Reference Only
Spec. No. JENF243A-9101V-01
P.1/10
Chip Ferrite Bead BLM18□□□□□□H1D
Murata Standard Reference Specification[AEC-Q200]
1.Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM18_□H Series based on AEC-Q200.
2.Part Numbering
(ex.)
BL
M
18
(1)
(2)
(3)
(1)Product ID
(2)Type
(3)Dimension (L×Ｗ)
AG
121
S
Ｈ
1
D
(4)
(5)
(6)
(7) (8)
(9)
(4)Characteristics
(7)Category(for Automotive Electronics)
(5)Typical Impedance at 100MHz (8)Numbers of Circuit
(6)Performance
(9)Packaging (D:Taping)
3.Rating
Customer
Part Number
MURATA
Part Number
Impedance ()
(at 100MHz)(*1)
(refer to below comment)
Typical
BLM18PG300SH1D
BLM18PG330SH1D
BLM18PG600SH1D
BLM18PG121SH1D
BLM18PG181SH1D
BLM18PG221SH1D
BLM18PG331SH1D
BLM18PG471SH1D
BLM18SP300SH1D
BLM18SP101SH1D
BLM18SP221SH1D
BLM18SP601SH1D
BLM18SP102SH1D
BLM18KG221SH1D
BLM18KG331SH1D
BLM18KG471SH1D
BLM18KG601SH1D
BLM18KG102SH1D
BLM18SN220TH1D
BLM18KG260TH1D
BLM18KG300TH1D
BLM18KG700TH1D
BLM18KG101TH1D
BLM18KG121TH1D
BLM18AG121SH1D
BLM18AG151SH1D
BLM18AG221SH1D
BLM18AG331SH1D
BLM18AG471SH1D
BLM18AG601SH1D
BLM18AG102SH1D
20 min.
33±25%
40 min.
120±25%
180±25%
220±25%
330±25%
470±25%
30±10
100±25%
220±25%
600±25%
1000±25%
220±25%
330±25%
470±25%
600±25%
1000±25%
22±7
26±25%
30±25%
70±25%
100±25%
120±25%
120±25%
150±25%
220±25%
330±25%
470±25%
600±25%
1000±25%
30
33
60
120
180
220
330
470
30
100
220
600
1000
220
330
470
600
1000
22
26
30
70
100
120
120
150
220
330
470
600
1000
DC Resistance
( max.) (*1)
(refer to below
comment)
Initial
Values
Values After
at 85℃ at 125℃
Testing
1000
0.05
0.10
3000*2 1000*2
0.025
0.050
1000
0.1
0.2
2000*2 1000*2
0.05
0.10
1500*2 1000*2
0.09
0.18
1400*2 1000*2
0.10
0.14
1200*2 1000*2
0.15
0.20
1000
0.20
0.26
6000*2 4000*2
0.010
0.008
3700*2 2500*2
0.026
0.022
2800*2 1900*2
0.048
0.040
1500*2 1000*2
0.168
0.140
1200*2
800*2
0.222
0.185
2200*2 1500*2
0.050
0.060
1700*2 1200*2
0.080
0.095
1500*2 1000*2
0.130
0.145
1300*2 1000*2
0.150
0.165
1000*2
800*2
0.200
0.230
8000*2 5000*2
0.004
0.005
6000*2 4000*2
0.007
0.012
5000*2 3300*2
0.010
0.015
3500*2 2200*2
0.022
0.032
3000*2 1900*2
0.030
0.040
3000*2 1900*2
0.030
0.040
800
0.18
0.28
700
0.25
0.35
700
0.25
0.35
600
0.30
0.40
550
0.35
0.45
500
0.38
0.48
450
0.50
0.60
Rated
Current
(mA)
MURATA MFG.CO., LTD.
Remark
ESD Rank
2:2kV
6:25kV
6
For DC
power line
2
For DC
power line
(Thin type)
2
For
general
use
2
Reference Only
Spec. No. JENF243A-9101V-01
Customer
Part Number
MURATA
Part Number
P.2/10
Impedance ()
(at 100MHz)(*1)
(refer to below comment)
Typical
5±25%
5±25%
10±25%
10±25%
22±25%
22±25%
47±25%
47±25%
47±25%
5
5
10
10
22
22
47
47
47
BLM18BB600SH1D
BLM18BA750SH1D
BLM18BB750SH1D
BLM18BB121SH1D
BLM18BD121SH1D
BLM18BA121SH1D
BLM18BB141SH1D
BLM18BB151SH1D
BLM18BD151SH1D
BLM18BB221SH1D
BLM18BD221SH1D
BLM18BB331SH1D
BLM18BD331SH1D
BLM18BD421SH1D
BLM18BB471SH1D
BLM18BD471SH1D
BLM18BD601SH1D
BLM18BD102SH1D
BLM18BD152SH1D
BLM18BD182SH1D
BLM18BD222SH1D
BLM18BD252SH1D
60±25%
75±25%
75±25%
120±25%
120±25%
120±25%
140±25%
150±25%
150±25%
220±25%
220±25%
330±25%
330±25%
420±25%
470±25%
470±25%
600±25%
1000±25%
1500±25%
1800±25%
2200±25%
2500±25%
60
75
75
120
120
120
140
150
150
220
220
330
330
420
470
470
600
1000
1500
1800
2200
2500
600
300
600
550
300
200
500
450
300
450
250
400
250
250
300
250
200
200
150
150
150
150
0.25
0.70
0.30
0.30
0.4
0.9
0.35
0.37
0.4
0.45
0.45
0.58
0.5
0.55
0.85
0.55
0.65
0.85
1.2
1.5
1.5
1.5
0.35
0.80
0.40
0.40
0.5
1.0
0.45
0.47
0.5
0.55
0.55
0.68
0.6
0.65
0.95
0.65
0.75
0.95
1.3
1.6
1.6
1.6
For
high speed
signal line
Storage Temperature : -55°C to +125°C
Operating Temperature : -55°C to +125°C
(*1)
Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
(Note)As for Rated currentmarked with *2,
Rated Current is derated as right figure
depending on the operating temperature.
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
R a te d C u rre n t ( A )
BLM18BB050SH1D
BLM18BA050SH1D
BLM18BB100SH1D
BLM18BA100SH1D
BLM18BB220SH1D
BLM18BA220SH1D
BLM18BB470SH1D
BLM18BD470SH1D
BLM18BA470SH1D
DC Resistance
( max.) (*1)
Rated
(refer to below
ESD Rank
Current
comment)
Remark
2:2kV
(mA)
6:25kV
Initial
Values
Values After
at 85℃ at 125℃
Testing
800
0.05
0.10
500
0.2
0.3
700
0.10
0.20
500
0.25
0.35 For
700
0.20
0.30 high speed
2
500
0.35
0.45 signal line
600
0.25
0.35
500
0.3
0.4
300
0.55
0.65
Rated current
at 85°C
Rated current
at 125°C
0
85
125
Operating Temperature (°C)
MURATA MFG.CO., LTD.
2
Reference Only
Spec. No. JENF243A-9101V-01
P.3/10
4.Style and Dimensions
1.6 ±0.15
0 . 8 ±0 . 1 5
■ Equivalent Circuit
Ｔ
0 . 4 ± 0 .2
: E le c t r o d e
P/N
BLM18_SH
BLM18_TH
(
)
Resistance element becomes
dominant at high frequencies.
■ Unit Mass (Typical value)
BLM18_SH：0.005g
BLM18_TH：0.004g
T
0.8±0.15
0.6±0.15
(in mm)
5.Marking
No marking.
6.Specifications
6-1.Electrical Performance
No.
Item
6-1-1 Impedance
Specification
Meet item 3.
6-1-2 DC Resistance
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
Measuring Equipment : Digital multi meter
For BLM18SN
Measuring Equipment : YOKOGAWA 755611 or the equivalent
Test Fixture : KEYSIGHT 16044A or the equivalent
＊Except resistance of the Substrate and Wire
6-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Stress
Test Method
No.
3
High
1000hours at 125 deg C
Temperature
Set for 24hours at room
Exposure
temperature, then measured.
Murata Specification / Deviation
Meet Table A after testing.
Table A
Appearance
No damage
Impedance
Within ±30%
Change
（for BLM18SN
(at 100MHz)
Within ±50%）
DC
Resistance
4
Temperature Cycling
1000cycles
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Meet item 3.
Meet Table B after testing.
TableB
Appearance
No damage
Impedance
Within ±30%
（for BLM18SN
Change
Within ±50%）
(at 100MHz)
(for BLM18KG
Within-10%to+50%)
DC Resistance Meet item 3.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101V-01
P.4/10
AEC-Q200
Murata Specification / Deviation
5
Stress
Destructive
Physical Analysis
Test Method
Per EIA469
No electrical tests
7
Biased Humidity
1000hours at 85 deg C, 85%RH Meet Table C after testing.
Apply max rated current.
TableC
No.
No defects
Appearance
No damage
Impedance
Within ±30%
（for BLM18KG/SN
Change
Within ±50%）
(at 100MHz)
DC
Meet item 3.
Resistance
8
Operational Life
Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table C after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
9
10
External Visual
Physical Dimension
No abnormalities
No defects
12
Resistance to Solvents
13
Mechanical Shock
Visual inspection
Meet ITEM 4
（Style and Dimensions）
Per MIL-STD-202
Method 215
Per MIL-STD-202 Method 213
Condition F
1500g's (14.7N)/0.5ms/
Half sine
14
Vibration
15
Resistance
to Soldering Heat
17
Not Applicable
Meet Table D after testing.
Table D
Appearance
Impedance
Change
(at 100MHz)
DC Resistance
No damage
Within ±30%
Meet item 3.
5g's(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Solder temperature
260C+/-5 deg C
Immersion time 10s
Meet Table D after testing.
ESD
Per AEC-Q200-002
Meet Table D after testing.
ESD Rank: Meet Item 3. (Rating)
18
Solderability
Per J-STD-002
Method b : Not Applicable
95% of the terminations is to be soldered.
19
Electrical
Characterization
Measured : Impedance
No defects
20
21
Flammability
Board Flex
Not Applicable
Meet Table C after testing.
22
Terminal Strength
Per UL-94
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding tim
Per AEC-Q200-006
30
Electrical
Transient
Conduction
Per ISO-7637-2
Not Applicable
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table C after testing.
No defects
MURATA MFG.CO., LTD.
Reference Only
P.5/10
2.0±0.05
4.0±0.1
4.0±0.1
+0.1
1.85±0.1
3.5±0.05
1.5 -0
8.0±0.3
7.Specification of Packaging
7-1.Appearance and Dimensions (8mm-wide paper tape)
1.75±0.1
Spec. No. JENF243A-9101V-01
1.05±0.1
1.1max.
BLM18_SH：1.1 max.
Direction of feed
BLM18_TH：0.85max.
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously
and sealed by top tape and bottom tape.
(2) The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel are kept.
7-2.Tape Strength
(1)Pull Strength
Top tape
Bottom tape
5N min.
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
165 to 180 degree
Bottom tape
Top tape
F
Base tape
7-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2) , Quantity, etc)
1) « Expression of Inspection No. »
□□ OOOO
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101V-01
P.6/10
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS discrimination(2) ,Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
7-4. Specification of Outer Case
Label
H
D
W
8.
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an order.
Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment
(7)Traffic signal equipment
(3)Undersea equipment
(8)Transportation equipment (trains,ships,etc.)
(4)Power plant control equipment
(9)Data-processing equipment
(5)Medical equipment
(10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101V-01
P.7/10
8-5. Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration
due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1.Land pattern designing
< For BLM18 series
(except BLM18P/BLM18S/BLM18K type) >
Chip Ferrite Bead
Type
BLM18 (except18P/18S/
BLM18K type)
c
a
Solder Resist
b
Pattern
Soldering
Flow
Reflow
a
0.8
0.7
b
2.5
2.0
c
0.7
0.7
(in mm)
< For BLM18P/BLM18S/BLM18K type >
Chip Ferrite Bead
Rated
Current Soldering
a
b
(A)
0.5 to 1.5
BLM18P 1.7 to 2.5
Flow
Flow
BLM18K
3 to 4
0.8
Flow/
2.5
Reflow Reflow Reflow
5 to 6
2.0
0.7
BLM18SN
8
BLM18SP 1.2 to 6.0
Type
c
d
a
b
c
0.7
Land pad thickness
and dimension d
18µm 35µm 70µm
0.7
0.7
0.7
1.2
0.7
0.7
2.4
1.2
0.7
6.4
3.3 1.65
6.4
3.3
6.4
(in mm)
Solder Resist
Pattern
The excessive heat by land pads may cause deterioration
at joint of products with substrate.
9-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101V-01
P.8/10
(3)soldering profile
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Pre-heating
Heating
Cycle of flow
Standard Profile
Time. (s)
Standard Profile
150℃、60s min.
250℃、4～6s
2 times
Limit Profile
265℃±3℃、5s max.
2 times
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
9-3.Reworking with soldering iron
Pre-heating: 150°C, 1 min
Tip temperature: 350°C max.
Soldering time : 3(+1,-0) seconds.
Time. (s)
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
2 times
Limit Profile
above 230°C、60s max.
260°C,10s
2 times
Soldering iron output: 80W max.
Tip diameter:φ3mm max.
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
t
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101V-01
P.9/10
9-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
a
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
b
〈 Poor example〉
〈 Good example〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Perforation
Stress Level
A > D *1
A > B
A > C
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw Hole
Recommended
9-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101V-01
P.10/10
9-9. Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken
solder joints. Before starting your production process,
test your cleaning equipment / process to insure it does not degrade this product.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10.
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
工商网监
湘ICP备2023018690号
