Spec. No. JENF243A-9122M-01
P.1/11
Chip Ferrite Bead BLM18□□□□□□Z1D
Murata Standard Reference Specification [AEC-Q200]
1.Scope
This reference specification applies to Chip Ferrite Bead BLM18_□Z Series for Automotive Electronics based on
AEC-Q200 except for Power train and Safety.
2.Part Numbering
(ex.)
BL
M
18
(1)
(2)
(3)
(1)Product ID
(2)Type
(3)Dimension (L×Ｗ)
AG
121
S
Z
1
D
(4)
(5)
(6)
(7) (8)
(9)
(4)Characteristics
(7)Category(for Automotive Electronics)
(5)Typical Impedance at 100MHz (8)Numbers of Circuit
(6)Performance
(9)Packaging (D:Taping)
3.Rating
Customer
Part Number
MURATA
Part Number
Impedance ()
(at 100MHz)(*1)
(refer to below
comment)
Typical
20 min.
33±25%
DC Resistance
( max.) (*1)
(refer to below
comment)
Rated
Current
(mA)
at
85℃
at
125℃
1000
3000*2 1000*2
BLM18PG300SZ1D
BLM18PG330SZ1D
BLM18PG600SZ1D
BLM18PG121SZ1D
BLM18PG181SZ1D
BLM18PG221SZ1D
BLM18PG331SZ1D
BLM18PG471SZ1D
40 min.
120±25%
180±25%
220±25%
330±25%
470±25%
30
33
60
120
180
220
330
470
BLM18SP300SZ1D
BLM18SP101SZ1D
BLM18SP221SZ1D
BLM18SP601SZ1D
BLM18SP102SZ1D
30±10
100±25%
220±25%
600±25%
1000±25%
30
100
220
600
1000
6000*1
3700*1
2800*1
1500*1
1200*1
BLM18KG221SZ1D
BLM18KG331SZ1D
220±25%
330±25%
220
330
BLM18KG471SZ1D
BLM18KG601SZ1D
BLM18KG102SZ1D
BLM18AG121SZ1D
BLM18AG151SZ1D
BLM18AG221SZ1D
BLM18AG331SZ1D
BLM18AG471SZ1D
470±25%
600±25%
1000±25％
120±25%
150±25%
220±25%
330±25%
470±25%
470
600
1000
120
150
220
330
470
2200*2 1500*2
1700*2 1200*2
1500*2 1000*2
1000
2000*2 1000*2
1500*2 1000*2
1400*2 1000*2
1200*2 1000*2
1000
4000*1
2500*1
1900*1
1000*1
800*1
*2
*2
1300 1000
1000*2 800*2
800
700
700
600
550
MURATA MFG.CO., LTD.
Remark
Initial
Values
Values
After
Testing
0.05
0.025
0.1
0.05
0.09
0.10
0.15
0.20
0.10
0.050
0.2
0.10
0.18
0.14
0.20
0.26
0.008
0.022
0.040
0.140
0.185
0.010 For DC
0.026 power line
0.048
0.168
0.222
0.050
0.080
0.060
0.095
0.130
0.150
0.200
0.18
0.25
0.25
0.30
0.35
0.145
0.165
0.230
0.28
0.35
0.35
0.40
0.45
For
general use
ESD Rank
2:2kV
2
Spec. No. JENF243A-9122M-01
Customer
Part Number
MURATA
Part Number
P.2/11
Impedance ()
(at 100MHz)(*1)
(refer to below
comment)
Typical
BLM18AG601SZ1D
BLM18AG102SZ1D
BLM18BB050SZ1D
BLM18BA050SZ1D
BLM18BB100SZ1D
BLM18BA100SZ1D
BLM18BB220SZ1D
BLM18BA220SZ1D
BLM18BB470SZ1D
BLM18BD470SZ1D
BLM18BA470SZ1D
BLM18BB600SZ1D
BLM18BA750SZ1D
BLM18BB750SZ1D
BLM18BB121SZ1D
BLM18BD121SZ1D
BLM18BA121SZ1D
BLM18BB141SZ1D
BLM18BB151SZ1D
BLM18BD151SZ1D
BLM18BB221SZ1D
BLM18BD221SZ1D
BLM18BB331SZ1D
BLM18BD331SZ1D
BLM18BD421SZ1D
BLM18BB471SZ1D
BLM18BD471SZ1D
BLM18BD601SZ1D
BLM18BD102SZ1D
BLM18BD152SZ1D
BLM18BD182SZ1D
BLM18BD222SZ1D
BLM18BD252SZ1D
BLM18SG260TZ1D
BLM18SG700TZ1D
BLM18SG121TZ1D
BLM18SG221TZ1D
BLM18SG331TZ1D
BLM18SN220TZ1D
BLM18KG260TZ1D
BLM18KG300TZ1D
BLM18KG700TZ1D
BLM18KG101TZ1D
BLM18KG121TZ1D
600±25%
1000±25%
5±25%
5±25%
10±25%
10±25%
22±25%
22±25%
47±25%
47±25％
47±25%
60±25%
75±25%
75±25%
120±25%
120±25%
120±25%
140±25%
150±25%
150±25%
220±25%
220±25%
330±25%
330±25%
420±25%
470±25%
470±25%
600±25%
1000±25%
1500±25%
1800±25%
2200±25%
2500±25%
26±25%
70±25%
120±25%
220±25%
330±25%
22±7%
26±25%
30±25%
70±25%
100±25%
120±25%
Operating Temperature : -55°C to +125°C
600
1000
5
5
10
10
22
22
47
47
47
60
75
75
120
120
120
140
150
150
220
220
330
330
420
470
470
600
1000
1500
1800
2200
2500
26
70
120
220
330
22
26
30
70
100
120
Rated
Current
(mA)
at
85℃
at
125℃
500
450
800
500
700
500
700
500
600
500
300
600
300
600
550
300
200
500
450
300
450
250
400
250
250
300
250
200
200
150
150
150
150
6000*2 1000*2
4000*2 1000*2
3000*2 1000*2
2500*2 1000*2
1500*2 1000*2
8000*2 5000*2
6000*2 4000*2
5000*2 3300*2
3500*2 2200*2
3000*2 1900*2
3000*2 1900*2
DC Resistance
( max.) (*1)
(refer to below
comment)
Initial
Values
0.38
0.50
0.05
0.2
0.10
0.25
0.20
0.35
0.25
0.3
0.55
0.25
0.70
0.30
0.30
0.4
0.9
0.35
0.37
0.4
0.45
0.45
0.58
0.5
0.55
0.85
0.55
0.65
0.85
1.2
1.5
1.5
1.5
0.007
0.020
0.025
0.040
0.070
0.004
0.007
0.010
0.022
0.030
0.030
Values
After
Testing
0.48
0.60
0.10
0.3
0.20
0.35
0.30
0.45
0.35
0.4
0.65
0.35
0.80
0.40
0.40
0.5
1.0
0.45
0.47
0.5
0.55
0.55
0.68
0.6
0.65
0.95
0.65
0.75
0.95
1.3
1.6
1.6
1.6
0.012
0.030
0.035
0.055
0.085
0.005
0.012
0.015
0.032
0.040
0.040
Remark
For
general use
For
high speed
signal line
2
For
high speed
signal line
For DC
power line
(Thin type)
Storage Temperature : -55°C to +125°C
MURATA MFG.CO., LTD.
ESD Rank
2:2kV
Spec. No. JENF243A-9122M-01
P.3/11
(*1)
Standard Testing Conditions
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
R a te d C u rre n t ( A )
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
(*2)In case of Rated current is more than 1A,
Rated Current is derated as right figure
depending on the operating temperature.
Rated current
at 85°C
Rated current
at 125°C
0
85
125
Operating Temperature (°C)
4.Style and Dimensions
1.6±0.15
0.8±0.15
0.8±0.15
■ Equivalent Circuit
T
0.4±0.2
: Electrode
T
(in mm)
BLM18SG***TZ1D
BLM18KG***TZ1D
BLM18SN***TZ1D
BLM18*****SZ1D
0.5±0.15
0.6±0.15
(
)
Resistance element becomes
dominant at high frequencies.
■ Unit Mass (Typical value)
BLM18*****TZ1D
0.004g
BLM18*****SZ1D
0.005g
0.8±0.15
5.Marking
No marking.
6.Specifications
6-1.Electrical Performance
No.
Item
6-1-1 Impedance
Specification
Meet item 3.
6-1-2 DC Resistance
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
Measuring Equipment : Digital multi meter
For BLM18SN
Measuring Equipment : YOKOGAWA 755611 or the equivalent
Test Fixture : KEYSIGHT 16044A or the equivalent
＊Except resistance of the Substrate and Wire
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9122M-01
P.4/11
6-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
No.
Stress
Test Method
1000hours at 125 deg C
3
High
Set for 24hours at room
Temperature
temperature, then measured.
Exposure
Murata Specification / Deviation
Meet Table A after testing.
Table A
Appearance
No damage
Impedance
Within ±30%
（for BLM18SN
Change
Within ±50%）
(at 100MHz)
DC
Meet item 3.
Resistance
4
Temperature Cycling
1000cycles
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table B after testing.
TableB
Appearance
No damage
Impedance
Within ±30%
（for BLM18SN
Change
Within ±50%）
(at 100MHz)
(for BLM18KG
Within-10%to+50%)
DC Resistance Meet item 3.
5
Destructive
Physical Analysis
Biased Humidity
Per EIA469
No electrical tests
1000hours at 85 deg C, 85%RH
Apply max rated current.
No defects
7
Meet Table C after testing.
TableC
Appearance
No damage
Impedance
Within ±30%
（for BLM18KG/SN
Change
Within ±50%）
(at 100MHz)
DC
Meet item 3.
Resistance
8
Operational Life
Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table C after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
9
External Visual
Visual inspection
No abnormalities
10
Physical Dimension
Meet ITEM 4
（Style and Dimensions）
No defects
12
Resistance to Solvents Per MIL-STD-202
Method 215
Mechanical Shock
Per MIL-STD-202 Method 213
Condition F
1500g's (14.7N)/0.5ms/
Half sine
Not Applicable
14
Vibration
5g's(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Meet Table D after testing.
15
Resistance
to Soldering Heat
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table C after testing.
13
Meet Table D after testing.
Table D
Appearance
No damage
Impedance
Change
Within ±30%
(at 100MHz)
DC Resistance
Meet item 3.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9122M-01
P.5/11
AEC-Q200
No.
Stress
Murata Specification / Deviation
17
ESD
Test Method
Per AEC-Q200-002
18
Solderability
Per J-STD-002
19
Measured : Impedance
20
Electrical
Characterization
Flammability
Method b : Not Applicable
95% of the terminations is to be soldered.
No defects
Per UL-94
Not Applicable
21
Board Flex
Meet Table C after testing.
22
Terminal Strength
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding tim
Per AEC-Q200-006
No defects
30
Electrical
Transient
Conduction
Per ISO-7637-2
Not Applicable
Meet Table D after testing.
ESD Rank: Meet Item 3. (Rating)
7.Specification of Packaging
7-1.Appearance and Dimensions (8mm-wide paper tape)
Appearance and Dimensions
8mmwide Paper tape
1.85±0.1
BLM18PG***SZ1D
BLM18SP***SZ1D
BLM18AG***SZ1D
BLM18B****SZ1D
BLM18SN***TZ1D
BLM18KG****Z1D
+0.1
1.5 -0
3.5±0.05
2.0±0.05
4.0±0.1
4.0±0.1
8.0±0.3
Type
1.75±0.1
Part Number
4mm-pitch
1.05±0.1
a
Direction of feed
2mm-pitch
1.05±0.1
0.85 max.
8.0±0.3
8mmwide Paper tape
1.85±0.1
BLM18SG***TZ1D
+0.1
1.5 -0
3.5±0.05
2.0±0.05
2.0±0.05
2.0±0.1 4.0±0.1
Dimension “a”
1.1 max.
1.75±0.1
Item
BLM18*****SZ1D
BLM18KG***TZ1D
BLM18SN***TZ1D
0.9max.
Direction of Feed
(in mm)
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9122M-01
P.6/11
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously
and sealed by top tape and bottom tape.
(2) The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
7-2.Tape Strength
(1)Pull Strength
Top tape
Bottom tape
Top tape
165 to 180 degree
5N min.
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
F
Bottom tape
Base tape
7-3.Taping Condition
(1)Standard quantity per reel
Type
BLM18(except BLM18SG)
BLM18SG
Quantity per 180mm reel
4000 pcs. / reel
10000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2) , Quantity, etc)
1) « Expression of Inspection No. »
□□ OOOO
(1)
(1) Factory Code
(2) Date
(2)
(3)
First digit
: Year/ Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS discrimination(2) ,Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
2.0±0.5
Trailer
160 min.
Leader
Label
190 min.
Empty tape
210 min.
Top tape
13.0±0.2
+1
60 -0
21.0±0.8
9.0 +1
-0
Direction of feed
13.0±1.4
+0
180 -3
(in mm)
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9122M-01
P.7/11
7-4. Specification of Outer Case
Label
H
D
W
8.
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an order.
Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment
(7)Traffic signal equipment
(3)Undersea equipment
(8)Transportation equipment (trains,ships,etc.)
(4)Power plant control equipment
(9)Data-processing equipment
(5)Medical equipment
(10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1.Land pattern designing
Standard land dimensions
< For BLM18 series (except BLM18P/BLM18S/BLM18K type) >
Chip Ferrite Bead
Type
BLM18 (except18P/18S/
BLM18K type)
c
a
Solder Resist
b
Pattern
MURATA MFG.CO., LTD.
Soldering
Flow
Reflow
a
0.8
0.7
b
2.5
2.0
c
0.7
0.7
(in mm)
Spec. No. JENF243A-9122M-01
P.8/11
< For BLM18P/BLM18S/BLM18K type >
Chip Ferrite Bead
Land pad thickness
Rated
and dimension d
Current Soldering
a
b
c
(A)
18µm 35µm 70µm
0.5 to 1.5
0.7
0.7
0.7
BLM18P
1.7 to 2.5
1.2
0.7
0.7
Flow
Flow
BLM18S
3 to 4
2.4
1.2
0.7
Flow/
0.8
2.5
BLM18K
0.7
Reflow Reflow Reflow
5 to 6
6.4
3.3 1.65
2.0
0.7
BLM18SN
8
6.4
3.3
BLM18SP 1.2 to 6.0
6.4
The excessive heat by land pads may cause deterioration
(in mm)
at joint of products with substrate.
Type
c
d
a
Solder Resist
b
Pattern
9-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3)soldering profile
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Pre-heating
Heating
Cycle of flow
Standard Profile
150℃、60s min.
250℃、4～6s
2 times
Standard Profile
Time. (s)
Limit Profile
265℃±3℃、5s max.
2 times
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9122M-01
P.9/11
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time. (s)
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
2 times
Pre-heating
Heating
Peak temperature
Cycle of reflow
Limit Profile
above 230°C、60s max.
260°C,10s
2 times
9-3.Reworking with soldering iron
Pre-heating: 150°C, 1 min
Tip temperature: 350°C max.
Soldering time : 3(+1,-0) seconds.
Soldering iron output: 80W max.
Tip diameter:φ3mm max.
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
t
9-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
a
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
b
〈 Poor example〉
〈 Good example〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
MURATA MFG.CO., LTD.
Stress Level
A > D *1
A > B
A > C
Spec. No. JENF243A-9122M-01
Perforation
P.10/11
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw Hole
Recommended
9-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
9-9.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) During ultrasonic cleaning, under some cleaning conditions, the resonation of PCB should be caused by
its vibration .Be sure to do the test cleaning with actual cleaning equipment before production and confirm
that product does not be damaged by cleaning.
(3)Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9122M-01
P.11/11
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10.
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
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