Spec No.: JENF243A_0003AL-01
P1/12
CHIP FERRITE BEAD BLM18□□□□□□N1□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip ferrite bead BLM18_□N series for general electronic equipment.
2. Part Numbering
(Ex.)
BL
Product
ID
M
Type
18
Dimension
(L × W)
AG
Characteristics
121
S
Impedance
Performance
(Typical value
at 100 MHz)
N
Category
1
Numbers
of circuit
D
Packaging
D: taping
3. Part Number and Rating
Operating temperature range
Storage temperature range
Customer
Part number
-55°C to +125°C
-55°C to +125°C
Murata
Part number
Impedance
(Ω)
at 100 MHz
Rated current*1
(mA)
Ambient
Ambient
Typ. temperature temperature
85°C
125°C
DC resistance
(Ω max.)
Initial
values
Values
after
testing
Remark
BLM18RK121SN1D
120±25%
120
-
200
0.25
0.35
For digital interface
BLM18RK221SN1D
220±25%
220
-
200
0.30
0.40
For digital interface
BLM18RK471SN1D
470±25%
470
-
200
0.50
0.60
For digital interface
BLM18RK601SN1D
600±25%
600
-
200
0.60
0.70
For digital interface
BLM18RK102SN1D
1000±25%
1000
-
200
0.80
0.90
For digital interface
BLM18PG300SN1D
20 min.
30
-
1000
0.05
0.10
For DC power line
BLM18PG330SN1D
33±25%
33
3000
1000
0.025
0.050
For DC power line
BLM18PG600SN1D
40 min.
60
-
1000
0.10
0.20
For DC power line
BLM18PG121SN1D
120±25%
120
2000
1000
0.05
0.10
For DC power line
BLM18PG181SN1D
180±25%
180
1500
1000
0.09
0.18
For DC power line
BLM18PG221SN1D
220±25%
220
1400
1000
0.10
0.14
For DC power line
BLM18PG331SN1D
330±25%
330
1200
1000
0.15
0.20
For DC power line
BLM18PG471SN1D
470±25%
470
-
1000
0.20
0.26
For DC power line
BLM18SP300SN1D
30±10
30
6000
4000
0.008
0.010
For DC power line
BLM18SP101SN1D
100±25%
100
3700
2500
0.022
0.026
For DC power line
BLM18SP221SN1D
220±25%
220
2800
1900
0.040
0.048
For DC power line
BLM18SP601SN1D
600±25%
600
1500
1000
0.140
0.168
For DC power line
BLM18SP102SN1D
1000±25%
1000
1200
800
0.185
0.222
For DC power line
BLM18KG221SN1D
220±25%
220
2200
1500
0.050
0.060
For DC power line
BLM18KG331SN1D
330±25%
330
1700
1200
0.080
0.095
For DC power line
BLM18KG471SN1D
470±25%
470
1500
1000
0.130
0.145
For DC power line
BLM18KG601SN1D
600±25%
600
1300
1000
0.150
0.165
For DC power line
BLM18KG102SN1D
1000±25%
1000
1000
800
0.200
0.230
For DC power line
BLM18SD220SN1D
22±25%
22
6000
3500
0.008
0.013
For DC power line
BLM18SG330SN1D
33±25%
33
6000
3500
0.008
0.013
For DC power line
BLM18AG121SN1D
120±25%
120
-
800
0.18
0.28
For general use
BLM18AG151SN1D
150±25%
150
-
700
0.25
0.35
For general use
BLM18AG221SN1D
220±25%
220
-
700
0.25
0.35
For general use
BLM18AG331SN1D
330±25%
330
-
600
0.30
0.40
For general use
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
Customer
Part number
Murata
Part number
P2/12
Impedance
(Ω)
at 100 MHz
Rated current*1
(mA)
Ambient
Ambient
Typ. temperature temperature
85°C
125°C
DC resistance
(Ω max.)
Initial
values
Values
after
testing
Remark
BLM18AG471SN1D
470±25%
470
-
550
0.35
0.45
For general use
BLM18AG601SN1D
600±25%
600
-
500
0.38
0.48
For general use
BLM18AG102SN1D
1000±25%
1000
-
450
0.50
0.60
For general use
BLM18BB050SN1D
5±25%
5
-
800
0.05
0.10
For high speed
signal line
BLM18BA050SN1D
5±25%
5
-
500
0.2
0.3
For high speed
signal line
BLM18BB100SN1D
10±25%
10
-
700
0.10
0.20
For high speed
signal line
BLM18BA100SN1D
10±25%
10
-
500
0.25
0.35
For high speed
signal line
BLM18BB220SN1D
22±25%
22
-
700
0.20
0.30
For high speed
signal line
BLM18BA220SN1D
22±25%
22
-
500
0.35
0.45
For high speed
signal line
BLM18BB470SN1D
47±25%
47
-
600
0.25
0.35
For high speed
signal line
BLM18BD470SN1D
47±25%
47
-
500
0.3
0.4
For high speed
signal line
BLM18BA470SN1D
47±25%
47
-
300
0.55
0.65
For high speed
signal line
BLM18BB600SN1D
60±25%
60
-
600
0.25
0.35
For high speed
signal line
BLM18BA750SN1D
75±25%
75
-
300
0.70
0.80
For high speed
signal line
BLM18BB750SN1D
75±25%
75
-
600
0.30
0.40
For high speed
signal line
BLM18BB121SN1D
120±25%
120
-
550
0.30
0.40
For high speed
signal line
BLM18BD121SN1D
120±25%
120
-
300
0.4
0.5
For high speed
signal line
BLM18BA121SN1D
120±25%
120
-
200
0.9
1.0
For high speed
signal line
BLM18BB141SN1D
140±25%
140
-
500
0.35
0.45
For high speed
signal line
BLM18BB151SN1D
150±25%
150
-
450
0.37
0.47
For high speed
signal line
BLM18BD151SN1D
150±25%
150
-
300
0.4
0.5
For high speed
signal line
BLM18BB221SN1D
220±25%
220
-
450
0.45
0.55
For high speed
signal line
BLM18BD221SN1D
220±25%
220
-
250
0.45
0.55
For high speed
signal line
BLM18BB331SN1D
330±25%
330
-
400
0.58
0.68
For high speed
signal line
BLM18BD331SN1D
330±25%
330
-
250
0.5
0.6
For high speed
signal line
BLM18BD421SN1D
420±25%
420
-
250
0.55
0.65
For high speed
signal line
BLM18BB471SN1D
470±25%
470
-
300
0.85
0.95
For high speed
signal line
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
Customer
Part number
Murata
Part number
P3/12
Impedance
(Ω)
at 100 MHz
Rated current*1
(mA)
Ambient
Ambient
Typ. temperature temperature
85°C
125°C
DC resistance
(Ω max.)
Initial
values
Values
after
testing
Remark
BLM18BD471SN1D
470±25%
470
-
250
0.55
0.65
For high speed
signal line
BLM18BD601SN1D
600±25%
600
-
200
0.65
0.75
For high speed
signal line
BLM18BD102SN1D
1000±25%
1000
-
200
0.85
0.95
For high speed
signal line
BLM18BD152SN1D
1500±25%
1500
-
150
1.2
1.3
For high speed
signal line
BLM18BD182SN1D
1800±25%
1800
-
150
1.5
1.6
For high speed
signal line
BLM18BD222SN1D
2200±25%
2200
-
150
1.5
1.6
For high speed
signal line
BLM18BD252SN1D
2500±25%
2500
-
150
1.5
1.6
For high speed
signal line
BLM18SG260TN1D
26±25%
26
6000
1000
0.007
0.012
For DC power line
(thin type)
BLM18SG700TN1D
70±25%
70
4000
1000
0.020
0.030
For DC power line
(thin type)
BLM18SG121TN1D
120±25%
120
3000
1000
0.025
0.035
For DC power line
(thin type)
BLM18SG221TN1D
220±25%
220
2500
1000
0.040
0.055
For DC power line
(thin type)
BLM18SG331TN1D
330±25%
330
1500
1000
0.070
0.085
For DC power line
(thin type)
BLM18SN220TN1D
22±7
22
8000
5000
0.004
0.005
For DC power line
(thin type)
BLM18KG260TN1D
26±25%
26
6000
4000
0.007
0.012
For DC power line
(thin type)
BLM18KG300TN1D
30±25%
30
5000
3300
0.010
0.015
For DC power line
(thin type)
BLM18KG700TN1D
70±25%
70
3500
2200
0.022
0.032
For DC power line
(thin type)
BLM18KG101TN1D
100±25%
100
3000
1900
0.030
0.040
For DC power line
(thin type)
BLM18KG121TN1D
120±25%
120
3000
1900
0.030
0.040
For DC power line
(thin type)
*1 As shown in the diagram below, derating is applied to the rated current of the BLM18PG (excluding BLM18PG300SN1,
BLM18PG600SN1, BLM18PG471SN1), BLM18S□, BLM18KG series based on the operating temperature.
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
P4/12
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
Equivalent circuit
Unit mass (typical value):
BLM18*****SN1*: 0.005 g
BLM18*****TN1*: 0.004 g
Part number
T
BLM18SG***TN1*
0.5±0.15
BLM18SN***TN1*
0.6±0.15
BLM18KG***TN1*
0.6±0.15
BLM18*****SN1*
0.8±0.15
6. Marking
No marking.
7. Electrical Performance
No.
Item
Specification
Test method
7.1
Impedance
Meet chapter 3 ratings.
Measuring equipment: Keysight 4991A or the
equivalent
Measuring frequency: 100 MHz±1 MHz
Measuring fixture: Keysight 16192A or the equivalent
7.2
DC resistance
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
(Applied to BLM18SN type)
Measuring equipment: Yokogawa 755611 or the
equivalent
Measuring fixture: Keysight 16044A or the
equivalent
Substrate wiring resistance is excluded.
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
P5/12
8. Mechanical Performance
The product is soldered on a substrate for test. (Excluding appearance and dimensions, drop, resistance to soldering heat,
and solderability)
(Test shall be done using flux, solder and soldering condition which are specified in chapter 12 except the case of being
specified special condition.)
No.
Item
Specification
Test method
8.1 Appearance and
Meet chapter 5.
Visual inspection and measured with slide calipers.
Dimensions
8.2 Shear test
Appearance: No significant mechanical Applying force: 6.8 N
damage shall be observed.
Holding time: 5 s±1 s
Impedance change rate (at 100 MHz):
Force application direction:
within ±30% (within ±50% for
BLM18SN_TN)
DC resistance: Meet chapter 3 ratings.
8.3 Bending test
Appearance: No significant mechanical
damage shall be observed.
Impedance change rate (at 100 MHz):
within ±30% (within ±50% for
BLM18SN_TN)
DC resistance: Meet chapter 3 ratings.
Test substrate: glass-epoxy substrate (100 mm × 40
mm × 1.6 mm)
Pressurizing speed: 0.5 mm/s
Pressure jig: R340
Deflection: 1.0 mm
Holding time: 30 s
8.4 Vibration
Appearance: No significant mechanical
damage shall be observed.
Impedance change rate (at 100 MHz):
within ±30% (within ±50% for
BLM18SN_TN)
DC resistance: Meet chapter 3 ratings.
Appearance: No significant mechanical
damage shall be observed.
Impedance change rate (at 100 MHz):
within ±30% (within ±40% for BLM18KG)
(within ±50% for BLM18SN_TN)
DC resistance: Meet chapter 3 ratings.
Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for
approx. 1 min
Total amplitude: 1.5 mm
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
8.5 Resistance to
soldering heat
8.6 Drop
8.7 Solderability
Flux: ethanol solution with a rosin content of 25(wt)%
Pre-heating: 150°C±10°C/60 s to 90 s
Solder: Sn-3.0Ag-0.5Cu solder
Solder temperature: 270°C±5°C
Immersion time: 10 s±0.5 s
Immersion and emersion rates: 25 mm/s
Post-treatment: left at a room condition for 48 h±4 h
Appearance shall have no significant
The product shall be dropped on concrete or steel
mechanical damage.
board.
Method: free fall
Height: 75 cm
Attitude from which the product is dropped: 3 directions
Number of times: 3 times for each direction (Total 9
times)
95% or more of the outer electrode shall Flux: ethanol solution with a rosin content of 25(wt)%
be covered with new solder seamlessly. Pre-heating: 150°C±10°C/60 s to 90 s
Solder: Sn-3.0Ag-0.5Cu solder
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
Immersion and emersion rates: 25 mm/s
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
P6/12
9. Environmental Performance
The product is soldered on a glass-epoxy substrate for test.
(Test shall be done using flux, solder and soldering condition which are specified in chapter 12 except the case of being
specified special condition.)
No.
Item
Specification
Test method
9.1 Temperature cycle
Appearance: No significant mechanical Single cycle conditions:
damage shall be observed.
Step 1: -55°C (+0°C, -3°C)/30 min±3 min
Impedance change rate (at 100 MHz):
Step 2: ordinary temperature/10 min to 15 min
within ±30% (within +50%, -10% for
Step 3: +125°C (+3°C, -0°C)/30 min±3 min
BLM18KG) (within ±50% for
Step 4: ordinary temperature/10 min to 15 min
BLM18SN_TN)
Number of testing: 100 cycles
DC resistance: Meet chapter 3 ratings.
Post-treatment: left at a room condition for 48 h±4 h
9.2 Humidity
Appearance: No significant mechanical Temperature: 40°C±2°C
damage shall be observed.
Humidity: 90% (RH) to 95% (RH)
Impedance change rate (at 100 MHz):
Test time: 1000 h (+48 h, -0 h)
within ±30% (within ±50% for
Post-treatment: left at a room condition for 48 h±4 h
BLM18SN_TN)
DC resistance: Meet chapter 3 ratings.
9.3 Heat life
Appearance: No significant mechanical Temperature: 125°C±3°C (85°C±3°C if exceeding
damage shall be observed.
rated current 1A)
Impedance change rate (at 100 MHz):
Applied current: rated current at test temperature
within ±30% (within ±50% for
Test time: 1000 h (+48 h, -0 h)
BLM18SN_TN)
Post-treatment: left at a room condition for 48 h±4 h
DC resistance: Meet chapter 3 ratings.
9.4 Cold resistance
Appearance: No significant mechanical Temperature: -55°C±2°C
damage shall be observed.
Test time: 1000 h (+48 h, -0 h)
Impedance change rate (at 100 MHz):
Post-treatment: left at a room condition for 48 h±4 h
within ±30% (within ±50% for
BLM18SN_TN)
DC resistance: Meet chapter 3 ratings.
10. Specification of Packaging
10.1 Appearance and dimensions of tape
• 8 mm width/paper tape (BLM18RK***SN1D, BLM18PG***SN1D, BLM18AG***SN1D, BLM18B****SN1D,
BLM18KG****N1D, BLM18S****SN1D, BLM18SN***TN1D)
A
1.05±0.1
B
1.85±0.1
t
1.1 max.
(BLM18*****S*1)
0.85 max.
(BLM18*****T*1)
(in mm)
• 8 mm width/paper tape (BLM18SG***TN1D)
A
1.05±0.1
B
1.85±0.1
t
0.9 max.
(in mm)
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
P7/12
10.2 Taping specifications
Packing quantity
(Standard quantity)
4000 pcs/reel (except BLM18SG***TN1D)
10000 pcs/reel (only BLM18SG***TN1D)
Packing method
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom
tape when the cavities of the carrier tape are punched type).
Feed hole position
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
Joint
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are
seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Cover tape (or top tape)
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched type)
5 N min.
10.4 Peeling off force of tape
Speed of peeling off
Peeling off force
300 mm/min
0.1 N to 0.6 N (The lower limit is for typical value.)
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
(2) Date
□□
○○○○
First digit: year/last digit of year
(1)
(2)
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHSY
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
P8/12
10.8 Specification of outer box
Dimensions of outer box
(mm)
Label
H
D
H
186
186
93
5
* Above outer box size is typical. It depends on a
quantity of an order.
D
W
11.
W
Standard reel quantity
in outer box (reel)
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea
(4) Power plant
equipment
control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, (7) Traffic signal
(8) Disaster/crime
trains, ships, etc.)
equipment
prevention
equipment
(9) Data-processing
(10) Applications of similar complexity and/or reliability
equipment
requirements to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
11.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
12. Precautions for Use
This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a
conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for flow and reflow soldering:
Flow
Reflow
a
0.8
0.7
b
2.5
2.0
c
0.7
0.7
(in mm)
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
P9/12
Flow
Reflow
0.8
0.7
a
b
2.5
2.0
c
0.7
0.7
(in mm)
Type
BLM18P
BLM18S
BLM18K
Rated
current
(A)
Pattern thickness and
dimension d
18 μm
35 μm
70 μm
0.5 to 1.5
0.7
0.7
0.7
1.7 to 2.5
1.2
0.7
0.7
3 to 4
2.4
1.2
0.7
5 to 6
6.4
3.3
1.65
BLM18SN
8
-
6.4
3.3
BLM18SP
1.2 to 6.0
-
6.4
-
If heat generation from patterns is large, please pay attention
since the joint of products with substrates may deteriorate.
(in mm)
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 200 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (flow, reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
(1) Flow
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Standard Profile
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C/60 s min.
150°C/60 s min.
Heating
250°C/4 s to 6 s
265°C±3°C/5 s
2 times
2 times
Number of flow cycles
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
P10/12
(2) Reflow
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
150°C to 180°C/90 s±30 s
Heating
Above 220°C/30 s to 60 s
Above 230°C/60 s max.
245°C±3°C
260°C/10 s
2 times
2 times
Peak temperature
Number of reflow cycles
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
Pre-heating
150°C/approx. 1 min
Tip temperature of soldering iron
350°C max.
Power consumption of soldering iron
80 W max.
Tip diameter of soldering iron
Soldering time
ø3 mm max.
3 s (+1 s, -0 s)
Number of reworking operations
2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
12.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
〈 Poor example〉
〈 Good example〉
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
P11/12
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D*1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the
board separation surface.
A>C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.8 Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder
joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this
product.
MURATA MFG CO., LTD
Spec No.: JENF243A_0003AL-01
P12/12
12.9 Storage and transportation
Storage period
Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading
to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
12.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
12.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD