BLM21AG331SH1D

BLM21AG331SH1D

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    0805

  • 描述:

    贴片磁珠 330Ω@100MHz ±25% 0805 150mΩ 800mA

  • 详情介绍
  • 数据手册
  • 价格&库存
BLM21AG331SH1D 数据手册
Spec No.: JENF243A 9102N-01 P6/11 9.3 Break down force of tape Cover tape (or top tape) Applied to paper carrier tape 5 N min. Applied to Plastic carrier tape 10 N min. Bottom tape (only when the cavities of the carrier tape are punched type) 5 N min. 9.4 Peeling off force of tape Speed of peeling off Peeling off force 300 mm/min Paper tape: 0.1 N to 0.6 N (The lower limit is for typical value.) Plastic tape: 0.2 N to 0.7 N (The lower limit is for typical value.) 9.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) 9.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  □□ ○○○○ (2) Date First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 9.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. MURATA MFG CO., LTD Spec No.: JENF243A 9102N-01 P11/11 11.9 Storage and transportation Storage period Use the product within 6 months after delivery. If you do not use the product for more than 6 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Do not keep products in bulk packaging. Bulk storage could result in collisions between the products or between the products and other parts, resulting in chipping or wire breakage. • Avoid storing the product by itself bare (i.e. exposed directly to air). Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 11.10 Resin coating (including moisture-proof coating) When the product is coated/molded with resin, its electrical characteristics may change. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.11 Mounting conditions Check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 11.12 Operating environment Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew. 11.13 Mounting density If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures. If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating temperature for the product. 12. Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD
BLM21AG331SH1D
物料型号:文档中列出了多种物料型号,例如BLM21PG220SH1D、BLM21PG300SH1D等,这些型号属于Murata公司生产的芯片磁珠BLM21_SH系列。

器件简介:这些芯片磁珠适用于汽车电子,基于AEC-Q200标准,主要用于DC电源线和高速信号线。

引脚分配:文档中没有明确指出引脚分配,但提到了这些器件是无极性的,意味着没有特定的引脚分配顺序。

参数特性:包括工作温度范围(-55°C至+125°C),存储温度范围(-55°C至+125°C),以及在100MHz下的典型阻抗值。

功能详解:这些芯片磁珠主要用于抑制高频噪声,保护电路免受电磁干扰。

应用信息:适用于DC电源线和高速信号线的噪声抑制,具体型号根据阻抗值和额定电流进行选择。

封装信息:文档中提到了不同的封装选项,例如D: taping (180 mm reel, paper tape) 和 L: taping (o180 mm reel, plastic tape),表示这些器件可以以不同的方式进行封装和卷带。
BLM21AG331SH1D 价格&库存

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BLM21AG331SH1D
  •  国内价格 香港价格
  • 4000+0.428824000+0.05550
  • 8000+0.402828000+0.05213

库存:3825

BLM21AG331SH1D
  •  国内价格
  • 1+1.31730
  • 30+1.22940
  • 100+1.14160
  • 500+1.05380
  • 1000+0.96600
  • 2000+0.87820

库存:2

BLM21AG331SH1D
  •  国内价格 香港价格
  • 4000+0.628734000+0.08136
  • 8000+0.551888000+0.07142
  • 12000+0.5169512000+0.06690
  • 20000+0.4698020000+0.06080
  • 24000+0.4628124000+0.05989

库存:0

BLM21AG331SH1D
  •  国内价格
  • 1+0.89818
  • 30+0.86610
  • 100+0.83403
  • 500+0.76987
  • 1000+0.73779
  • 2000+0.71854

库存:2

BLM21AG331SH1D
  •  国内价格 香港价格
  • 1+1.790291+0.23168
  • 10+1.2681210+0.16411
  • 25+1.0971925+0.14199
  • 50+0.9827450+0.12718
  • 100+0.87842100+0.11368
  • 250+0.75273250+0.09741
  • 500+0.66593500+0.08618
  • 1000+0.585601000+0.07578

库存:3825

BLM21AG331SH1D
  •  国内价格
  • 4000+0.58463
  • 8000+0.51318
  • 12000+0.48070
  • 20000+0.43685
  • 24000+0.43035

库存:0