Unit Mass (Typical value)
0.005g
5. Marking
No marking.
6. Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
7. Specifications
7-1. Electrical Performance
No.
Item
Specification
7-1-1 Impedance
Meet item 3.
7-1-2 DC Resistance
Meet item 3.
7-2. Mechanical Performance
No.
Item
Specification
7-2-1 Appearance and Meet item 4.
Dimensions
7-2-2 Bonding
Meet Table 1.
Strength
Table 1
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
No damage
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
Test Method
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
Test Method
Visual Inspection and measured with Slide Calipers.
It shall be soldered on the substrate.
Applying Force(F) : 6.8N
Applying Time : 5s±1s
Applied direction:Parallel to substrate
Side view
F
Within ±30%
F
R0.5
Meet item 3.
Substrate
7-2ー3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm40mm1.0mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Pressure jig
R340
F
Deflection
45mm
MURATA MFG.CO., LTD.
45mm
Product
Spec. No. JENF243A-0004R-01
No.
Item
7-2ー4 Vibration
P.3/9
Specification
Meet Table 1.
7-2-5 Resistance
to Soldering
Heat
7-2ー6 Drop
Products shall be no failure
after tested.
7-2-7 Solderability
The electrodes shall be at
least 95% covered with new
solder coating.
7-3. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Temperature
Meet Table 1.
Cycle
7-3-2 Humidity
7-3-3 Heat Life
7-3-4 Cold
Resistance
Meet Table 2.
Table 2
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
Meet Table 1.
No damage
Within ±30%
(for BLM18HE
Within ±40%)
Test Method
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s~90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition for 48h±4h.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction
(Total 9 times)
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s~90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
Test Method
1 cycle:
1 step:-55 °C(+0 °C,-3 °C) / 30min±3min
2 step:Ordinary temp. / 10min to 15min
3 step:+125 °C(+3 °C,-0 °C) / 30min±3min
4 step: Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
Applying Current : Rated Current (at 125°C)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Meet item 3.
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0004R-01
P.4/9
+0.1
1.85±0.1
3.5± 0.05
1.5 -0
8.0±0.3
2.0±0.05
4.0±0.1
4.0±0.1
1.75±0.1
8. Specification of Packaging
8-1. Appearance and Dimensions (8mm-wide paper tape)
1.05±0.1
1.1max.
Direction of feed
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point
The base tape and top tape have no spliced point
(4) Cavity
There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
8-2. Tape Strength
(1) Pull Strength
Top tape
Bottom tape
5N min.
(2) Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
165 to 180 degree
Bottom tape
Top tape
F
Base tape
8-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2) There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS marking (2), Quantity, etc)
1) « Expression of Inspection No. »
□□
(1)
(1) Factory Code
(2) Date
OOOO
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (2) , Quantity , etc)
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0004R-01
P.5/9
(6) Dimensions of reel and taping(leader-tape, trailer-tape)
8-4. Specification of Outer Case
Label
H
D
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an order.
W
9. ! Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (vehicles, trains, ships, etc.)
(9)Data-processing equipment
(10)Applications of similar complexity and /or reliability requirements to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
Standard land dimensions (Flow and Reflow soldering)
Chip Ferrite Bead
c
a
Solder Resist
b
Pattern
Soldering
Flow
Reflow
a
0.8
0.7
b
2.5
2.0
c
0.7
0.7
(in mm)
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0004R-01
P.6/9
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Pre-heating
Heating
Cycle of flow
Standard Profile
150°C, 60s min.
250°C, 4s~6s
2 times
Standard Profile
Time. (s)
Limit Profile
265°C±3°C, 5s max.
2 times
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150°C~180°C, 90s±30s
above 220°C, 30s~60s
245°C±3°C
2 times
Time. (s)
Limit Profile
above 230°C, 60s max.
260°C, 10s
2 times
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0004R-01
P.7/9
10-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min
Tip temperature: 350°C max.
Soldering time : 3(+1,-0) seconds.
Soldering iron output: 80W max.
Tip diameter:φ3mm max.
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
(T: Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
a
b
〈 Poor example〉
Products shall be located in the sideways
direction (Length: ab) to the mechanical
stress.
〈 Good example〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Perforation
Stress Level
A > D *1
A > B
A > C
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw Hole
Recommended
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0004R-01
P.8/9
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
10-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA)
(2) During ultrasonic cleaning, under some cleaning conditions, the resonation of PCB should be caused by
its vibration. Be sure to do the test cleaning with actual cleaning equipment before production and confirm
that product does not be damaged by cleaning.
(3)Cleaner
1.Cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order
to remove the cleaner.
(5)Other cleaning
Please contact us.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11. Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0004R-01
11.
P.9/9
! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.