Reference Only
Spec. No. JENF243A-0003AK-01
P.1/12
Chip Ferrite Bead BLM18□□□□□□N1□ Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM18_□N Series.
2.Part Numbering
(ex.)
BL
M
18
AG
121
S
N
1
D
(1)
(2)
(3)
(4)
(5)
(6)
(7) (8)
(9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Customer
Part Number
MURATA
Part Number
BLM18RK121SN1D
BLM18RK121SN1B
BLM18RK221SN1D
BLM18RK221SN1B
BLM18RK471SN1D
BLM18RK471SN1B
BLM18RK601SN1D
BLM18RK601SN1B
BLM18RK102SN1D
BLM18RK102SN1B
BLM18PG300SN1D
BLM18PG300SN1B
BLM18PG330SN1D
BLM18PG330SN1B
BLM18PG600SN1D
BLM18PG600SN1B
BLM18PG121SN1D
BLM18PG121SN1B
BLM18PG181SN1D
BLM18PG181SN1B
BLM18PG221SN1D
BLM18PG221SN1B
BLM18PG331SN1D
BLM18PG331SN1B
BLM18PG471SN1D
BLM18PG471SN1B
BLM18SP300SN1D
BLM18SP300SN1B
BLM18SP101SN1D
BLM18SP101SN1B
BLM18SP221SN1D
BLM18SP221SN1B
BLM18SP601SN1D
BLM18SP601SN1B
BLM18SP102SN1D
BLM18SP102SN1B
Impedance ()
(at 100MHz, Under Standard
Testing Condition)
Rated
Current
(mA)
at
at
Typical
85℃
125℃
DC Resistance
( max.)
Values
Initial
After
Values
Testing
120±25%
120
200
0.25
0.35
220±25%
220
200
0.30
0.40
470±25%
470
200
0.50
0.60
600±25%
600
200
0.60
0.70
1000±25%
1000
200
0.80
0.90
20 min.
30
1000
0.05
0.10
33±25%
33
0.025
0.050
40 min.
60
0.1
0.2
120±25%
120
2000*1
1000*1
0.05
0.10
180±25%
180
1500*1
1000*1
0.09
0.18
220±25%
220
1400*1
1000*1
0.10
0.14
330±25%
330
1200*1
1000*1
0.15
0.20
470±25%
470
0.20
0.26
30±10
30
6000*1
4000*1
0.008
0.010
100±25％
100
3700*1
2500*1
0.022
0.026
220±25％
220
2800*1
1900*1
0.040
0.048
600±25％
600
1500*1
1000*1
0.140
0.168
1000±25％
1000
1200*1
800*1
0.185
0.222
MURATA MFG.CO., LTD.
3000*1
1000*1
1000
1000
Remark
For
Digital
Interface
For DC
power line
Reference Only
Spec. No. JENF243A-0003AK-01
Customer
Part Number
MURATA
Part Number
BLM18KG221SN1D
BLM18KG221SN1B
BLM18KG331SN1D
BLM18KG331SN1B
BLM18KG471SN1D
BLM18KG471SN1B
BLM18KG601SN1D
BLM18KG601SN1B
BLM18KG102SN1D
BLM18KG102SN1B
BLM18SD220SN1D
BLM18SD220SN1B
BLM18SG330SN1D
BLM18SG330SN1B
BLM18AG121SN1D
BLM18AG121SN1B
BLM18AG151SN1D
BLM18AG151SN1B
BLM18AG221SN1D
BLM18AG221SN1B
BLM18AG331SN1D
BLM18AG331SN1B
BLM18AG471SN1D
BLM18AG471SN1B
BLM18AG601SN1D
BLM18AG601SN1B
BLM18AG102SN1D
BLM18AG102SN1B
BLM18BB050SN1D
BLM18BB050SN1B
BLM18BA050SN1D
BLM18BA050SN1B
BLM18BB100SN1D
BLM18BB100SN1B
BLM18BA100SN1D
BLM18BA100SN1B
BLM18BB220SN1D
BLM18BB220SN1B
BLM18BA220SN1D
BLM18BA220SN1B
BLM18BB470SN1D
BLM18BB470SN1B
BLM18BD470SN1D
BLM18BD470SN1B
BLM18BA470SN1D
BLM18BA470SN1B
BLM18BB600SN1D
BLM18BB600SN1B
BLM18BA750SN1D
BLM18BA750SN1B
BLM18BB750SN1D
BLM18BB750SN1B
P.2/12
Impedance ()
(at 100MHz, Under Standard
Testing Condition)
Rated
Current
(mA)
at
at
Typical
85℃
125℃
DC Resistance
( max.)
Values
Initial
After
Values
Testing
220±25％
220
2200*1
1500*1
0.050
0.060
330±25％
330
1700*1
1200*1
0.080
0.095
470±25％
470
1500*1
1000*1
0.130
0.145
600±25％
600
1300*1
1000*1
0.150
0.165
1000±25％
1000
1000*1
800*1
0.200
0.230
22±25％
22
6000*1
3500*1
0.008
0.013
33±25％
33
6000*1
3500*1
0.008
0.013
120±25%
120
800
0.18
0.28
150±25%
150
700
0.25
0.35
220±25%
220
700
0.25
0.35
330±25%
330
600
0.30
0.40
470±25%
470
550
0.35
0.45
600±25%
600
500
0.38
0.48
1000±25%
1000
450
0.50
0.60
5±25%
5
800
0.05
0.10
5±25%
5
500
0.2
0.3
10±25%
10
700
0.10
0.20
10±25%
10
500
0.25
0.35
22±25%
22
700
0.20
0.30
22±25%
22
500
0.35
0.45
47±25%
47
600
0.25
0.35
47±25%
47
500
0.3
0.4
47±25%
47
300
0.55
0.65
60±25%
60
600
0.25
0.35
75±25%
75
300
0.70
0.80
75±25%
75
600
0.30
0.40
MURATA MFG.CO., LTD.
Remark
For DC
power line
For
general
use
For
high speed
signal line
Reference Only
Spec. No. JENF243A-0003AK-01
Customer
Part Number
MURATA
Part Number
BLM18BB121SN1D
BLM18BB121SN1B
BLM18BD121SN1D
BLM18BD121SN1B
BLM18BA121SN1D
BLM18BA121SN1B
BLM18BB141SN1D
BLM18BB141SN1B
BLM18BB151SN1D
BLM18BB151SN1B
BLM18BD151SN1D
BLM18BD151SN1B
BLM18BB221SN1D
BLM18BB221SN1B
BLM18BD221SN1D
BLM18BD221SN1B
BLM18BB331SN1D
BLM18BB331SN1B
BLM18BD331SN1D
BLM18BD331SN1B
BLM18BD421SN1D
BLM18BD421SN1B
BLM18BB471SN1D
BLM18BB471SN1B
BLM18BD471SN1D
BLM18BD471SN1B
BLM18BD601SN1D
BLM18BD601SN1B
BLM18BD102SN1D
BLM18BD102SN1B
BLM18BD152SN1D
BLM18BD152SN1B
BLM18BD182SN1D
BLM18BD182SN1B
BLM18BD222SN1D
BLM18BD222SN1B
BLM18BD252SN1D
BLM18BD252SN1B
BLM18SG260TN1D
BLM18SG260TN1B
BLM18SG700TN1D
BLM18SG700TN1B
BLM18SG121TN1D
BLM18SG121TN1B
P.3/12
Impedance ()
(at 100MHz, Under Standard
Testing Condition)
Rated
Current
(mA)
at
at
Typical
85℃
125℃
DC Resistance
( max.)
Values
Initial
After
Values
Testing
120±25%
120
550
0.30
0.40
120±25%
120
300
0.4
0.5
120±25%
120
200
0.9
1.0
140±25%
140
500
0.35
0.45
150±25%
150
450
0.37
0.47
150±25%
150
300
0.4
0.5
220±25%
220
450
0.45
0.55
220±25%
220
250
0.45
0.55
330±25%
330
400
0.58
0.68
330±25%
330
250
0.5
0.6
420±25%
420
250
0.55
0.65
470±25%
470
300
0.85
0.95
470±25%
470
250
0.55
0.65
600±25%
600
200
0.65
0.75
1000±25%
1000
200
0.85
0.95
1500±25%
1500
150
1.2
1.3
1800±25%
1800
150
1.5
1.6
2200±25%
2200
150
1.5
1.6
2500±25%
2500
150
1.5
1.6
26±25％
26
6000*1
1000*1
0.007
0.012
70±25％
70
4000*1
1000*1
0.020
0.030
120±25％
120
3000*1
1000*1
0.025
0.035
MURATA MFG.CO., LTD.
Remark
For
high speed
signal line
For DC
power line
(Thin type)
Reference Only
Spec. No. JENF243A-0003AK-01
Customer
Part Number
P.4/12
Impedance ()
(at 100MHz, Under Standard
Testing Condition)
Rated
Current
(mA)
at
at
Typical
85℃
125℃
MURATA
Part Number
BLM18SG221TN1D
BLM18SG221TN1B
BLM18SG331TN1D
BLM18SG331TN1B
BLM18SN220TN1D
BLM18SN220TN1B
BLM18KG260TN1D
BLM18KG260TN1B
BLM18KG300TN1D
BLM18KG300TN1B
BLM18KG700TN1D
BLM18KG700TN1B
BLM18KG101TN1D
BLM18KG101TN1B
BLM18KG121TN1D
BLM18KG121TN1B
DC Resistance
( max.)
Values
Initial
After
Values
Testing
220±25％
220
2500*1
1000*1
0.040
0.055
330±25％
330
1500*1
1000*1
0.070
0.085
22±7
22
8000*1
5000*1
0.004
0.005
26±25％
26
6000*1
4000*1
0.007
0.012
30±25％
30
5000*1
3300*1
0.010
For DC
power line
0.015 (Thin type)
70±25％
70
3500*1
2200*1
0.022
0.032
100±25％
100
3000*1
1900*1
0.030
0.040
120±25％
120
3000*1
1900*1
0.030
0.040
(*1)In case of Rated current is more than 1A,
Rated Current is derated as right figure
depending on the operating temperature.
R a te d C u rre n t ( A )
Operating Temperature : -55°C to +125°C
Storage Temperature : -55°C to +125°C
Rated current
at 85°C
Rated current
at 125°C
0
85
125
Operating Temperature (°C)
4.Style and Dimensions
1 . 6 ±0 . 1 5
0.8 ±0.15
■ Equivalent Circuit
T
0.4 ±0.2
: E le c t ro d e
(
P/N
T
0.5±0.15
0.6±0.15
0.6±0.15
0.8±0.15
(in mm)
5.Marking
No marking.
6.Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
MURATA MFG.CO., LTD.
)
Resistance element becomes
dominant at high frequencies.
■ Unit Mass (Typical value)
BLM18*****SN1*:0.005g
BLM18*****TN1*:0.004g
BLM18SG***TN1*
BLM18SN***TN1*
BLM18KG***TN1*
BLM18*****SN1*
Remark
Reference Only
Spec. No. JENF243A-0003AK-01
P.5/12
7.Specifications
7-1.Electrical Performance
No.
Item
7-1-1 Impedance
Specification
Meet item 3.
7-1-2 DC
Resistance
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
Measuring Equipment : Digital multi meter
For BLM18SN_TN
Measuring Equipment : YOKOGAWA 755611 or the equivalent
Test Fixture : KEYSIGHT 16044A or the equivalent
＊Except resistance of the Substrate and Wire
7-2.Mechanical Performance
No.
Item
7-2-1 Appearance
and
Dimensions
7-2-2 Bonding
Strength
Specification
Meet item 4.
Test Method
Visual Inspection and measured with Slide Calipers.
Meet Table 1.
It shall be soldered on the substrate.
Applying Force(F) : 6.8N
Applying Time : 5s±1s
Applied direction :Parallel to substrate
Table 1
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
No damage
Within ±30%
(for BLM18SN_TN
Within ±50%)
Side view
Ｆ
Ｆ
R0.5
Meet item 3.
Substrate
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm40mm1.6mm
Deflection : 1.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Pressure jig
R340
F
Deflection
45mm
7-2-4 Vibration
7-2-5 Resistance
to Soldering
Heat
Meet Table 2.
Table 2
Appearance No damage
Impedance
Within ±30%
Change
(for BLM18KG
(at 100MHz)
Within ±40%)
(for BLM18SN_TN
Within ±50%)
DC
Resistance
45mm
Product
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition for 48h±4h.
Meet item 3.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0003AK-01
P.6/12
No. Item
7-2-6 Drop
Specification
Products shall be no failure after
tested.
7-2-7 Solderability
The electrodes shall be at least
95% covered with new solder
coating.
Test Method
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction(Total 9 times)
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Temperature Meet Table 3.
Cycle
Table 3
Appearance No damage
Impedance
Within ±30%
Change
(for BLM18KG
(at 100MHz)
Within-10%to+50%)
(for BLM18SN_TN
Within ±50%)
DC
Resistance
7-3-2 Humidity
7-3-3 Heat Life
7-3-4 Cold
Resistance
Meet Table 1.
Test Method
1 cycle:
1 step:-55 °C(+0 °C,-3 °C) / 30min±3min
2 step:Ordinary temp. / 10min to 15min
3 step:+125 °C(+3 °C,-0 °C) / 30min±3min
4 step: Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Meet item 3.
Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
(in case of Rated current is more than 1A,
do the test at : +85 °C±3°C)
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0003AK-01
P.7/12
8.Specification of Packaging
8-1.Appearance and Dimensions (8mm-wide paper tape)
Appearance and Dimensions
2.0±0.05
4.0±0.1
4.0±0.1
3.5±0.05
1.85±0.1
BLM18RK***SN1D
BLM18PG***SN1D
BLM18AG***SN1D
8mmBLM18B****SN1D
wide Paper tape
BLM18KG****N1D
4mm-pitch
BLM18S****SN1D
+0.1
1.5 -0
BLM18SN***TN1D
8.0±0.3
Type
1.75±0.1
Part Number
1.05±0.1
a
Direction of feed
2mm-pitch
3.5±0.05
8mmwide Paper tape
1.85±0.1
BLM18SG***TN1D
+0.1
1.5 -0
8.0±0.3
2.0±0.05
2.0±0.05
2.0±0.1 4.0±0.1
2.0±0.05
Dimension “a”
1.1 max.
0.85 max.
1.75±0.1
Item
BLM18*****SN1D
BLM18KG***TN1D
BLM18SN***TN1D
0.9max.
1.05±0.1
Direction of Feed
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape continuously and sealed by top tape
and bottom tape.
(2) Sprocket hole:The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Top tape
Bottom tape
5N min.
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
165 to 180 degree
Bottom tape
MURATA MFG.CO., LTD.
Top tape
F
Base tape
Reference Only
Spec. No. JENF243A-0003AK-01
P.8/12
8-3.Taping Condition
(1)Standard quantity per reel
Type
BLM18(except BLM18SG)
BLM18SG
Quantity per 180mm reel
4000 pcs. / reel
10000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape (empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc)
1) « Expression of Inspection No. »
□□ OOOO
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
2) « Expression of RoHS Marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS discrimination(2), Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
8-4. Specification of Outer Case
Label
H
D
W
9.
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an
order.
Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0003AK-01
P.9/12
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Disaster prevention / crime prevention equipment
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Transportation equipment (vehicles,trains,ships,etc.)
(4) Power plant control equipment
(9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
9-3. Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration
due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
Standard land dimensions
< For BLM18 series (except BLM18P/BLM18S/BLM18K type) >
Chip Ferrite Bead
Type
BLM18 (except18P/18S/
BLM18K type)
c
a
Solder Resist
b
Pattern
Soldering
Flow
Reflow
a
0.8
0.7
b
2.5
2.0
c
0.7
0.7
(in mm)
< For BLM18P/BLM18S/BLM18K type >
Chip Ferrite Bead
Rated
Current Soldering
a
b
(A)
0.5 to 1.5
BLM18P
1.7 to 2.5
Flow
Flow
BLM18S
3 to 4
Flow/
0.8
2.5
BLM18K
Reflow Reflow Reflow
5 to 6
2.0
0.7
BLM18SN
8
BLM18SP 1.2 to 6.0
Type
c
d
a
b
c
0.7
Solder Resist
Pattern
The excessive heat by land pads may cause deterioration
at joint of products with substrate.
10-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
MURATA MFG.CO., LTD.
Land pad thickness
and dimension d
18µm 35µm 70µm
0.7
0.7
0.7
1.2
0.7
0.7
2.4
1.2
0.7
6.4
3.3 1.65
6.4
3.3
6.4
(in mm)
Reference Only
Spec. No. JENF243A-0003AK-01
P.10/12
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3)soldering profile
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Pre-heating
Heating
Cycle of flow
Standard Profile
Time. (s)
Standard Profile
150℃、60s min.
250℃、4～6s
2 times
Limit Profile
265℃±3℃、5s max.
2 times
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
2 times
Time. (s)
Limit Profile
above 217°C、60s~150s
260°C,10s
2 times
10-3.Reworking with soldering iron
Pre-heating: 150°C, 1 min
Tip temperature: 350°C max.
Soldering time : 3(+1,-0) seconds.
Soldering iron output: 80W max.
Tip diameter:φ3mm max.
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0003AK-01
P.11/12
10-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
(T: Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
a
b
〈 Poor example〉
Products shall be located in the sideways
direction (Length: ab) to the mechanical
stress.
〈 Good example〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Perforation
Stress Level
A > D *1
A > B
A > C
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw Hole
Recommended
10-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0003AK-01
P.12/12
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew
10-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
10-9.Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or
broken solder joints. Before starting your production process,
test your cleaning equipment / process to insure it does not degrade this product.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11 .
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
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